TW511291B - Plating apparatus - Google Patents
Plating apparatus Download PDFInfo
- Publication number
- TW511291B TW511291B TW090105095A TW90105095A TW511291B TW 511291 B TW511291 B TW 511291B TW 090105095 A TW090105095 A TW 090105095A TW 90105095 A TW90105095 A TW 90105095A TW 511291 B TW511291 B TW 511291B
- Authority
- TW
- Taiwan
- Prior art keywords
- plating
- bath
- electroplating
- aforementioned
- baths
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims abstract description 136
- 238000005406 washing Methods 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims description 50
- 230000007246 mechanism Effects 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000009751 slip forming Methods 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000010410 layer Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000002356 single layer Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000012054 meals Nutrition 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 201000004569 Blindness Diseases 0.000 description 1
- 101100493705 Caenorhabditis elegans bath-36 gene Proteins 0.000 description 1
- 101100493706 Caenorhabditis elegans bath-38 gene Proteins 0.000 description 1
- 101100493710 Caenorhabditis elegans bath-40 gene Proteins 0.000 description 1
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 101150062523 bath-39 gene Proteins 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000085536A JP3588304B2 (ja) | 2000-03-27 | 2000-03-27 | メッキ装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW511291B true TW511291B (en) | 2002-11-21 |
Family
ID=18601862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090105095A TW511291B (en) | 2000-03-27 | 2001-03-06 | Plating apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3588304B2 (ko) |
| KR (1) | KR100574304B1 (ko) |
| CN (1) | CN1234919C (ko) |
| TW (1) | TW511291B (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3568486B2 (ja) * | 2000-03-29 | 2004-09-22 | 三洋電機株式会社 | 半導体装置の製造方法 |
| US7772043B2 (en) | 2001-12-12 | 2010-08-10 | Sanyo Electric Co., Ltd. | Plating apparatus, plating method and manufacturing method for semiconductor device |
| JP4813935B2 (ja) * | 2006-03-20 | 2011-11-09 | 上村工業株式会社 | 搬送用ハンガー |
| CN103305896B (zh) * | 2012-03-07 | 2015-09-09 | 昆山东威电镀设备技术有限公司 | 连续电镀液体导电装置及连续液体电镀方法 |
| JP6463622B2 (ja) * | 2014-11-27 | 2019-02-06 | Ykk株式会社 | めっき装置、めっきユニット、及びめっきライン |
| CN106319606B (zh) * | 2016-07-18 | 2018-08-14 | 北京纽堡科技有限公司 | 矩阵式电镀生产线 |
| KR101729769B1 (ko) * | 2016-09-29 | 2017-04-24 | 주식회사 지씨이 | 하나의 시스템 내에서 2종 이상의 도금을 동시에 시행할 수 있게 하는 인쇄회로기판 도금장치 |
| CN115573019B (zh) * | 2022-12-09 | 2023-02-17 | 宁波德洲精密电子有限公司 | 一种引线框架电镀柜 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05255899A (ja) * | 1992-03-12 | 1993-10-05 | Electroplating Eng Of Japan Co | 自動めっき装置 |
| JP2825732B2 (ja) * | 1993-05-31 | 1998-11-18 | 大日本印刷株式会社 | Ｉｃリードフレームの部分めっき装置 |
-
2000
- 2000-03-27 JP JP2000085536A patent/JP3588304B2/ja not_active Expired - Fee Related
-
2001
- 2001-03-06 TW TW090105095A patent/TW511291B/zh active
- 2001-03-26 KR KR1020010015541A patent/KR100574304B1/ko not_active IP Right Cessation
- 2001-03-27 CN CNB011120681A patent/CN1234919C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010091034A (ko) | 2001-10-22 |
| JP2001271200A (ja) | 2001-10-02 |
| KR100574304B1 (ko) | 2006-04-27 |
| CN1322863A (zh) | 2001-11-21 |
| JP3588304B2 (ja) | 2004-11-10 |
| CN1234919C (zh) | 2006-01-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |