511430 A7 B7 經 濟 部 智 慧 財 產 局 員 工 消 費 合 社 印 製 五、發明說明（/ ) 本發明係關於一種在有纖基板上形成高密度超細線路 的方法’尤指一種可有效防止線路側蝕以利於製作超細線 路的方法。 按，對於印刷電路板產業而言，製程中的線寬控制為 嚴格要求精確度的重要項目之一。但在實際製程中，印刷 電路板成品之線寬卻因製程步驟的變異而與原設計線寬有 異’意即印刷電路板成品上的線路因蝕刻量變異而出現過 蝕（overetch)或蝕刻不全（underetch)現象。由於側蝕現 象將直接影響印刷電路板之電氣特性，為解決此一問題， 一種可行的方法係在線路底片設計時，先針對可能產生的 侧蝕量預作補償，以便使製程完成後之印刷電路板線寬與 原设計線寬相符，而獲致理想的線寬控制。 ^然而，印刷電路板的密度愈來愈高，線路結構越來越 複雜，其製程步驟也愈來愈多，而變異機率亦隨之相對提 高。舉例而言，目前的電路板多為多層電路板，而在製程 中，電路板係縱向排列以進行蝕刻，如線路配置角度略有 偏差，兩面的蝕刻程度即不儘相同，很可能造成其中一面 ㈣完全’另-面則關不完全，由此可見，卩預估方式 估計側蝕補償量，其誤差率是相當大的。 由上述可知，側蝕問題對印刷電路板而言是十分普遍 =題’然而既有的預估補償方式誤差大，並無法賴以提 路的完整性與穩定度，故有待進-步檢討，並謀求可511430 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (/) The present invention relates to a method for forming high-density ultra-fine lines on a fiber substrate. Conducive to making ultra-fine lines. According to the printed circuit board industry, line width control in the manufacturing process is one of the important items that require strict accuracy. However, in the actual manufacturing process, the line width of the printed circuit board finished product is different from the original design line width due to variations in the process steps. Underetch. Since the side etch phenomenon will directly affect the electrical characteristics of the printed circuit board, in order to solve this problem, a feasible method is to precompensate for the amount of side etch that may occur in the design of the circuit film in order to make the printing after the process is completed. The line width of the circuit board is consistent with the original design line width, and the ideal line width control is obtained. ^ However, the density of printed circuit boards is getting higher and higher, the circuit structure is becoming more and more complex, the number of process steps is increasing, and the probability of mutation is correspondingly increased. For example, most current circuit boards are multi-layer circuit boards. In the manufacturing process, the circuit boards are arranged vertically for etching. If the circuit configuration angle is slightly different, the degree of etching on both sides is different, which may cause one side. ㈣Complete 'the other side is not completely closed, so it can be seen that the estimation rate of side erosion compensation by 卩 Estimation method has a considerable error rate. From the above, it can be seen that the problem of side etching is very common for printed circuit boards. However, the existing estimation compensation method has a large error and cannot rely on the integrity and stability of the road, so it needs to be further reviewed. And seek
行的解決方案。 J 因此，本發明主要目的在提供_種可有效防止線路側 x 297公釐） I I------------1 (請先閱讀背面之注意事項再填寫本頁)OK solution. J Therefore, the main purpose of the present invention is to provide _ a kind that can effectively prevent the line side x 297 mm) I I ------------ 1 (Please read the precautions on the back before filling this page)
H ϋ n I 511430 A7 B7 五、發明說明（/ ) 蝕以利於製作超細線路的方法。 為達成前述目的採取的主要技術手段係令前述方法包 括有： 在有纖基板表面壓上銅膜； 在有纖基板的鋼膜上進行影像轉移以形成銅線路； 在銅線路表面形成錫層，以構成抗蝕防護； 在有纖基板上附著電著光阻，利用電著光阻均勻的覆 蓋於銅膜與銅線路表面及其側壁； 除去有纖基板上除鋼線路側壁以外的電著光阻； 餘刻掉有纖基板上多餘的銅膜； 剝除銅線路侧壁之電著光阻及其表面之錫層； 以前述方法可利用電著光阻對銅線路側壁形成防護以 有效避免銅線路側壁在製程中過蝕，以利於製作超細線路 〇 前述的電著光阻係以沈積方式均勻的附著於鋼膜與銅 線路上。 又達成前述目的之另一技術手段係令前述方法包括下 列步驟： 在有纖基板表面壓上銅膜，並在銅膜上形成銅線路； 在銅線路表面形成錫層； 對有纖基板表面銅膜及鋼線路進行蝕刻； 在有纖基板上附著電著光阻，利用電著光阻均句的覆 蓋於銅膜與銅線路表面及其側壁； 除去有纖基板上除鋼線路側壁以外的電著光阻； 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --裝 i I-----訂·---- # 經濟部智慧財產局員工消費合作社印制衣 )11430 A7 B7 五、發明說明（3 經 濟 部 智 慧 財 產 局 消 費 合 作 社 印 製 餘刻掉有纖基板上多餘的銅膜； 剝除銅線路側壁之電著光阻及其表面之錫層； 利用前述方法仍可利於製作超細線路。 刖述的電著光阻以電鏟方式附著於鋼膜與鋼線路表面 〜為使貴審查委員進一步瞭解前述目的及本發明之技 術特徵’炫附以圖式詳細說明如后：(一） 圖式部分： 第圖A〜F :係、本發明一較佳實施例之製程步驟示意圖 第一圖A〜F:係本發明又一較佳實施例之製程步驟示意 圖。(二） 圖號部分： (1〇)有纖基板 (1 2)銅線路 (1 4)電著光阻 有關本發明一 包括有下列步驟： 在一有纖基板（10)表面壓上適當厚度的銅膜 1 ); ' 又在有纖基板（1 0 )的銅膜（1 1 )上進行影 移以形成鋼線路（丄2); 在鋼線路（1 2 )表面形成錫層（1 3 )，以便 線路（1 9 A 4 ^ )表面構成抗#隔離（在此以上之步驟請 (1 1 )銅膜 (13)錫層 較佳實施方法，請參閱第一圖所示H ϋ n I 511430 A7 B7 V. Description of the Invention (/) Method of etching to facilitate the production of ultra-fine lines. The main technical measures adopted to achieve the foregoing purpose are to make the aforementioned method include: pressing a copper film on the surface of the fiber substrate; performing image transfer on the steel film of the fiber substrate to form a copper circuit; forming a tin layer on the surface of the copper circuit, To form a corrosion protection; attach an electrophotographic resist on the fiber substrate, use the electrophotographic resist to uniformly cover the surface of the copper film and the copper circuit and its side wall; remove the electrophotographic light on the fiber substrate except the side wall of the steel line The extra copper film on the fiber substrate is etched away. The electrical photoresist on the side wall of the copper circuit and the tin layer on the surface are stripped off. The electrical photoresist can be used to protect the side wall of the copper circuit to effectively avoid it. The side wall of the copper circuit is over-etched during the manufacturing process to facilitate the production of ultra-fine lines. The aforementioned photoresist system is uniformly deposited on the steel film and the copper circuit in a deposition manner. Another technical means for achieving the foregoing object is to make the method include the following steps: pressing a copper film on the surface of the fiber substrate, and forming a copper circuit on the copper film; forming a tin layer on the surface of the copper circuit; The film and steel circuit are etched. Electro-resistive photoresist is attached to the fiber substrate, and the copper film and the surface of the copper circuit and their side walls are covered with the electro-resistive photoresist. The photoresist; 4 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) --Install i ----- Order ·- --- # Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs) 11430 A7 B7 V. Description of the Invention (3 The printed film of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed off the excess copper film on the fiber substrate; stripped the copper wiring The electrophotographic photoresist on the side wall and the tin layer on the surface; the aforementioned method can still be used to make ultra-fine lines. The electrophotographic photoresist described above is attached to the surface of the steel film and the steel circuit by a shovel ~ In order to further your review committee Understand the foregoing The technical features of the present invention are illustrated in detail with drawings as follows: (a) Schematic parts: Figures A ~ F: Schematic diagram of the process steps of a preferred embodiment of the present invention; Figures A ~ F : It is a schematic diagram of the process steps of another preferred embodiment of the present invention. (II) Part of the drawing: (10) Fiber substrate (1 2) Copper circuit (1 4) Photoresistor related to the present invention includes the following Steps: pressing a copper film of an appropriate thickness on the surface of the fiber substrate (10) 1); and performing a shadow shift on the copper film (1 1) of the fiber substrate (10) to form a steel circuit (丄 2) A tin layer (1 3) is formed on the surface of the steel line (1 2) so that the surface of the line (1 9 A 4 ^) forms an anti-isolation (please (1 1) the copper film (13) tin layer compared to the above steps) Best implementation method, please refer to the first picture
(21。 川43〇 A7 Β7(21.Chuan 43〇 A7 B7
二圖=:隨後去除轉移銅線路影像用之光阻(如 在有纖基板（10)上附著電著光阻帝 ，阻（"）均勻的覆蓋於銅膜（11)與二路= 2)表面及其側壁（如第一圖c所示）； 除去有纖基板（i 〇 )上除銅線路（丄2 )側 =夕餘電著光阻（14)(如第—㈣所示），意即 位於銅線路（i 2)側壁上的電著光阻（丄4). 姓刻去除有纖基板（10)上多餘的銅膜（1 =二圖E所示)：此時銅線路（12)側壁因電著光阻 1 4)的隔離防護，故不受蝕刻製程影響； 剝除位於銅線路（i 2 )側壁上之電3著光阻（工4) 及其表面之錫層（13)(如第一，所示）；直中. 是一種感光阻劑，原應用於外形複雜金屬物品的電著塗裝 ^ ’目前開始被作為光阻運用，其係採沈積或電錢方式將 感光性帶電樹脂帶電膠體粒子均勾的鑛到的電路板的銅面 上’作為抗敍刻的阻劑。與一般光阻相同，電著光阻亦分 為正光阻與負光阻，於本實施例中，係採用正光阻的電著 光阻、。且由於線路形狀規則，故電著光阻的附著方式係以 沈積為之。 、/於電著光阻（1 4)係可均勾的附著在銅面上，因 此田有纖基板（1 〇 )沈積有機光阻時，電著光阻（1 4 )將均勾的附著在其銅膜（11)與銅線路（12)上的 6 本紙張尺度適財國國家標準（CNS)A規格⑽χ挪公[ Μ---------------- (請先閱讀背面之注意事項再填寫本頁) 511430 A7 B7 五、發明說明（了） H3 )表面’並進-步均勻的附著在銅線路(1 2 述上電著光阻（14)步驟後，繼而去除多 艺2)二：其可舰刻液敍刻方式，去除銅線路 (12)側J以外的銅膜（11)。 =後_用影像轉移、曝光顯影配合關 表面的錫層（13)及側壁上的電著総 (14) ’㈣在有纖基板（1Q)上完成線路製作。 传铜方法中，利用電著光阻（14)的隔離防護， 、3 / 1 2 2 )的側壁不虞在蝕刻過程中遭到侵蝕，咅 即可確保銅線路（i 2 )的完整性，在完整性可 : 訂 的狀況下，即可利用前述方法在有纖 上、製 超細線路。 U )上表作 有：明又一較佳實施— # 在-有纖基板（1〇 )表面壓上銅膜（ 銅：（11)上形成銅線路（12)，而在銅線 )表面形成錫層（13)(如第二圖八所示）； 丄2Π纖基板（1 ◦)表面的銅膜（1 1 )與鋼線路（ 進仃蝕刻，使銅線路（1 2)側壁略微凹入，該凹 入處則為錫層（i 3 )所覆蓋（如第二圖6所示）·， 在有纖基板（1 〇)上電錢電著光阻（丄 (14)均勻的覆蓋於銅膜（11)與鋼線路（ 1 2)表面，並進行均㈣電著光阻钱將光阻錢在錫層 1 / 2 本紙張尺度適用中國國家鮮（CNS)A4規格⑵Q χ 297公爱 511430 A7Second figure =: Then remove the photoresist used to transfer the image of the copper circuit (if the photoresist is attached to the fiber substrate (10), the resistance (") covers the copper film (11) and the second circuit = 2) ) The surface and its side wall (as shown in the first figure c); remove the copper circuit (丄 2) side on the fiber substrate (i 〇) = xiyu electrical photoresist (14) (as shown in -㈣) , Meaning the photoresist (位于 4) located on the side wall of the copper line (i 2). Remove the excess copper film on the fiber substrate (10) (1 = shown in Figure 2): at this time the copper line (12) The side wall is isolated and protected by the photoresist 14), so it is not affected by the etching process; strip the 3 photoresist (work 4) and the tin layer on the surface of the copper line (i 2) (13) (as shown in the first figure); Zhizhong. Is a photoresist, originally used in the painting of metal articles with complex shapes ^ 'At present, it is used as a photoresist, which is used for depositing or electric money. In the method, the copper surface of the circuit board to which the photosensitive charged resin charged colloid particles are uniformly hooked is used as an anti-etching resist. Like ordinary photoresists, electrical photoresists are also divided into positive photoresists and negative photoresists. In this embodiment, positive photoresists are used. And because the shape of the circuit is regular, the adhesion of the photoresist is based on deposition. // The photoresist (1 4) can be evenly attached to the copper surface, so when Tian You fiber substrate (10) deposits the organic photoresist, the photoresist (1 4) will be evenly attached. The 6 papers on its copper film (11) and copper circuit (12) are suitable for the National Standard (CNS) A specification of the country of wealth. (Please read the precautions on the back before filling in this page) 511430 A7 B7 V. Description of the invention (H3) The surface is 'parallel-adhered' to the copper circuit (step 12) Then, remove the multi-art 2) 2: its engravable liquid engraving method, remove the copper film (11) other than the copper line (12) side J. = Back_ Use the image transfer, exposure and development to match the surface of the tin layer (13) and the electrical writing on the side wall (14) '㈣ to complete the circuit production on the fiber substrate (1Q). In the copper transfer method, the isolation and protection of the photoresist (14) is used, and the sidewall of 3/1 2 2) is not eroded during the etching process, so that the integrity of the copper circuit (i 2) can be ensured. Completeness: Under the condition of order, you can use the method described above to make ultra-fine lines on fiber. U) The above table is as follows: Ming another preferred implementation — # A copper film is pressed on the surface of the fiber substrate (10) (copper: (11) forms a copper circuit (12), and a copper wire) forms Tin layer (13) (as shown in the second figure eight); Π2Π fiber substrate (1 ◦) on the surface of the copper film (1 1) and the steel circuit (etched to make the side of the copper circuit (1 2) slightly concave The recess is covered by the tin layer (i 3) (as shown in the second figure 6). The photoresist (丄 (14) is uniformly covered on the fiber substrate (10)) Copper film (11) and steel circuit (1 2) surface, and uniformly photoresist the money to put the photoresist in the tin layer 1/2. The paper size is applicable to China National Fresh (CNS) A4 specification. Q χ 297 511430 A7
(1 3 )下方的銅線側壁（如第二圖c所示）·， 利用曝光《彡方式除去有纖基板（i Q )上除銅線路 、(12)側壁以外的電著光阻（14)(如第二圖d所示 II多餘的鋼膜（i i ( i著光阻（1 4)及A表 示）；其中：Μ :1 2 )先作適當程度的 .4)後，可為銅線路（ 〔’針對前述的側蝕量係 U灸，其形狀已呈現不規 :1 4)得均勻的附著在 面〇 :’由於錫層（1 3 )的 下方的電著光阻（i 4 壁上的電著光阻（14 銅膜（11)及錫層（ 不發生側蝕現象，而利 泉路。 一種可使基板上線路於 可確保線路的完整性及 故可有效提高線路的密 ——-从4現袼（21〇 x 297公爱）——----(1 3) The side wall of the copper wire underneath (as shown in the second figure c), and the photoresist on the fiber substrate (i Q) except for the copper circuit and the side wall of (12) is removed by the exposure method (14 ) (As shown in the second figure d II, the excess steel film (ii (i is the photoresist (1 4) and A); where: M: 1 2) first make the appropriate degree. 4), it can be copper The line (['For the aforementioned side erosion amount is U moxibustion, its shape has been irregular: 1 4) must be uniformly attached to the surface 0:' Due to the electrical photoresist (i 4 under the tin layer (1 3)) Electrophotographic photoresist on the wall (14 copper film (11) and tin layer (without side erosion phenomenon, but Liquan Road. One can make the circuit on the substrate to ensure the integrity of the circuit and effectively improve the density of the circuit. ——- from 4 now (21〇x 297 public love) --------
511430 A7 _B7_ 五、發明說明（7 ) 度與均勻度，由此可見，本發明已具備顯著的實用價值與 進步性，並符合發明專利要件，爰依法提起申請。 (請先閱讀背面之注意事項再填寫本頁) 裝 --訂—------- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）511430 A7 _B7_ V. Description of the invention (7) Degree and uniformity. It can be seen that the invention has significant practical value and progress, and meets the requirements of invention patents. (Please read the precautions on the back before filling out this page) Binding-Bookmarking --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized according to the Chinese National Standard (CNS) A4 (210 X 297 mm)