經濟部智慧財產局員工消費合作社印製 502296 A7 ____________ B7 五、發明說明（） 發明領域： 本發明係有關於一種晶圓盒（p〇d)之清潔設備及其清潔 方法，特別是有關於一種利用氣體吹除附著在晶圓盒上之 微粒（Particles)的清潔設備及其清潔方法。 發明背景： 隨考半導體元件積集度（Integration)的增加，半導體 的製程邁進深次微米元件的時代，由於元件線幅尺寸的縮 小，積體電路元件受到污染物的影響更為嚴重^舉例而 言，當微塵顆粒沾附在製作半導體元件的晶圓上時，便有 可能影響到晶圓上之精密導線佈局的圖案，而造成元件電 性短路或斷路的嚴重後果。因此，在高密度之半導體元件 的製作過程中，對潔淨度的要求極其嚴格，微粒或氣體污 染物均會污染晶圓，而導致產品良率下降，降低產值。 然而，由於半導體元件的複雜度日益增加，伴隨而來 的是，製程步驟的複雜程度也增加許多。在半導體元件的 生產過程許多可能的污染原因’例如氣體管線未清 洗乾淨、供應之氣鱧純度不夠、真空附件、闊或調壓表品 質不佳所造成之反應室污染或晶圓污染。因此，對於半導 體工業而言’乾淨清潔的生產線以及污染防治在積體電路 (請先閱讀背面之注意事項再填寫本頁) 1 --------訂- -------- 502296 A7 B7 五、發明說明（ 元件的生產與運送過程令是相當重要的 經濟部智慧財產局員工消費合作社印製 在半導體元件的製作過程中，針對製程目的之不同， 而有各種不同之機台，因此晶圓可能需在不同之製程機台 令轉換’以製造符合所需之元件。晶圓在機台間轉換時， 係先將晶圓放置在晶圓盒中，再利用自動化材料處理系統 (Automated Material Handling System ; AMHS)將晶圓盒運 送至下一製程之機台上，然後利用機械手臂將晶圓取出， 以利下一製程步驟之進行，或者是先將晶圓盒先儲放在潔 淨室之倉儲中，靜待下一製程步驟的進行。 然而，晶圓盒之材料通常為壓克力，因此在晶圓盒之 運送或搬運過程中，相當容易因晶圓盒與外界之摩擦而引 發靜電（Static Electricity)的產生，而使其本身帶有靜電。 當晶圓盒帶有靜電時，便很有可能會吸附存在於潔淨室内 或工作人員身上之微粒，而使得大量之微粒附著在其上， 尤其是與其他裝置接觸較為頻繁之晶圓盒底部。在後續之 製程中，晶圓盒會被自動化材料處理系統運送到不同之製 程機台，或是被運送至倉儲中，而導致製程機台或倉儲受 到微粒的污染，且當機械手臂將放置在晶圓盒之晶圓取出 時’可能會因為氣流或機械手臂已受微粒污染，而使得晶 圓受到微粒的污染，進而破壞晶圓上之元件佈局圖案，嚴 重影響元件的電性穩定度。 (請先閱讀背面之注意事項再填寫本頁) -·裝 n n W_IJ · n n n UK tl 言 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 502296 A7 B7_ 五、發明說明（） 發明目的及概述： 鑒於上述習知晶圓盒常會在運送過程中，沾附有許多 微粒，甚至會因摩擦而使其帶有靜電，而吸附更多之微粒 灰塵於其上。更進一步地使晶圓受到污染，而降低元件的 電性穩定度。 因此，本發明之一目的為提供一種晶圓盒之清潔設 備，其係設置在倉儲系統之輸送裝置_，且此清潔設備至 少包括反應室以及位於反應室之進氣口與抽氣口。利用進 氣口所喷出之乾燥氣體吹晶圓盒，藉以去除附著在晶圓盒 上之微粒、污染物，再利用抽氣口將帶有微粒以及污染物 之氣體排出，大幅減少晶圓盒上之微粒以及污染物的數 量。 本發明之另一目的為提供一種具有去靜電裝置之晶圓 盒清潔設備，此晶圓盒清潔設備係設置於倉儲系統之輸送 裝置中，除了反應室以及位於反應室之進氣口與抽氣口 外，此晶圓盒清潔設備内並安裝有去靜電（De-static Electricity)裝置。由於晶圓盒清潔設備内之去靜電裝置可 將晶圓盒所帶有之靜電消除，因此吸附在晶圓盒上之微 粒、灰塵、或污染物等，便可輕易地藉由進氣口所吹出之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n n n I i ϋ JJr n n -1Λ f · t— ϋ n n ϋ n n 一 _0*. · n n n n n n n I (請先閱讀背面之注意事項再填寫本頁) 502296 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 乾燥氣體予以去除’再以抽氣口將帶有微粒、灰塵、或污 染物之氣體抽出反應室。 本發明之再 目的為挺供^一種晶圓盒之清潔裝置，由 於本發明之晶圓盒清潔設備中安袭有感應器，當入口之感 應器感應到晶圓盒時，進氣口便開始喷出氣體，而當出口 之感應器感應到晶圓盒時，進氣口便會停止喷出氣體。因 此’可在不增加線上工作人員之負擔下，達到減少微粒或 污染物的數量。· 本發明之再一目的為提供一種晶圓盒之清潔方法，此 晶圓盒之清潔方法係運用本發明之晶圓盒清潔設備來進 行。由於，大多數裝載有晶圓之晶圓盒都可能會由自動化 材料處理系統運送至倉儲中儲放，因此在將晶圓盒輸送至 倉儲則，先利用本發明之晶圓盒清潔設備，將黏附在晶圓 盒上之微粒或污染物吹除，#將晶圓盒送入倉儲内。藉由 晶圓盒清潔設備之感應器，可輕鬆地降低附著在晶圓盒之 微粒或污染物的數量，而提高吝σ ώ 1 J展〇〇良率。 根據以上所述之目的，太旅Λ i發明更提供了一種晶圓盒之 清潔設備，適用於倉儲系統之铪 ^ <輸送裝置，以清潔經由此輸 送襞置進入此倉儲系統之倉儲沾 $辟的晶圓盒，此晶圓盒之清潔 裝置至少包括：一反應室；複數袖 是敌個感應器位於此反應室内， 本紙張尺度適財關家標♦ (CNS)A4祕（210 — — — — — ——— — — 4 f ·1111111 一SJ« — — — — — — I — # (請先閱讀背面之注意事項再填寫本頁) 502296 A7 B7 五、發明說明（ 其中這些感應器之一部分係位於此反應室之入口，而這此 感應器之其餘部分則位於此反應室之出口；複數個進氣口 位於此反應室之下端；以及至少一抽氣口位於此反應室之 上端。另外，更可於此反應室之入口處額外設置去靜電裝 置’藉以消除此晶圓盒所帶有之靜電，以利清潔此晶圓盒。 根據以上所述之目的，本發明更提供了 一種晶圓盒之 清潔方法，此方法係運用晶圓盒之清潔設備，其中此晶圓 盒之清潔設備係裝設於倉儲系統之輸送裝置上，且此方法 至少包括：提供至少一晶圓盒於此輸送裝置上，並將此至 少一晶圓盒運入此晶圓盒之清潔設備内，其中此晶圓盒之 清潔設備至少包括一反應室、複數個進氣口、以及至少一 抽氣口；從這些進氣口喷出作用氣體，藉以去除附著在此 至少一晶圓盒之複數個微粒；以及抽出作用氣體。 圖式簡單說明： {請先閱讀背面之注意事項再填寫本頁) T .. —V n US ammmmmm J ^ i Mmmm§ ϋ —Bv in tmmmmw n n I 言 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 502296 A7 ____________ B7 V. Description of the Invention () Field of the Invention: The present invention relates to a cleaning device for a wafer cassette (p0d) and a cleaning method thereof, and particularly to a A cleaning device and a cleaning method for removing particles attached to a wafer box by using a gas. Background of the Invention: With the increase in integration of semiconductor components, the semiconductor manufacturing process is moving into the era of deep sub-micron components. Due to the shrinking of the line size of components, integrated circuit components are more seriously affected by pollutants. In other words, when the dust particles adhere to the wafer on which the semiconductor device is made, it may affect the pattern of the precise wire layout on the wafer, and cause serious consequences of the electrical short circuit or disconnection of the device. Therefore, in the manufacturing process of high-density semiconductor components, the requirements for cleanliness are extremely strict. Particles or gaseous pollutants will contaminate the wafer, resulting in a decrease in product yield and a reduction in output value. However, due to the increasing complexity of semiconductor devices, the complexity of process steps has also increased. There are many possible causes of contamination in the production process of semiconductor components, such as contamination of the reaction chamber or wafer due to poor quality of the gas pipelines, insufficient purity of the supplied thoron, vacuum accessories, wide or poor pressure gauges. Therefore, for the semiconductor industry, 'clean and clean production lines and pollution control in integrated circuits (please read the precautions on the back before filling out this page) 1 -------- Order- ------- -502296 A7 B7 V. Description of the invention (The order of the production and transportation of components is very important. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. During the production of semiconductor components, there are various opportunities for different purposes of the process. Therefore, the wafer may need to be converted in different process equipment to manufacture the required components. When the wafer is transferred between the equipment, the wafer is first placed in a wafer box, and then automated material processing is used. The system (Automated Material Handling System; AMHS) transports the wafer box to the next process machine, and then uses the robotic arm to remove the wafer to facilitate the next process step, or the wafer box is stored first. Put it in the clean room storage and wait for the next process step. However, the material of the wafer box is usually acrylic, so it is quite easy to change the wafer box during the transportation or handling of the wafer box. The friction with the outside world will cause static electricity (Static Electricity) to generate static electricity. When the wafer cassette is charged with static electricity, it is likely to adsorb the particles existing in the clean room or the staff, which will cause a large amount of The particles are attached to it, especially the bottom of the wafer box that is in frequent contact with other devices. In subsequent processes, the wafer box will be transported to the different process machines by the automated material processing system or to the warehouse. And the process machine or storage is contaminated with particles, and when the robotic arm takes out the wafer placed in the wafer box, the wafer may be contaminated with particles because of the air flow or the robotic arm is contaminated with particles. , And then destroy the component layout pattern on the wafer, which seriously affects the electrical stability of the component. (Please read the precautions on the back before filling out this page)-· Installation nn W_IJ · nnn UK tl Note This paper standard applies to Chinese national standards (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 502296 A7 B7_ V. Description of the invention () Clear purpose and summary: In view of the above-mentioned conventional wafer cassettes, many particles are often attached during the transportation process, and they may even be electrostatically charged due to friction, so that more particles of dust are adsorbed on them. Further, the wafer It is contaminated and reduces the electrical stability of the components. Therefore, an object of the present invention is to provide a cleaning device for a wafer cassette, which is a conveying device provided in a storage system, and the cleaning device includes at least a reaction chamber and a The air inlet and air exhaust of the reaction chamber. Use the dry gas sprayed from the air inlet to blow the wafer box to remove the particles and pollutants attached to the wafer box, and then use the air exhaust to carry the particles and pollutants. The gas is discharged, which greatly reduces the amount of particles and pollutants on the wafer cassette. Another object of the present invention is to provide a wafer cassette cleaning device having a destatic device. The wafer cassette cleaning device is provided in a conveying device of a storage system, except for a reaction chamber and an air inlet and an air exhaust port located in the reaction chamber. In addition, the wafer cassette cleaning equipment is equipped with a De-static Electricity device. Since the static elimination device in the wafer box cleaning equipment can eliminate the static electricity carried by the wafer box, the particles, dust, or pollutants adsorbed on the wafer box can be easily passed through the air inlet. The blown-out paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) nnn I i ϋ JJr nn -1Λ f · t— ϋ nn ϋ nn a_0 *. · Nnnnnnn I (Please read the back first Note: Please fill out this page again) 502296 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention () Dry gas shall be removed, and then the gas with particles, dust, or pollutants shall be extracted through the exhaust port to react room. Another object of the present invention is to provide a cleaning device for a wafer box. Since the wafer box cleaning device of the present invention has a sensor, when the inlet sensor senses the wafer box, the air inlet starts to spray. The gas exits, and when the sensor at the outlet senses the wafer cassette, the gas inlet will stop emitting gas. Therefore, it can reduce the number of particles or pollutants without increasing the burden of online workers. Another object of the present invention is to provide a method for cleaning a wafer cassette. The method for cleaning the wafer cassette is performed by using the wafer cassette cleaning equipment of the present invention. Since most wafer cassettes loaded with wafers may be transported to the warehouse by an automated material handling system, the wafer cassette cleaning equipment of the present invention is used to transport wafer cassettes to the warehouse. The particles or contaminants adhered to the wafer box are blown away, and #the wafer box is sent to the warehouse. The sensor of the wafer box cleaning equipment can easily reduce the number of particles or pollutants attached to the wafer box, and improve the yield of 吝 σ 1 1 展 〇〇. According to the above-mentioned purpose, the Tailu Λi invention also provides a cleaning device for wafer cassettes, which is suitable for the transportation system of the storage system ^ < conveying device to clean the storage system that enters the storage system through this transportation system. The wafer box, the wafer box cleaning device at least includes: a reaction chamber; a plurality of sleeves are located in this reaction chamber, the paper size is suitable for financial and family standards (CNS) A4 secret (210 — — — — — ——— — — 4 f · 1111111 One SJ «— — — — — — — I — # (Please read the notes on the back before filling out this page) 502296 A7 B7 V. Description of the invention (one of these sensors is part of It is located at the entrance of the reaction chamber, and the rest of the sensor is located at the exit of the reaction chamber; a plurality of air inlets are located at the lower end of the reaction chamber; and at least one suction port is located at the upper end of the reaction chamber. In addition, more An additional anti-static device can be provided at the entrance of the reaction chamber to eliminate the static electricity carried by the wafer cassette to facilitate cleaning of the wafer cassette. According to the above-mentioned purpose, the present invention further provides A wafer box cleaning method. The method uses a wafer box cleaning device, wherein the wafer box cleaning device is installed on a conveying device of a storage system, and the method includes at least: providing at least one wafer box On the conveying device, the at least one wafer cassette is transported into the cleaning equipment of the wafer cassette, wherein the cleaning equipment of the wafer cassette includes at least a reaction chamber, a plurality of air inlets, and at least one air outlet Spraying the action gas from these air inlets to remove the plurality of particles attached to the at least one wafer box; and extracting the action gas. Brief description of the diagram: {Please read the precautions on the back before filling this page) T .. —V n US ammmmmm J ^ i Mmmm§ ϋ —Bv in tmmmmw nn I Printed by the Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs
本發明的較佳實施例將於往後之說明文字中辅以下列 圖形做更詳細的闡述，其中·· 第1圖為繪示本發明之一較佳實施例之具有晶圓盒之 清潔設備的倉儲系統的上視圖； 第2圖為繪示本發明之一較佳實施例沿第1圖之A-A 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 502296 A7 _B7_ 五、發明說明（） 剖面線的剖面示意圖；以及 第3圖為繪示本發明之一較佳實施例沿第1圖之B-B 剖面線的剖面示意圖。 圖號對照說明： 100 倉儲系統 102 倉儲 104 輸送裝置 106 埠 108 清潔設備 110 晶圓盒 112 反應室 114 機械手臂 1 16 進氣口 118 抽氣口 120 感應器 122 去靜電裝置 124 作用氣體 126 廢氣 128 入口 130 出口 發明詳細說明： 本發明揭露一種晶圓盒之清潔裝置以及清潔方法，本 發明之晶圓盒清潔裝置具有進氣口，可對晶圓盒喷出乾燥 氣體，而吹掉附著在晶圓盒上之微粒，達到降低晶圓盒之 微粒含量的目的。為了使本發明之敘述更加詳盡與完備， 可參照下列描述並配合第1圖至第3圖之圖示。 由於，在晶圓廠之潔淨室中，晶圓在不同機台間轉換 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) US ei n He (I is is n —-Ί VMM· * n n m uv ϋ Mmmmi In 訂· I------ # (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 502296 A7 ---E___ _____ 五、發明說明（) 時，晶圓大都是先被放置在晶圓盒内，再利用自動化材料 處理系統將晶圓盒運送到目的機台，然後利用機械手臂將 位於晶圓盒内之晶圓取出，而放入機台的反應室内進行處 理。在半導體的製程中，晶圓通常並不會一直持續處於$ 處理的狀況。這些暫時不處理之晶圓，便會由晶圓盒所裝 載，並藉由自動化材料處理系統將晶圓盒儲放於倉鍺系統 之倉儲中。因此，大多數之晶圓盒會經由輸送裝置運送至 倉儲存放。 请參照第1圖’其係繪示為本發明之一較佳實施例之 具有晶圓盒之清潔設備的倉儲系統的上視圖。將晶圓盒u 〇 儲放於倉儲系統1 00之倉儲1 02時，自動化材料處理系統 (未繪示）或線上工作人員將晶圓盒1 1 0放在倉儲系統1 〇〇 之輸送裝置104的埠106上。再利用機械手臂丨14(如第2 圖所示），將晶圓盒1 1 0傳送至下一個埠1 0 6上，此步驟持 續進行至將晶圓盒110送入倉儲102内。 因此，本發明將晶圓盒1 1 0之清潔設備1 08設置在倉 儲102以及與倉儲1〇2相鄰之埠1〇6之間’較不會因輸送 裝置104之埠106的存在而造成設置的困難’且可在晶圓 盒11 0進入倉儲1 02前，去除沾附在晶圓盒1 1 〇上之微粒 等污染物。請同時參照第2圖，其係緣示本發明之一較佳 實施例沿第1圖之Α-Α剖面線的剖面开"意圖’並清一併參 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n n 1 n ϋ ί 4— H ·ϋ ami n * n is n n Is ϋ 一.. lot fl w a··* > mw . (請先閱讀背面之注意事項再填寫本頁) 502296 Α7The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, among which: Figure 1 is a cleaning device with a wafer cassette showing a preferred embodiment of the present invention The top view of the storage system; Figure 2 shows a preferred embodiment of the present invention along the AA of Figure 1. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Intellectual property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 502296 A7 _B7_ V. Description of the Invention () A schematic cross-sectional view of the section line; and FIG. 3 is a schematic cross-sectional view showing a preferred embodiment of the present invention along the BB section line of FIG. 1. Comparative description of drawing numbers: 100 storage system 102 storage 104 conveying device 106 port 108 cleaning equipment 110 wafer box 112 reaction chamber 114 robot arm 1 16 air inlet 118 air inlet 120 sensor 122 destatic device 124 working gas 126 exhaust gas 128 inlet 130 outlet invention detailed description: The present invention discloses a wafer box cleaning device and cleaning method. The wafer box cleaning device of the present invention has an air inlet, which can spray dry gas to the wafer box and blow off the adhered wafer. The particles on the box can reduce the particle content of the wafer box. In order to make the description of the present invention more detailed and complete, reference may be made to the following descriptions and the illustrations in FIGS. 1 to 3. Because in the clean room of the fab, the wafer is converted between different machines. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f) US ei n He (I is is n —-Ί VMM · * nnm uv ϋ Mmmmi In Order · I ------ # (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 502296 A7 --- E___ _____ V. In the description of the invention (), most of the wafers are first placed in the wafer box, and then the automated material processing system is used to transport the wafer box to the destination machine, and then the robot is used to remove the wafers located in the wafer box. And placed in the reaction chamber of the machine for processing. In the semiconductor manufacturing process, the wafer is usually not always in the $ processing state. These temporarily unprocessed wafers will be loaded by the wafer box and borrowed. The wafer box is stored in the warehouse germanium system by an automated material handling system. Therefore, most wafer boxes are transported to the warehouse via a conveying device. Please refer to FIG. 1 ', which shows the invention A preferred embodiment having a wafer cassette The top view of the storage system of the cleaning equipment. When the wafer box u 〇 is stored in the storage system 1 00 and the warehouse 1 02, the automated material processing system (not shown) or the online staff will place the wafer box 1 1 0 Warehousing system 100's transport device 104 on port 106. The robotic arm 14 (as shown in Figure 2) is used to transfer the wafer cassette 1 10 to the next port 106, and this step continues Until the wafer cassette 110 is sent into the warehouse 102. Therefore, the present invention sets the cleaning equipment 108 of the wafer cassette 110 between the warehouse 102 and the port 106 adjacent to the warehouse 102. It will be difficult to set up due to the existence of port 106 of conveying device 104 ', and the contaminants such as particles attached to wafer box 110 can be removed before wafer box 110 enters storage 102. Please also refer to Fig. 2 is a diagram showing a preferred embodiment of the present invention along the section A-A of Fig. 1 along the section " intent " and refer to the paper dimensions to apply Chinese National Standard (CNS) A4 specifications (210 X 297 mm) nn 1 n ί ί 4— H · ϋ ami n * n is nn Is ϋ one: lot fl wa ·· * > mw. (Please Notes on the back read and re-fill of this page) 502296 Α7
五、發明說明（） 經濟部智慧財產局員工消費合作社印製 照第3圖，其係繪示本發明之一較佳實施例沿第1圖之B-B 剖面線的剖面示意圖。本發明之清潔設備1 08至少包括反 應室1 1 2、位於反應室1 1 2下端之複數個進氣口 1 1 6、位於 反應室1 1 2上端之至少一抽氣口丨1 8、以及複數個感應器 120。其中，反應室1 12之材料可例如為不鏽鋼（Stainless Steel)、抗靜電壓克力等不產生靜電之材質，而反應室112 包覆住倉儲102以及與倉儲1〇2相鄰之埠1〇6之間的輸送 裝置1 04的全部或一部份，依清潔所需時間而決定反應室 1 12之長度，且這些感應器120之一部份位於反應室1 12 之入口 1 2 8，而這些感應器1 2 0之另一部份則位於反應室 112 之出口 130。 當晶圓盒110由輸送裝置104之機械手臂114承載， 從與倉儲102相鄰之埠106進入反應室1 12時，位於反應 室112之入口 128處的感應器120會感應到晶圓盒110， 而啟動清潔設備108之進氣裝置（未繪示），使作用氣體124 以每平方英吋約80英磅（即80psi)的壓力從反應室112下 端之進氣口 116喷出，而產生氣流從晶圓盒之下方往 上吹，其中作用氣體124可例如為氮氣（N2)、乾燥空氣、 或是惰性氣體等。此時，附著在晶圓盒1 1 0之表面的微粒、 灰塵等污染物，尤其是吸附於晶圓盒1 1 0之底部的污染 物，會被進氣口 116喷出之作用氣體124所產生的氣流吹 掉。因此，可大幅減少附著於晶圓盒1 1 0之表面的污染物 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） (請先閱讀背面之注意事項再填寫本頁) ----- · I I I I I I . ^02296 Α7 Β7 經濟部智慧財產局員工消費合作社印製 1、發明說明（ 含量。 然後，再利用位於反應室Π 2上端之抽氣口 Π 8，將含 有微粒、灰塵等污染物的廢氣126抽離反應室112。當機 械手臂Π4將晶圓盒110運送至反應室112之出口 130時， 位於反應室112之出口 130處的感應器120會感應到晶圓 盒11 0，而關閉清潔設備108之進氣裝置，藉以停止從進 氣口 116喷出作用氣體124，進而完成晶圓盒110之清潔 步驟。 由於，感應器120可感應到晶圓盒1 1 0進入或離開反 應室112，而啟動或關掉清潔設備108之進氣裝置，自動 從反應室112下端之進氣口 116喷出作用氣體124或停止 喷出作用氣體1 24 ^因此，在本發明之晶圓盒1 1 〇的清潔 方法中，整個的清潔過程都不需要工作人員來操作，而不 會增加線上工作人員的負擔。 此外，若晶圓盒1 1 0本身所帶有之靜電太大，而使得 晶圓盒11 0對微粒、灰塵等污染物的吸附力較大，導致清 潔設備108喷出之作用氣體124所形成之氣流的強度無法 將微粒、灰塵等污染物從晶圓盒110之表面吹除。此時， 便可在反應室112之入口 128附近裝設去靜電裝置122。 如此一來，便可在晶圓盒Π 0進入反應室11 2時，利用去 10 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n m H* ϋ H ϋ el·! tMW n If ϋ · n ϋ n ·ϋ n n m 一 I i n I— n I I— n I (請先閱讀背面之注意事項再填寫本頁) 502296 A7 B7_^_ 五、發明說明（) 靜電裝置1 22將晶圓盒1 1 0所帶有之靜電消除，以利去除 晶圓盒1 1 0之表面的微粒、灰塵等污染物，增加清潔效果。 (請先閱讀背面之注意事項再填寫本頁) 本發明之一優點就是在提供一種晶圓盒之清潔設備， 藉由清潔設備之感應器可自動進行晶圓盒之清潔步驟，不 需額外之人力控制，而不會增加工作人員的負擔。 本發明之另一優點就是在提供一種晶圓盒之清潔方 法，運用裝設在倉儲以及與倉儲相鄰的璋之間的清潔設 備，藉由清潔設備所喷出之乾燥氣流吹除晶圓盒表面之微 粒、灰塵等。因此，可減少晶圓盒表面之微粒、灰塵的含 量，而降低對晶圓的污染，進而增加產品良率。 本發明之再一優點就是因為發明之晶圓盒的清潔設備 具有去靜電裝置，因此可消除晶圓盒所帶有之靜電，以增 強清潔設備所喷出之氣流清潔晶圓盒表面的能力，大幅降 低附著在晶圓盒表面之微粒含量。 經濟部智慧財產局員工消費合作社印製 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）V. Description of the Invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 3 is a schematic cross-sectional view showing a preferred embodiment of the present invention along the line B-B of Figure 1. The cleaning device 1 08 of the present invention includes at least a reaction chamber 1 1 2, a plurality of air inlets 1 1 6 located at the lower end of the reaction chamber 1 1 2, at least one air suction port 1 8 at the upper end of the reaction chamber 1 1 2, and a plurality of Person sensors 120. Among them, the material of the reaction chamber 112 can be, for example, stainless steel, static voltage resistance, and other materials that do not generate static electricity, and the reaction chamber 112 covers the warehouse 102 and the port 1 adjacent to the warehouse 102. All or part of the conveying device 104 between 6 determines the length of the reaction chamber 1 12 according to the time required for cleaning, and a part of these sensors 120 is located at the entrance 1 2 8 of the reaction chamber 1 12 and Another part of these sensors 120 is located at the outlet 130 of the reaction chamber 112. When the wafer cassette 110 is carried by the robot arm 114 of the conveying device 104 and enters the reaction chamber 112 from the port 106 adjacent to the storage 102, the sensor 120 at the entrance 128 of the reaction chamber 112 will sense the wafer cassette 110 The air inlet device (not shown) of the cleaning device 108 is activated, so that the working gas 124 is ejected from the air inlet 116 at the lower end of the reaction chamber 112 at a pressure of about 80 pounds per square inch (ie, 80 psi), thereby generating The airflow blows upward from below the wafer cassette, and the action gas 124 may be, for example, nitrogen (N2), dry air, or inert gas. At this time, pollutants such as particles and dust adhering to the surface of the wafer box 110, especially pollutants adsorbed to the bottom of the wafer box 110, will be affected by the action gas 124 ejected from the air inlet 116. The generated air blows off. Therefore, the pollutants attached to the surface of the wafer cassette 1 10 can be greatly reduced. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 meals) (Please read the precautions on the back before filling this page) ----- · IIIIII. ^ 02296 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, 1. Description of the invention (Contents. Then, the exhaust port Π 8 located at the upper end of the reaction chamber Π 2 will contain particles and dust. The exhaust gas 126 waiting for pollutants is extracted from the reaction chamber 112. When the robotic arm 4 transports the wafer cassette 110 to the exit 130 of the reaction chamber 112, the sensor 120 located at the exit 130 of the reaction chamber 112 will sense the wafer cassette 11 0, and the air inlet device of the cleaning device 108 is closed, thereby stopping the ejection of the working gas 124 from the air inlet 116, thereby completing the cleaning step of the wafer cassette 110. Because the sensor 120 can sense that the wafer cassette 1 1 0 enters Or leave the reaction chamber 112, and start or shut off the air intake device of the cleaning device 108, and automatically eject the action gas 124 or stop the action gas 1 24 from the air inlet 116 at the lower end of the reaction chamber 112. Therefore, in the present invention, Wafer In the cleaning method of 110, the entire cleaning process does not need to be operated by a worker, and does not increase the burden on the online staff. In addition, if the static electricity carried by the wafer cassette 1 10 is too large, so that The wafer box 110 has a large adsorption force for particles, dust and other pollutants, resulting in the strength of the airflow formed by the action gas 124 ejected from the cleaning device 108 cannot blow particles, dust and other pollutants from the surface of the wafer box 110 At this time, a static elimination device 122 can be installed near the entrance 128 of the reaction chamber 112. In this way, when the wafer cassette Π 0 enters the reaction chamber 112, it can be used for 10 paper sizes in China. National Standard (CNS) A4 (210 X 297 mm) nm H * ϋ H ϋ el ·! TMW n If ϋ · n ϋ n · ϋ nnm-I in I— n II— n I (Please read the Please fill in this page again for attention) 502296 A7 B7 _ ^ _ V. Description of the invention () Electrostatic device 1 22 Eliminates the static electricity of wafer box 1 10 to facilitate the removal of particles on the surface of wafer box 1 1 0, Contaminants such as dust increase the cleaning effect. (Please read the precautions on the back before (Fill in this page) One of the advantages of the present invention is to provide a wafer box cleaning device. The sensor of the cleaning device can automatically perform the wafer box cleaning step without additional human control and without increasing staff. Another advantage of the present invention is to provide a method for cleaning a wafer cassette, which uses a cleaning device installed between a warehouse and a plutonium adjacent to the warehouse, and blows it off with a dry air stream sprayed from the cleaning device. Particles and dust on the surface of the wafer box. Therefore, the content of particles and dust on the surface of the wafer box can be reduced, and contamination of the wafer can be reduced, thereby increasing the product yield. Another advantage of the present invention is that the wafer box cleaning equipment of the invention has a de-static device, so the static electricity carried by the wafer box can be eliminated, so as to enhance the ability of the airflow sprayed by the cleaning device to clean the surface of the wafer box. Significantly reduces the amount of particles attached to the surface of the wafer cassette. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. As understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application for the present invention. Equivalent changes or modifications made under the spirit disclosed by the invention should all be included in the scope of patent application described below. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)