TW507347B - Method for filling plating through hole on package substrate and mechanism thereof - Google Patents

Abstract

A method for filling a plating through hole (PTH) on an package substrate and a mechanism thereof are applied on a process of filling a PTH of an package substrate produced by roll to roll, reel to reel or panel to panel in a high density I/O package flexible substrate. The method mainly comprises: forming a release film on upper and lower surfaces of an package substrate; forming a plurality of PTHs in the package substrate; filling the PTHs with an electrically conductive material; forming a plurality of plugs in which the upper and lower ends of each plug form bumps; removing the upper and lower bumps of the plugs; and removing the release film to complete the production of filling the PTH of a package substrate.

Description

507347 V. Description of the invention (υ [Field of invention] The present invention relates to a method and a mechanism for filling through holes in a package substrate, and is effectively applied to a high-density I / 0 package substrate, especially a process for manufacturing through holes in a flexible substrate. BACKGROUND OF THE INVENTION Generally speaking, in conventional packaging substrates, such as the Flexible Substrate produced by Roll to Roll or Reei to Reel, the conductor layer is usually only Single-layer metal layer or double-layer metal layer. For the double-layer metal layer's piating through hole (PTH), when the hole diameter is more than 100uin, usually only the through-holes are electroplated. However, when the hole diameter is smaller than 丨 00um, if the whole hole is plated with conductive material to complete the plugging, it will be quite difficult and time-consuming to implement. Now please refer to the first figure, the first The figure shows the conventional technology, when the hole diameter of the through hole 2 of the packaging substrate 1 is small, a conductive plating layer 3 is directly plated by electroplating to fill the through hole 2 to form electrical conduction. However, Kanji In production, it is very difficult and time-consuming to completely fill the through hole without gaps by electroplating. Moreover, there will be unevenness in the up and down of the through hole 2 and it is easy for moisture to enter. Please refer to the second for the production. Figures A and B are another common method of packaging substrates. The second method shown in Figure A is a plugging hole of a conventional packaging substrate. In the clothing technology, a plating layer is plated on the packaging substrate 1. 3, and fill the through hole: after the plug 4 is formed, a bump is formed on the upper and lower ends of the plug 4; = through; after; 'must be smoothed by the process of brushing the substrate surface, as shown in the second B

507347 V. Description of the invention (2) No. 1 The main disadvantage is that by the method of surface smoothing, it is unavoidable to apply great pressure on the surface of the board, which is very likely to cause great variation and damage to the material and the problem of material expansion and contraction; and This brush grinding process step reduces the production yield. Therefore, the flexible substrate cannot be completed by the conventional manufacturing method shown in the second figure; and the flexible substrate also faces the same problem when there are multiple conductor layers. Because of this, the present invention proposes a process method that does not require brushing, does not generate deformation force on the substrate, and can be effectively applied to the packing of high-density holes. The process method is simple and fast. [Summary and purpose of the invention] The main purpose of the present invention is to provide a method and mechanism for filling through holes of a package substrate, which can be effectively applied to a roll-type (Rou to R〇l 丨) and a roll-shaped (Reel to Reel) and panel (panei panei) and other production methods of the package substrate through-hole plugging process. Another object of the present invention is to provide a method for filling via holes in a package substrate and a mechanism thereof, which can be effectively used in a package substrate for multi-layer conductor layers. Another object of the present invention is to provide a method for filling via holes in a package substrate and Its mechanism can omit the process of through-hole plating and achieve the purpose of electrically conducting the substrate up and down. Another object of the present invention is to provide a method for filling via holes in a package substrate and a mechanism thereof, which do not need to be subjected to a brushing treatment and do not generate a deformation force on a substrate. Another object of the present invention is to provide through-hole filling in a package substrate.

507347 V. Description of the invention (3) The method and its mechanism 'can be applied to high-density through-hole packing, and the manufacturing method is short and fast. In order to achieve the above-mentioned object, the through-hole filling method for a package substrate according to the present invention includes: first, forming a release film on the upper and lower surfaces of a package substrate in a desired process, and forming a plurality of packages in the package substrate; Through holes can be formed by punching, laser drilling, or mechanical drilling (Dr. 1 1 i ng). Then, the conductive material is used to fill a plurality of through-holes that are formed. Therefore, a plurality of plugs are formed, and a bump is formed at each of the upper and lower ends of the base. After that, the upper and lower bumps of the two plugs can be removed by a rubber scraper. Finally, the release film on the package substrate is removed to form a via hole for the package substrate. 70 Preferably, the through-hole filling method of the packaging substrate according to the present invention is a method of filling conductive materials into a plurality of through-holes. The method is: ΐΓΓ = ηΗηδ), double-sided printing (D〇Uble Side Printing) i right? Sldecoating) and other methods; even stuffing conductive materials into plug holes with multiple through / use holes. For better luck, it is used in the smaller through hole filling mechanism of the package substrate according to the present invention. The spoon is fixed through one side of the screen to the other side and the conductive material is fixed. The substrate is placed between the stencil and the fixture to install the base. 507347 V. Description of the invention (4) Design: There is a scraper and conductive material, which can be applied to the stencil back and forth by the scraper to make the conductive material penetrate uniformly Into the through hole of the package substrate to complete the through hole filling of the package substrate. Comparison: For the through-hole filling core of the package substrate according to the present invention, a plurality of stencils or steel plates are packaged. Each of the stencils (or steel plates) can be borrowed from a certain material (such as a conductive material). One side of the screen (or steel plate) penetrates from the side to the side, and the packaging substrate is placed between a plurality of screens (or steel plates), such as the middle of two screens (or steel plates). Each mesh (or steel plate) is provided with a scraper and a conductive material is placed. The scraper in the mesh (or steel plate) can be used to penetrate the conductive material into the through hole of the packaging substrate to fill the through hole. hole. And it includes another, a scraper, which is individually installed on the outside of the screen (or steel plate) to scrape up and down the flat plate generated after the completion of the through hole base. ,

Preferably, the through-hole filling mechanism of the package substrate according to the present invention includes a set of rollers, which are correspondingly disposed on the top and bottom of the package substrate. A group of conductive materials, which are individually placed between the roller and the top and bottom of the package substrate The main reason is that the conductive material can be uniformly filled into the through holes of the packaging substrate by rolling back and forth through the roller to fill the through holes. There are also two sets of driver's knives, which are individually installed on the outer side of the drum 'to scrape up and down convex plates produced after the through-holes are filled. 'A For convenience of explanation, the term “stencil” in the following means to include a plate or a steel plate. Since the method uses a mesh plate, the conductive material can be evenly distributed on the

3U / J47 V. Description of the invention (5) " --- On the release film ′ will not cause waste of conductive materials, so it can save process cost and easy operation. [Detailed description of the invention] The present invention proposes a method and a mechanism for filling through holes of a package substrate, which are mainly applicable to roll-to-roll and roll-type (Reel tReel) or through-hole and plug-in process of packaging substrates such as Panel to Panel. And the method of the present invention does not require a brushing treatment, and does not generate a deformation force on the substrate, and its manufacturing method is simple and fast. Regarding the detailed content and technology of the present invention, the following explanations are given in conjunction with the drawings as follows: > Now refer to FIG. 2A, and FIG. The cross-section of the through hole 2 formed on the substrate 1 is not intended. First, the method flow of the present invention is to form a release film 14 on each of the package substrate 10 and the upper and lower surfaces, and then form a plurality of through holes 12 in the package substrate 10. Among them, the plurality of through-holes 12 can be formed by punching, laser drilling, or mechanical drilling 1 2 ing. Then, the conductive material is used to fill the plurality of through holes 12 to form a plurality of plugs 20, and a bump 22 is formed at each of the upper and lower ends of each plug 20, as shown in FIG. 3b. After that, the upper and lower bumps 22 of the plurality of plugs 20 are removed. After the bumps 22 are scraped off, 4 is shown in FIG. 3C. Finally, the release film 14 is removed, and the through-holes 12 of the package substrate 10 are filled to become a conductive plug 20, as shown in FIG. 3D. The above-mentioned method for removing the bumps 22 is mainly provided by a set of scrapers.

Page 8 JU / J47 V. Description of the invention (6)-The person who scraped the upper and lower bumps 22 will be further explained in the fifth figure C described later. The scraper can be a scraper. Xi . In the practical application of the method for filling the through-holes of the packaging substrate of the present invention, the process step of forming a circuit pattern is further combined with j, so that the manufacturing process of the substrate of the present invention can further include a process of forming a circuit pattern. A well-known method for filling through holes in a package substrate and forming a circuit. The steps for filling first are as shown in the third A_D diagram, which are included in the package substrate: forming a release film; forming a plurality of through holes on the package substrate. ; I fill a plurality of through holes to form a plurality of plugs, each plug

i. A bump is formed at each end of the il; the protrusions above and below are removed from the plugs. After that, please refer to the fourth A-forming method, and continue the third!) After the drawing process, a cross-sectional schematic diagram of each of the conductive layers 30 is formed by the roofing. A photoresist 40 is formed on the ¥ electric layer 30, and the photoresist 40 is exposed as shown in the R-th pattern 50, as shown in the figure: No. Pre-required circuit. After that, the developer needs to go to two or four D as shown in Fig. EH, and then the conductive layer of the non-circuit pattern part is left for a while, as shown in the fourth E. Finally, the flower pattern on the circuit pattern

In order to form the required circuit layer 32 by stripping, as shown in FIG. 4f: knife D, on the other hand, according to the method of the present invention, a plug-side J electrical material is formed from a plurality of through holes in the packaging substrate. The method of removing the stuffing is shown in the third AB diagram, which is the base two method:-and the bump 22 is a method that can be printed by 507347 V. Invention description (7) (Printing) method, double side printing (Double side Printing) method Or completed by double side coating (Double Side Coating). It may further include a vacuum printing method for filling a conductive material into a plurality of through holes, and is suitable for a through hole having a smaller hole diameter, for example, a through hole having a diameter smaller than 10 μm. For a description of filling through-holes by printing, please refer to FIG. 5, where FIG. 5A is a schematic diagram of the first embodiment of the through-hole filling mechanism of the packaging substrate of the present invention. The main system 1 includes a device with a screen 100, which can provide a material, such as a conductive material / two from one side of the screen 100 (the upper side of the figure) to the other side (the lower side of the figure) ) Penetrate. And there is a fixed object 13, a distance from 100, a space for the package substrate 10 to be used for hand ^ $ fixed use j 30, which can be a thing on the printing press table, this 1 female package The substrate 10 is placed between the screen 100 and the fixed object 130 === 12 ° of the knife, and is installed in the screen 100, which may be in rubber. That is, a conductive material 11 〇 is also placed on the stencil 100 100. It is combined to form a scrape H0. The conductive material 11 0 is evenly coated on the stencil back and forth. The conductive material 110 can be passed through === electricity 111. In order to complete the penetration through the through holes 12 of the package substrate 10, the fifth β diagram is completed. 2. The filling of the through-hole 12 of the clothes and soil board. For further explanation, please refer to the implementation of the guidebook. The structure of the plug 20 forming the through-hole filling mechanism of the package substrate: dry stand ^ 枓110 is filled into the through-hole 12 and further diagrams are considered. At this time, the upper and lower ends of the plug 20 will have 507347. V. Description of the invention (8) The bump 22 must be scraped off. Please refer to the fifth c. The main system includes another set of doctor blades 200, which are arranged corresponding to the upper and lower sides of the package, and are used to insert the upper and lower projections 22 of the plug 20, the soil plate, and the doctor blade 200 itself. Can be made of rubber scraper. *By. For a description of double-sided printing (Double side printi through-holes), please refer to the sixth figure. The sixth figure is a schematic diagram of the second embodiment of the structure of the seal of the through-hole filling mechanism of the present invention. ^ ^ Including settings There are a plurality of screens 100. In the embodiment of the sixth figure, it is implemented by setting and placing two screens 100, which are respectively placed on two sides (or above and below) of the package substrate. Each The stencil 100 is provided with a material, for example, material 11 〇, which penetrates from one side of the stencil 丨 00 to the other side, and the sealing substrate 10 is placed between the two stencils 1 0 Q In addition, a first set of scrapers 120 is provided, which is an embodiment using two scrapers, which are individually installed in the plate 100. Each of the screens 100 is provided with a conductive material n0, and the second set of scrapers 1 is used. 2 〇 Apply conductive material 11 〇 back and forth on the screen plate 丨 〇〇 to form a flat plate-shaped conductive object 丨 丨 丨, so that the conductive material 11 () can penetrate the packaging substrate 1 uniformly through the screen plate 100 In the through hole 丨 2, the plug 20 is formed by plugging the through hole 12. Thereafter, a cap The group of scrapers 200 are individually mounted on the outer sides of the two screens 1000, and are used to scrape the upper and lower convex plates 24 generated by the insert 20 after the through holes 2 are filled. Among them, the first The two groups of doctor blades 120 and 200 can be implemented as rubber doctor blades. For instructions on filling the through-holes by double-side coating, please refer to Figure 7 and Figure 7. It is a schematic diagram of the composition of the third embodiment of the through-hole filling mechanism of the multilayer packaging substrate of the present invention

Page 11 3U / J47

Illustration. The main system includes _ deg θ ^ ^ Ο Λ Π 〆 ™ ^ Group roll 疴 300, which is set in two ways, which are individually set on Fengmeng I 4 goods & $ 7L, every 1 Ling board 10 〇 On both sides (or above and below). The electrical materials are two, and the installation type is between the roller 300 and the package encapsulant. Nn From the work 7 丨 1U⑺ to the back and forth ^ side, through the roller 300 mi 乂! Electrical material 110 are all Sent into the package substrate 10 ^ = filling the base through hole to form a plug 20, and the package substrate 10y convex plate-shaped conductive object 24 must be scraped off. And a set of scraper blades 200 ′ are individually corresponding devices on the outer side of the drum 300, which are used to scrape up and down the flat plate-shaped conductive object M generated after the hole 12 is filled. [Effects of the invention] As described in Θ, the through-hole filling method and mechanism of the multilayer package substrate described in this volume can effectively produce the following effects: (1) The present invention can effectively solve the conventional roller type (R〇11 t0 R〇 ll), Reel to Reel or Panel toPanel, and other processes are used to improve the current status of the two metal layer flexible substrates only through-hole plating without filling. (2) The present invention uses a conductive material to fill conductive vias, which can effectively omit the process of via plating, and achieve the purpose of conducting the substrate up and down; it does not need to be brushed and does not generate deformation force on the substrate. The inventive technology is applied to the filling of high-density through-holes, and its process is short and fast. (3) In the present invention, when a through-hole is filled to form a plug, since the packaging substrate is protected by a type film, the bump can be easily scraped off after the hole, which not only saves the amount of conductive material, but also does not Any stress on the packaging substrate,

Page 12 ί) ϋ / 34 / V. Description of the invention (10) ------- Can easily complete the action of plugging holes. (4) The present invention can be applied to substrates of 籀 om, 0.025_〇 2mmJf. For example, if the diameter is larger than n and the pore size, the present invention is applicable or can be applied to / less than 0.025min. It is smaller than lOOiim. ;. Larger than 200um, 100-20um or the above, it fully shows the utilization of the through-hole tool industry of the multilayer dream seal board of the present invention == the daggers are all rich in the progress of implementation It is completely in line with the gist of invention patents: head = new invention not seen before death, but the law mentioned above applies for application. It can be used to limit the 3 copies of the present invention !: The preferred embodiment of the invention is just an equivalent range of disadvantageous ranges. That is to say, the scope of application for exclusive coverage according to the present invention. 4k conversion and modification should still belong to the patent

The 507347 diagram on page 13 is a simple illustration. The first diagram is a through-hole of a package substrate for conventional technology, and the cross-section structure of a through-hole electrical mine is not intended. The second diagram A is a through-hole of a package substrate for conventional technology. Sectional schematic diagram of electroplating and filling of non-conductive plugs; Figure 2B is a schematic sectional diagram of a brushing process performed in a through hole of a packaging substrate of a conventional technology; Figure 3A is a packaging substrate of an embodiment of the present invention In the through-hole filling method, a schematic cross-sectional view of a through-hole is formed on a package substrate; FIG. 3B is a schematic cross-sectional view of a plug-in-hole forming method in the through-hole-filling method of a package substrate according to an embodiment of the present invention; FIG. 2C is a schematic cross-sectional view of the method for filling through holes in a package substrate according to an embodiment of the present invention, and removing the bumps above and below the plug; FIG. 3D is a method for filling through holes in a package substrate according to an embodiment of the present invention ^ A schematic cross-sectional view of removing a release film from a packaging substrate; FIG. 4A is a through-hole filling method and an electrical forming method of the packaging substrate according to an embodiment of the present invention, and the conductive layer is formed after the third D drawing process is continued. The cross-section is unbearable; Figure 2B is a schematic cross-sectional view of forming a photoresist in a method of filling and sealing a through-hole of a sealing substrate according to an embodiment of the present invention; ^ Figure is a through-hole of a packaging substrate according to an embodiment of the present invention Filling and circuit: a schematic cross-sectional view of the exposed circuit pattern in the method; = is a schematic cross-sectional view of the developing circuit pattern in the through-hole padding and electrical method of the sealing and sealing substrate of the embodiment of the present invention; Through-hole stuffing and electricity of the package substrate according to the embodiment of the invention

The diagram is a simple explanatory diagram; the schematic cross-section of the conductive layer that is not etched in the non-circuit pattern part is schematically shown in the Γ square diagram method. This stripping: the through-hole filling of the package substrate and the fifth fifth A picture system. This is a schematic cross-sectional view of a circuit pattern formed by a photoresist; the structure of the embodiment is shown. The first embodiment of the through-hole filling mechanism of the package substrate in FIG. Λ is coated with the through-hole of the package substrate of the present invention. No. of the tampon — intent. Dom ¥ Electric material is filled into the through-holes to form a plug. In the embodiment shown, 'f is the package base except the convex H. The first and sixth pictures of the through-hole plugging mechanism are the seal 5 of the present invention. No intention. Schematic diagram of the composition of the case. 1. Schematic diagram of the structure of the second embodiment of the through-hole plugging mechanism of the soil plate. [Description of symbols] Bu 10 Package substrate 2 ^ 12 Through hole 3 Plating layer 4 ^ 20 Plug 14 Release film 22 Bump 24 Convex plate 30 Conductive layer 1 Page 15 507347 Brief description of the diagram 32 Circuit layer 40 Photoresist 50 pattern 100 screen (or steel plate) 110 conductive material 111 plate-shaped conductive object 120 ^ 200 scraper 130 fixture 300 roller 1BΪ page 16

Claims (1)

A method for forming a through-hole soil substrate of a package substrate includes forming a release film on the upper and lower surfaces of the package substrate ^, π must be above and below; __ holes The package substrate is etched or perforated to form a plurality of through packages. The material shell fills the plurality of through holes to form a plurality of plugs, and a bump is formed on each of the upper and lower ends of the female plug; the upper and lower bumps of the plurality of plugs are removed; and the province-shaped film is removed to complete the Via filling of the package substrate. 2. The through-hole filling method of the package substrate as described in item 丨 of the patent application Among the methods, the method of forming a plurality of through holes is completed by punching. 3. According to the method for filling via holes of a package substrate as described in item 丨 of the scope of the patent application, wherein the method for forming a plurality of via holes is completed by laser drilling. 4 · The through-hole filling method of the package substrate described in item 1 of the scope of the patent application, wherein the method of forming a plurality of through-holes is completed by mechanical drilling. 5. The through hole filling method of the package substrate according to item 1 of the stated patent scope, wherein the conductive material is used to fill the plurality of through holes, and the method is to print (Pr i ηΐ i ng) Completed by. ', 6 · The method for filling through holes of a package substrate as described in item 5 of the scope of patent application', wherein the method of printing includes: setting a screen; placing the conductive material on a screen; 2002.05.23.017 5U7347 Amendment No. 901227Q8 VI. Patent application scope Γ The package substrate is placed between the screen and a fixed object; and the cup? = Glue scraper coats the conductive material evenly in the net through hole . Μ conductive material is filled through the screen to the through hole filling method eight of the package substrates described in the 7.1 application, § HAI conductive material is filled with j-side printing (Duoble Print Print) ) Method; two =, the method of filling the through hole of the package substrate described in 8.ϊ ^, and the method of printing on the surface, including: setting a plurality of screens; placing the conductive material in the plurality The sealing substrate is placed between the plurality of stencils; and the conductive material is moved back and forth by the plurality of rubber scrapers to the plurality of stencils so that the conductive plate: two to the plurality of stencils In each of the through holes, the #rap chopsticks> Λ 2 ° Hai mesh plate and stuffed. τ and the bump of the insert is formed as a flat plate 9 · As claimed: the method for filling through holes of the package substrate described in item 1 of the patent scope, wherein the conductive material fills the plurality of The method completed by surface coating (Duoble Sliding Coating) method is [10., the through hole filling method of the package substrate as described in item 9 of the patent scope of Shenyan], The method of surface coating includes: placing a plurality of rollers on the packaging substrate, and lowering the conductive substrate; placing the conductive material on the packaging substrate, and directly conducting the conductive material through the plurality of rollers. Material is evenly spread back and forth Page 18, 2002.05.23.018 507347 ^ No. 901227QS _Η 修 修 _ Sixth, the scope of the patent application, the sealing substrate, so that the conductive material is directly filled into the plurality of through holes' makes the plug's bumps formed as A flat plate. Π · 、 For example, the method for filling through holes of a package substrate as described in item i of the patent application scope further includes a vacuum printing method for filling the conductive material into the plurality of through holes. . 1 2. The through-hole filling method 2 of the package substrate as described in the first item of the patent scope of the application, wherein the method for removing the bumps is to scrape the bumps with a plurality of rubber scrapers. 13. A method for filling through holes in a package substrate and forming a circuit, comprising: forming a release film on the top and bottom of the package substrate; etching or perforating the package substrate to form a plurality of through holes; 亇 1 ^ electrical material Filling the plurality of through holes to form a plurality of plugs, and a bump is formed on each of the upper and lower ends of the female plug; removing the bumps above and below the plug; removing the release film from the spear; A conductive layer is formed on each of the upper and lower layers; a photoresist is formed on the conductive layer; a circuit pattern is exposed on the photoresist; the circuit pattern is developed; the conductive layer of the non-circuit pattern portion of the worm is carved; and 14 is stripped from the circuit pattern The photoresist forms a circuit layer. 4. The method for filling and forming through holes of a package substrate as described in item 13 of the patent scope, wherein the conductive material fills the compound & Page 19 2002.05.23.019 6. Scope of patent application The method of through hole is completed by printing (Pr i n 11 ng). The method for filling through holes and forming roads of a package substrate according to Item 14 of Shishen's Patent Scope, wherein the printing method includes: placing the conductive material on a screen; and mounting the package substrate Placed between the screen and a fixed object; and the conductive material is evenly coated back and forth on the screen by a rubber scraper, so that the conductive material passes through the screen and is stuffed to the plurality of channels. In the hole. 1 R • The method for via hole filling and circuit formation of a package substrate as described in item 13 of the scope of patent application, wherein the method for filling the plurality of via holes with the conductive material is 1 double-sided printing (Double side Printing) method. The method for filling the through-holes of a package substrate and forming a circuit as described in item 16 of the scope of the application for a patent, wherein the double-sided printing method includes: 'Place the conductive material in different plural numbers Screens The package substrate is placed between the plurality of stencils; and the conductive material is evenly coated on the plurality of stencils by a plurality of rubber scrapers, so that the conductive material passes through the stencils = The plugs are filled into the plurality of through holes, and the bumps of the plug are formed into a flat soil shape. The method for filling via holes and forming a circuit of a package substrate as described in Item 13 of the 18.2 application patent scope, wherein the method for filling the plurality of via holes with the conductive material is coated on both sides (DuoMe Side c〇ating) square Page 20, 2002. 05. 23. 020 Amendment ^-No. 901227 ⑽ year a, application — completed by the formula. 19 // The method for forming a multi-layer package substrate and the circuit formation method described in item 18, wherein the method of double-sided coating includes placing the conductive material on the package substrate, Below: The: ΐ ί ϊ roller directly coats the conductive material evenly on the through: soil plate; ^, so that the conductive material is directly packed to the plurality of 20, so that the plug's bumps Formed into a flat plate shape. The method for filling the through-holes of the package substrate and forming the circuit as described in Item 13 of the electric power range, including a method of vacuum printing, which uses ^ X to fill the conductive material to the plurality of through-holes. in. . The through-hole filling of the package substrate described in Item 13 and several rubber scrapers to scrape off the bump.糸 乂 后 22 · A through-hole filling mechanism for a package substrate includes: a surface; a plate that provides a material from the side of the screen to the other side: =, 'is the corresponding distance from the screen A spacer, the clothing substrate is fixed, the packaging substrate is placed in the spacer; a scraper is attached to the screen; a conductive material is placed in the screen; and the electric 2 scraper makes the conductive material back and forth Coated on the screen, so that "electrical materials are penetrated into the through holes of the packaging substrate, so that Page 21 2002.05. 23. 021 507347 __Case No. 90122798 VI. Scope of patent application Year-on-year_Hi Through hole filling of package substrate. 2 3 · The through-hole filling mechanism for a package substrate as described in item 22 of the scope of patent application, wherein the fixing object is a vacuum-fixed package substrate. 24. The through-hole filling mechanism for a package substrate as described in item 22 of the scope of patent application, wherein the fixture is a printer. 25. The through-hole filling mechanism for a package substrate according to item 22 of the scope of application for a patent, wherein the doctor blade is a rubber doctor blade. 6. The through-hole filling mechanism of the package substrate as described in Item 2 of the declared patent scope, further including a set of scrapers for scraping the upper and lower bumps generated after the through-hole is filled. 27. A through-hole filling mechanism for a package substrate includes: a plurality of screen plates, each of which provides a material that penetrates from one side of the screen plate to the other side, and the package substrate is placed in the plurality of Between the stencils; the first set of scrapers are individually installed in the plurality of stencils; the plurality of conductive materials are individually placed in the stencils, and the conductive material is coated back and forth by the second set of scrapers Stencil so that the conductive material penetrates evenly into the through holes of the packaging substrate to fill the and The second group of scrapers are individually installed on the outer side of the plurality of screen plates, and are used to scrape up and down convex plates generated after the through holes are filled. • The through-hole filling mechanism of the package substrate according to item 27 of the patent application scope, wherein the first group of scrapers and the second group of scrapers are rubber scrapers. 2002. 05. 23. 022 507347 A through-hole filling mechanism for a package substrate, comprising: a set of rollers correspondingly disposed above and below the package substrate; and a set of conductive materials individually placed between the set of rollers and the upper and lower surfaces of the package substrate , By rolling back and forth of the set of rollers, the conductive material is evenly packed into the through holes of the packaging substrate to fill the through holes; and a set of scrapers, which are corresponding devices on the outer side of the set of rollers, The upward and downward convex plates generated after the through hole filling is completed are scraped off. 30. The through-hole plugging structure of the package substrate according to item 29 of the scope of the application for patent, wherein the group of scrapers is a rubber-to-knife. , 2002. 05. 23. 023