TW518908B - Organic electroluminescent element, and method for manufacturing the same - Google Patents

Organic electroluminescent element, and method for manufacturing the same Download PDF

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TW518908B
TW518908B TW089113202A TW89113202A TW518908B TW 518908 B TW518908 B TW 518908B TW 089113202 A TW089113202 A TW 089113202A TW 89113202 A TW89113202 A TW 89113202A TW 518908 B TW518908 B TW 518908B
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substrate
temperature
organic
layer
vacuum deposition
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Kenji Mori
Yoshikazu Sakaguchi
Joji Suzuki
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Nec Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/87Arrangements for heating or cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8794Arrangements for heating and cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • H10K85/111Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30Coordination compounds
    • H10K85/321Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
    • H10K85/324Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/631Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

To provide an organic electroluminescent element reducing leakage currents and a method for manufacturing an EL panel using the element. This method for manufacturing an organic electroluminescent element at least includes (A) the process of depositing a first electrode on a substrate, (B) the process of layering one or more organic compound thin-film layers including a luminescent layer on the first electrode, and (C) the process of depositing a second electrode on the organic compound thin-film layers. The substrate temperature is 70 DEG C or less during the processes (B), (C), between the processes (B), (C), and during the period from the end of the process (C) to the time when the substrate temperature attains room temperature, and the absolute value of rate of variation in temperature is within 1.5 DEG C/sec. The invented process can produce an electroluminescent element having excellent rectifying characteristics.

Description

518908 五、發明說明(1) 【發明領域】 本發明係有關於一種可用於平面光源或顯示裝置的有 機電激光元件(organic electroluminescence device)及 其製造方法;一種有機電激光面板(organic electroluminescence panel);以及一種用於製造此有機 電激光元件的真空沈積裝置。 【習知技術】 有機電激光元件最佳的應用是在平面顯示裝置。不同 於無機電激光元件的是,有機電激光元件並不需要Ac或高 電壓’且由於有機化合物的多樣性,因此相當容易提供不 同的顏色。因此,其在全彩的應用上是可預期的,其相關 的研究和發展仍在持續地進行著,且已發展出在低電壓下 具有高發光的結構。當無機電激光元件藉由電場激發而發 光時,有機電激光元件藉由載子注入而發光,而載子注子 是發生在當電洞和電子分別從陽極和陰極注入時。從兩個 電極(陽極和陰極)注入的正負載子會遷移至相反的電極, 且它們的再結合產生了激發子(exciton)。當這些激發子 的能量釋放出時,會放出光線,而此放射光即為有機X電激 光元件的發光。過去,有機電激光元件的研究主要是使用 咼純度的單晶恩(anthracene),然而,其發光性 (luminance)、發光效率(iuminescence efficiency)和發 光穩定性(luminescence stability)均相當低。518908 V. Description of the invention (1) [Field of the invention] The present invention relates to an organic electroluminescence device and a manufacturing method thereof that can be used for a flat light source or a display device; an organic electroluminescence panel And a vacuum deposition apparatus for manufacturing the organic electro-laser element. [Known Technology] The best application of organic electric laser elements is in flat display devices. Unlike inorganic electro-laser elements, organic electro-laser elements do not require Ac or high voltage 'and because of the diversity of organic compounds, it is quite easy to provide different colors. Therefore, it is expected in the application of full color, and its related research and development are still ongoing, and a structure with high light emission at low voltage has been developed. When an inorganic electric laser device emits light by being excited by an electric field, an organic electric laser device emits light by carrier injection, and carrier injection occurs when holes and electrons are injected from the anode and the cathode, respectively. The positive carriers injected from the two electrodes (anode and cathode) migrate to the opposite electrode, and their recombination generates an exciton. When the energy of these excitons is released, light is emitted, and this emitted light is the light emitted by the organic X-electron laser element. In the past, the research of organic electro-optical laser devices mainly used a single crystal of thorium purity (anthracene). However, its luminance, iuminescence efficiency, and luminescence stability were all relatively low.

Kodak公司的Tang等人,在丨987年報導了包括兩層疊的有 機薄層之結構,在低電壓下可以提供相當高的發光性和穩Kodak's Tang et al. Reported in 987 a structure comprising two laminated organic thin layers, which can provide quite high luminosity and stability at low voltages.

518908 五、發明說明(2) 疋性。此為一轉捩點,使得有機電激光元件的研究和發展 fe知相當熱門。在Tang等人報導的結構中,將包括了發光 層(luminescent layer)和電洞傳輸層(h〇le transp〇rt layer)之兩層疊的有機薄層,插入一對電極之間,此結構 在電壓10V的情況下,展現了丨,〇〇〇 cd/m2的優越特性,這 在基日守之月ίΐ疋無法達到的,見丁ang et al·,Appl. Phys.518908 V. Description of the invention (2) Nature. This is a turning point, which makes the research and development of organic electric laser devices very popular. In the structure reported by Tang et al., Two laminated organic thin layers including a luminescent layer and a hole transporation layer are inserted between a pair of electrodes. At a voltage of 10V, it exhibits the superior characteristics of 丨, 00cd / m2, which cannot be reached on the base of the moon, see Ding ang et al., Appl. Phys.

Lett·,51(12),9 1 3 ( 1 987 )。最近,更發展出一種結構, 其係在上述的結構中的陰極和發光層之間提供一層電子傳 輸層(electron transport layer),以及另一種在上述的 結構的電洞傳輸層和陽極之間提供一層電洞注入層(h〇 i e in ject ion layer)之結構。再者,許多研究著重在各分層 的物質上,使得發光效率、生命期等已獲得許多改善;有 機電激光元件在平面顯示器(其中有機電激光元件排列於 X-Y平面)上的應用是被高度預期的;且已發展出被動式矩 陣趨動型256 X 64點單色顯示器〔例如,h. Nakata, Display and Imaging Vol. 5, pp. 273-277(1997) ; H. Nakata, Basics and Application of Organic EL Devices , Organic Molecular Electronics andLett., 51 (12), 9 1 3 (1 987). Recently, a structure has been developed which provides an electron transport layer between the cathode and the light emitting layer in the above structure, and another structure provided between the hole transport layer and the anode in the above structure. The structure of a hole injection layer. Furthermore, many researches have focused on various layered materials, which have resulted in many improvements in luminous efficiency and lifetime. The application of organic electro-laser elements in flat displays (where organic electro-laser elements are arranged on the XY plane) is highly regarded. Expected; and passive matrix actuated 256 X 64 dot monochrome displays have been developed [for example, h. Nakata, Display and Imaging Vol. 5, pp. 273-277 (1997); H. Nakata, Basics and Application of Organic EL Devices, Organic Molecular Electronics and

Bioelectronics 第六屆會議之文章,the Hapan Society of Applied Physics, pp· 147〜154(1997) 〕 。 在被動式矩陣趨動型的256x 64點有機電激光元件方 面,通常列邊電極(陰極)的掃描為1/64功率,攔邊電極 (陽極)平行地趨動;即使用線性連續趨動。在此情況下, 除非有機電激光面板使用具有卓越的整流之有機電激光元Article of the sixth session of Bioelectronics, the Hapan Society of Applied Physics, pp. 147 ~ 154 (1997)]. In the passive matrix actuation type 256x64 point organic electro-optical laser device, the scanning of the column electrode (cathode) is usually 1/64 power, and the edge electrode (anode) is actuated in parallel; that is, linear continuous actuation is used. In this case, unless the organic electric laser panel uses an organic electric laser element with excellent rectification

第5頁 518908 五、發明說明(3) 件’否則會造成甚至疋非選擇的像素亦會發光,且可見到 干擾現象’並且使顯示器具有非常低品質的影像。〔例 如,每一個選擇像素(pixel)周圍的像素會發光成+形。 其詳細的描述見S. Ohtsuki,"Basics and Application of Organic EL Devices丨丨,Organic MolecularPage 5 518908 V. Description of the invention (3) Otherwise, it will cause even non-selected pixels to emit light, and interference phenomena can be seen ', and the display has a very low-quality image. [For example, the pixels around each selected pixel (pixel) will emit a + shape. For a detailed description, see S. Ohtsuki, " Basics and Application of Organic EL Devices 丨, Organic Molecular

Electronics and Bioelectronics 第六屆會議之文章, the Hapan Society of Applied Physics, ρρ· 1 39-1 46( 1 997)〕 有機電激光元件是一種具有正負載子注入型之發冷光 的裝置,在反向電壓的施加下,即當負電壓施加至電洞傳 輸層邊的電極,且正電壓施加至電子傳輸層邊的電極的情 况下’沒有電流會穿過此裝置。然而,在其實際的應用 上’在一些情況下,當施加反向電壓時,會發生非常少量 的漏電流。此漏電流可能來自,例如,(丨)由構成有機層 和電極之物質所決定的本質,以及(2)有機層和金屬層的 物理變化,比如每一層結構的不一致。 然而’漏電流的機制仍不清楚。順便一提,有報導指 出使用特別的物質做為陰極可以改善整流 (rectification) 〔Ν· Asai et al·, Display and Paging,Vol· 5,pp· 279〜283( 1 997)〕。然而,其只做 报小部份的研究在製造有機電激光元件的條件,其發現沒 有條件可以有效地製造具有優越整流的有機電激光元件。 如上所述’當有機電激光元件排列在X-Y面來製造面 板’且此面板受到簡單的矩陣趨動,當元件在低整流時,Article of the sixth session of Electronics and Bioelectronics, the Hapan Society of Applied Physics, ρρ · 1 39-1 46 (1 997)] The organic electro-optical laser element is a kind of cold light device with a positive carrier injection type. Under the application of voltage, that is, when a negative voltage is applied to the electrode on the side of the hole transport layer and a positive voltage is applied to the electrode on the side of the electron transport layer, 'no current will pass through this device. However, in its practical application, in some cases, when a reverse voltage is applied, a very small amount of leakage current occurs. This leakage current may come from, for example, (1) the nature determined by the materials constituting the organic layer and the electrode, and (2) physical changes of the organic layer and the metal layer, such as inconsistent structure of each layer. However, the mechanism of 'leakage current' is still unclear. Incidentally, it has been reported that the use of a special substance as a cathode can improve rectification [N · Asai et al ·, Display and Paging, Vol · 5, pp · 279 ~ 283 (1 997)]. However, it only reported a small part of the research on the conditions for manufacturing organic electric laser elements, and found that there is no condition that can effectively manufacture organic electric laser elements with superior rectification. As described above, when the organic electro-optical laser element is arranged on the X-Y plane to manufacture a panel, and the panel is subjected to a simple matrix motion, when the element is at low rectification,

518908 五、發明說明(4) 會產生如上所提及的漏電流,因而看到干擾現象 (cross-talk phenomenon),且此顯示器的影像品質非常 低。 、 【發明之目的】 ^本發明的目的在提供一種有機電激光元件,其在不改 ' 變傳統有機電激光元件的特性下,具有高的整流,以及提 ' 供一種使用此種裝置的有機電激光面板。 本發明提供有機電激光元件的製造方法,豆至少包 括: ’、 (A) 在基板上形成第一電極; (B) 在第一電極上形成一層以上的有機化合物薄膜, β 此有機化合物薄膜包含一發光層;以及 (C )在有機化合物薄膜層上形成第二電極, 其中基板的溫度維持在7 〇或更低,基板之溫度改變 的速率維持在1 · 5 °C /秒或低於此絕對值,在步驟(β )和 (C),在步驟(Β)和(c)之間,和完成步驟(c)時,基板的溫 一 度變成室溫。 為了能控制上述基板的溫度,本發明更提供一種真空 沈積裝置,其至少具有: (1)具有平滑表面的基板支撐物,用以支撐基板;以 及 (2)基板溫度控制裝置,用於控制在層膜成型面的基 板之溫度基板,此基板溫度控制裝置的構成至少有: (2 -1 )溫度感測器;518908 V. Description of the invention (4) The leakage current mentioned above will be generated, so a cross-talk phenomenon is seen, and the image quality of this display is very low. [Objective of the invention] ^ The object of the present invention is to provide an organic electric laser element which has high rectification without changing the characteristics of the traditional organic electric laser element, and to provide a method for using such a device. Electromechanical laser panel. The present invention provides a method for manufacturing an organic electric laser device. The bean includes at least: (A) forming a first electrode on a substrate; (B) forming more than one layer of an organic compound film on the first electrode, and the organic compound film includes A light emitting layer; and (C) forming a second electrode on the organic compound thin film layer, wherein the temperature of the substrate is maintained at 70 or lower, and the rate of temperature change of the substrate is maintained at 1.5 ° C / second or lower The absolute value is between step (β) and (C), between steps (B) and (c), and when step (c) is completed, the temperature of the substrate becomes room temperature at one time. In order to control the temperature of the substrate, the present invention further provides a vacuum deposition device, which at least: (1) a substrate support having a smooth surface to support the substrate; and (2) a substrate temperature control device for controlling the The temperature substrate of the substrate on the layer film forming surface, and the structure of the substrate temperature control device includes at least: (2 -1) a temperature sensor;

第7頁 518908 __—— 五、發明說明(5) (2-2)計算裝置; (2-3)熱釋放和吸收裝置。 藉由使用本發明的步驟,可以製造具有,單之,=趨 動的有機電激光面板,其玎避免干擾、具有高顯不品質及 顯示元件在性質上有顯著改變。 【圖式簡單說明】 第1圖係繪示一般的有機電激光元件之示意圖。 第2圖係繪示本發明之真空沈積裝置的真空反應室之 結構,其能夠控制基板溫度。 第3圖係表示由例丨和比較例1所製造之有機電激光元 件的電流-電壓特性。垂直軸表示電流,但是以取對數後 的絕對值表示,以顯示在負方向流動的電流。 _符號說明】 基板:11、2 4 透明電極:1 2 電洞傳輸層:1 3 發光層:14 電子傳輸層:1 5 陰極:16 計算單元:21 熱釋放及吸收器:2 2 熱偶器:2 3 主窗板:2 5 蒸氣源窗板:2 6 蒸發源:2 7 【發明的詳細說明】 本發明為解決上述之傳統有機電激發光元件的問題, 因此做了一些研究。結果發現在形成有機層及電極時,藉 由維持溫度變化速率及在有機層成型面的基板溫度,可以 降低上述的問題。 麵Page 7 518908 __—— V. Description of the invention (5) (2-2) Computing device; (2-3) Heat release and absorption device. By using the steps of the present invention, it is possible to manufacture an organic electro-optical laser panel having, for example, a tendency, which avoids interference, has a high display quality, and has a significant change in the properties of the display element. [Brief description of the drawings] FIG. 1 is a schematic diagram showing a general organic electric laser device. Fig. 2 shows the structure of a vacuum reaction chamber of a vacuum deposition apparatus of the present invention, which can control the temperature of a substrate. Fig. 3 is a graph showing the current-voltage characteristics of the organic electric laser device manufactured in Example 丨 and Comparative Example 1. The vertical axis represents current, but is expressed as an absolute value after taking the logarithm to show the current flowing in the negative direction. _Symbol description】 Substrate: 11, 2 4 Transparent electrodes: 1 2 Hole transport layer: 1 3 Light emitting layer: 14 Electron transport layer: 1 5 Cathode: 16 Calculation unit: 21 Heat release and absorber: 2 2 Thermocouple : 2 3 Main window plate: 2 5 Vapor source window plate: 2 6 Evaporation source: 2 7 [Detailed description of the invention] The present invention has done some research in order to solve the above-mentioned problems of the traditional organic electro-excitation light element. As a result, it was found that when the organic layer and the electrode are formed, the above problems can be reduced by maintaining the temperature change rate and the substrate temperature on the molding surface of the organic layer. surface

第8頁 518908Page 8 518908

本發明提供一種有機電激光元件的製造方法,其至少 包括: (A) 在基板上形成第一電極; (B) 在第一電極上形成一或多層有機化合物薄膜,此 有機化合物薄膜包含發光層,·以及 (C) 在有機化合物薄膜層上形成第二電極, 其中基板的溫度維持在70 r或更低,基 的速率維持在1.5T;/秒或低於此絕對值,在步驟(㈦和 VC),在步驟(B)和(c)之間,和完成步驟(c)時,基板的溫 度變成室溫。The invention provides a method for manufacturing an organic electric laser device, which at least comprises: (A) forming a first electrode on a substrate; (B) forming one or more organic compound films on the first electrode, the organic compound film including a light-emitting layer , And (C) forming a second electrode on the organic compound thin film layer, wherein the temperature of the substrate is maintained at 70 r or lower, and the rate of the base is maintained at 1.5 T; / sec or lower than this absolute value, in step (㈦ And VC), between steps (B) and (c), and when step (c) is completed, the temperature of the substrate becomes room temperature.

一在本發明中,有機電激發光元件的基板之可以選自具 I 有咼平坦度,可抗製造有機電激光元件時所產生的應力, 低光耗損率等特性之各種物質,較佳的是玻璃基板。 ^為得到本發明的成效,在有機層成型面的基板之溫度 ,化值’較佳疋維持在1 · 5它/秒或更低;更佳的是在〇 · 7 5 °C/秒或低於此之絕對值。最好基板溫度能維持不變。· 一 要在有機層成型面的基板的溫度之最大值為8〇。〇或 更低」則可以確實達到本發明的效果。為了確保得到本發 — 明之效果,將最大溫度預定在7〇 〇c或更低,最好在t或、 更低。 _ 、么為了實行本發明的製程,基板的最低溫度儘可能的低 _ 於约—20 0。(:,然而,本發明製程在實際的應用上,基板溫 度通常約維持在室溫。 在有機層成型面的基板之溫度(此後提及這種溫度以First, in the present invention, the substrate of the organic electro-optic light-emitting element may be selected from various materials having characteristics such as flatness, resistance to stress generated when manufacturing the organic electro-laser element, and low light loss rate. It is a glass substrate. ^ In order to obtain the effect of the present invention, the temperature of the substrate on the molding surface of the organic layer is preferably 'maintained' at 1 · 5 it / s or lower; more preferably at 0.75 ° C / s or Below this absolute value. It is desirable that the substrate temperature be maintained constant. · The maximum temperature of the substrate to be formed on the organic layer molding surface is 80. "0 or lower" can certainly achieve the effect of the present invention. In order to ensure that the effect of the present invention is obtained, the maximum temperature is set to 700 ° C or lower, preferably t or lower. In order to implement the manufacturing process of the present invention, the minimum temperature of the substrate is as low as possible. (: However, in the practical application of the process of the present invention, the substrate temperature is usually maintained at about room temperature. The temperature of the substrate on the molding surface of the organic layer (hereinafter this temperature is referred to as

518908 五、發明說明(乃 基板溫度〃稱之)可藉由在將形成有機層那一的基板、 或當第一電極已形成於其上時之第一電極上,放置溫度感 測裔,而測得其溫度。 ▲有機化合物薄膜層包括由二層或二層以上的電洞傳 輸層、電子傳輸層等所組成的發光層(luminescent layer)時,步驟(B)提及不僅個別有機化合物薄膜層形成 的時間’而且還有基板在蒸發沈積裝置上形成一層及下一 層之間的時間。518908 V. Description of the invention (referred to as the temperature of the substrate) The temperature sensor can be placed on the substrate on which the organic layer will be formed, or on the first electrode when the first electrode has been formed thereon, and Measure its temperature. ▲ When the organic compound thin film layer includes a luminescent layer consisting of two or more hole transport layers, electron transport layers, etc., step (B) refers to not only the formation time of individual organic compound thin film layers' There is also the time between when the substrate is formed on the evaporative deposition device and the next layer.

在本發明中,在控制基板溫度及溫度改變速率期間之 時間’預期是從至少在打開蒸發沈積裝置主要窗板以開始 形成第一有機化合物薄膜層到形成第二電極後,基板冷卻 至室溫而且能從蒸發沈積裝置取出的全部時間。 在上文中’開始控制基板溫度的時候,就是打開蒸發 沈積I置窗板的時候。然而,這樣的製程在實施上,控制 基板温度可能會比控制蒸發源加熱的時機來得容易。 藉由利用本發明的製程,在施加反向偏壓時,已經可 能得到較低漏電流之有機電激發光元件。In the present invention, the time period during which the temperature of the substrate and the rate of temperature change are controlled is expected to be from the time when at least the main window plate of the evaporation deposition device is opened to start forming the first organic compound thin film layer to the second electrode, and the substrate is cooled to room temperature And it can be taken out of the evaporative deposition device for the entire time. In the above, when the temperature control of the substrate is started, it is the time to open the evaporative deposition I and set the window plate. However, in the implementation of such a process, it may be easier to control the substrate temperature than to control the timing of the evaporation source heating. By using the process of the present invention, when a reverse bias voltage is applied, it is already possible to obtain an organic electro-optic light element with a lower leakage current.

在本發明中,有機電激光元件的整流上之改善的原 因’推測是可藉由縮小基板溫度的變化來降低異接面 (heterointerface)的微擾亂(microdis〇rder),且藉以降 低有機電激光元件的漏電流。其中異接面的微擾亂是由熱 應力所產生的,而熱應力係來自於構成不同層的個別物質 之間的熱性質之差異所引起的。 、 在本發明中’步驟(B)及(C)期望用真空沈積來處理,In the present invention, the reason for the improvement in the rectification of the organic electric laser element is' presumably that the microdisorder of the heterointerface can be reduced by reducing the change in the substrate temperature, thereby reducing the organic electric laser. Component leakage current. The micro-disturbance of the interface is caused by thermal stress, which is caused by the difference in thermal properties between the individual substances constituting the different layers. In the present invention, the steps (B) and (C) are desirably processed by vacuum deposition,

518908 五、發明說明(8) — 真空沈積是利用蒸發源在真空下加熱,以產生蒸汽或分子 團(cluster)而沈積在基板上的一種技術。就加熱而言, 可用電子束加熱(其為一種用電子束直接於物質上加熱的 技術)、電阻加熱等等。 在本發明中,真空沈積裝置至少具有: α)具有平滑表面的基板支撐物,用以支撐基板;以 及 (2)基板溫度控制裝置,用於控制層膜成型面的基板 溫度’此基板溫度控制裝置的構成至少有: (2 -1)溫度感測器; (2-2)計算裝置; (2-3)熱釋放和吸收裝置。 基板溫度改變可由計算裝置評估溫度感測器得知知, 從裝置上送出一個信號到熱釋放及吸收裝置,以消除基板 溫度改變’而可預先決定基板溫度及改變速率。 使用這種基板溫度控制裝置,使得在膜層形成期間, 可以將基板的溫度做稍微地改變,亦可以將其維持在7〇 t 或更低,藉此產生更高品質的有機電激發光元件。 理想的狀況是熱釋放及吸收裝置可以合而為一。 也期望真空沈積裝置中的基板溫度控制器可以將層膜 成型面的基板溫度控制於70它或更低,且將層膜成型^的 基板溫度改變速率維持在1 · 5 °C /秒或低於此絕對值。、 理想的基板支撐物需有平滑的表面,藉由JIS B 060 1 -1 994測得,表面粗糙度為:(1)算術平均粗糙度518908 V. Description of the invention (8)-Vacuum deposition is a technology that uses an evaporation source to heat under vacuum to produce steam or clusters and deposits it on a substrate. In terms of heating, electron beam heating (which is a technique for heating an electron beam directly on a substance), resistance heating, and the like can be used. In the present invention, the vacuum deposition device has at least: a) a substrate support having a smooth surface to support the substrate; and (2) a substrate temperature control device to control the substrate temperature of the film forming surface; the substrate temperature control The composition of the device is at least: (2 -1) temperature sensor; (2-2) computing device; (2-3) heat release and absorption device. The temperature change of the substrate can be known from the evaluation temperature sensor of the computing device. A signal is sent from the device to the heat release and absorption device to eliminate the substrate temperature change ', and the substrate temperature and change rate can be determined in advance. By using such a substrate temperature control device, the temperature of the substrate can be slightly changed during the formation of the film layer, and it can also be maintained at 70 t or lower, thereby generating a higher-quality organic electroluminescent device. . Ideally, the heat release and absorption devices can be combined into one. It is also expected that the substrate temperature controller in the vacuum deposition apparatus can control the substrate temperature of the film forming surface to 70 or lower, and maintain the substrate temperature changing rate of the film forming ^ at 1 · 5 ° C / sec or low. Here the absolute value. The ideal substrate support requires a smooth surface, as measured by JIS B 060 1 -1 994. The surface roughness is: (1) arithmetic average roughness

518908518908

=200 nm或更小,以及(2)最大高度(Ry)= 800 nm或更 小。如果基板支撐物的表面粗链度滿足以上所述的兩種情 況時’則基板與支撐物之間的接觸區域大,而且可由熱 釋放及及收褒置(其以與基板支撑物整合為一)改善基板溫 度的控制。 基板支撐物的平滑表面與基板間可用一軟金屬(s〇 f t metal)填滿,而不留下任何間隙。藉由在基板與支撐物間 填滿金屬,以進一步改善基板溫度的控制。 、 此類的軟金屬一般可用銦、鋁等。商業上可用銦薄片 或其他符合這些條件的金屬。= 200 nm or less, and (2) Maximum height (Ry) = 800 nm or less. If the surface rough chain degree of the substrate support satisfies the above two conditions, then the contact area between the substrate and the support is large, and can be released by heat release and storage (which is integrated with the substrate support into one ) Improve control of substrate temperature. The smooth surface of the substrate support and the substrate can be filled with a soft metal without leaving any gap. By filling the metal between the substrate and the support, the temperature control of the substrate is further improved. In general, such soft metals can be indium and aluminum. Commercially available flakes of indium or other metals that meet these criteria.

本發明的真空沈積裝置適用於步驟(B)&(C)。 “ 在本發明中,更進一步提供一種由這些用於製造有機 電激光元件的製程所製造的有機電激光元件。 本發明的有機電激光元件適用於有機電激光面板,其 中大多數的元件是以矩陣形排列。使用本發明的有機電激 光元件所製造的顯示器,其在施加反向偏壓時具有低漏電 流’且具有低干擾及高顯像品質。 第1圖是繪示有機電激光元件的結構圖。在基板丨丨上 形成透明電極12 ;在透明電極12上依序形成電洞傳輸層The vacuum deposition apparatus of the present invention is suitable for steps (B) & (C). "In the present invention, there is further provided an organic electric laser element manufactured by these processes for manufacturing an organic electric laser element. The organic electric laser element of the present invention is suitable for an organic electric laser panel, and most of the elements are A matrix arrangement. A display manufactured by using the organic electric laser device of the present invention has low leakage current when applied with a reverse bias, and has low interference and high development quality. The first figure shows an organic electric laser device Structure diagram. A transparent electrode 12 is formed on the substrate; a hole transport layer is sequentially formed on the transparent electrode 12.

i3、發光層14與電子傳輸層15 ;以及在電子傳輸層15上形 成陰極16。 在施行本發明之製程來製造有機電激光元件上,並沒 有特別限定其結構;因此可以使用過去的研究與發展的結 果。意即,可用已知的基板,已知的陽極,各種已知的有i3, the light emitting layer 14 and the electron transport layer 15; and a cathode 16 is formed on the electron transport layer 15. There is no particular limitation on the structure of the organic electro-optical laser device produced by the process of the present invention; therefore, the results of past research and development can be used. That is, a known substrate, a known anode, various known

518908 五、發明說明(10) 機材料,已知的陰極等。在 件是由三層有機層13 中/不的有機電激光元 /第1圖中,可以將發二植成個。載子❹ 合H個載子傳輸層 士 輪層其中之 機層變為四層或更多層。 有、、σ σ或者改變三層有 每一有機層中也有可能使用二 可在陰極上,且光1 6 ^ 次以上的材料。基板 序上,就第i圖的元H兩個/其1傳出。在元件的製造順 極、電洞傳遞層、發光/、電^上的製程順序為陽 當簡[然而非特ί;:的::傳;:板:;二此順序相 較易議順序為陰極、電子傳輸;:發光Ϊ陰;:;夺輸 層及陽極。、此順序亦無特定的限制。 σ兩 第2圖為本發明的真空沈積裝置(有基板溫度控制器) $ i 應门至>之一貫施例。第2圖中基板24(已有膜層‘成 於其上)被固疋至與熱釋放及吸收器相整合的基板支撐物 上。在基板24上設置熱偶器(therm〇c〇uple)23,用以測量 基板的/jul度。g第一電極形成於基板μ上時,熱偶器23係 設置於第一電極上。 … W ’、 基板的溫度控制是利用以下的方法。藉由熱偶器2 3所 測得之基板的溫度與其改變速率,係由計算單元 (computation uni t)21來求得。計算單元21送出一信號至 與基板支撐物相整合的熱釋放及吸收器22(此後提及的熱 釋放及吸收器,均為具有基板支撐物的熱釋放及吸收 器),因此可消除在基板上出現的溫度變化,使基板溫度518908 V. Description of the invention (10) Mechanical materials, known cathodes, etc. In this case, the organic electric laser element in the three-layer organic layer 13 is not used. / In the first figure, the two hairs can be planted into one. The carrier is combined with H carrier transport layers, and the carrier layer of the wheel layer becomes four or more layers. Yes, σ σ or change the three layers. It is also possible to use two materials in each organic layer that can be used on the cathode and light more than 16 ^ times. On the substrate sequence, two / one of the elements H in the i-th figure are transmitted. The manufacturing sequence of the components in the forward direction, the hole transfer layer, and the light-emitting / electrical process is Yang Dangjian [However, the special ::: 传;: 板:; The second order is the more negotiable order is the cathode , Electron transmission ;: light-emitting yin;:; lose the layer and anode. There is no specific restriction on this order. σtwo Figure 2 shows a vacuum deposition device (with a substrate temperature controller) according to the present invention. In Fig. 2, the substrate 24 (on which an existing film layer is formed) is fixed to a substrate support integrated with a heat release and absorber. A thermocouple 23 is provided on the substrate 24 to measure the / jul degree of the substrate. g When the first electrode is formed on the substrate μ, the thermocouple 23 is provided on the first electrode. ... W '. The temperature of the substrate is controlled by the following method. The temperature of the substrate and its changing rate measured by the thermocouple 23 are obtained by a computing unit 21 (computation uni t). The computing unit 21 sends a signal to the heat release and absorber 22 integrated with the substrate support (the heat release and absorber mentioned hereinafter are all heat release and absorber with a substrate support), so it can be eliminated on the substrate. Temperature changes that occur on the substrate

第13頁 518908 五、發明說明(11) 改變速率和基板溫度落於預定範圍,即分別為1 · 5 °C /秒或 更低及70 °C或更低;根據此信號,具有基板支撐物的熱釋 放及吸收會與基板做熱交換。 將用於形成膜層的個別物質置於個別的蒸發源 (vaporization source)27,並藉由電阻加熱裝置或電子 束裝置來加熱。一膜層的形成係由打開蒸氣源窗板26及主 窗板25而開始,而於關閉主窗板25後完成。Page 13 518908 V. Description of the invention (11) The change rate and substrate temperature fall within a predetermined range, namely 1.5 ° C / sec or lower and 70 ° C or lower respectively; according to this signal, there is a substrate support The heat release and absorption will be exchanged with the substrate. An individual substance for forming a film layer is placed in an individual evaporation source 27 and is heated by a resistance heating device or an electron beam device. The formation of a film layer is started by opening the vapor source window plate 26 and the main window plate 25, and is completed after closing the main window plate 25.

將具有基板支撐物的熱釋放吸收器22以及熱偶器23, 暴露在真空的環境下,因此,其必須由在真空系統中沒有 不利影響的物質或結構所組成。熱偶器23係用於監控基板 表面的溫度,且使用一個如第2圖所示的熱偶器;然而, 也可以使用兩個熱偶器。當基板的尺寸足夠大時,或者當 僅使用數個蒸發源時,最好是使用多個熱偶器。在這樣的 情況下,應決定每一個熱偶器的位置和大小,才不致阻礙 在基板移動的蒸氣流。具有基板支撑物的熱釋放吸收器會 與基板熱交換,且可以消除基板的溫度變化。The heat release absorber 22 and the thermocouple 23 having the substrate support are exposed to a vacuum environment, and therefore, they must be composed of a substance or structure that does not adversely affect the vacuum system. The thermocouple 23 is used to monitor the temperature of the substrate surface, and one thermocouple is used as shown in Fig. 2; however, two thermocouples may be used. When the size of the substrate is large enough, or when only a few evaporation sources are used, it is preferable to use multiple thermocouples. In such cases, the position and size of each thermocouple should be determined so as not to obstruct the flow of vapors moving on the substrate. The heat release absorber with the substrate support will exchange heat with the substrate and can eliminate the temperature change of the substrate.

在本發明中’具有基板支撐物的熱釋放吸收器22,其 與基板24接觸的表面之表面粗糙度,以JIS b 060 1 -1994 測量,較佳的是(1)算術平均粗糙度(Ra)為200nm或更低, 且(2)最大高度(Ry)為8〇〇 nm或更低。藉由具有基板支撐物 的熱釋放吸收恭2 2提供如此平滑的表面,使得在基板和具 有基板支撐物的熱釋放吸收器22之間可獲得高的黏著力/, 而且即使在咼真空環境下仍可以進行快速的熱傳導。 應知道的疋,除非與具有基板支撐物的熱釋放吸收器In the present invention, the surface roughness of the surface of the heat release absorber 22 having a substrate support in contact with the substrate 24 is measured in accordance with JIS b 060 1 -1994, preferably (1) the arithmetic average roughness (Ra ) Is 200 nm or less, and (2) the maximum height (Ry) is 800 nm or less. The heat-releasing absorption with the substrate support Gong 22 provides such a smooth surface that a high adhesion force can be obtained between the substrate and the heat-releasing absorber 22 with the substrate support, and even in a vacuum environment Fast heat transfer is still possible. Be aware of radon, unless with a heat release absorber with substrate support

第14頁 518908Page 14 518908

五、發明說明(12) 22接觸的那一面之基板表面的粗糙度是與具有基板支撐物 的熱釋放吸收器22的表面粗糙度具有相同的等級,或者是 小於,否則是無法獲得如上所述之好的熱傳導、。當兩個表 面間的黏著度不足時,熱能傳導便不平穩,且基板溫度的 控制力下降。(例如:溫度控制的時間延遲上升)。 在基板支撐物的平滑表面與基板之間,可用一軟金屬 填滿,使得其間不會有空隙存在。藉由在基板與支撐物之 間填滿金屬,可進一步改善基板溫度的控制。 藉由填入相當軟的金屬(如銦)薄片或其他類似此性質 者於兩表面間,並藉由將此兩表面壓合(press_b〇ndi叫) 以得到較高的黏著性,如此便可使基板24與具有基板支撐 物的熱釋放吸收器22之間的熱傳導較平順。這類的金屬薄 片不,可使較差黏著度的兩表面間有較高的控溫性,而且 在較高黏著度的兩表面間亦有此功用。 計算單元21可計算熱偶器的溫度改變,並且傳送一訊 號到具有基板支撐物的熱釋放吸收器2 2,以消除此溫度改 變。具有基板支撐物的熱釋放吸收器22係根據此傳遞的訊 號,來改變基板的表面溫度。 藉著上述的機制,在膜層形成期間,可以將基板的溫 度改變速率(以絕對值表示)控制在丨· 5它/秒或更低,較 佳的是0· 75 °C或更低,最佳為零(即固案基板的溫度),並 且可以將基板的溫度控制在7〇 t或更低。順帶提起的是, 熱釋放吸收2 2可能具有一結構,此結構的内部有加熱器 及冷卻裔’或者此結構内部有鈍性液體(inert Hquid)或V. Description of the invention (12) The roughness of the surface of the substrate on the side contacted by 22 is the same grade as that of the surface of the heat release absorber 22 with the substrate support, or is less than, otherwise it cannot be obtained as described above. Good heat conduction. When the adhesion between the two surfaces is insufficient, the thermal energy transmission is not smooth, and the control force of the substrate temperature is reduced. (Example: Time delay of temperature control rises). Between the smooth surface of the substrate support and the substrate, it can be filled with a soft metal so that there is no gap in between. By filling the metal between the substrate and the support, the temperature control of the substrate can be further improved. By filling a relatively soft metal (such as indium) flakes or other similar properties between the two surfaces, and by pressing the two surfaces (press_bond), you can get higher adhesion, so you can The heat conduction between the substrate 24 and the heat release absorber 22 having a substrate support is made smoother. This type of metal sheet does not allow higher temperature control between the two surfaces with poor adhesion, and also has the function between the two surfaces with higher adhesion. The calculation unit 21 may calculate a temperature change of the thermocouple and transmit a signal to the heat release absorber 22 having a substrate support to eliminate the temperature change. The heat release absorber 22 having a substrate support changes the surface temperature of the substrate based on the signal transmitted therefrom. By the above-mentioned mechanism, during the formation of the film layer, the temperature change rate (expressed in absolute value) of the substrate can be controlled to 丨 5 it / s or lower, preferably 0. 75 ° C or lower, The optimum is zero (ie, the temperature of the solid substrate), and the temperature of the substrate can be controlled at 70 t or lower. Incidentally, the heat release absorption 2 2 may have a structure having a heater and a cooling member inside the structure, or an inert Hquid inside the structure or

518908 五、發明說明(13) ---- 類似此性質者的循環。 真空沈積裝置的真空反應室内,更進一步提供所需數 目的其他所需部件(未於第2圖中繪示),例如用於監控蒸 發速率的裝置、用於膜層圖案化的光罩、及其他。 第2圖中緣示有三個蒸發源,但是可能使用更多的蒸 發源,,係依據藉由真空沈積所形成之膜層的層數而定。 ^通常’藉由真空沈積形成膜層時,基板的溫度會隨著 祭發源加熱的開始而平緩上升。同時隨著主窗板的打開, 基板溫度會快速上升,直到主窗板關閉為止。本發明的第 一個重點是’基板的溫度會從蒸發源開始加熱時平緩升 雨’直至膜層形成完;再者,基板溫度係維持在在7 〇它或 更低。基板溫度增加的速率較佳的是丨· 5。〇/秒或更低,更 佳的疋0 · 7 5 C /秒或更低’最佳的是零(即固定的基板溫 度),甚至是在主窗板已經打開後。 當膜層的形成結束後,關閉主窗板,並且停止加熱蒸 發源(熱供給變為零),基板溫度快速下降。本發明的第二 個重點是基板溫度平緩下降。基板溫度下降速率較佳的是 1· 5 °c /秒或更低,更佳的是〇· 75 °C /秒或更低。 基板溫度這樣的上升與下降是引人注意的,特別是高 沸點的材料的真空蒸氣沈積,而且在普通的有機電激光元 件製造過程中,特別是從金屬物質形成電極層,已成為問 崎。基板的溫度變化速率可能變大’而且在有機化合&薄 膜層的形成上,是根據所使用之每一有機物質的特^、沈 積速率的穩定性、每一層的厚度等等而定。因此,根據本518908 V. Description of the invention (13) ---- A cycle similar to this nature. The vacuum reaction chamber of the vacuum deposition device further provides the required number of other required components (not shown in Figure 2), such as a device for monitoring the evaporation rate, a photomask for patterning the film layer, and other. In Figure 2 there are three evaporation sources, but more evaporation sources may be used, depending on the number of film layers formed by vacuum deposition. ^ Usually, when the film layer is formed by vacuum deposition, the temperature of the substrate gradually rises as the heating of the sacrificial source starts. At the same time, with the opening of the main window, the temperature of the substrate will rise rapidly until the main window is closed. The first important point of the present invention is that the temperature of the substrate will gradually increase from the time when the evaporation source starts to heat until the film layer is formed; further, the substrate temperature is maintained at 70 ° C or lower. The rate at which the substrate temperature increases is preferably 5 ·. 〇 / s or lower, more preferably 疋 0 · 7 5 C / s or lower 'is optimally zero (ie, fixed substrate temperature), even after the main window has been opened. When the formation of the film layer is completed, the main window panel is closed, and the heating evaporation source is stopped (the heat supply becomes zero), and the substrate temperature is rapidly decreased. The second important point of the present invention is that the substrate temperature drops gently. The substrate temperature decreasing rate is preferably 1.5 ° C / sec or lower, and more preferably 0.75 ° C / sec or lower. The rise and fall of the substrate temperature is noticeable, especially the vacuum vapor deposition of high-boiling materials, and the formation of electrode layers from metal materials in the manufacturing process of ordinary organic electric laser devices has become a problem. The temperature change rate of the substrate may become larger, and the formation of the organic compound & thin film layer depends on the characteristics of each organic substance used, the stability of the deposition rate, the thickness of each layer, and so on. Therefore, according to this

518908 ’貫際上在製造具有低漏電流的有機電激光元 的是在真空沈積裝置中連續形成所有膜層的步 在形成這些膜層步驟之前和之後(降太其士 層之前的步驟外),操作基板溫度;基板 多層的情況下,只要維持上述溫度改變速率及 隨後的蒸發步驟可能不需等待蒸發源到達所需 一蒸發源也是一熱產 時,基板 的厚度、 明所描述 度控制亦 生大量的 在膜層形 的製程中 升,因此 4材料的 生源, 溫度增 真空沈 的溫度 可。當 蒸氣黏 成時之 ,使用 基板與 利用效 所要考 加速率 積速率 增加速 蒸發源 著在真 材料的 基板溫 蒸發源 能成為 五、發明說明(14) 發明的製程 件上,較佳 驟中,以及 上形成第一 在形成 基板溫度, 溫度的時間 因此每 發源與基板 且,根據每 形狀等,可 度’即使在 距離太大時 部,而非基 降低。同時 藉以抑制基 減小,並且 是本發明的 例子 的距離夠大 一膜層形成 以觀察本發 基板沒有溫 ,蒸發源產 板,並且用 ’在本發明 板溫度的上 使膜層形成 另一重點。 慮的是當蒸 較低,並 、蒸發源的 率和基板溫 與基板間的 空反應室内 利用效能會 度控制器, 間的距離可 可行的。這 本發明將伴隨著τ , 本發明並不限定在這 ^例子做更清楚的描述。然而, 範圍當屬本發明。〜彳lj子,只要不脫離本發明之精神和 〔例1 ] 步驟(A)(第一電極的形成)518908 'Consistently in the production of organic electro-laser elements with low leakage current, the steps of continuously forming all film layers in a vacuum deposition device are before and after the steps of forming these film layers (outside the steps before descending the tarmac layer) In the case of multiple substrates, as long as the above temperature change rate and subsequent evaporation steps are maintained, it may not be necessary to wait for the evaporation source to reach the required one. When the evaporation source is also a thermal output, the thickness of the substrate and the degree of control are also described. A large number of rises in the film-shaped process, so the temperature of the 4 materials can increase the temperature of the vacuum sink. When the vapor sticks, the use of the substrate and the utilization rate must be considered. The rate of increase of the rate of increase of the rate of evaporation is due to the fact that the temperature of the substrate of the real material can be the source of evaporation. 5. Inventory (14) The process of the invention is better. First, the temperature of the substrate is first formed, and the time of the temperature is therefore per source and the substrate and, depending on each shape and the like, the degree can be reduced even when the distance is too large, not the base. At the same time, the distance of the substrate is reduced, and it is an example of the present invention. The distance of the film layer is large enough to observe that the substrate of the present invention is not warm. The evaporation source produces a plate. Focus. It is considered that when the vaporization is low, the efficiency of the evaporation source, the temperature of the substrate, and the empty reaction room between the substrate and the use of the efficiency controller, the distance between them may be feasible. This invention will be accompanied by τ, and the invention is not limited to this example for a clearer description. However, the scope belongs to the present invention. ~ 彳 lj 子, as long as it does not depart from the spirit of the present invention and [Example 1] Step (A) (Formation of the first electrode)

518908 五、發明說明(15) 在厚度為0 · 7 mm的玻璃基板上利用濺鍍法形成銦錫氧 化物(indium tin oxide ; ΙΤ0)層,使其片電阻(sheet resistance)變為15Ω/0 ;再藉由蝕刻(圖案化)將其不需 要的,份移除,以得到具有IT0陽極(第一電極)(此後,= 此段落中,具有第一電極的基板簡稱為、、基板,,)。將此 基板置於中性清潔溶液中進行超音波清潔,之後放入異丙 醇(isopropyl alC0h0l)中,然後將其充份地乾燥,再於 110 °C下進行UV-臭氧清潔5分鐘。 、 步驟(B)(有機薄膜的形成) ,上述基板的-面’非第一電極的那面’黏著且固定 到具有基板支撐裝置的熱釋放和吸收裝置,此基板固定哭 二供二電阻加熱型的真空沈積裝置且具有基板溫度控制。。 =。=此例子中’為了提高基板和基板支撐器之間的黏 力,向下與銦薄板壓合並介於其間。 在此例子中使用的真空沈積裝置具有5個基發源 (=〇⑴atl0n _rce),從蒸發源到基板的距離約⑽ 熱釋放和吸收裝置係由不銹鋼所構成,1、、曰 藉由將内部之含說的隋性液體進行 接:二:: 釋放和吸收裝置之表面與基板接觸,盆且衣付此熱 大高度(Ry)= 800 nm或更小。 以及(2)取 接著,所有將形成各層的原料被 源,如下所述。 你別的瘵發518908 V. Description of the invention (15) An indium tin oxide (ITO) layer is formed on a glass substrate having a thickness of 0.7 mm by sputtering, so that its sheet resistance becomes 15Ω / 0 ; And then remove unnecessary portions by etching (patterning) to obtain an IT0 anode (first electrode) (hereafter, = in this paragraph, the substrate with the first electrode is simply referred to as, substrate, ). This substrate was placed in a neutral cleaning solution for ultrasonic cleaning, then placed in isopropyl alC0h0l, and then fully dried, and then subjected to UV-ozone cleaning at 110 ° C for 5 minutes. Step (B) (formation of organic thin film), the -side of the substrate, the side other than the first electrode, is adhered and fixed to a heat release and absorption device having a substrate supporting device, and the substrate is fixed for two resistance heating Type vacuum deposition device and has substrate temperature control. . =. = In this example ', in order to increase the adhesion between the substrate and the substrate holder, it is pressed down with the indium sheet and interposed therebetween. The vacuum deposition device used in this example has 5 basic sources (= 〇⑴atl0n _rce). The distance from the evaporation source to the substrate is approximately ⑽ The heat release and absorption device is made of stainless steel. The connection of the inert liquid is as follows: 2: The surface of the release and absorption device is in contact with the substrate, and the basin and clothing are subjected to this high thermal height (Ry) = 800 nm or less. And (2) Take Next, all the raw material blankets that will form each layer are described below. Your other hair

第18頁 518908 五、發明說明(16) (1)將200 mg之用於電洞傳輸層(hole transport layer)的物質,即 N,N’-二苯基-N,N,-雙(1-奈基)-(1,1,-雙苯基)-4, 4’ -二胺(N,Ν’ -diphenyl-N,N,-bis( α -naphthyl)-1,1’-biphenyl-4,4’-diamine ;簡稱 α -NPD),放置於鉬舟(molybdenum boat),且將此鉬舟設置 於蒸發源内。 α - NPD的結構如下所示。Page 18 518908 V. Description of the invention (16) (1) 200 mg of substance for the hole transport layer (N, N'-diphenyl-N, N, -bis (1) -Nayl)-(1,1, -bisphenyl) -4, 4'-diamine (N, N'-diphenyl-N, N, -bis (α -naphthyl) -1,1'-biphenyl- 4,4'-diamine; referred to as α-NPD), placed on a molybdenum boat, and the molybdenum boat was set in an evaporation source. The structure of α-NPD is shown below.

(2)將 200 mg之用於綠發光層(green iuminescent layer)及亦用於電子傳輸層(eiectr〇n transport layer) 的物質’即二(8-奎林)|呂錯合物(tris(8-quinolinolato) aluminum complex ;簡稱Alq3),放置於鉬舟,且將此鉬 舟設置於蒸發源内。 A 1 q 3的結構如下所示。(2) 200 mg of the substance used in the green iuminescent layer and also in the electron transport layer (iectron transport layer), namely di (8-Quillin) | Lu complex (tris ( 8-quinolinolato) aluminum complex; referred to as Alq3), placed in a molybdenum boat, and the molybdenum boat is set in an evaporation source. The structure of A 1 q 3 is shown below.

第19頁 518908 五、發明說明(17)Page 19 518908 V. Description of the invention (17)

(3)將2克的鋁和〇 · 5克的鋰兩者做為陰極的物質放置 在個別的鎢舟,且將此鎢舟設置於蒸發源内。鋰需快速地 設置妥當,以抑制其表面的氧化,且在設置完後,立即開 始排出真空反應室。(3) Put 2 g of aluminum and 0.5 g of lithium as the cathode in a separate tungsten boat, and set this tungsten boat in the evaporation source. Lithium needs to be set up quickly to suppress oxidation on its surface, and immediately after it is set out, the vacuum reaction chamber is started.

然後,真空反應室内部的真空度的級數會降至— 5帕 (Pa^,广操作基板溫度控制裝置(㈣心❺ cor^t^olleo,並開始控制基板溫度。將包含“―NpD iiL加熱’h當沈積速度穩定在約°」nm/sec時,打開主 相同的方彳ττ > 板且凡成龟洞傳輸層的形成。在 相门的方式下,在沈積速度約為01 以形成厚度為7。⑽的發光層(亦可 些有機層的形成僅使用一個光罩,形 ^二。& 步驟(C)(第二電極的形成) 形成有機層的圖案。 下事先將用於形成陰極的光罩和用 518908 五、發明說明(18) ------- 於有機化合物薄層的光罩設置在真空反應室内,而每一個 光罩可由一從真空反應室外所製做的順序來選擇)在設置 好用於形成陰極的光罩後,加熱含鋰的鎢舟和含鋁的鎢 f ’亚控制鋰和鋁的沈積速度,使鋰對鋁的比例變成約〇 · 1%然後’打開主窗板。陰極層的形成速度為2 nm/sec。 ^陰極層的厚度到達2 5 〇 nm時,關閉主窗板,並停止此兩 ?备發源的加熱。 在本發明中,藉由氣相沈積來處理步驟(B)和(c)。真 空沈積的技術是一種在真空下將蒸發源加熱,以產生蒸氣 或分子團(cl uster),而將蒸氣或分子團沈積在基板上。 對上述之加熱而言,可以使用電子束加熱(electron beam heat ing) ’其包括施用電子束至一物質,以將其直接加 熱’或者使用電阻加熱(resistance heating)等等。 在此例子中,使用鋰/鋁混合物做為陰極。將鋰混入 銘中’以得到較高的電子注入效率,且鋰的高度從有機層 和陰極之間的界面可高達數十·。當含鐘的鋁層之厚度達 到上述之數十nm時,經的沈積可能會停止,之後繼續形成 的陰極可能僅有鋁。 當所有層的形成完成後,在基板溫度控制器的操作 下’將產品冷卻至室溫,以使基板的溫度變化速度成為1 5 °C或更低。此後,慢慢將乾燥的氮氣導入真空反應室 中。 當真空反應室變成大氣壓時,將產品快速地取出,並 在乾燥的氮氣存在的情況下,用蓋子和黏著劑將其密封。Then, the number of steps of the degree of vacuum inside the vacuum reaction chamber will be reduced to -5 Pa (Pa ^, operating the substrate temperature control device (㈣ 心 ❺ cor ^ t ^ olleo, and start to control the substrate temperature. It will include "-NpD iiL Heating 'h When the deposition rate is stable at about ° "nm / sec, open the main square 彳 ττ > plate and form the formation of the transport layer of the turtle hole. In the phase gate method, the deposition rate is about 01 to A light emitting layer having a thickness of 7. is formed. (Organic layers can be formed using only a photomask, and the shape is two. &Amp; Step (C) (Formation of the second electrode). The pattern of the organic layer will be used in advance. The photomask used for forming the cathode and the 518908 V. Description of the invention (18) ------- The photomask for the organic compound thin layer is set in the vacuum reaction chamber, and each photomask can be made from a vacuum reaction chamber Choose the order of doing) After setting the photomask used to form the cathode, heat the lithium-containing tungsten boat and aluminum-containing tungsten f 'sub to control the deposition rate of lithium and aluminum, so that the lithium to aluminum ratio becomes about 0 ·· 1% and then 'open the main window. The formation rate of the cathode layer is 2 nm / sec. When the thickness of the electrode layer reaches 250 nm, the main window plate is closed and the heating of these two sources is stopped. In the present invention, steps (B) and (c) are processed by vapor deposition. Vacuum-deposited Technology is a method of heating an evaporation source under vacuum to generate vapor or cluster, and depositing vapor or molecular clumps on a substrate. For the above heating, electron beam heating (electron beam heat ing) can be used. ) 'It includes applying an electron beam to a substance to directly heat it' or using resistance heating, etc. In this example, a lithium / aluminum mixture is used as the cathode. Lithium is mixed into the inscription 'to obtain High electron injection efficiency, and the height of lithium can be as high as several tens from the interface between the organic layer and the cathode. When the thickness of the bell-containing aluminum layer reaches the above several tens of nm, the deposited deposition may stop, after that The cathode that continues to form may be only aluminum. After the formation of all layers is completed, the product is cooled to room temperature under the operation of the substrate temperature controller so that the temperature change rate of the substrate becomes 15 ° C or lower. After slowly dried nitrogen introduced into the vacuum chamber when the vacuum chamber becomes the atmospheric pressure, the product will be rapidly removed, and dried in the presence of nitrogen, and with a cap adhesive seal it.

518908518908

〔例2〕[Example 2]

第22頁 518908 五、發明說明(20) 步驟(A)(第一電極的形成) 在基板上形成ITO陽極層,並將其進行清洗,其方法 與例1相同,藉以完成步驟(A)。 步驟(B)(有機薄膜的形成) 此步驟和下一個步驟(C)中係使用相同的真空沈積裝 置,如例1中的真空沈積裝置。使用與例1相同的方式,將 基板固定到具有基板支撐裝置的熱釋放和吸收裝置,而且 將後續用於形成各層的物質分別放置至舟且設置相對應的 蒸發源。其使用與例1相同的舟,即用於有機物質的鉬製 舟和用於陰極物質的鎢製舟。 (1 ) 2 0 Omg的α -NPD做為電洞傳輸層的物質。 (2)200mg 的DPVBi(4, 4’ -bis(,2’ -diphenylvinyl) b i pheny 1 )做為藍發光層的物質。 D P V B i的結構如下所示。Page 22 518908 V. Description of the invention (20) Step (A) (Formation of the first electrode) The method of forming an ITO anode layer on a substrate and cleaning it is the same as in Example 1 to complete step (A). Step (B) (Formation of Organic Thin Film) This step and the next step (C) use the same vacuum deposition apparatus, such as the vacuum deposition apparatus in Example 1. In the same manner as in Example 1, the substrate was fixed to a heat release and absorption device having a substrate supporting device, and the subsequent substances used to form each layer were separately placed on a boat and a corresponding evaporation source was set. It used the same boat as in Example 1, namely, a boat made of molybdenum for organic matter and a boat made of tungsten for cathode matter. (1) 20 mg of α-NPD is used as the material of the hole transport layer. (2) 200 mg of DPVBi (4, 4 '-bis (, 2' -diphenylvinyl) bi pheny 1) was used as the substance of the blue light-emitting layer. The structure of D P V B i is shown below.

第23頁 518908 五、發明說明(21) (3)200g的Alq做為電子傳輸層。 (4 ) 2 g的A 1做為陰極的物質。 (5 ) 0 · 5 g的L i做為陰極的物質。 設置L i的方式,與例1相同。排出的方式與例1相同; 當真空度的級數達到1 〇-5帕(p a )時,開始藉由基板溫度控 制裝置控制基板溫度。 之後,將包含a -NPD的鉬舟慢慢加熱,當沈積速度穩 定在約0· lnm/sec時,打開主窗板並開始形成物質層。當 此層的厚度達到5〇nm時,關閉主窗板,且完成電洞傳輸層 的形成。在相同的方式下’在沈積速度約為〇· lnm/sec下 沈積DPVBi,以形成厚度為“㈣的發光層。亦在相同的方 式下,在沈積速度約為〇lnm/sec下沈積Alq3,以形成厚 度為40、nm的電子傳輸層。這些有機層的形成僅使用一個 光罩,並形成有機層的圖案。 步驟(C)(第二電極的形成) 1积:ΐ ΐ極的光罩’而形成陰極的方式與例1相同。當 ;二,=二,f預定的改變速度下,將基板的溫度降低至 ^ ^用與例1相同的密封方法到電激發光元 才%作基板溫度岳丨|哭 14, ^ 成的元件取出後二至將真空反應室打開且將完 表面取尚的溫度約為6〇 〇c,且 Γ t 上形成4個發光區,而每一 / σ C。在一片基板 板上形成4個偾| a 個均為2nm X 2nm,藉以在一基 烙成4個像素所有相同的結構。 518908 五、發明說明(22) 〔比較例2〕 以例2中的方法,製造如例2中具有相同結構的有機電 激發光元件,除了基板溫度控制器沒有在物質層形成步 期間操作(α-NPD蒸發源的加熱—形成NpD層-完成 加=:停止運作-DPVBi蒸發源的加熱—形‘DpvJ層 -完成~加熱-停止運作—Alq蒸發源的加熱—形成 層—完成加熱-停止運作—陰極物質蒸發源的加熱一 形成陰極物質層-完成加熱—停止運作—取出)。從基 板溫度控制器沒有操作後,基板溫度會從每一個加熱源^ 始加熱時逐漸地增加,隨著主窗板的打開而快速地增加, 且持續增加直到主窗板關閉為止。當主窗板關閉且^ 一蒗 發源加熱停止後,基板溫度會同時地快速下降。: 勢,特別是發生在沈積陰極物質的時候。在陰極層形成 間’基板溫度增加速度的最大值為22t:/秒;在^極層= 成後’基板溫度降低速度的最大值為—181 ; =二 超過70 °C,約為80。(:左右。 土板/皿度 在有機層的形成上,Alq(在有機物質之中, 最而的蒸發溫度)層的形成期間,基板溫度 過1.5X:/秒。 i化迷度超 〔例3〕 步驟(A)(第一電極的形成) 在基板上形成I TO陽極層,並將其進行清洗,豆 與例1相同,藉以完成步驟(A)。 ’、法 步驟(B )(有機薄膜的形成)Page 23 518908 V. Description of the invention (21) (3) 200g of Alq is used as the electron transport layer. (4) 2 g of A 1 is used as the material of the cathode. (5) 0 · 5 g of Li is used as the material of the cathode. The way to set L i is the same as in Example 1. The discharging method is the same as in Example 1. When the degree of vacuum reaches 10-5 Pa (p a), the substrate temperature is controlled by the substrate temperature control device. After that, the molybdenum boat containing a-NPD was slowly heated. When the deposition rate was stabilized at about 0.1 nm / sec, the main window plate was opened and a material layer started to form. When the thickness of this layer reaches 50 nm, the main window plate is closed, and the formation of the hole transport layer is completed. In the same manner, DPVBi was deposited at a deposition rate of about 0.1 nm / sec to form a light-emitting layer having a thickness of ㈣. In the same manner, Alq3 was deposited at a deposition rate of about 0.1 nm / sec. In order to form an electron transporting layer with a thickness of 40 nm, these organic layers are formed using only one photomask and a pattern of the organic layer is formed. Step (C) (Formation of the Second Electrode) 'The method of forming the cathode is the same as in Example 1. When the second, = two, f predetermined change rate, the temperature of the substrate is reduced to ^ ^ using the same sealing method as in Example 1 until the electro-excitation photon is used as the substrate Temperature Yue 丨 | After crying out, the temperature of the completed element is two to two, the vacuum reaction chamber is opened and the finished surface temperature is about 60 ° C, and 4 light-emitting areas are formed on Γ t, and each / σ C. Four 偾 | a are formed on a substrate plate, all of which are 2nm X 2nm, so that the four pixels have the same structure on the same substrate. 518908 V. Description of the invention (22) [Comparative Example 2] Take Example 2 Method to produce an organic electroluminescent device with the same structure as in Example 2, except The plate temperature controller did not operate during the material layer formation step (heating of the α-NPD evaporation source-formation of the NpD layer-completion plus =: stop operation-heating of the DPVBi evaporation source-shaped 'DpvJ layer-completion ~ heating-stop operation- Heating of Alq evaporation source—forming layer—complete heating—stop operation—heating of cathode material evaporation source—forming of cathode material layer—complete heating—stop operation—removal). After the substrate temperature controller is not operated, the substrate temperature will change from every A heating source ^ gradually increases at the beginning of heating, and increases rapidly with the opening of the main window, and continues to increase until the main window is closed. When the main window is closed and the heating of the source is stopped, the temperature of the substrate will increase. Simultaneous rapid decline .: Potential, especially when the cathode material is deposited. The maximum value of the substrate temperature increase rate during the formation of the cathode layer is 22t: / s; The maximum value is -181; = more than 70 ° C, about 80. (: about. The soil plate / dish degree in the formation of the organic layer, Alq (the most evaporation temperature among organic materials) layer During the formation, the substrate temperature was over 1.5X: / sec. The temperature was too high. [Example 3] Step (A) (Formation of the first electrode) An ITO anode layer was formed on the substrate and washed. 1 is the same to complete step (A). ', Method step (B) (formation of organic thin film)

518908518908

五、發明說明(23) 此步驟和下一個步驟(c )中係使用相同的真空沈壯 置,如例1中的真空沈積裝置。使用與例1相同的方式袭 基板固定到具有基板支撐裝置的熱釋放和吸收裝置將 將後續用於形成各層的物質分別放置至舟且設置相對:且 瘵發源。其使用與例1相同的舟,即用於有機物質的鉬〜制的 舟和用於陰極物質的鎢製舟。 衣 (1 ) 20 0mg的α -NPD做為電洞傳輸層的物質。 (2) 1 OOmg 的DCM(4-(dicyanome thy lene)-2iethy 1 - 6- (p-dimethylaniinostytyl)-4H-pyran)做為紅發光層的物V. Description of the invention (23) In this step and the next step (c), the same vacuum deposition equipment is used, such as the vacuum deposition equipment in Example 1. In the same manner as in Example 1, the substrate was fixed to a heat release and absorption device having a substrate supporting device. Substances used to form each layer were placed on the boat and placed opposite each other: and the source was generated. The same boat as in Example 1 was used, that is, a boat made of molybdenum for organic materials and a boat made of tungsten for cathode materials. (1) 20 mg of α-NPD is used as the material of the hole transport layer. (2) 100 mg of DCM (4- (dicyanome thy lene) -2iethy 1-6- (p-dimethylaniinostytyl) -4H-pyran) as the red light-emitting layer

DCM的結構如下所示。The structure of DCM is shown below.

(3) 200mg 的Alq (4) 2g的A1做為陰極的物質。 (5) 0.5g的Li做為陰極的物質。 設置Li的方式,與例1相同。(3) 200 mg of Alq (4) 2 g of A1 as the cathode material. (5) 0.5g of Li is used as the material of the cathode. The method of setting Li is the same as in Example 1.

麵 第26頁 518908 五、發明說明(24) 之後,排出的方式與例1相同;當真空度的級數達到 1 0_5帕(Pa)時,開始藉由基板溫度控制裝置控制基板溫 度。 之後’將包含a - N P D的舟慢慢加熱,當沈積速度移 定在約0· lnm/sec時,打開主窗板並開始形成物質層。當、 此層的厚度達到5 0 nm時’關閉主窗板,且完成電洞傳輪層 的形成。相繼地加熱含A1 q的鉬舟和含dcm的鉬舟;控制 Alq和DCM的沈積速度,使DCM對Alq的重量比變成1% ;以及 打開主窗板。當Alq-DCM混合層的厚度達到5〇nm時,僅關 閉含DCM的_舟之蒸發源的主窗板,並停止加熱。在發光 層中的Alq具有主物質(host material)的功能',以使X其 推雜D C Μ ( * 種發光物質)。 之後,為了形成電子傳輸層,僅沈積41(1,I厚度為 。因此,形成發光層(a1q/dcm混合層)及電子傳輸層 ^Alq)這些有機層的形成僅使用一個光罩,其具有 /、例1相同的形狀,並形成有機層的圖案。 步驟(C)(第二電極的形成) i开4:ί極:光罩’而形成陰極的方式與例1相同。1 =速度下,將基板的溫度降低 件。 使用與例1相同的密封方法到電激發光元 操作基板溫度控制哭, 成的元件取出後為卜 、,、玉反應室打開且將 表面最高的:。在操作基板溫度控制器期間,基 敢-的'皿度約為6(rc,且沒有超過7(rc。在一片基 518908 五、發明說明(25) 上形成4個發光區’而母一個均為2ππι X 2πιη,藉以在一某 板上形成4個像素所有相同的結構。 〔比較例3〕 以例3中的方法,製造如例3中具有相同結構的有機電 激發光元件,除了基板溫度控制器沒有在物質層形成步驟 期間操作(α -NPD蒸發源的加熱-形成α —NPD層-完成 加熱-停止運作- Alq和DCM蒸發源的加熱一形成^^和 DCMj -完成DCM蒸發源的加熱—繼續Mq蒸發源的加熱 〜完成A lq蒸發源的加熱-停止運作-陰極物質蒸發源 的加熱~形成陰極物質層—完成加熱—停止運作-取 出)。從基板溫度控制器沒有操作後,基板溫度會從每一 個加熱源開始加熱時逐漸地增加,隨著主窗板的打開而快 =?加’且持續增加直到主窗板關閉為止。f主窗板關 ^且母—蒸發源加熱停止後,基板溫度會同時地快速下 ΐ炼ί樣的趨勢,特別是發生在沈積陰極物質的時候。在 ,、極,形成期間,基板溫度增加速度的最大值為21口 ‘ :3 Ϊ f層形成後,基板溫度降低速度的最大值為―1.8 ,土板溫度超過7 〇 °C,約為8 0 °C左右。 最高ΐΪί層的形成上,Mq(在有機物質之中,AU擁有 過1.5 = t 層的形成期間’基板溫度的變化速度超 〔例4〕 與例1使相用同與t製造有機電激光元件相同的材料,使用 '。的瘵况沈積裝置,來製造2 5 6 (陽極數目)χPage 26 518908 V. After the description of the invention (24), the discharge method is the same as in Example 1. When the degree of vacuum reaches 10-5 Pa (Pa), the substrate temperature is controlled by the substrate temperature control device. After that, the boat containing a-NP is slowly heated, and when the deposition speed is shifted to about 0.1 nm / sec, the main window plate is opened and a material layer starts to form. When the thickness of this layer reaches 50 nm, the main window plate is closed and the formation of the hole-passing layer is completed. The molybdenum boat containing A1 q and the molybdenum boat containing dcm were successively heated; the deposition rate of Alq and DCM was controlled so that the weight ratio of DCM to Alq became 1%; and the main window was opened. When the thickness of the Alq-DCM mixed layer reaches 50 nm, only the main window plate of the evaporation source containing DCM is closed, and the heating is stopped. The Alq in the light-emitting layer has the function of a host material, so that X is doped with D C M (* light-emitting materials). After that, in order to form an electron transport layer, only 41 (1, I thickness is. Therefore, the organic layer is formed using a light-emitting layer (a1q / dcm mixed layer) and an electron transport layer ^ Alq). /, The same shape as in Example 1, and a pattern of an organic layer was formed. Step (C) (Formation of the second electrode) The method of forming the cathode in the same manner as in Example 1 is as follows. 1 = Reduces the temperature of the substrate at speed. The same sealing method as in Example 1 was used to control the temperature of the substrate to electrically excite the light source. After the components were taken out, the reaction chamber was opened and the surface was highest: During the operation of the temperature controller of the substrate, the base temperature is about 6 (rc, and does not exceed 7 (rc. 4 light-emitting areas are formed on a piece of base 518908 V. Invention Description (25)) and the mother is uniform. It is 2ππι X 2πιη, so that 4 pixels have the same structure on a certain board. [Comparative Example 3] Using the method in Example 3, an organic electroluminescent device having the same structure as in Example 3 was manufactured, except for the substrate temperature. The controller did not operate during the material layer formation step (heating of the α-NPD evaporation source-formation of the α -NPD layer-completion of heating-stopping operation-heating of Alq and DCM evaporation sources-formation of ^^ and DCMj-completion of DCM evaporation sources Heating-continue heating of Mq evaporation source ~ complete heating of A lq evaporation source-stop operation-heating of cathode material evaporation source ~ formation of cathode material layer-complete heating-stop operation-take out). After no operation from substrate temperature controller, The temperature of the substrate will gradually increase from the beginning of each heating source, and it will increase quickly as the main window panel is opened and continue to increase until the main window panel is closed. F The main window panel is closed ^ and the mother-evaporation source is heating stop Later, the temperature of the substrate will be rapidly reduced at the same time, especially when the cathode material is deposited. During the formation of the cathode, the maximum temperature increase rate of the substrate is 21 ': 3 Ϊ f layer After the formation, the maximum temperature decrease rate of the substrate is ―1.8, and the soil plate temperature exceeds 70 ° C, which is about 80 ° C. In the formation of the highest layer, Mq (Among organic substances, AU has over 1.5 = During the formation of the t layer, 'the substrate temperature changed at a faster rate [Example 4] The same material as that used in Example 1 was used to fabricate the organic electro-laser element, and the condition deposition device was used to manufacture 2 5 6 ( Number of anodes) χ

第28頁 518908 五、發明說明(26) 2(陰極數目)點綠色有機電激光面板,其具有與例1之有 =電激^t件㈣㈣層結構。#_個像素的形狀 (r〇w)方向和每一行(column)方向為〇 33咖高度/〇 〇4_ 二„成係使用與例1相同的材料,厚度與例"目 :封:了玻璃基板、陽極圖·、有機層光罩、陰極光單和 ΠΐΓν 形狀與例1不同。膜層的形成係使 /目η的基板溫度控制器,且基板的溫度改變速率 :控:,75 口秒或小於此絕對值。即使在膜層形成J 板溫度控制器仍持續操作—陣子,當基板溫度降至 广,慢慢將乾燥的氮氣導入真空反應室 壓力變為大氣壓時,•生成的面板快速自真i 黏;。繼鋅i:亚在乾燥氮氣的存在下,密封在套子内:及 並將^ 呆作基板溫度控制器,直到打開真空反應室, 其拓=而沾面板取出為止。在操作基板溫度控制器期間, 基板表面的最高溫度約為60 °c,且不超過70 t:。 〔比較例4〕 激於::4徠中的方法’製造如例4中具有相同結構的有機電 期3 m除了基板溫度控制器沒有在物質層形成步驟 個Λ拥攸基板溫度控制器沒有操作後,基板溫度會從 源開始加熱時逐漸地增加,隨著主窗板的打開 、k B加,且持續增加直到主窗板關閉為止。當主窗 Ϊ:閉2 —蒸發源加熱停止後,基板溫度會同時地快速 降k樣的趨勢,特別是發生在沈積陰極物質的時候。 在陰極層形成期間,基板溫度增加速度的最大值為2 π /Page 28 518908 V. Description of the invention (26) 2 (number of cathodes) dot green organic electric laser panel, which has the same layer structure as that of Example 1. The shape (r〇w) direction of each pixel and the direction of each column (column) are 〇33 coffee height / 〇〇4_ Second, the system uses the same materials as in Example 1, thickness and example " head: seal: the The shape of the glass substrate, the anode, the organic layer mask, the cathode light sheet, and ΠΐΓν are different from those in Example 1. The formation of the film layer is based on the substrate temperature controller of the mesh, and the temperature change rate of the substrate: control: 75 ports Second or less than this absolute value. Even if the J-plate temperature controller is formed in the film layer, the temperature controller continues to operate—for a while, when the substrate temperature drops to a wide range, the dry nitrogen is slowly introduced into the vacuum reaction chamber when the pressure becomes atmospheric pressure. Quickly self-adhesive; followed by zinc i: sealed in the sleeve in the presence of dry nitrogen: and will be used as a substrate temperature controller until the vacuum reaction chamber is opened, and the top panel is removed. During the operation of the substrate temperature controller, the maximum temperature on the surface of the substrate was about 60 ° C, and did not exceed 70 t: [Comparative Example 4] Excited by :: 4 The method of manufacturing the same structure as in Example 4 Organic electricity period 3 m except substrate temperature control There is no step in the formation of the material layer. After the substrate temperature controller is not operated, the substrate temperature will gradually increase when the source is heated. With the opening of the main window, k B increases, and continues to increase until the main window is closed. So far, when the main window is closed: 2-after the heating of the evaporation source is stopped, the temperature of the substrate will decrease rapidly at the same time, especially when the cathode material is deposited. During the formation of the cathode layer, the maximum temperature of the substrate increases Value is 2 π /

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第29頁 518908 五、發明說明(27) 秒[在陰極層形成後,基板溫度降低速度的最大值為1 · a 在幵/成有機層期間,基板溫度增加的速度大於1 . $ C / 秒,其係依有機層的物質而定。在陰極形成的期 溫度超過70 t。 〔例5〕 製造與例2有相同膜層結構的藍色有機電激光面板, =吏,與例4相同之具有陽極圖案、有機層光罩、陰極光 封套之玻璃基板。膜層的形成係使用與例2相同的 土板溫度控制器,且基板的溫度改變速率係控制在〇. 75 t; 此絕對I °即使在膜層形成完後,基板溫度控 n f操作—陣子,當基板溫度降至室溫時,慢慢將 灰段^ 中。當真空反應室内部的壓力 ^為,巧日守,將生成的面板快速自真空反應内 = 在下,密封在套子内以及黏著。繼續操作 imr直到打開真空反應室,並將完成的面板 溫产約為6〇Ϊ作基板溫度控制器㈣’基板表面的最高 狐度約馮b(JC,且不超過7〇。(3。 〔比較例5〕 激發ΓΓ件中的:法,製造如例5中具有相同結構的有機電 期二举作W ΐ 了基板溫度控制器沒有在物質層形成步驟 IV 溫度控制器沒有操作後,基板溫度會從 ::: 開始加熱時逐漸地増加,隨著主窗板的打開 板關門t τ加’且持續增加直到主窗板關閉為止。當主窗 板關閉且母—蒸發源加熱停止後,基板溫度會同時:快;Page 29 518908 V. Description of the invention (27) seconds [After the formation of the cathode layer, the maximum substrate temperature reduction rate is 1 · a During the formation of the organic layer, the substrate temperature increases at a rate greater than 1. $ C / second It depends on the substance of the organic layer. During the formation of the cathode, the temperature exceeded 70 t. [Example 5] A blue organic electro-optical laser panel having the same film structure as that of Example 2 was fabricated. A glass substrate having an anode pattern, an organic layer mask, and a cathode light envelope was used as in Example 4. The formation of the film layer uses the same soil plate temperature controller as in Example 2, and the temperature change rate of the substrate is controlled at 0.75 t; this absolute I ° Even after the film layer is formed, the substrate temperature is controlled by nf operation—for a while When the temperature of the substrate is lowered to room temperature, slowly place the gray section ^. When the pressure inside the vacuum reaction chamber is ^, Qiao Rishou, will quickly generate the panel self-vacuum reaction = underneath, sealed in the sleeve and adhered. Continue to operate the imr until the vacuum reaction chamber is opened, and the completed panel temperature production is about 60%, which is used as the substrate temperature controller, and the maximum fox degree on the substrate surface is about von b (JC, and not more than 70. (3. 〔 Comparative Example 5] Excitation of the ΓΓ method: The organic electric phase with the same structure as in Example 5 was performed as W 二 The substrate temperature controller was not formed in the material layer. Step IV After the temperature controller was not operated, the substrate temperature It will gradually increase from the beginning of heating: as the main window opens and closes the door t τ ′ and continues to increase until the main window closes. When the main window is closed and the mother-evaporation source heating stops, the substrate The temperature will be at the same time: fast;

518908 五、發明說明(28) 下降。這樣的趨勢,特別是發生在沈積陰極物質的時候。 在陰極層形成期間,基板溫度增加速度的最大值為2 °C / 秒;在陰極層形成後,基板溫度降低速度的最大值為丨· 5 c。在形成有機層期間,基板溫度增加的速度大於u。〇 / 秒’其係依有機層的物質而定。在陰極形成的期間,基 溫度超過7 0 °c。 土 〔例6〕 製造與例3有相同膜層結構的紅色有機電激光面板, ”使2與例4相同之具有陽極圖案、有機層光罩、陰極光 山封套之玻埚基板。膜層的形成係使用與例3相同的 I板溫度控制器,且基板的溫度改變速 陣子’當基板溫度降至室溫時,慢慢將 變兔士二虱蜍入真空反應室中。當真空反應室内部的壓力 ",壓時,將生成的面板快速自真空反應 =鼠氣的存在下,密封在套子内以及黏著。繼續操作 器’直到打開真空反應室,並將完成的面板 溫度約為,且不超過心。&板表面的“ 麵 〔比較例6〕 期間操作。從其士二,,孤";,制裔沒有在物質層形成步驟 备一 ; 土板溫度控制為沒有操作後,基板、、西声合從 -固加熱源開始加熱時逐漸地增加,隨著主窗:二曰丁開518908 V. Description of invention (28) Decline. Such a trend occurs especially when a cathode material is deposited. During the formation of the cathode layer, the maximum temperature increase rate of the substrate was 2 ° C / sec; after the formation of the cathode layer, the maximum temperature decrease rate of the substrate was 5 c. During the formation of the organic layer, the temperature of the substrate increases faster than u. 〇 / sec 'depends on the substance of the organic layer. During the formation of the cathode, the base temperature exceeded 70 ° C. [Example 6] A red organic electro-optical laser panel having the same film structure as that of Example 3 was manufactured. "Make a glass pot substrate with an anode pattern, an organic layer mask, and a cathode light mountain envelope, the same as in Example 4, and make a film layer." The system uses the same I-plate temperature controller as in Example 3, and the temperature of the substrate changes rapidly. When the substrate temperature drops to room temperature, slowly turn the bunny bug into the vacuum reaction chamber. When the inside of the vacuum reaction chamber The pressure ", when pressed, the generated panel is quickly self-vacuum reacted = in the presence of rat gas, sealed in the sleeve and adhered. Continue to operate the device until the vacuum reaction chamber is opened, and the temperature of the completed panel is about, and Do not exceed the heart. &Amp; The surface of the board was operated during the "face [Comparative Example 6]. From the second, the solitary quotation, the system did not prepare the material layer in the preparation step; after the soil plate temperature was controlled to no operation, the substrate, and the sound of the sound from the solid-heat heating source began to gradually increase, with The main window: Er Yue Ding Kai

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第31頁 518908 五、發明說明(29) 而快速地增加,且持續增加直到主窗板關閉為止。當主窗 板關閉且每一蒸發源加熱停止後,基板溫度會同時地快速 下降。這樣的趨勢,特別是發生在沈積陰極物質的時候。 在陰極層形成期間,基板溫度增加速度的最大值為2。〇 / 和,在陰極層形成後,基板溫度降低速度的最大值為1 · 5 t。在形成有機層期間,基板溫度增加的速度大於l5t:/ 秒,其係依有機層的物質而定。在陰極形成的期間,基板 溫度超過7 0 °c。 〔例子和比較例之間的比較〕 在例1至3以及比較例1至3中所製造的有機電激光元 件,係在-15V和H5V之間測量電壓-電流特性。此量測係 以下面兩個方向進行: (1) 施加電壓從0V增加至+ 1 5V的正方向(n〇rmal direction),以及 (2) 施加電壓從〇v降低至一 15v的 direction) 〇 ^^^^(reverse 每一個元件均重覆三次的測量動从 颅Φ= 里勳作,以檢查元件的電 壓-電流特性之再現性。 第3圖係繪示例i和比教例}之測量數 水平軸代表施加的電壓,垂直軸代表 回 之電壓-電流特性差異不大。在例i和 從第3圖中可以清楚地看到,心i;:邑對值的對數。 ★兩阵+ + # ^ 比車父例1之間的正方向 比較例1中,在電壓 1〇¥下,電流約為1〇-3八。 同時,在反方向與漏電流相關的差異較大。在例工 518908 五、發明說明(30) 中,電流幾乎固定在丨〇-3A,甚至當電壓降低時亦然。相反 在比較例1中,當以絕對值表示的電壓變大時,漏電 流會增加。當在—丨5 v進行比較時,比較例1的漏電流比例1 大2至4。 在例1中’在正反兩方向兩者的電壓應用下,可獲得 良好再現性的數據。相反地,在比較例1中,在反方向之 電壓的應用下,在漏電流流動上有一偏差,甚至存在於在 一基板上製造的像素間。這種趨勢亦見於比較例2和比較 例3。在例2和例3中,可以獲得如例1之高再現性和小偏差 的數據。從這些獲得的數據中,整流比率是使用下面的公 式來計算。其結果列於表1。 整流比率= I當施加+1 5 V時的電流丨/丨當施加-1 5 V時的電 流丨 518908 五、發明說明(31) 表1 整流比率 例1 釣 1〇8 比較例1 104 至 1〇6 例2 釣108 比較例2 104 至 1〇6 例3 約1〇8 比較例3 1〇4 至 1〇δ ........... --------Page 31 518908 V. Description of the invention (29) It increases rapidly and continues to increase until the main window panel is closed. When the main window is closed and the heating of each evaporation source is stopped, the temperature of the substrate will decrease rapidly at the same time. Such a trend occurs especially when a cathode material is deposited. During the formation of the cathode layer, the maximum value of the substrate temperature increasing rate was two. ○ / and, after the formation of the cathode layer, the maximum temperature decrease rate of the substrate was 1.5 t. During the formation of the organic layer, the temperature of the substrate increases at a rate greater than 15 t: / sec, which depends on the substance of the organic layer. During the formation of the cathode, the substrate temperature exceeded 70 ° C. [Comparison between Examples and Comparative Examples] The organic electric laser elements manufactured in Examples 1 to 3 and Comparative Examples 1 to 3 were measured for voltage-current characteristics between -15V and H5V. This measurement is performed in the following two directions: (1) the positive direction (n0rmal direction) where the applied voltage is increased from 0V to + 1 5V, and (2) the applied voltage is reduced from 0v to a direction of 15v). ^^^^ (reverse Each element was repeated three times. The measurement was performed from the skull Φ = Li Xun, to check the reproducibility of the voltage-current characteristics of the element. Figure 3 shows the measurement of the example i and the comparison teaching example} The horizontal axis represents the applied voltage, and the vertical axis represents the difference between the voltage and current characteristics. In example i and from Figure 3 it can be clearly seen that the logarithm of the heart i ;: yi pair value. + # ^ Compared with the positive direction of Comparative Example 1 between the car parent example 1, the current is about 10-30 at a voltage of 10 ¥. At the same time, the difference related to the leakage current in the reverse direction is large. In the example 518908 5. In the description of the invention (30), the current is almost fixed at 0-3A, even when the voltage is reduced. In contrast, in Comparative Example 1, when the absolute value of the voltage becomes larger, the leakage current increases. When comparing at 5 V, the leakage current ratio 1 of Comparative Example 1 is 2 to 4 larger. In Example 1, 'both positive and negative Good reproducible data can be obtained by applying both voltages. Conversely, in Comparative Example 1, under the application of voltages in the opposite direction, there is a deviation in the leakage current flow, even in the manufacture on a substrate This trend is also seen in Comparative Examples 2 and 3. In Examples 2 and 3, data with high reproducibility and small deviations as in Example 1 can be obtained. From these obtained data, the rectification ratio is Use the following formula to calculate. The results are shown in Table 1. Rectification ratio = I current when +1 5 V is applied 丨 / 丨 current when -1 5 V is applied 518908 V. Description of the invention (31) Table 1 Rectification ratio example 1 fishing 108 comparison example 1 104 to 106 example 2 fishing 108 comparison example 2 104 to 106 example 3 about 108 comparison example 3 104 to 10 δ ... ..... --------

從表1可以清楚看出,在本發明中,所製造的有機電 激光元件在反方向具有低的漏電流,且在整流上有優越的 結果。 每一個在例4至6以及比較例4至6中製造的256 χ 64點 有機電激光面板,都連接至趨動電路。在丨/ 6 4功率和固; 電流數據h 5虎自行邊(陽極邊)送出後,列邊(陰極邊)連名 ΐ ϋ換至?地;卩此種方式趨動來顯示信件、文字、圖; 4寺,且外表上可觀察到有沒有干擾存在。 此干擾的存在與否列於表2。從表2可以清楚看出,η 板1、 ' 、八有簡單矩陣趨動型的有機電激光〗 518908 五、發明說明(32) 表2 干擾 例1 不存在 比較例1 存在 例2 不存在 比較例2 存在 例3 不存在 比較例3 存在As is clear from Table 1, in the present invention, the manufactured organic electro-optical laser element has a low leakage current in the reverse direction and has excellent results in rectification. Each of the 256 x 64-point organic electro-optical laser panels manufactured in Examples 4 to 6 and Comparative Examples 4 to 6 was connected to a driver circuit. In 丨 / 6 4 the power and solid; the current data h 5 Tigers sent by themselves (anode side), the column side (cathode side) consecutively ϋ ϋ to? Ground; 卩 This way it is acted to display letters, words, pictures; 4 temples, and the presence of interference can be observed on the exterior. The presence or absence of this interference is listed in Table 2. It can be clearly seen from Table 2 that η plate 1, ', and 8 have organic matrix lasers of simple matrix actuation type. 518908 V. Description of the invention (32) Table 2 Interference example 1 does not exist Comparative example 1 Existing example 2 Exists Example 2 Exist Example 3 Exist Comparative Example 3 Exist

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Claims (1)

518908— fr年f月ιϋ曰518908— fr year f month ιϋ J7l, 科播圍 擦號 89113202 1 · 一種有機電激光元件的製造方法,至少包括·· (A) 在一基板上形成一第一電極; (B) 在該第一電極上形成一或多層有機化合物薄膜, 該(等)有機化合物薄膜包含一發光層;以及 (C) 在该(等)有機化合物薄膜層上形成一第二電極, 其中該基板的溫度維持在7〇 °C或更低,基板之溫度改 變的速率維持在1 · 5 °c /秒或低於此絕對值,在步驟(B )和 (C) ’在步驟(B)和(C)之間,和完成步驟(c)時,基板的溫 度變成室溫。 2 ·如申請專利範圍第1項所述之有機電激光元件的製 造方法’其中步驟(B)和(C)係利用真空沈積處理。 3·如申請專利範圍第2項所述之有機電激光元件的製 造方法,其中步驟(8)和((:)中的真空沈積,所使用的真空 沈積裝置至少具有: I (1)具有平滑表面的一基板支撐物,用以支撐一基 板;以及 & (、一土板溫度控制裝置,用於控制該基板的成膜側 表面的溫度,該基板溫度控制裝置的構成至少有·· (2 - 1 ) —溫度感測器; (2-2) —計算裝置; (2 - 3) —熱釋放和吸收裝置。 以及4二;種ΪΓ電ΐ光元件’包括一第-電極、-發光層 特徵在於:”請專利範圍第1項所 述之有機電激光几件的製造方法之製程所形成。 5 · —種有機雷激u 518908 __ 案號 89113202 六、申請專利範圍J7l, Kebowei No. 89113202 1 · A method for manufacturing an organic electric laser device, at least comprising: (A) forming a first electrode on a substrate; (B) forming one or more organic layers on the first electrode A compound film, the (or) organic compound film including a light-emitting layer; and (C) forming a second electrode on the (or) organic compound film layer, wherein the temperature of the substrate is maintained at 70 ° C or lower, The rate of substrate temperature change is maintained at 1.5 ° c / sec or below this absolute value, between steps (B) and (C) 'between steps (B) and (C), and step (c) is completed At this time, the temperature of the substrate becomes room temperature. 2. The method for manufacturing an organic electro-optical laser device according to item 1 of the scope of the patent application, wherein steps (B) and (C) are performed by vacuum deposition. 3. The method for manufacturing an organic electric laser device according to item 2 of the scope of the patent application, wherein the vacuum deposition in steps (8) and ((:), the vacuum deposition device used has at least: I (1) has a smooth A substrate support on the surface for supporting a substrate; and (A soil plate temperature control device for controlling the temperature of the film-forming surface of the substrate, the substrate temperature control device is composed of at least ...) 2-1) —temperature sensor; (2-2) —computing device; (2-3) —heat release and absorption device. The characteristics of the layer are: "Please be formed by the manufacturing process of the organic electro-laser as described in item 1 of the patent scope. 5 · —Organic Thunder Laser u 518908 __ Case No. 89113202 6. Scope of Patent Application 圍第4項所述之複數個有機電激光元件以矩陣方式排列 6· —種真空沈積裝置,至少具有: (1)具有平滑表面的一基板支撐物,用以支撐一基 板;以及 (2 ) —基板溫度控制裝置,用於控制在層膜成型面的 基板之溫度基板,該基板溫度控制裝置的構成至少有: (2-1) 一溫度感測器; (2-2) —計算裝置; (2-3) —熱釋放和吸收裝置; 其中該基板支撐物和該熱釋放和吸收裝置係整合成 元件。 ” 7· —種真空沈積裝置,至少具有: (1)具有平滑表面的一基板支撐物,用以支撐一基 板;以及 ι (2 ) —基板溫度控制裝置,用於控制在層膜成型面的 基板之溫度基板,該基板溫度控制裝置的構成至少有·· (2 - 1 ) —溫度感測器; (2-2) —計算裝置; (2-3) —熱釋放和吸收裝置; 田 其中該基板溫度控制裝置可將該基板的成膜側表面 脈度維持在7 〇,或更低,且該基板的成膜側表面的溫产 改變速率維持在1 · 5 °C /秒或低於此絕對值。 /皿又 8· 一種真空沈積裝置,至少具有: (1)具有平滑表面的一基板支撐物,用以支擔一装 板;以及 又保基The plurality of organic electro-laser elements described in item 4 are arranged in a matrix manner. 6 · A vacuum deposition device having at least: (1) a substrate support having a smooth surface for supporting a substrate; and (2) — A substrate temperature control device for controlling the temperature substrate of the substrate on the lamination film forming surface, the substrate temperature control device is composed of at least: (2-1) a temperature sensor; (2-2) — a computing device; (2-3) —Heat release and absorption device; wherein the substrate support and the heat release and absorption device are integrated into a component. 7. A vacuum deposition device having at least: (1) a substrate support having a smooth surface to support a substrate; and (2)-a substrate temperature control device for controlling the The temperature of the substrate, the substrate temperature control device is composed of at least (2-1)-temperature sensor; (2-2)-computing device; (2-3)-heat release and absorption device; Tian Zhong The substrate temperature control device can maintain the pulse rate of the film-forming side surface of the substrate at 70 or lower, and the temperature production change rate of the film-forming side surface of the substrate can be maintained at 1.5 ° C / sec or lower. This absolute value is 8. A vacuum deposition device having at least: (1) a substrate support having a smooth surface for supporting a mounting plate; and protecting the substrate 2138-3320-pf2 第37頁 518908 _案號 89113202 9/ 年又月 \ 〇 f__^_ 六、申請專利範圍 (2) —基板溫度控制裝置,用於控制在層膜成型面的 基板之>JDL度基板’该基板溫度控制裝^置的構成至少有: (2-1 ) 一溫度感測器; (2-2) —計算裝置; (2-3) —熱釋放和吸收裝置; 其中藉由JIS B 0 6 0卜1 994測量具平滑表面的該基板 支撐物的表面粗糙度為(1)算術平均粗糙度(Ra)為2〇〇nm或 更低’且(2)最大高度(Ry)為80Onm或更低。 9·如申請專利範圍第8項所述之真空沈積裝置,其中 一軟金屬填入具平滑表面的該基板支撐物和該基板之間, 使其間不具空隙。 1 〇 ·如申請專利範圍第6、7或8項所述之真空沈積裝 ,)其中在真空反應室中具有成膜材料的蒸發源’且配置 有/、该蒸發源相對的基板支撐物。 1 1 ·如申請專利範圍第1 0項所述之真空沈積裝置,更 具有加熱該成膜材料的電子束加熱裝置或電阻加熱裝置。 2 ·如申明專利範圍弟67或8項所述之真空沈積裝 f盟更具有加熱該成膜材料的電子束加熱裝置或電阻加熱2138-3320-pf2 Page 37 518908 _ Case No. 89113202 9 / year and month \ 〇f __ ^ _ VI. Patent Application Scope (2) — substrate temperature control device for controlling the substrate on the film forming surface > The JDL degree substrate includes at least: (2-1) a temperature sensor; (2-2) — a computing device; (2-3) — a heat release and absorption device; The surface roughness of the substrate support having a smooth surface measured by JIS B 0 6 0 1 1 994 is (1) the arithmetic average roughness (Ra) is 2000 nm or less' and (2) the maximum height (Ry ) Is 80 nm or less. 9. The vacuum deposition apparatus according to item 8 of the scope of the patent application, wherein a soft metal is filled between the substrate support having a smooth surface and the substrate without a gap therebetween. 10. The vacuum deposition device according to item 6, 7, or 8 of the scope of the patent application, wherein the vacuum reaction chamber has an evaporation source of the film-forming material 'and is provided with a substrate support opposite to the evaporation source. 1 1 · The vacuum deposition device described in item 10 of the scope of patent application, further comprising an electron beam heating device or a resistance heating device for heating the film forming material. 2 · The vacuum deposition device described in Item 67 or 8 of the declared patent scope has an electron beam heating device or resistance heating for heating the film forming material. 2138-3320-pf2.ptc 第38頁2138-3320-pf2.ptc Page 38
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