TW511436B - Improved print manufacturing method for laminated devices - Google Patents

Abstract

The present invention provides an improved print manufacturing method for laminated devices. In forming an insulating layer in the multi-layer metal circuit, a halftone having a pattern opposite to the metal circuit pattern on the substrate is used to fill an insulating material between the metal circuit and substrate, so as to ensure that the metal circuit and insulating layer exhibit a flat effect after forming the insulating layer. Accordingly, it is able to ensure the quality in forming each layer of metal circuit, and effectively avoid encapsulating bubbles therein when forming the insulating layer, which may influence the yield rate of the laminated devices.

Description

A7 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (Kinds can be related to: an improved printing method for laminated components, especially-a quality method for manufacturing interlayer laminated components. 7) ', And can effectively improve the product item rhyme, because the electronic products in the big eight two one integrated circuit, so that one-knife electronic circuits have been integrated in the development of potential, traditional electricity =:; = 化' and with this -To achieve the goal of effectively saving the area of the circuit board = to develop toward miniaturization, and the current multilayer component manufacturing process ::, aims to reduce the production of miniaturized, miniaturized electronics The plane is in the manufacturing process of laminated components; it is used as a wave waver, etc. However, because the existing process design of electronic components with low current cannot be raised or lowered by 60 ~ 70%, the yield of the parts can only stay in the middle of the process. The implementation process, I would like to explain in detail with the illustration ^ _ using a single-layer substrate lamination element first please refer to the seventh version of A, B-road pattern (6 0 1) screen version (6 "two of its use-forming a wire The brush forms a metal circuit (5 1), and it is lost on the substrate (50). The upper surface of the substrate (50) is coated with -V as it is on the appropriate g) of the lower metal circuit (5 i), as opposed to 3), for electrical connection; As shown in the ninth figure, the through hole (5 q ”(51) f 3) of the aforementioned filling and sloping edge layer (5 2) and the underlying metal circuit ^ ^ ----- (Please read the note on the back first Matters written on this page)

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V. Description of the Invention (>) Please refer to the tenth figure, the aforementioned metal circuit layer insulation layer (5 4); ☆ The above is a conventional single-layer substrate pole #King. Two layers of metal lines 4) Coated 0) Manufacture of laminated components ^ (5 4) A defense 2) needs to be formed between them, plus the insulation layer (5 ◦) of the insulation layer (5 ◦), but two :::: = The substrate (50% -thickness, and the printing soil of the subsequent process = (50)) the topography method is evenly distributed on the substrate (5C)). Therefore, there is no depression on both sides of the insulating material. It ’s difficult; doubling the step up. Furthermore, because the insulating material is trapped on the ㈣ & bubble, the laminated components are burnt μ. The shop says, 'The two sides of the spring road are covered with 9, _ _ Wen 钿 shou, the original Covered with an insulating layer. (5 2) The delay of escape under appropriate conditions. ^ ^ The two-way out of the Guangxi where the magnetic effect is reduced by the Pudong hole hinders lattice bonding and even causes holes or clothing marks. Therefore, this The manufacturing process cannot be applied to high-power electronic components. = Clerk = The insulation layer can be flat, so after the coating is completed, the insulation layer can be leveled from eight to four times to improve the reliability of the upper layer to form a Monsoon line. But for this unstable process Because: In the application of high-power electronic components, because the cross-sectional area of the circuit cannot be increased, it is necessary to use a multi-layer substrate process in parallel, and several powers are small = several electronics are connected in parallel to achieve high current and high impedance. The electronic components 'for the design of high-current and high-resistance inductive components, if the multilayer substrate is made' will not only increase the volume of the components, but also apply the Chinese National Standard (CNS) A4 specification due to the insulation of this paper. ⑵Q X 297 male 3) A7 V. Description of the invention (>) The thickness of the layer cannot be controlled, and the Rdc is not proportional to xl. Therefore, when the apricot flow occurs, it will cause power loss and high temperature. From the above, Tian Zhi knows that the multilayer device with large current and high impedance is implemented in this custom system. Its yield is only 60% ~ 70%, so it takes a lot of time to make two books. It can be seen how to further provide more effective The multi-layered manufacturing method should be carefully considered by this industry to help the competitiveness of these industries. For this reason, the main object of the present invention is to provide a process for forming a laminated component in which each insulating layer 7 can be kept flush with the metal circuit without generating bubbles and causing the component to be sintered and formed during the final sintering and molding. The main technical means used to achieve the above purpose is to include the following steps in the upper process; clothing lines; forming the first layer of metal circuits 'form a layer of a specific element on a substrate to form a layer of insulating layer' using- Form the first layer of metal circuit, "," to fill the insulating material between the metal circuit and the substrate; form an insulating isolation layer, apply a layer of insulating material on the surface of the third line and the insulating layer; 9 The above steps are mainly through the screen to fill the space other than the liquid separation line, that is, the m sheet material section is filled with the metal edge material, which can be covered with the _; present; cover; the f material is fully coated on the metal material and the insulation isolation layer On the end face, there is an insulating isolation layer. This insulating isolation layer can be maintained because the formation layer is in a flat shape, so it belongs to the two-way and insulation build-up layer. It is known that this way can be used: Continue to build up 7C pieces and turn the paper size on the production line. Guan Xu i ^ NS) A4 donkey ⑵ 511436 Λ7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, π, invention description (1) can be kept at Fixed position And cuttings will not blocked by the upper and lower insulating isolation layer; is too passage of said electrical connection member of the production yield of the laminate hole. "Ming can effectively improve the production of this month: the next purpose is to provide a wide range of suitable high-power electronic components: the use of the above process steps to make a large cross-sectional area of the metal wire: surface two ^ as a single-layer high-power electronic components Feasibility, through the larger line to increase the amount of current, and can be completed on a single-layer substrate with large electric >, L, large impedance electronic components. In order to allow your reviewers to further understand this The specific design and other purposes of the invention are detailed with drawings as follows: (1) Schematic part: The first figures A and B are cross-sectional views of the preferred embodiment of the present invention, which are different. The screen plate forms a metal circuit with a specific pattern on a substrate. It is a cross-sectional view of a preferred embodiment of the present invention, which reveals that the screen plate of an anti-metal circuit forms a level insulation layer on the side of the metal circuit. It is a cross-sectional view of a preferred embodiment of the present invention, which discloses a screen plate forming a through-hole state on the first insulating isolation layer. It is a cross-sectional view of a preferred embodiment of the present invention, which does not expose a screen plate on A specific pattern is formed on the first insulating isolation layer Metal lines. One of the preferred system of the present invention is a cross-sectional view of the embodiment, which Jie

Second picture A, B

Third picture A, B

Brother four pictures A, B

The fifth picture A, B I_________6 This paper size is applicable to China National Standard (CNS) A4 specification (210 packs --- (please read the precautions on the back first to write this page) J ^ T · -line · A7 Description of the invention ( Six pictures Seven pictures

The younger brother I, the ninth, the tenth, the tenth, do not screen form a through-hole state on the second insulating isolation layer. A, B: The impedance values respectively measured in the AC and DC states of the present invention. B · is a cross-sectional view of a conventional multilayer component, which reveals that a net # plate forms a metal pattern with a specific pattern on a substrate. A cross-sectional view of an m-layered component, which reveals that the screen forms a through-hole state on the first insulating layer. • A cross-sectional view of a conventional laminated component, which reveals that a screen plate forms a second metal circuit on the first marginal layer. • A cross-sectional view of a conventional laminated component, which reveals a state where a screen plate forms another through hole on a second insulating layer. Fig. Shows the impedance values measured in the AC and DC states of the present invention. Part of drawing number: ----------------- (Please read the note B on the back first to write this page) 14 16 2 0 2 1 2 2 5 0 5 2) substrate) first insulating layer) first insulating isolation layer) through-hole) screen plate) screen plate) screen plate) substrate) first insulating layer (1 1) first Metal line (1 3) Second insulation layer (1 5) Second insulation isolation layer (17) Second metal line (2 0 1) Line pattern (2 1 1) Anti-line pattern (2 2 1) Through-hole pattern ( 51) The first metal circuit (5 3) through-hole The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) M1436 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (^) :: 乂) The second metal circuit (55), the second insulation and isolation layer) and the screen (6 0 1). The process of making the circuit pattern clear can make each layer of the insulation and isolation layer on the substrate close to the horizontal center, so that the cross-sectional area of the metal circuit on the substrate. It is larger for conventional users in order to: form high-power electronic components on f substrates, where the process includes several steps of M:-forming a metal circuit, which is based on- A metal circuit (11) (as shown in Fig. A) forming a specific electron: piece on (work 〇) is formed by using a screen (2 〇) with a special circuit pattern (2 Q 丄) to form a metal The circuit (ii) is formed on the substrate by printing, as shown in the first figure B; forming an insulating layer (12), which is a screen version (Sichuan) with a road pattern (211) formed by Xiang and Qiandao The insulating material 枓 is filled between the metal circuit (11) and the substrate (10), as shown in the second figure A and B; forming an insulating isolation layer (1 4), which is coated with a layer of insulating material-layer metal circuit (i) And the upper end face of the insulating layer (丄 2) as shown in Figure A; forming a through-hole (1 6), and forming a through-hole (16) connected to the insulating isolation layer (丄 4) to the lower metal line (11) ' As shown in the third figure B, 'the screen pattern (2 21) is used to form the through-hole pattern (2 21) at a specific position of the insulating isolation layer (i 4) with respect to the underlying metal circuit (1 ◦) ^' The through-holes (16) are formed downwards using the method of rice carving; this paper size applies to China National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back first 1 --- ▼ Write this page). 丨 Line A7 V. Description of the invention (y) Fill in eight: The step is to fill the space other than the road (11) with the liquid insulating material mainly through the screen (2 2), The metal circuit (1 1) 费 间 包 wei ## on the substrate (10) is not set up, so that holes or cracks will not be formed on both sides of the circuit. Figure 24 shows the number of layers of metal that the present invention intends to form. Figure 2 Please refer to _A first. If the second layer is on the insulation ==== layer (..., the first metal circuit (17) The upper layer (1 5) of the second insulating isolation layer (1 4) is formed on the first insulating line (1 五), as shown in Figures 5 and 5 of the fifth figure, whereby the gold insulating isolation layers (15) are / On the flat surface of the substrate (10) and Λ.. 7.;, It is possible to increase the metal circuit (cross section area of the worker girl Lei A, and increase its current, which means that it can make large electricity /; 丨 L and large resistance electronic components. Factory can be used. The present invention is to form a spot through the layer of metal, which can effectively form an insulating layer on both sides of the line: and 4 meshes are on both sides of the line. After the formation of the downward recessed edge isolation layer, a large gold cross-sectional area is formed = :, the purpose of the sub-element, in addition to the formation of high-power electricity with an early substrate '_ sixth figure A, B And the eleventh. Figures :: This is a multi-layer diagram of the present invention and the conventional, and the dotted lines in the middle are the best electrical characteristics. From the illustration, the sixth figure A and the tenth-figure A are measurements The product i pieces; (Please read the Notes on the back to write this page) stapling --- · wire · Ministry of Economic Affairs Intellectual Property Office employees consumer cooperatives printed

This paper scale applies Chinese national standard 511436 A7. 5. Description of the invention (^) = Impedance diagram. The present invention is obviously more stable in this ideal range than conventional process components. Please refer to Figure 6B and Figure 11 No. B is to measure the DC impedance of the integrated components of the present invention and the conventional process. This DC impedance value should be as small as possible, and it is also obvious that the DC impedance distribution of the present invention is more stable and concentrated than conventional ones. To sum up, the following advantages are included: "~ 1 · Effectively prevent cracks and holes. 2 · Suitable for high power electronic components (such as those with high impedance). Well inch 3 · With the thin film manufacturing method, the volume and miniaturization of electronic components can be achieved. 'Collar 4 · The process steps are simple. Therefore, the design of the present invention complies with the requirements of the invention patent, and the application is submitted in accordance with the law. "(Please read the precautions on the back ^^ to write this page; i 壮 衣 Ί ^ τ ·

-Line. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized for China National Standard (CNS) A4 (210 x 297 mm)

Claims (1)

A. The scope of patent application r. 1. An improved printing method for laminated components, which includes the following processes for forming metal circuits, which are circuits for forming specific components on a substrate; "Forming an insulating layer, which uses a reverse pattern Screen plate, ',, and edge materials are coated on the surface of non-embedded metal wiring, to form an insulating isolation layer, which is coated with an insulating material on the top surface of the first acoustic circuit and the insulating layer; 〃 The above steps are mainly The metal lines are flush with the screen printing method through the insulation layer, so it provides a flat surface for the upward build-up process to ensure the reliability of each circuit in the stack. 2. The stack as described in item 1 of the patent scope The improved printing method of components, the screen plate used in the above-mentioned step of forming an insulating layer,-the reverse pattern of the metal circuit pattern is formed in the step. The meaning is the improved printing of the laminated component described in item 3 above, as described in item 1 of the scope of patent application. Method 1 ', after the above-mentioned step of forming an insulating isolation layer, a step of forming an insulating layer is added to the insulating isolation layer to the underlying metal circuit. The through hole is formed at a fixed position. 4. The improved printing method of the laminated component described in item 3 of the patent scope, "The above-mentioned step of forming the through hole is formed by using a screen pattern with a through hole pattern" on each insulation layer. The method of engraving the surname is then used to form the through hole. 5 As described in the application of the improved printing method of the laminated component described in the first item of the patent scope, the above-mentioned step of forming the metal circuit is a screen with a circuit pattern formed on the substrate and each insulating isolation layer. Metal lines are formed on it.