TW507257B - IC sample delivery procedure of IC testing processor and its structure - Google Patents

Abstract

The present invention relates to an IC sample delivery procedure of IC testing processor and its structure, and more particularly to an integrated circuit (IC) delivery procedure, in which several buffer regions are provided at the front terminal and the rear terminal of IC test region. The structure comprises an empty tray dispatching region, a sample feeding region, a master buffer region (preheat region), a test region, and a completed test for distributing region. Through the use of the master buffer region (preheat region) and plural buffer regions arranged inside the test region and the completed test for distributing regions, the delivering IC time difference between the master buffer region (preheat region) and the completed test for distributing regions is effectively used to continuously make the test region perform the action of testing IC such that the highest efficiency for the utilization of production capability can be obtained.

Description

507257 The failure to pursue the final test stage of its production caused the time schedule to increase, and the IC trays of the entire machine were interrupted after the delivery of the other 1C was delivered by the other 1C without delivery. Receiving the condition of one-handed transfer of the arm, the entire machine is used to absorb the IC seriously, so that the IC tray change operation in the (preheating zone) is tried, and it is not necessary to complete the whole (preheating zone). However, the present invention provides a limited amount of benefits. Shu V. Description of the Invention (l) Jufan automated machinery cannot process k, because it belongs to the delay of the production line, and the IC test the capacity of the processor. The general IC test processing is usually only performed by a vacuum suction test head, and the test is concentrated. It is so simple and straightforward that the process is not very eye-catching. The key is because changing the IC tray in this test process makes the I C complete testing and distribution area at the back of the I C in the test area, resulting in the entire test area operating efficiency. For this reason, the inventor has set up several buffers for a certain program, such as turning the main buffer counterclockwise, or a buffer function, intermittently doing the I c disc replacement action or turning the main buffer counterclockwise. In order to achieve the above-mentioned goals of the program, "are in the IP transport process," the performance, especially the segment, is often severely sent by the manufacturer. I sent the arm from the feed to the machine. Although it is on the machine production efficiency line, If the test area is set up in the 1C test plate, you can take the opportunity to stop the 1C set disk for a kind of operation.

It is the IC measurement that absorbs the entire compression, so it is an important class process. There is often a barrier to the operation of the machine from the IC to the test area and the test area. The machine is divided appropriately. The front and back sections (preheating disks) are used as buffers for waiting for the IC material (preheating disks) to prepare several buffers without having to use IC 507257. 5. Description of the invention (2), the entire machine must be stopped. Wait for a short interruption of some parts of the Sino-Sri Lanka simple transportation process before the cause ends before working. The features and effects are described below to illustrate the technical content of the present invention. Specific embodiments: The present invention is a c material conveying structure of a c test processor. (Please refer to the figure; shown in Figure L.) The main task is to schedule the junction by the empty material tray = zone 1, the main buffer (preheating). Area) 2, test area 3, completed test distribution area 4 and entry

The 1C delivery arms R1, R2, R3, and R4 are placed at the periphery of each area. Among them: empty, dispatch area 13: stacked by empty IC tray 12; incoming area 1 ·· will be tested I Ca is placed in the IC tray 1 1 and is concentrated in the main buffer zone (pre-heating zone) of the local area. 2: Five large-size plates 21 are set with the same size = ic receiving tray (pre-heating tray) 22, A space of one tray size is left, and the five IC receiving trays (preheating trays) 22 can be rotated 25 counterclockwise, and an appropriate force can be applied to warm the placed ICs; Trial area 3 · A test stand 3 01 is provided on a test stand 30, and the test stand 3015 has a row of test heads 302,. ^ 〇3 'its The width t is half of the width of the two-sound car (flying shuttle), and the first shuttle π flies & shuttle ^ ^ and the second shuttle ^ (flying shuttle) 3 3 One left and one right staggered and pass through the car in parallel (Shuttle) 32 and ί test base 301 can be moved forward and backward on the left side of the first shuttle. There are two = one shuttle (shuttle) and 33; the other can only accommodate a number of shuttles (shuttle). The second buffer area 31 of the IC.

507257 V. Description of the invention (3) ----- Wushu distribution area 4 · A third buffer zone 34 and two sets of discharging shuttle car trays (42), three fixed finished κ trays ( 46, 47, 48) and three-layer cascadable complete test 1C tray 49; ^ Delivery arm ^ Bu "^^ The first group ^ Delivery arm R /, mainly responsible for feeding the test 丨 Ca from the material Zone i is moved to the entrance zone 23 'of the main buffer zone (preheating zone) 2. The second group ic delivery arm R2 is mainly responsible for moving the ICa to be tested from the withdrawal zone 24 of the main buffer zone (preheating zone) 2. 1 (: seat (3211, 3212; 3311, 3312) on the left loading plate (3-21, 331) of the second buffer zone 31 or the first shuttle (shuttle) 32 and the second shuttle (shuttle) 33 ), · The second group of 1C delivery arms "is mainly responsible for the completion of the first test on the first shuttle (shuttle) 32, the second shuttle (shuttle) 33 on the right load plate (322, 332). (: Take $ to the third buffer zone 34 or 42; the fourth group 1C delivery arm R4 is responsible for moving the finished ICb in the shuttle car tray 42 to the fixed finished IC tray (46, 48) or Finished testing of the IC tray 49. According to the above structures, the main IC output The procedure is as follows:) The ICa to be tested is stacked and placed on the 1C tray 11 in the feeding area 1; The first group 1C delivery arm R1 moves the ICa to be tested to the main buffer area (preheating zone) that can be heated appropriately ) 2 inside the 1C receiving plate (preheating plate) 22 in the entrance area 23 and rotate the counterclockwise direction 25 after the 1C receiving plate (preheating plate) 22 is full, and so on. 3 ) When the device in the main buffer zone (preheating zone) 2 has the IC 1C receiving tray (preheating tray) 22 turned to the position of the taking out zone 24, the arm will be delivered in the second group of 1C! ^ Take 1C into the second buffer 31 and fill it up in order. 4) 隹 After the second buffer area 3 1 is filled with I c, continue to take out the next 丨 c

507257 V. Description of the invention (4), a shuttle car (flying shuttle) 32 inside the left loading plate 321 (shown in Figure 2A). 5) The second group 1C delivery arm R2 returns to the take-out area 24 and then takes out two ic, and sends the younger shuttle (flying shuttle) and the second shuttle (flying shuttle) back (shown in Figure 2b). 6) The second group of 1C delivery arm R2 is placed in 1C in the second shuttle (shuttle) 33 left carrier 331, while the test head 302 of the test base 301 takes out the first shuttle (shuttle) 3 2 left carrier 3 2 1 The second IC moves forward to the center position to prepare for the test. At this time, the other row of test heads 30 is located above the right carrier plate 332 of the second shuttle (shuttle) 33 (No. 2C). Pictured).

7) The second group 1C delivers the arm R2 back to the main buffer zone (the warm-up area extraction area 24 then takes out two 1C and test heads 30 2 for the Ic test, and at the same time sends the first shuttle (flying shuttle) 3 2β back, The second shuttle * car (shuttle) 33 is sent out (.shown in Figure 2D)., 8) The test head 303 to the second shuttle car (shuttle) 33 is taken out from the left loading plate 331 and pre-loaned for testing and testing. Seat 3 0 1 moves backward, so that test head 3 0 2 puts the finished I c into the first shuttle (flying shuttle) 32 right loading plate 322, and the second group Ic delivery arm R2 puts 1C in the first A shuttle (flying shuttle) 32 is inside the left loading plate 321 (shown in FIG. 2E).

9) The second group 1C delivery arm R2 returns to the main buffer 2 take-out area 24 and then takes out two 1C and test heads 303 for the 1C test. At the same time, the first shuttle (flying shuttle) 32 is sent out, and the second shuttle (flying shuttle) ) 33 return (shown in Figure 2F). 10) Take the test head 302 to the first shuttle (flying shuttle) 32 from the left loading plate 321 and take out 1C for testing. Move the test seat 3 〇1 forward so that the test head 3 〇03 puts the completed IC into the The second shuttle (flying shuttle) 33 is placed in the right loading plate 332, and at the same time, the second group ic delivery arm R2 is placed in 1C in the second shuttle (flying shuttle) 33 left loading plate 331, and the first

Page 7 ^ 07257 V. Description of the invention (5) Three sets of 1C delivery arms R3 carry the starting point ic J on the right shuttle disc 32 of the first shuttle (flying shuttle) 32 to the starting point of the shuttle vehicle disc 42 43 2 g not shown). = The second group of 1C delivers the arm R2 back to the main buffer zone (preheat and then remove two 1C, test head 302 as ΤΓ: 目 丨 丨 4 disciple.-) 39 ^ θ @ for 1 € test, at the same time One shuttle (Fly ^) 32 is transported back, younger one shuttle (Fly shuttle) 33 is sent out, and the shuttle car tray is loaded from the starting position 43 on the shuttle disk to the ending point 43a on the shuttle disk (2h Figure 12 ) The test head 303 to the second shuttle (shuttle) 33 are taken out from the carrier 331 丨 c. For the test and test seat 3 〇1 turn to Dejiang ... ^

After entering M & * / 1, move it, so that the test head 302 will put the completed 1C 5 Feng right carrier 322, and at the same time put the second group of 1C 笛 笛手 # R2 into the ic on the first shuttle (flying Shuttle) 32 left loading disc 321 "three sets_send arm two shuttles (flying shuttle) 33 right loading disc Chuan Shang = c suction = to the shuttle car disc loading starting point 4 of the shuttle car disc 42, rncb ^., C,., Λ Λ Λ ^ 43;:!:; C ^ ue; ^ # W Κ2β? ^ ^ ^ ^ ^ ^ ^ ^) 2 ^ 24 shuttle) 32, and the second shuttle (flying shuttle) 33 Return, delivery = (Flying the starting point 44 from the disk to the end point of the shuttle car disk "a, the other end of the 2 shuttle car disk 42 from the end point 43a of the shuttle car disk to the starting point 43 (shown in Figure 2J) . Only Early Halberd

507257 V. Description of the invention (6) 14) Twenty groups of 1C delivery arms R4 are translated into ICb by shuttle lanes and will be taken out according to the "test results ^ (4B 48), ^ φ IC ^ 497 Υ'Ι; 1 Step 10 is performed intermittently. In the tray 49, the parallel jump can be seen from the above steps. In the test zone 3, _. ^ =: R fly to the left loading plate (heart m punch zone (preheat zone)) 2 to obtain the Ka to be tested, but when the main buffer zone) 2 turns the IC receiving tray (preheating tray) 22, the second group of IC delivery hands j R2 cannot be taken out from the main buffer zone (preheating zone) 2 (: At this time, the program can immediately refer to f 1 to take the 1Ca to be tested from the second buffer 31 and continue to perform the test of 1C without stopping and waiting until the previously suspended factors stop (ie the 1C holding plate (preheating disk)). 2 2 turn one space in place) and then resume the normal procedure, and because the 1C delivery arm R2 has a faster transfer speed than 1 (: the test speed is faster, the waiting time in the second buffer zone 2 can be intermittently The test ICa is full; similarly, when the test distribution area 4 is temporarily unavailable due to the replacement of the IC tray, the program can also temporarily specify the third group. C The delivery arm R3 is placed after taking out the ICa (that is, it is taken out from the right tray of the first and second shuttle (shuttle)) (that is, the car tray 42 of the discharge shuttle or the tray 46, 47, 48 of the 1C after the test) ) Change to place in the second buffer w, the third group I c delivery arm u continues to move 'when the cause of the previous pause is eliminated, then reply to the original 丨 c delivery process' and 1C delivery arm R3 delivery 1 (: The speed is fast, enabling the 'interrupted performance' to take out the measured ICb from the third buffer zone 34 to the vehicle shuttle 4 / 'of the discharge shuttle in the neutral position to empty the 丨 c in the third buffer zone 34; so, Keep the state where the second buffer 3 1 is filled with the I Ca to be tested, and the third buffer 3 4 is cleared to complete the measurement Cb,

507257 V. Description of the invention (7), the test operation of the IC in the most important test area 3 of the entire IC test processor can not be interrupted to increase the overall efficiency. Although the present invention is disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various equivalent changes and decorations without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should also refer to those defined by the appended patent application scope.

Page 10 507257 Simple illustration of the drawing-Simple illustration of the drawing Figure 1 is the I c conveying configuration diagram of the present invention. FIG. 2 is a schematic diagram of placing the test area I c of the present invention in a second buffer zone. FIG. 2A is a schematic diagram of the test area 丨 c of the present invention placed on the left loading plate I C of the first shuttle (fly). Figure 2B is a schematic diagram of the test area of the present invention: a) the first shuttle (shuttle) is sent out; b) the second shuttle (shuttle) is sent back. Fig. 2C shows the test area of the present invention: a) the test head takes out the left carrier IC of the first shuttle (shuttle) for testing; b) puts 1C into the left carrier of the second shuttle (shuttle) No. 1 (: seat schematic diagram. Figure 2 D is a schematic diagram of the test area of the present invention: a) the first shuttle (shuttle) returned; b) the second shuttle (shuttle) sent out. Figure 2E is in the test area of the present invention: a) Put the test head back to the test IC at the 1C seat of the right shuttle of the first shuttle (flying shuttle) Λ) Take out the second shuttle (flying shuttle) Left loading plate C # test; c) Put the I c to be tested into the left loading plate of the first shuttle (shuttle) again. Figure 2F is a schematic diagram of the test area of the present invention: a) the first shuttle (shuttle) is sent out; b) the second shuttle (shuttle) is sent back.

507257 Brief description of diagrams Figure 2G is in the test area of the present invention: a) Put the test head back and finish the test IC at Block 1C on the right side of the second shuttle (shuttle). b) Take out the left carrier IC of the first shuttle (flying shuttle) for testing; c) Take the finished test 1C on the right carrier of the first shuttle (flying shuttle) into the receiving tray of the third buffer zone; d ) Put the IC under test into the left loading disc of the second shuttle (shuttle) again. Figure 2 shows the test area of the present invention:

a) The first shuttle (shuttle) is sent back; b) The second shuttle (shuttle) is sent out, schematic diagram. Figure 2I is in the test area of the present invention: a) Put the test head back and finish the test 1C on the 1C seat of the right shuttle of the first shuttle (shuttle); * b) Take out the second shuttle (shuttle) IC # test on the left loading plate; c) Take the completed test 1C on the right loading plate of the second shuttle (flying shuttle) into the receiving plate of the third buffer zone;

d) Put the IC under test into the left loading disc of the first shuttle (shuttle) again. Figure 2J is a schematic diagram of the test area of the present invention: a) the first shuttle (shuttle) is sent out; b) the second shuttle (shuttle) is sent back. Simple explanation of symbols used in each drawing

Rl, R2, R3, R4.1.1C delivery arm

Simple illustration on page 12 507257.

a. IC to be tested b. IC to be tested 1. Feed area 1 1. IC tray 1 2. Empty IC tray 1 3. Empty tray scheduling area 2 · Main buffer zone (preheating area) 21. Generous Plate 22 · 1C receiving plate (preheating plate) 23 · Entrance area 24. Take-out area 25. Rotate counterclockwise 3. Test area 3 0. Test bench 3 0 1. Test stand 302, 303. Test head 3 1 The second buffer zone 32. The first shuttle (flying shuttle) 321. The left carrier 3211, 3212.1C seat 322. The right carrier 3221, 3222.1C seat 33. The second shuttle (fly shuttle) 331. The left carrier

Page 13 507257 The diagram briefly explains the 3311 and 3312.1C blocks 332. The right loading discs 3321, 3322, and 1C blocks 34. The third buffer zone 4. The complete test distribution area 42. The discharging shuttle car disc 43, 44. shuttle car disc Loading start point 43a, 44a. Shuttle car tray loading end point 46, 47, 48. Finish test 1C tray

49. Finish test 1C tray

Page 14

Claims (1)

507257 VI. Scope of patent application1. An IC material conveying structure of an IC test processor is mainly composed of an empty tray scheduling area, a feeding area, a main buffer zone (preheating area), a testing area, a finished testing distribution area, and It is composed of 1C delivery arms placed around the periphery of each area. The empty tray scheduling area is formed by stacking empty I c trays. Feeding area: Place the 1C to be tested in the 1C tray, and Focus on the stacking of this area; Main buffer zone (preheating zone): set five 1C holding plates (preheating plates) of the same size in a large square, leaving a space of one disk size, and the five The IC receiving plate (preheating plate) can be rotated counterclockwise and can be appropriately heated to heat the placed IC; Test area: There is a test stand on a test stand. The test stand is provided with two rows of test heads (two, four, six, or eight can be installed), the width of which is exactly the width of the second shuttle (shuttle). Half, and the first shuttle (flying shuttle) and the second shuttle flying shuttle) two left and one right staggered and pass through the test bench 胄, the rear side; the two test seats can be moved forward and backward on the first shuttle Car (Shuttle 0 and the second shuttle (shuttle)): There is a second buffer zone on the left side of the shuttle shuttle (shuttle) that can hold several ICs; a test distribution area. Only the third buffer zone and two sets of discharge shuttle car trays: only fixed fixed 1C trays and three zones can be stacked to complete the test 1 (: tray set Cfj arm. The first ㈣ delivery arm is mainly responsible for moving the test 丨 :: to the entrance area of the buffer zone (preheating zone); the second group ㈣ ϊ = 疋 is responsible for transferring the lca to be tested from the main buffer zone (previously Hot zone) in the IC seat on the left carrier plate; the third group 1 (: delivery arm, main shuttle 1 507257 m = ic on the right loading plate of the first shuttle (flying shuttle) and second shuttle (flying shuttle) measured = out to the third buffer zone or on-board tray of the shuttle; the fourth group of IC delivery arms, 矗 t Move the finished car to the finished test in the tray: c to the fixed finished test, and then stack the finished test ic tray. 't The IC material conveying procedure of the two types of IC test handlers, the 1c material conveying steps are as follows: 1) The I c to be tested is stacked on the feed 2) The first group of 1 C delivery arms will place the area to be processed ( The ic holding tray (preheating tray) in the entrance area inside the preheating zone) is pushed backwards after being full; on the IC tray of the zone; the test IC is moved to the main buffer holding tray (preheating tray) that can be heated appropriately. Inside, and rotate one division in the clockwise direction of the Ic, and so on. 3) When the device in the main buffer zone (preheating zone) has 1 (: 1 (: receiving tray (preheating tray): to the take out zone) Position, that is, the second group of IC delivery arms to take its Ic into the second buffer, and fill it in order; 4) 俟 the second buffer is filled with 1 (:, then continue to take out the next [丨 Placed in the left loading disc of the first shuttle (shuttle);, 5) The second group of ic delivery arms returns to the take-out area and then takes out two ic, and sends the first shuttle (shuttle) out, the first The second shuttle (shuttle) returns; 6) The second group 1C delivery arm is placed in the IC on the left loading plate of the second shuttle (shuttle), while testing the test head of the seat, and taking out the first shuttle (shuttle) ) The second IC on the carrier plate is moved forward to the center position and released for testing. At this time, the other test head is located above the right carrier plate of the second shuttle (shuttle); 7) The second group of 1C delivery arms Return to the main buffer (preheating area) take-out area and take out two 1C, test head for 1 (: test, at the same time return the first shuttle (flying shuttle), ^ 07257 6. The scope of the patent application is sent out by the second shuttle (shuttle); 8) Take the test head to the left loading plate of the second shuttle (shuttle) and take out 1 (: prepare for testing, move the test seat back, so that The test head puts the completed IC into the right loading disc of the first shuttle (air shuttle), and the second set of IC delivery arms is placed in the 1 (: left loading disc of the first shuttle (flying shuttle); first In group 1c, return the arm to the main buffer take-out area and take out two ICs and test heads for 1C test. At the same time, send out the first shuttle (shuttle) and return the second shuttle (shuttle); 3) Test head Go to the left shuttle of the first shuttle (shuttle) and take the IC to prepare for the test. Move the test seat forward, so that the test head will put “c” after the test into the right of the second shuttle (shuttle). In the loading tray, and at the same time, the second group of 1 (: · delivery arm is placed in the IC of the second shuttle (shuttle) left loading plate, and the third group of IC delivery arms The 1C on the loading tray is sucked into the starting point of the shuttle loading tray of the unloading shuttle loading tray. 11) _The second group of 1C delivery arms is returned to the main buffer zone (preheating area) and then taken out. Then a 1C, Measurement The first 1 (: test, at the same time, the first shuttle (shuttle) is returned, the second shuttle (shuttle) is sent out, and the shuttle car tray is loaded from the shuttle car tray to the starting point to the shuttle car tray to the end 1 2) Measure the head down to the left shuttle of the first shuttle (flying shuttle) and take out I c to prepare for the test and test seat to move backward, so that the test head puts the IC that has been tested into the first shuttle (flying shuttle) ) In the right loading disc, and at the same time the second group 1 (: the delivery arm is placed in ic, in the left loading disc of the first shuttle (flying shuttle), and the third group of IC is delivering the arm to the second shuttle (flying shuttle) 1) on the right loading disc (: sucked to the shuttle car ^ loading starting point of the discharging shuttle car tray), at the same time, the fourth group 1 (: delivery arm is taken from the shuttle car loading end point on page 17 507257 VI. Application The scope of the patent is to complete the test IC, and classify it into three ports, according to the test results of the IC. ^ Test 1C tray or stacked inside the test IC tray; ---, the end of the 13) second group 1C delivery Return the arm to the main buffer area (preheating area) and take out two 1C and test heads for 1C test. At the same time, return the first shuttle shuttle and the discharge shuttle to the shuttle tray from the second shuttle (point load to the shuttle shuttle). The end of the disk loading, the other end of the delivery shuttle car disk loading end returns to the starting point of the active discharging shuttle car tray; 14) The fourth group ^ delivery arm is taken out from the shuttle loading end of the car and is based on the 1C test result. Classified into three solid or stacked into the finished 1C tray, and jump from the i. Step According to the above steps in the tray, the first shuttle (flying shuttle) and the second (pre- ' Under the procedure, it is directly executed by the main buffer zone: the IC under test, but when the main buffer zone (preheat zone) is turned by 1C, the second group of 1C delivery arms cannot be transferred from the main buffer zone (pre-Z Γ, , 'The program can be immediately designated to be fetched from the second buffer: Continue: Execute the test ic without having to stop and wait until the booth (ie, the IC receiving tray (preheating tray) turns into place = 、 # The pepper *,. Sequence and the transfer speed of the 1 c delivery arm are fuller than the IC test 1C; at the same time, ", B, break, and put the test to be completed in the second buffer for the test 1C and release: Alas. The delivery area is temporarily unable to be replaced by the first and second shuttle due to the replacement of the IC tray. (Flying tray = placed in the third buffer zone, and the third-level IC J to J mm Page 18 507257 6. When the reason for the suspension of the patent application scope is eliminated, the original IC delivery process will be replied, and the IC delivery arm will transport ICs faster, enabling the third buffer to be intermittent when in neutral. Take out the test IC to the car tray of the discharge shuttle to empty the IC in the third buffer zone. In this way, keep the second buffer zone filled with the test IC and the third buffer zone to clear the test IC. Operator who can test IC without interrupting test area. Page 19