TW517324B - A method for determining conditions of a gas outlet device in a semiconductor apparatus - Google Patents

A method for determining conditions of a gas outlet device in a semiconductor apparatus Download PDF

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Publication number
TW517324B
TW517324B TW90129797A TW90129797A TW517324B TW 517324 B TW517324 B TW 517324B TW 90129797 A TW90129797 A TW 90129797A TW 90129797 A TW90129797 A TW 90129797A TW 517324 B TW517324 B TW 517324B
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Taiwan
Prior art keywords
gas
output device
patent application
scope
gas output
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TW90129797A
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Chinese (zh)
Inventor
Yu-Jiun Lin
Jen-Wei Liau
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Winbond Electronics Corp
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Abstract

A method for determining condition of a gas outlet device in a semiconductor apparatus is disclosed. The gas outlet device having plurality of gas holes is connected with a gas piping system and then is put into a container including deionized water therein. Nitrogen gas is directed into the gas outlet device via the gas piping system and bubbles are generated. According to the bubble distribution pattern, the condition of gas outlet device is determined.

Description

517324 A7 - - ··...* · B7_ 五、發明説明(I ) 發明領域 本發明係關於氣體輸出裝置的測試,尤其係關於半導 體設備中氣體輸出裝置的氣孔是否阻塞之測試方法及其裝 置。 發明背景 在半導體的製程中,常常需要沉積一層或多層的薄膜 作爲絕緣層或導電層,這些薄腠沉積方法通常採用物理氣 相沉積(PVD)或化學氣相沉積(CVD)。·在氣相沉.積的設 備中,提供氣體的氣體輸出裝置狀況優劣,爲影響薄膜品 質的重要因子之一。不同設備公司所提供的物理或化學氣 相沉積機台各有其特殊設計以符合製程需求。其中一種氣 體輸出裝置含有許多氣孔以提供均勻的氣體來源來沉積薄 膜,如圖1所示,氣體輸出裝置1以箭頭的方向提供均勻 氣體於晶圓2上來沉積薄膜。或藉由密集氣孔所提供的氣 體屏幕隔絕外界空氣或污染物(未圖示),以達到所需之潔 淨度。 在圖2中爲圖1中的氣體輸出裝置1的氣孔11之分佈 示意圖,氣孔11爲分佈密集且相互距離一致的小孔。爲淸 楚標示圖2中將氣孔11放大,實際應用上氣孔11極小爲 肉眼所難辨識。如此密集分佈的氣孔11如果有任何一部份 堵塞,會造成氣體輸出裝置1只有部分的氣孔11能提供氣 體,部分無法提供,導致晶圓2上之薄膜沉積厚度不均勻。 除此之外,假如所提供的氣體是用於隔絕外界氣體或污染 4WBE/0105TW, 90-102 1 本紙張又度適用中國國家標準(CNS ) A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 517324 A7 • · . · · * * * B7_ 五、發明説明(>) 時,當氣孔阻塞時會造成隔絕效果不佳,使得潔淨度無法 保持,導致晶圓上掉落過多污染粒子。 以上因氣孔11阻塞所導致的兩種狀況,造成晶圓有薄 膜平坦度不均勻和微粒污染問題,而導致整批晶圓需報 廢。在氣體輸出裝置1裝上機台使用之前,目前缺乏可簡 易測試氣體輸出裝置的方法,只能在上機測試出現問題時 才能得知氣孔是否阻塞,但此時已浪費一批晶圓。 綜上所述,晶圓製造業需要一種測試氣體輸出裝置之 氣孔是否阻塞的方法·。而且是不需裝上機台進行半.導體製 程就可進行測試的方法。以降低機台的不確定因素,且可 避免浪費晶圓,造成不必要的成本支出和後續廢棄晶圓處 理的環保問題。 發明目的與摘要 本發明之目的在於測試半導體設備中氣體輸出裝置的 氣孔是否阻塞。 一種測試半導體設備之氣體輸出裝置是否阻塞的方 法,包含下列步驟。首先提供一氣體輸出裝置,含有複數 個氣孔,將此氣體輸出裝置連接一供氣系統。將氣體輸出 裝置置於一容器中,該容器內裝有一液體,該液體爲對氣 體輸出裝置無腐蝕性,且液體液面蓋過複數個氣孔。由供 氣系統導入對氣體輸出裝置無腐蝕性的測試氣體,由複數 個氣孔所冒出的氣泡於液體中的分佈情形,判定氣孔的阻 塞狀況。 4WBE/0105TW, 90-102 2 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ---:--------AVI-----訂------ (請先閱讀背面之注意事項再填寫本頁) 517324 A7 B7 五、發明説明(3 ) 圖式簡單說明 圖1爲半導體製程中的氣體輸出裝置示意圖。 圖2爲圖1之氣體輸出裝置的氣孔示意圖。 圖3爲本發明之較佳實施例中供氣系統示意圖。 圖4爲本發明之較佳實施例中,開有透明視窗的容器 示意圖。 圖5爲本發明之較佳實施例中固定支架示意圖。 圖6爲本發明之較佳實施例中,以固定支架將氣體輸 出裝置固定的示意圖。 圖7爲本發明之較佳實施例中將氣體輸出裝置置於容 器中的示意圖。 圖8爲本發明之較佳實施例中當氣孔無堵塞時,從透 明視窗所看到的氣泡分佈狀況。 圖9爲本發明之較佳實施例中當部分氣孔阻塞時,從 透明視窗所看到的其中一種氣泡分佈狀況。 (請先閲讀背面之注意事項再填寫本頁) 4 -1T填寫本517324 A7--·· ... * · B7_ V. Description of the Invention (I) Field of the Invention The present invention relates to a test of a gas output device, and particularly to a method and a device for testing whether a gas hole of a gas output device in a semiconductor device is blocked. . BACKGROUND OF THE INVENTION In the semiconductor manufacturing process, it is often necessary to deposit one or more thin films as an insulating layer or a conductive layer. These thin film deposition methods usually use physical vapor deposition (PVD) or chemical vapor deposition (CVD). • In the vapor deposition and deposition equipment, the condition of the gas output device that provides the gas is one of the important factors affecting the quality of the film. The physical or chemical gas deposition machines provided by different equipment companies have their own special designs to meet process requirements. One type of gas output device includes a plurality of air holes to provide a uniform gas source to deposit a thin film. As shown in FIG. 1, the gas output device 1 provides a uniform gas in the direction of an arrow to deposit a thin film on a wafer 2. Or use the gas screen provided by the dense air holes to isolate the outside air or pollutants (not shown) to achieve the required cleanliness. FIG. 2 is a schematic diagram of the distribution of the pores 11 of the gas output device 1 in FIG. 1. The pores 11 are small holes with dense distribution and consistent distances from each other. For the sake of clarity, the pores 11 are enlarged in FIG. 2. In practice, the pores 11 are extremely small and difficult to recognize by the naked eye. If any part of the densely distributed pores 11 is blocked, only part of the pores 11 of the gas output device 1 can supply gas, and part of the pores 11 cannot be provided, resulting in uneven thickness of the thin film deposition on the wafer 2. In addition, if the provided gas is used to isolate the outside air or pollute 4WBE / 0105TW, 90-102 1 This paper is again applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read first Note on the back, please fill in this page again) Order printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumers ’Cooperatives of the Ministry of Economics and Intellectual Property Bureau's printed by the Consumer Cooperatives 517324 A7 When the air holes are blocked, the insulation effect is not good, and the cleanliness cannot be maintained, resulting in too many contaminated particles falling on the wafer. The above two conditions caused by the blockage of the air holes 11 cause the wafer to have uneven film flatness and particle contamination problems, and the entire batch of wafers need to be scrapped. Before the gas output device 1 was installed and used on the machine, there is currently no simple method for testing the gas output device. Only when there is a problem in the test on the machine can it be known whether the air holes are blocked or not. In summary, the wafer manufacturing industry needs a method to test whether the air holes of the gas output device are blocked. And it is a method that can be tested without installing a machine for semi-conductor process. In order to reduce the uncertainty of the machine, it can avoid wasting wafers, causing unnecessary costs and environmental issues in the subsequent disposal of discarded wafers. Object and Summary of the Invention The object of the present invention is to test whether the air holes of a gas output device in a semiconductor device are blocked. A method for testing whether a gas output device of a semiconductor device is clogged, including the following steps. First, a gas output device is provided, which contains a plurality of air holes. This gas output device is connected to a gas supply system. The gas output device is placed in a container containing a liquid, which is non-corrosive to the gas output device, and the liquid surface covers a plurality of air holes. The gas supply system is used to introduce test gas that is not corrosive to the gas output device, and the distribution of bubbles in the liquid from a plurality of air holes in the liquid determines the blockage of the air holes. 4WBE / 0105TW, 90-102 2 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) ---: -------- AVI ----- Order ------ (Please read the precautions on the back before filling out this page) 517324 A7 B7 V. Description of the invention (3) Brief description of the drawing Figure 1 is a schematic diagram of the gas output device in the semiconductor process. FIG. 2 is a schematic diagram of pores of the gas output device of FIG. 1. FIG. 3 is a schematic diagram of a gas supply system in a preferred embodiment of the present invention. Figure 4 is a schematic view of a container with a transparent window in a preferred embodiment of the present invention. FIG. 5 is a schematic diagram of a fixing bracket in a preferred embodiment of the present invention. Fig. 6 is a schematic diagram of fixing a gas output device by a fixing bracket in a preferred embodiment of the present invention. Fig. 7 is a schematic view of placing a gas output device in a container in a preferred embodiment of the present invention. Fig. 8 shows the distribution of air bubbles as seen from the transparent window when the air holes are not blocked in the preferred embodiment of the present invention. Fig. 9 is a view of one of the air bubble distribution conditions seen from the transparent window when part of the air holes are blocked in the preferred embodiment of the present invention. (Please read the notes on the back before filling this page) 4 -1T

、1T 經濟部智慧財產局員工消費合作社印製 圖式元件說明 1氣體輸出裝置 11氣孔 2晶圓 3固定裝置 31底板 33固定板 4供氣系統 12氣體輸入管 32側板 34螺絲 4WBE/0105TW, 90-102 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 517324 42氣體閥門 44測試氣體管路 46氣體通道 62透明視窗 64輪子 A7 B7 五、發明説明(牟) 41接頭 43流量計 45氣體輸出裝置 61容器 6 3排水閥 7測試液體 發明詳細說明 •本發明所提供的測試方法爲將欲測試的氣體輸出裝置 置於裝有液體的容器中,通入測試氣體,觀察氣體輸出裝 置之氣孔所冒出的氣泡在液體中分佈狀況。所需的基本測 試配備爲裝有液體的容器和提供氣體的供氣系統。如圖3 所示的供氣系統4藉由接頭41和氣體輸出裝置連接,置入 如圖4所示的容器61並且注入測試液體。接著通入測試液 體進行測試。 圖3爲供氣系統示意圖,供氣系統主要包括氣體通道 46和接頭41。氣體通道46較佳以不鏽鋼管製成。接頭可 根據半導體氣體輸出裝置所需的接頭來選擇,在一較佳實 施例中接頭41爲塑膠軟管,用以分別連接測試氣體管路 44及氣體輸出裝置45。爲了控制導入氣體的流量,進一步 可裝上氣體閥門42和流量計43。供氣系統上的接頭41、 氣體閥門42及流量計43的數目可依照需要而定,即所要 測試的半導體氣體輸出裝置上有多少組氣體輸入管而定。 在此實施例中氣體輸出裝置45爲圖1中的氣體輸出裝 4WBE/0105TW, 90-102 4 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) —l·-------·1-----^-----rl^m (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 517324 A7 B7 五、發明説明(5) 置1,圖1中的氣體輸出裝置1有一組氣體輸入管12,因 此需要1組接頭41、氣體閥門42及流量計43。 (請先閱讀背面之注意事項再填寫本頁) 圖4爲測試用之容器示意圖,其內裝有測試用液體。 測試用液ΪΙ需對氣體輸出裝置1無腐蝕性,讓氣體輸出裝 置1測試後如無問題在烘乾後即可使用,在一較佳實施例 使用去離子水做爲測試液體。此外,只從頂端觀察液體中 氣泡分佈並不淸楚,因此在一較佳實施例中此容器依需要 可在側面開有至少一個透明視窗‘62。測試過後,爲方便在 測試後排出使用過測試用液體,可裝設排水閥63,爲了移 動方便,在下方裝有輪子64。 爲避免通入氣體後氣體輸出裝置會隨著氣泡冒出而在 容器中漂浮移動,干擾觀察氣泡冒出的狀況。在一較佳實 施例中可利用一固定支架來固定氣體輸出裝置,接上供氣 系統後,置於裝有測試液體的容器中來實施測試。 經濟部智慧財產局員工消費合作社印製 請參考圖5,爲固定裝置的示意圖,其材料較佳爲不 鏽鋼。固定裝置的組合爲一底板31,其上裝有複數個側板 32,側板的個數依據要固定的氣體輸出裝置而定。在此實 施例中,固定氣體輸出裝置1有一組氣體輸入管12,所需 的側板32爲2個。側板32上裝有固定板33以夾住氣體輸 出裝置1的氣體輸入管12,以螺絲34鎖緊側板32及固定 板33來固定氣體輸出裝置1,整體設置方式如圖6所示。 如此固定氣體輸出裝置1之後,使其不會在液體中漂浮。 圖6中氣體輸出裝置1的氣體輸入管12和接頭41連接, 以便由圖3中之供氣系統4導入測試氣體。 4WEE/0105TW, 90-102 5 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) 517324 A7 - * · · ·. * ‘ B7 五、發明説明(b ) (請先閱讀背面之注意事項再填寫本頁) 接著請參考圖7,將圖6裝設好的氣體輸出裝置1放 入容器61,於透明視窗62中可看到氣體輸出裝置1,其中 含有氣孔11之面向上,讓氣體可以順利排出且方便觀察, 注入測試液體7的液面蓋過氣體輸出裝置1。圖7中的氣 體輸出裝置1是如圖5所示由固定裝置_3固定,且裝有供 氣系統4。但爲避免圖片變爲複雜且標示不淸,在此未全 部詳細畫出。 裝設完成之後,接下來爲從供氣系統4導入測試氣體 來測試氣體輸出裝置_1。測試氣體需對氣體輸出裝置1無 腐蝕性,使得測試完沒問題的氣體輸出裝置1在烘乾後可 裝上機台使用。在一較佳實施例中使用氮氣爲測試氣體。 通入測試氣體後氣泡從氣體輸出裝置1之氣孔11冒出。如 圖8所示的透明視窗62中,爲一正常無阻塞之氣體輸出裝 置1的氣孔11所冒出氣泡於測試液體7中的分佈情形。由 於氣孔沒有阻塞,因此所有氣孔皆冒出氣泡,液體中的氣 泡分佈爲數量多且均勻。 經濟部智慧財產局員工消費合作社印製 如果氣體輸出裝置1上有部分的氣孔11阻塞,測試時 於透明視窗62所觀察到現象如圖9所示,只有部分的氣孔 可冒出氣泡,氣泡於液體7中的分佈爲數量少且集中於局 部氣孔沒有阻塞部份。隨阻塞的部分不同,氣泡的分佈狀 況不盡相同,不一定就如圖9所示之氣泡分佈狀況,但是 可以確定的是只有不阻塞的氣孔11才能冒出氣泡。因此只 要有阻塞的狀況發生,氣泡的分佈狀況必定和圖8的均勻 分佈狀況不同。 4WBE/0105TW, 90-102 6 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) · 517324 A7 • 一 · : \ * -B7 五、發明説明(1 ) (請先閱讀背面之注意事項再填寫本頁) 如上所述,藉由觀察液體中的氣泡分佈,含有密集氣 孔11的氣體輸出裝置1是否阻塞的狀況一目瞭然。測試後 結果如像圖8的正常狀況,將氣體輸出裝置1取出烘乾後, 就可以裝入機台使用。 熟悉本項技術者應該淸楚了解,本發明可以在不脫離 本發明的精神與範圍之下,以其他許多特定形式加以實 施。因此,現在提供的實施例應當被當作說明,而不是限 制性,此發明不受文中所給之細節所侷限,可隨所附的申 請專利範圍內做均等的變化與修改。 . 經濟部智慧財產局員工消費合作社印製 4WBE/0105TW, 90-102 7 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐)、 1T Printed component descriptions of employees ’cooperatives in the Intellectual Property Bureau of the Ministry of Economic Affairs -102 This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 517324 42 gas valve 44 test gas pipeline 46 gas channel 62 transparent window 64 wheels A7 B7 V. Description of invention (Mou) 41 connector 43 flowmeter 45 Gas output device 61 Container 6 3 Drain valve 7 Test liquid invention detailed description • The test method provided by the present invention is to place the gas output device to be tested in a container filled with liquid, pass in the test gas, and observe the gas output device The distribution of air bubbles from the stomata in the liquid. The basic tests required are equipped with a container filled with liquid and a gas supply system that supplies gas. The gas supply system 4 shown in FIG. 3 is connected to the gas output device through a joint 41, and the container 61 shown in FIG. 4 is put in and a test liquid is injected. Then test liquid is passed in for testing. Fig. 3 is a schematic diagram of a gas supply system. The gas supply system mainly includes a gas channel 46 and a joint 41. The gas passage 46 is preferably made of a stainless steel tube. The joint can be selected according to the joint required for the semiconductor gas output device. In a preferred embodiment, the joint 41 is a plastic hose for connecting the test gas line 44 and the gas output device 45, respectively. In order to control the flow rate of the introduced gas, a gas valve 42 and a flow meter 43 may be further installed. The number of joints 41, gas valves 42, and flow meters 43 on the gas supply system can be determined as needed, that is, how many sets of gas input pipes are on the semiconductor gas output device to be tested. In this embodiment, the gas output device 45 is the gas output device 4WBE / 0105TW, 90-102 4 shown in Figure 1. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) —l · --- ---- · 1 ----- ^ ----- rl ^ m (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 517324 A7 B7 V. Description of the invention (5) Set to 1. The gas output device 1 in FIG. 1 has a set of gas input pipes 12, so a set of joints 41, a gas valve 42 and a flow meter 43 are required. (Please read the precautions on the back before filling out this page) Figure 4 is a schematic diagram of the test container, which contains the test liquid. The test liquid Ϊ1 needs to be non-corrosive to the gas output device 1, so that the gas output device 1 can be used after drying without any problems after testing. In a preferred embodiment, deionized water is used as the test liquid. In addition, it is not uncommon to see the distribution of air bubbles in the liquid from only the top. Therefore, in a preferred embodiment, the container may have at least one transparent window '62 on the side if necessary. After the test, in order to facilitate the discharge of the used test liquid after the test, a drain valve 63 may be installed, and for ease of movement, wheels 64 are installed below. In order to prevent the gas output device from floating and moving in the container with the air bubbles after the gas is introduced, it will interfere with the observation of the air bubbles. In a preferred embodiment, a gas-fixing device can be used to fix the gas output device. After being connected to the gas supply system, it is placed in a container containing a test liquid to perform the test. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Please refer to Figure 5 for a schematic diagram of the fixed device. The material is preferably stainless steel. The combination of the fixing devices is a bottom plate 31 on which a plurality of side plates 32 are mounted, and the number of the side plates depends on the gas output device to be fixed. In this embodiment, the fixed gas output device 1 has a set of gas input pipes 12, and two side plates 32 are required. The side plate 32 is provided with a fixing plate 33 to clamp the gas input pipe 12 of the gas output device 1, and the side plate 32 and the fixing plate 33 are fastened with screws 34 to fix the gas output device 1. The overall arrangement is shown in FIG. After fixing the gas output device 1 in this manner, it is prevented from floating in the liquid. The gas input pipe 12 of the gas output device 1 in FIG. 6 is connected to the joint 41 so that the test gas is introduced by the gas supply system 4 in FIG. 3. 4WEE / 0105TW, 90-102 5 This paper size applies to Chinese National Standard (CNS) A4 size (210 X 297 mm) 517324 A7-* · · ·. * 'B7 V. Description of the invention (b) (Please read the back first Please note this page and fill in this page again) Then please refer to Figure 7 and place the gas output device 1 installed in Figure 6 into the container 61. You can see the gas output device 1 in the transparent window 62, which contains the air hole 11 facing up , So that the gas can be smoothly discharged and easy to observe, the liquid level of the test liquid 7 injected over the gas output device 1. The gas output device 1 in FIG. 7 is fixed by the fixing device_3 as shown in FIG. 5, and is provided with an air supply system 4. However, in order to avoid the pictures becoming complicated and not labeled well, not all of them are drawn in detail here. After the installation is completed, the next step is to test the gas output device_1 by introducing a test gas from the gas supply system 4. The test gas needs to be non-corrosive to the gas output device 1, so that the gas output device 1 that has no problem after the test can be installed on the machine after drying. In a preferred embodiment, nitrogen is used as the test gas. After the test gas is passed in, air bubbles emerge from the air holes 11 of the gas output device 1. The transparent window 62 shown in FIG. 8 shows the distribution of air bubbles in the test liquid 7 from the air holes 11 of a normal non-blocking gas output device 1. Since the pores are not blocked, all the pores are air bubbles, and the air bubbles in the liquid are distributed in a large number and uniformly. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. If part of the air holes 11 on the gas output device 1 is blocked, the phenomenon observed in the transparent window 62 during the test is shown in FIG. 9. The distribution in liquid 7 is small and concentrated in local pores without obstruction. Depending on the blocked part, the distribution of bubbles is not the same. It is not necessarily the distribution of bubbles as shown in Figure 9, but it can be determined that only the non-blocked pores 11 can produce bubbles. Therefore, as long as clogging occurs, the distribution of bubbles must be different from the uniform distribution of Figure 8. 4WBE / 0105TW, 90-102 6 This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) · 517324 A7 Please fill in this page again.) As described above, by observing the distribution of air bubbles in the liquid, it is clear at a glance whether the gas output device 1 containing dense pores 11 is blocked. After the test, the results are normal, as shown in Figure 8. After the gas output device 1 is taken out and dried, it can be put into the machine and used. Those skilled in the art should understand that the present invention can be implemented in many other specific forms without departing from the spirit and scope of the invention. Therefore, the embodiments provided now should be regarded as illustrative, not restrictive. The invention is not limited by the details given in the article, and can be changed and modified equally within the scope of the attached patent application. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4WBE / 0105TW, 90-102 7 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

517324 A8 B8 C8 D8 六、申請專利範圍 1· 一種測試一半導體設備之氣體輸出裝置是否阻塞的方 法,包含下列步驟: (請先閲讀背面之注意事項再填寫本頁) 提供一氣體輸出裝置,該氣體輸出裝置含有複數個氣 孔; 將該氣體輸出裝置連接一供氣系統; 將氣體輸出裝置置於一容器中,該容器內裝有一液體, 該液體爲對該氣體輸出裝置無腐蝕性,且該液體液面蓋 過該複數個氣孔; 由該供氣系統導入一測試氣體,該測試氣體對該氣體輸 出裝置無腐鈾性;以及 由該複數個氣孔所冒出的氣泡於液體中的分佈情形,判 定該氣孔的阻塞狀況。 2.如申請專利範圍第1項所述之方法,進一步包含一支 架,該支架固定該氣體輸出裝置於該容器中。 經濟部智慧財產局員工消費合作社印製 3·如申請專利範圍第1項所述之方法,其中該容器至少有 一透明視窗,以供一使用者觀察該複數個氣孔的冒出氣 泡狀況。 4·如申請專利範圍第1項所述之方法,其中該容器進一步 包含一排水閥。 5·如申請專利範圍第1項所述之方法,其中該液體爲去離 4WBE/0105TW, 90-102 8 本紙張尺度適用中國國家標準(CNS ) A4規格(210X:Z97公釐) 517324 A8 B8 C8 D8 六、申請專利範圍 子水。 (請先閲讀背面之注意事項再填寫本頁) 6. 如申請專利範圍第1項所述之方法,其中該測試氣體爲 氮氣。 7. 如申請專利範圍第1項所述之方法,其中該供氣系統進· 一步包含至少一氣體閥門,以控制該測試氣體之流量。 8. 如申請專利範圍第1項所述之方法,其中該供氣系統進 一步包含至少一個流量計,供測量經由該供氣系統所輸 出的該測試氣體之流量。 9. 一種測試半導體設備之氣體輸出裝置上複數個氣孔是 否阻塞的裝置,包含: 一容器,該容器裝有一透明視窗,內裝有一液體,該液 體爲對一氣體輸出裝置無腐蝕性之液體,且該液體液面 蓋過該複數個氣孔;以及 經濟部智慧財產局員工消費合作社印製 一供氣系統,提供對該氣體輸出裝置無腐鈾性之一測試 氣體,該供氣系統至少有一接頭和該氣體輸出裝置連 接,該供氣系統裝有一氣體閥門及一流量計,以控制氣 體的流量,其中由該複數個氣孔於液體中所冒出氣泡的 情形,判定該氣孔的阻塞狀況。 10. 如申請專利範圍第9項所述之裝置,進一步包含一支 4WBE/0105TW, 90-102 9 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 517324 A8 B8 C8 D8 六、申請專利範圍 架,該支架固定該氣體輸出裝置於該容器中。 (請先閱讀背面之注意事項再填寫本頁) 11. 如申請專利範圍第9項所述之裝置,其中該容器裝有一 排水閥以排除該液體。 12. 如申請專利範圍第9項所述之裝置,其中該液體爲去離 子水。 13. 如申請專利範圍第9項所述之裝置,其中該測試氣體爲 氮氣。 . 14. 如申請專利範圍第9項所述之裝置,其中該半導體設備 係由下列所選出,一物理氣相沉積(PVD)設備、一化 學氣相沉積(CVD)設備、一低壓化學氣相沉積(LPCVD) 設備、一強化式電漿化學氣相沉積(PECVD)設備及 一常壓化學氣相沉積(APCVD)設備。 經濟部智慧財產局員工消費合作社印製 15. 如申請專利範圍第9項所述之裝置,其中該氣體輸出裝 置經由複數個氣孔,提供一均勻的氣體氣幕,該氣體係 由下列所選出,一氮氣及一反應氣體。 4WBE/0105TW, 90-102 10 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)517324 A8 B8 C8 D8 6. Scope of patent application 1. A method for testing whether the gas output device of a semiconductor device is blocked, including the following steps: (Please read the precautions on the back before filling this page) Provide a gas output device, which The gas output device contains a plurality of air holes; the gas output device is connected to a gas supply system; the gas output device is placed in a container containing a liquid, the liquid is non-corrosive to the gas output device, and the The liquid level covers the plurality of air holes; a test gas is introduced from the gas supply system, and the test gas is non-corrosive to the gas output device; and the distribution of bubbles in the liquid from the plurality of air holes , Determine the blockage of the stomata. 2. The method according to item 1 of the scope of patent application, further comprising a bracket for holding the gas output device in the container. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. The method as described in item 1 of the scope of patent application, wherein the container has at least a transparent window for a user to observe the state of the air bubbles emerging from the plurality of air holes. 4. The method according to item 1 of the patent application scope, wherein the container further comprises a drain valve. 5. The method as described in item 1 of the scope of patent application, wherein the liquid is de-ionized 4WBE / 0105TW, 90-102 8 This paper size applies to China National Standard (CNS) A4 (210X: Z97 mm) 517324 A8 B8 C8 D8 VI. Patent application scope. (Please read the notes on the back before filling this page) 6. The method described in item 1 of the scope of patent application, where the test gas is nitrogen. 7. The method according to item 1 of the scope of patent application, wherein the gas supply system further includes at least one gas valve to control the flow of the test gas. 8. The method according to item 1 of the patent application scope, wherein the gas supply system further comprises at least one flow meter for measuring the flow rate of the test gas output through the gas supply system. 9. A device for testing whether a plurality of air holes in a gas output device of a semiconductor device is blocked, comprising: a container equipped with a transparent window containing a liquid, the liquid being a non-corrosive liquid to a gas output device, And the liquid level covers the plurality of air holes; and the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a gas supply system that provides a test gas that is non-corrosive to the gas output device and has at least one connector. Connected to the gas output device, the gas supply system is equipped with a gas valve and a flow meter to control the flow rate of the gas, and the blocking condition of the gas hole is determined by the air bubbles emerging from the plurality of gas holes in the liquid. 10. The device described in item 9 of the scope of patent application, further including a 4WBE / 0105TW, 90-102 9 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 517324 A8 B8 C8 D8 The scope of the patent application, the bracket fixed the gas output device in the container. (Please read the precautions on the back before filling this page) 11. The device described in item 9 of the scope of patent application, wherein the container is equipped with a drain valve to drain the liquid. 12. The device according to item 9 of the scope of patent application, wherein the liquid is deionized water. 13. The device according to item 9 of the scope of the patent application, wherein the test gas is nitrogen. 14. The device according to item 9 of the scope of patent application, wherein the semiconductor device is selected from the following: a physical vapor deposition (PVD) device, a chemical vapor deposition (CVD) device, and a low pressure chemical vapor phase. Deposition (LPCVD) equipment, an enhanced plasma chemical vapor deposition (PECVD) equipment and an atmospheric pressure chemical vapor deposition (APCVD) equipment. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 15. The device described in item 9 of the scope of patent application, wherein the gas output device provides a uniform gas curtain through a plurality of air holes, the gas system is selected from One nitrogen and one reaction gas. 4WBE / 0105TW, 90-102 10 This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm)
TW90129797A 2001-12-03 2001-12-03 A method for determining conditions of a gas outlet device in a semiconductor apparatus TW517324B (en)

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