507497 A7 _B7_ 五、發明說明（） 本發明係與印刷電路板（P c B )之製作方法有關， 特別是關於印刷電路板之防焊方法。 (請先閱讀背面之注意事項再填寫本頁) 按，一般印刷電路板之製作上，於外層線路之之製作 完成後，必須對該外層線路施以防焊保護處理，藉以避免 5 該外層線路氧化或焊接短路。 而習知印刷電路板之防焊處理方法，係以網版印刷、 滾筒式塗佈、簾塗或靜電噴塗等方式將聚焊綠漆塗覆於該 電路板之板面上，先經預烘乾燥後泠卻後，再利用曝光呈 像、顯影之方式去除不須保留之綠漆，並在最後以高溫烘 10 烤使保留下之綠漆中的樹脂完全硬化，形成保護該電路板 之電路的保護層。 此種習知防焊處理方法具有下列缺點： 1. 利用網版印刷或滾筒式塗佈等方式將防焊綠漆塗 覆於印刷電路板之方式，必須藉由多次網印或滾 15 印程序，才能累積綠漆至所需之厚度，故於程序 上較為繁複。 2. 在對該印刷電路板進行南溫洪烤的過程中’由於該 防焊綠漆中之樹脂材料與該電路板基材之膨脹係 數不同，故該樹脂材料與該電路板間容易產生内 經濟部智慧財產局員工消費合作社印製 20 應力，而使該電路板產生撓曲之現象。 3. 該防焊綠漆層之厚度不易控制，導致該電路板之電 性不穩。 4. 在塗覆防焊綠漆於電路板之過程中容易滲入氣 泡，致使防焊信賴性品質不佳，且形成之防焊層 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 507497 A7 _B7_^_ 五、發明說明（） 的壽命較短。 (請先閱讀背面之注意事項再填寫本頁) 5. 塗覆防焊綠漆於電路板之方式並無法使防焊綠漆 填滿該電路板上之通孔’故'^般在塗覆前’係先 以絕緣填塞物填塞該等通孔並刷磨平整後，再進 5 行防焊綠漆之塗覆，因而增加了印刷電路板製作 之時間及成本。 6. 塗覆防焊綠漆於電路板上時，於銅箔線路上較難形 成塗覆層，且其間結合度較差。 有鑑於此，本發明之主要目的在於提供一種防焊品質 10 良好，且不會引起電路板撓曲之印刷電路板之防焊方法。 經濟部智慧財產局員工消費合作社印製 用以達成前揭之發明目的，本發明之印刷電路板之防 焊方法，主要是於待防焊之電路板具有電路之一面或雙面 上，設有一層膨脹係數與該電路板基材相同的半固態防焊 材料、以及一覆蓋於該樹脂材料上之一金屬箔，再施予預 15 定壓力於該金屬箔上，並以一預定溫度烘烤一預定時間， 使該半固態之防焊材料固化；利用化學溶劑蝕刻方式將該 電路板上欲露出之銅面上方之金屬箔去除，再以電漿蝕刻 之方法將該電路板上欲露出之銅面上方的固態防焊材料去 除，以露出上述銅面；最後，利用化學溶劑去除覆蓋於該 20 防焊材料上剩餘之金屬箔及乾膜，完成該印刷電路板之防 焊作業。 為了讓貴審查委員能更清楚地了解本發明，茲舉本 發明較佳之實施例，並配合下列圖示詳細說明之： 第一圖係本發明方法之流程圖 一 4 一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 507497 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明說明（） 第二圖係本發明方法之實施示意圖 請參閱第一调，本發明之印刷電路板之防焊方法的步 驟如下： 一、 防焊材料之覆著：於待防焊之電路板具有電路之 5 一面或雙面上，設有一層預定厚度之膨脹係數與該電路板 基材相同或相近的半固態防焊材料、以及覆蓋於該防焊材 料上之一預定厚度的金屬箔。 二、 防焊材料之壓合與固化：施予預定壓力於該金屬 箔上，使該金屬箔與該電路板間之防焊材料緊密地覆著於 10 該電路板上，並以一預定溫度烘烤一預定時間，使該半固 態之防焊材料固化。 三、 非必要防焊材料之去除：利用化學溶劑蝕刻方式 將該電路板上欲露出之銅面上方之金屬箔去除，再以電漿 蝕刻之方法將該電路板上欲露出之銅面上方的固態防焊材 15 料去除，以露出上述銅面。 四、 金屬箔之去除：利用化學溶劑去除覆蓋於該防焊 材料上剩餘之金屬箱，完成該印刷電路板之防焊作業。 以上乃本發明之方法步驟，以下，茲舉一較佳實施例 配合第二圖，詳細說明本發明方法。 20 請參閱第二圖，本實施例之印刷電路板之防焊方法， 主要係用以在一已完成鑽通孔、鍍通孔及外層線路製作等 步驟之印刷電路板1上，作該電路板1外層線路防焊之防 焊處理，且該印刷電路之基材1 1材質為多功能環氧樹脂 (Multi-function Epoxy);因此，在本實施例中，該印刷 請 先 閱 讀 背 面 之 注 意 事 項赢1 5裝 t 訂 •f 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5Q7497 經濟部智慧財產局員工消費合作社印製 A7 B7 發明說明（） 電路板1上具有多數通孔12及預定之外層銅箔線路13 (如第二圖A所示）。而該印刷電路板1之防焊方法如下： 一、 防焊材料之覆著： 首先，準備一厚度介於20//m〜40/zm之鋁箔2，並 5 於該鋁箔2之一面上塗覆厚度約30 // m〜100 // m之防焊 材料3。該防焊材料3係以與該電路板1之基材1 1相同 材質之多功能環氧樹脂漆加有機溶劑而成，並經預烘形成 半固態狀（即黏稠狀）。以該鋁箔2上之防焊材料3貼覆 於該電路板1欲作防焊處理之一面上，使該防焊材料3夾 10 介於該電路板1與該鋁箔3間（如第二圖B所示）。 二、 防焊材料之壓合與固化： 施予10〜40 kgw/cm平方之均力於該銘箔2上，並施 予185°C之溫度烘烤該該防焊材料3，持續約1.5小時〜3 小時，致使： 15 1.該防焊材料3因所施予之壓力而填塞滿該電路板1 上之通孔1 2、盲孔等微孔且密切地著覆於於電路板1 上，形成一覆著層。 2.該防焊材料3中之有機溶劑因受熱而揮發，且該防焊 材料3中之環氧樹脂逐漸固化，形成一防焊保護層。 20 待該防焊材料3中之環氧樹脂固化而形成一防焊保護 層後，解除所施予之壓力及溫度。 三、 非必要防焊材料之去除： 以適當的溫度及壓力壓設一乾膜光阻4於該鋁箔2上 (如第二圖C所示），隨後配合一底片對該乾膜光阻4進 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 丨丨丨丨丨Λ- (請先閱讀背面之注意事項再填寫本頁) 裝 .. 507497 A7 B7 五、發明說明（） 行光照曝光，使該乾膜光阻4上’相對於該電路板1上不 欲裸露之線路的位置處產生顯影；再以破酸水溶劑和比重 (specific gravity ) 1·3〜1·5、溫度 40 C 〜60 C 之二鼠化 鐵（FeC 13 )溶劑分別蚀刻去除未顯影處之乾膜4 a及銘箔 5 2 a，使該銘结被去除處之彡衣氧樹脂露出於外（如弟一圖 D所示），再以1〜3 wt%、溫度45°C〜65°C之氫氧化鈉 (NaOH)去除剩餘之乾膜4 〇 隨後，利用電漿蝕刻之方式將露出之環氧樹脂蚀刻去 除’使該電路板1上欲裸路之銅免1 3 a鉻出（如弟一圖 10 E所示）。 四、金屬羯之去除· 最後，以體積比（v〇lumetov〇lume) 6〇%〜80%、溫 度50°C〜8〇°C之磷酸（H3P04)溶劑’或以濃度10%〜40 %、溫度20°C〜4 0 °C之鹽酸（HC1)去除剩餘之銘箔2 15 (如第二圖F所示）’完成整個防焊作業’該印刷電路板 1便可績行裸露銅箔1 3 a之鍍、鎳金作業。由於磷酸或 鹽酸可以腐蝕鋁而不會對強烈腐蝕銅，故本實施例選用鋁 箔作為防焊材料之覆層，便是基於此因。 經濟部智慧財產局員工消費合作社印製 由於上述壓設乾膜、曝光及顯影、電漿蝕刻等技術係 20 己知常用之技術，故在此便無更進一步說明之必要。 以下，茲說明本實施例之優點如下： 一、 該防焊材料3之厚度可一次設定完成，而能減少 製作程序，以減低製作成本。 二、 由於該防焊材料3為與該電路板1之基材1 1相 ________4 二 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印制衣 507497 A7 B7_ 五、發明說明（） 同的多功能環氧樹脂，其膨脹係數與該電路板1之基材1 1相同，故而在上述步驟二之烘烤的過程中，該防焊材料 3與該電路板1間不會產生因内應力出現而致使該電路板 1撓曲之情事。尤其，在步驟二之烘烤過程中，同時對該 5 對電路板1施有均力，更可防止該電路板1之變形。 三、由於該防焊材料3著附於該電路板上1後，其隔 介該鋁箔2而受有一均力維持一段時間，故該防焊材料3 會厚度均勻地著覆於該電路板1上，並於固化後形成厚度 均均之防焊保護層，使得該電路板1之電性較為穩定。 10 四、由於該防焊材料3著附於該電路板1上後，其隔 介該鋁箔2而受有一均力維持至其固化，故此一段期間不 易滲入氣泡，而能提高防焊保護層之品質，並延長其壽命。 五、 該防焊材料3因所施予之壓力而能同時填塞滿該 電路板1上之通孔、盲孔等微孔，故該電路板1於防焊前， 15 不須先以絕緣填塞物填塞該等通孔並刷磨平整，故可節省 該印刷電路板之製作時間，而能減低製作成本。 六、 該防焊材料3係以加壓加溫之方式著覆於該電路 板1上，故於該電路板1之銅箔線路1 3上亦能容易地著 覆，不會有著覆不良或剖離之情事。 20 综上所述，可知本發明確實可達成前揭之發明目的， 而確實具有增進之功效，具有產業之利用價值且可有效提 昇產業技術。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 裝--- (請先閱讀背面之注意事項*(填寫本頁) 訂· _ 507497 A7 B7 五、發明說明（ 圖不說明 第一圖係本發明方法之流程圖 第二圖係本發明方法之實施示意圖 符號說明： 10 15 印刷電路板1 基材1 1 通孔1 2 銅猪線路1 3 欲裸露之銅箔1 3 a 鋁箔2 未顯影處之銘猪2 a 防焊材料3 乾膜光阻4 未顯影之乾膜4 a (請先閱讀背面之注意事項再填寫本頁) _裝 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）507497 A7 _B7_ V. Description of the invention () The present invention is related to the method of making printed circuit boards (P c B), especially the soldering method of printed circuit boards. (Please read the precautions on the back before filling this page.) Press. For the production of general printed circuit boards, after the production of the outer circuit is completed, the outer circuit must be protected by soldering to prevent 5 outer circuits. Oxidation or welding short circuit. The conventional soldering treatment method for printed circuit boards is to apply poly-solder green paint to the surface of the circuit board by screen printing, roller coating, curtain coating or electrostatic spraying, and then pre-baking. After drying, the green paint that does not need to be retained is removed by exposure, imaging, and development, and finally baked at a high temperature for 10 hours to completely harden the resin in the retained green paint to form a circuit that protects the circuit board. Protective layer. This conventional solder mask treatment method has the following disadvantages: 1. The method of applying solder mask green paint to the printed circuit board by screen printing or roller coating must be repeated by screen printing or roller 15 printing. Only the procedure can accumulate the green paint to the required thickness, so the procedure is more complicated. 2. In the process of baking the printed circuit board in the south temperature, because the expansion coefficient of the resin material in the solder-proof green paint and the substrate of the circuit board is different, the resin material and the circuit board are prone to generate internal stress. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed 20 stresses, which caused the circuit board to flex. 3. The thickness of the solder resist green paint layer is not easy to control, resulting in electrical instability of the circuit board. 4. It is easy to infiltrate air bubbles during the process of applying solder mask green paint to the circuit board, resulting in poor quality of solder mask reliability, and the solder mask formed. The paper dimensions are applicable to Chinese National Standard (CNS) A4 (210 X 297) (Mm) 507497 A7 _B7 _ ^ _ 5. The description of the invention () has a short life. (Please read the precautions on the back before filling this page) 5. The method of applying the solder mask green paint to the circuit board does not make the solder mask green paint fill the through holes of the circuit board. “Front” is used to fill the through-holes with insulation fillers and brush and smooth them, and then apply 5 solder mask green paints, which increases the time and cost of printed circuit board production. 6. When applying solder-proof green paint on the circuit board, it is difficult to form a coating layer on the copper foil circuit, and the bonding degree between them is poor. In view of this, the main object of the present invention is to provide a soldering method for a printed circuit board that has good solder protection quality and does not cause circuit board deflection. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to achieve the previously disclosed purpose of the invention, the soldering protection method of the printed circuit board of the present invention is mainly provided on one or both sides of the circuit board to be soldered. A layer of semi-solid solder resist with the same expansion coefficient as the substrate of the circuit board, and a metal foil covering the resin material, and then a predetermined pressure is applied to the metal foil and baked at a predetermined temperature The semi-solid solder resist material is cured for a predetermined time; the metal foil above the copper surface to be exposed on the circuit board is removed by chemical solvent etching, and the circuit board is to be exposed by plasma etching. The solid solder mask material above the copper surface is removed to expose the copper surface. Finally, the remaining metal foil and dry film covering the 20 solder mask materials are removed with a chemical solvent to complete the solder mask operation of the printed circuit board. In order to allow your reviewers to understand the present invention more clearly, the preferred embodiment of the present invention is given below, and it will be described in detail with the following diagrams: The first diagram is a flowchart of the method of the present invention 1-4 The paper size is applicable to the country of China Standard (CNS) A4 specification (210 X 297 mm) 507497 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Description of the invention () The second diagram is a schematic diagram of the implementation of the method of the present invention. The steps of the soldering prevention method of the printed circuit board are as follows: 1. Covering the soldering prevention material: The circuit board to be soldered has 5 sides or both sides of the circuit, and is provided with a layer of expansion coefficient of a predetermined thickness and the circuit board. A semi-solid solder mask material with the same or similar substrates, and a metal foil with a predetermined thickness covering the solder mask material. 2. Compression and solidification of solder resist material: Apply a predetermined pressure to the metal foil, so that the solder resist material between the metal foil and the circuit board is tightly covered on the 10 circuit board, and at a predetermined temperature Baking for a predetermined time to cure the semi-solid solder resist. 3. Removal of non-essential solder masking materials: The metal foil above the copper surface to be exposed on the circuit board is removed by chemical solvent etching, and the copper foil on the circuit board is to be exposed by plasma etching. The solid solder resist 15 is removed to expose the copper surface. 4. Removal of metal foil: Use a chemical solvent to remove the remaining metal box covering the solder mask material to complete the solder mask operation of the printed circuit board. The above are the method steps of the present invention. In the following, a preferred embodiment is described in detail with reference to the second figure. 20 Please refer to the second figure. The soldering prevention method of the printed circuit board in this embodiment is mainly used to make the circuit on a printed circuit board 1 that has completed the steps of drilling through holes, plated through holes, and manufacturing outer layers. The soldering treatment of the soldering of the outer layer of the board 1 and the substrate 11 of the printed circuit is made of multi-function epoxy; therefore, in this embodiment, please read the note on the back first Matter to win 1 5 pack t order • f This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 5Q7497 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs, A7 B7 Invention Description () on circuit board 1 Most of the through holes 12 and the predetermined outer layer copper foil circuit 13 (as shown in the second figure A). The method of soldering the printed circuit board 1 is as follows: 1. Coating of solder resist material: First, prepare an aluminum foil 2 with a thickness of 20 // m ~ 40 / zm, and apply 5 on one side of the aluminum foil 2. Solder mask material with a thickness of about 30 // m to 100 // m3. The solder resist material 3 is made of a multifunctional epoxy resin paint of the same material as the substrate 11 of the circuit board 1 with an organic solvent, and is pre-baked to form a semi-solid state (ie, a viscous state). The solder resist material 3 on the aluminum foil 2 is pasted on one side of the circuit board 1 to be subjected to solder resist treatment, so that the solder resist material 3 is clamped 10 between the circuit board 1 and the aluminum foil 3 (as shown in the second figure). B). 2. Compression and solidification of solder resist material: A uniform force of 10 ~ 40 kgw / cm square is applied to the Ming foil 2, and the solder resist material 3 is baked at 185 ° C for about 1.5 Hours to 3 hours, resulting in: 15 1. The solder mask 3 fills the through holes 1 on the circuit board 1 due to the applied pressure 2. The micro holes such as blind holes are closely covered on the circuit board 1 On, a covering layer is formed. 2. The organic solvent in the solder resist 3 is volatilized by heat, and the epoxy resin in the solder resist 3 is gradually cured to form a solder resist. 20 After the epoxy resin in the solder resist material 3 is cured to form a solder resist protection layer, the applied pressure and temperature are released. 3. Removal of unnecessary solder mask material: Set a dry film photoresist 4 on the aluminum foil 2 with appropriate temperature and pressure (as shown in the second figure C), and then cooperate with a film to enter the dry film photoresist 4 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 丨 丨 丨 丨 丨 Λ- (Please read the precautions on the back before filling this page) Packing: 507497 A7 B7 V. Description of the invention ( ) Line exposure, so that the development of the dry film photoresist 4 with respect to the position of the circuit board 1 does not want to be exposed to the development; and then with acid-breaking water solvent and specific gravity (1 ~ 3 ~ 1 ·) 5. The temperature of 40 C ～ 60 C is etched to remove the dry film 4 a and the foil 5 2 a of the undeveloped part respectively, so that the oxygen-repellent resin on the place where the inscription is removed is exposed. (As shown in Figure D), remove the remaining dry film with 1 ~ 3 wt% sodium hydroxide (NaOH) at a temperature of 45 ° C to 65 ° C. 4 Then, use plasma etching to remove the remaining dry film. The exposed epoxy resin is etched and removed, so that the copper on the circuit board 1 to be exposed is freed from chromium by 1 3 a (as shown in FIG. 10E). 4. Removal of metal samarium. Finally, a phosphoric acid (H3P04) solvent 'with a volume ratio (v〇lumetov〇lume) of 60% to 80%, a temperature of 50 ° C to 80 ° C, or a concentration of 10% to 40%. Hydrochloric acid (HC1) at a temperature of 20 ° C ~ 40 ° C remove the remaining foil 2 15 (as shown in the second figure F) 'Complete the entire solder mask operation' The printed circuit board 1 can perform bare copper foil 1 3 a plating, nickel gold operation. Because phosphoric acid or hydrochloric acid can corrode aluminum without corrosive copper, this embodiment uses aluminum foil as the coating of the solder resist material for this reason. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Since the above-mentioned technologies such as laminating dry film, exposure and development, and plasma etching are well-known technologies, there is no need for further explanation here. In the following, the advantages of this embodiment are described as follows: 1. The thickness of the solder resist 3 can be set at one time, which can reduce the production process and reduce the production cost. 2. Since the solder resist material 3 is in phase 1 with the substrate 1 of the circuit board 1 ________4 The two paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed clothing 507497 A7 B7_ V. Description of the invention () The same multifunctional epoxy resin has the same expansion coefficient as the substrate 1 1 of the circuit board 1, so during the baking of step 2 above, the solder resist The material 3 and the circuit board 1 will not cause the circuit board 1 to flex due to the occurrence of internal stress. In particular, during the baking process in step two, even force is applied to the 5 pairs of circuit boards 1 at the same time, which can prevent the circuit board 1 from being deformed. 3. After the solder resist 3 is attached to the circuit board 1, it is maintained for a period of time by the aluminum foil 2 through the aluminum foil 2. Therefore, the solder resist 3 will cover the circuit board 1 evenly in thickness. After that, a solder resist with a uniform thickness is formed after curing, so that the electrical properties of the circuit board 1 are relatively stable. 10 Fourth, after the solder resist 3 is attached to the circuit board 1, it is maintained by a uniform force through the aluminum foil 2 until it solidifies, so it is not easy to penetrate the air bubbles during this period, and the solder resist can be improved. Quality and extend its life. V. The solder resist material 3 can fill the micro holes such as through holes and blind holes on the circuit board 1 at the same time due to the applied pressure. Therefore, the circuit board 1 does not need to be filled with insulation before soldering. The material fills the through holes and is brushed and flattened, so the manufacturing time of the printed circuit board can be saved, and the manufacturing cost can be reduced. 6. The solder resist material 3 is covered on the circuit board 1 by means of pressure and heating, so it can be easily covered on the copper foil circuit 1 3 of the circuit board 1 without any defective coating or Separation of affairs. 20 In summary, it can be seen that the present invention can indeed achieve the purpose of the invention previously disclosed, and indeed has an enhanced effect, has an industrial use value, and can effectively improve industrial technology. This paper size applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm). Packing --- (Please read the notes on the back * (fill in this page). _ 507497 A7 B7 V. Description of the invention (not shown) The first diagram is a flowchart of the method of the present invention. The second diagram is a schematic diagram of the method of the present invention. Symbol description: 10 15 Printed circuit board 1 Substrate 1 1 Through hole 1 2 Copper pig circuit 1 3 Copper foil to be exposed 1 3 a Aluminum foil 2 Pig with undeveloped part 2 a Solder mask 3 Dry film photoresist 4 Dry film with undeveloped 4 a (Please read the precautions on the back before filling this page) Printed paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)