497294 A7 _____B7_ 五、發明説明（1 ) [發明所屬之技術領域] 本發明係有關於將在外圍部包含裝置之銷插入用鎖貫 穿孔插座安裝於電路基板之方法，在外圍部包含裝置之銷 插入用銷貫穿孔，安裝於電路基板之插座、及黏貼於安裝 在電路基板之插座上面之膠帶。 [習知技術] 作為中央處理器等裝置可調換安裝之插座安裝於電路 基板之方法已知有如下者。首先，裝置可插入的中央貫穿 孔與裝置之銷可插入的銷貫穿孔一起可覆蓋那樣將膠帶黏 貼於插座上面。接著將略吸盤狀之吸附夾具定位在插座之 吸附部份之後自上方密接膠帶，由此吸附保持插座載置於 電路基板上。而且，將吸附夾具離脫膠帶，藉設置於插座 連接端子部份之焊錫，面對電路基板回流焊接插座，由於 是同時自插座上面剝離膠帶，該安裝即可完成了。 [發明欲解決之課題] 不過，通常吸附夾具具有與中央貫穿孔略同程度或其 以下之截面積。因而，插座因其輸送時之溫度或濕度等原 因而變形時，會損害覆蓋中央貫穿孔黏貼於插座上面之膠 帶之平面性。因此，有因吸附夾具而降低插座之吸附保持 力，或因吸附夾具被吸附之插座姿勢傾斜，或在電路基板 插座之載置位置偏移致安裝精確度降低之虞。 所以，在本發明提供一種藉吸附夾具確實地吸附保持 插座，可得精確度良好的安裝於電路基板之方法，適合實 施該方法之插座及膠帶作為解決課題。 4 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公爱） A7 ---------!Z__ 五、發明說明（2 ) [為解決課題之手段] 為解決前述課題本發明插座之安裝方法係在前述插座 内部含藉連結部由作成不連續之槽孔圍繞形成之舌片之吸 附部份其中，將該插座藉吸附夾具吸附保持下載置於前述 電路基板上，將該吸附夾具離脫該插座，在該電路基板回 流焊接該插座，由於取起該舌片在連結部自該插座分離而 形成中央貫穿孔。 依據本發明，因舌片在吸附部份藉吸附夾具強力維持 插座之吸附保持力，進而可謀求提高插座朝電路基板之安 裝精確度。而且，插入安裝之後，由於在連結部將舌片自 插座分離而形成中央貫穿孔，在此可作成可安裝中央處理 器等裝置之狀態。 再者，本發明之安裝方法其特徵為在前述插座以前述 吸附夾具保持之前，至少在前述吸附部份將膠帶黏貼在該 插座上面，在前述電路基板回流焊接該插座之後，自該插 座上面剝離該膠帶。 依據本發明，在插座之吸附部份黏貼在該插座上面之 膠帶藉舌片支撐於上方。因而，可防止因吸附夾具引起膠 帶之真空吸附力降低，進而可謀求提高插座朝電路基板安 裝之精確度。 而且’本發明之安裝方法其特徵在於將在對應前述槽 孔之位置形成第1開放部之前述膠帶，藉該第1開放部前述 槽孔至少在一部份開放之狀態黏貼於前述插座上面。 依據本發明，當透過膠帶之第1開放部及插座之槽孔回 本紙張尺度適用中國國家標準（CNS) A4規格（21〇><297公楚） .......................裝-.................tr..................線 (請先閲讀背面之注意事項再填寫本頁) 497294 A7 B7 五、發明説明（3 ) 流焊接時熱風流入該插座下方。因而，藉該熱風有效地加 熱插座及電路基板，可迅速且確實地作回流焊接。 (請先閲讀背面之注意事項再填寫本頁) 再者，本發明之安裝方法其特徵為在上方閉塞前述銷 貫穿孔，在前述插座上面黏貼前述膠帶。 依據本發明，由於藉膠帶完全塞住銷貫穿孔之上方， 即使當回流焊接時含於焊錫之焊劑有氣化之情形，也可抑 制氣化之焊劑在銷貫穿孔内上升。因而，由於在安裝於銷 貝穿孔内之連接端子上方部份不易附著焊劑，然而將裝置 女裝於插座時，該裝置之銷與連接端子之連接可作成良好 者。 而且’本發明之安裝方法係前述插座於前述外圍部遍 及外周緣及内周緣全周，包含有位於比前述銷貫穿孔形成 面還上方之外周緣部及内周緣-部，其特徵為由於將前述膠 可黏貼於該外周緣部上面及内周緣部上面，於該形成部份 之上方一邊完全塞住該形成部份，一邊黏貼於該插座上面。 依據本發明，由於藉膠帶將銷貫穿孔形成面在其上方 完全塞住’當回流焊接時可抑制通過銷貫穿孔之烙化焊錫 之上升。再者，由於膠帶比銷貫穿孔形成面還上方，可防 止膠帶之黏著劑附著形成面，進而可防止因該黏著劑引起 塵埃附著銷貫穿孔。即使在本發明，由於藉膠帶銷貫穿孔 之形成面在其上方完全塞住，當回流焊接時即使含於焊錫 之^"劑有氣化的情形，也可抑制氣化之焊劑上升貫穿孔 内。再者’由於膠帶比銷貫穿孔形成面還上方，可防止膠 帶之黏著劑朝形成面附著，進而可防止因該黏著劑引起塵497294 A7 _____B7_ V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for installing a lock through-hole socket for inserting a pin including a device in a peripheral portion on a circuit board, and including a pin of the device in a peripheral portion Insertion pin through holes, sockets mounted on circuit boards, and tapes stuck to sockets mounted on circuit boards. [Conventional Technology] The following is known as a method for mounting a socket on a circuit board as a socket that can be replaced and installed by a central processing unit or the like. First, the center through hole through which the device can be inserted and the pin through hole through which the device's pin can be inserted can be covered so that the tape is adhered to the socket. Next, a slightly sucker-shaped suction jig is positioned on the suction part of the socket, and then the tape is tightly adhered from above, thereby holding the socket on the circuit substrate by suction. In addition, the adsorption jig is detached from the adhesive tape, and the solder is provided on the connection terminal part of the socket, and the socket is reflow soldered to the circuit board. Since the tape is peeled from the socket at the same time, the installation can be completed. [Problems to be Solved by the Invention] However, in general, the suction jig has a cross-sectional area that is approximately the same as or less than that of the central through hole. Therefore, when the socket is deformed due to temperature or humidity during transportation, the flatness of the tape covering the central through hole and sticking to the upper surface of the socket will be impaired. Therefore, there is a possibility that the suction holding force of the socket is reduced due to the suction jig, or the posture of the socket to which the suction jig is sucked is inclined, or the mounting position of the circuit board socket is shifted, resulting in a reduction in mounting accuracy. Therefore, the present invention provides a method for reliably holding a socket by a suction jig, which can be mounted on a circuit board with good accuracy, and a socket and a tape suitable for implementing the method are provided as a solution problem. 4 (Please read the precautions on the back before filling this page) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 public love) A7 ---------! Z__ V. Description of the invention (2) [Means for solving the problem] In order to solve the foregoing problem, the socket installation method of the present invention includes an adsorption part of a tongue formed by a discontinuous slot surrounded by a connecting portion inside the aforementioned socket, and the socket is borrowed by an adsorption jig. The suction holding is placed on the circuit board, the suction jig is released from the socket, the socket is reflow soldered on the circuit board, and the central through hole is formed by taking off the tongue and separating it from the socket at the connecting portion. According to the present invention, since the tongue retains the suction holding force of the socket by the suction fixture at the suction portion, the mounting accuracy of the socket toward the circuit substrate can be improved. In addition, after insertion and installation, the tongue is separated from the socket at the connection portion to form a central through hole, and a state such as a central processing unit can be installed here. Furthermore, the installation method of the present invention is characterized in that, before the socket is held by the suction jig, at least the suction portion is pasted with adhesive tape on the socket, and the socket is peeled off from the socket after the circuit board is reflow soldered. The tape. According to the present invention, the adhesive tape adhered to the upper surface of the socket by the adsorption portion of the socket is supported by the tongue. Therefore, it is possible to prevent the vacuum suction force of the tape from being lowered due to the suction jig, thereby improving the accuracy of mounting the socket toward the circuit board. Furthermore, the installation method of the present invention is characterized in that the aforementioned adhesive tape forming a first opening portion at a position corresponding to the aforementioned slot hole is adhered to the above socket by a state in which the aforementioned slot hole of the first opening portion is at least partially open. According to the present invention, when the paper is passed through the first opening of the adhesive tape and the slot of the socket, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇 > < 297) .... .............. install ... .. line (please read the precautions on the back before filling out this page) 497294 A7 B7 V. Description of the invention (3) Hot air flows under the socket during soldering. Therefore, the hot air can effectively heat the socket and the circuit board, and reflow soldering can be performed quickly and reliably. (Please read the precautions on the back before filling this page.) Furthermore, the installation method of the present invention is characterized in that the above-mentioned pin through-hole is closed above, and the above-mentioned tape is pasted on the above-mentioned socket. According to the present invention, since the upper part of the pin through hole is completely covered by the adhesive tape, even if the flux contained in the solder is vaporized during reflow soldering, the vaporized flux can be prevented from rising in the pin through hole. Therefore, since the solder is not easy to adhere to the upper portion of the connection terminal installed in the pin hole, however, when the device is mounted on the socket, the connection between the pin and the connection terminal of the device can be made good. In addition, the installation method of the present invention is that the socket includes the outer periphery and the inner periphery all over the outer periphery, and includes an outer periphery portion and an inner periphery-portion located above the pin through hole forming surface. The aforementioned glue can be adhered to the upper surface of the outer peripheral portion and the upper surface of the inner peripheral portion, and while the formation portion is completely plugged above the formation portion, it is adhered to the socket. According to the present invention, since the pin-through-hole forming surface is completely plugged thereon by using an adhesive tape ', the reflow soldering can suppress the rise of the soldering solder passing through the pin-through hole. Furthermore, since the adhesive tape is above the pin through-hole formation surface, it is possible to prevent the adhesive from forming on the adhesive-attachment surface of the tape, thereby preventing dust from attaching to the pin through-hole due to the adhesive. Even in the present invention, since the formation surface of the penetration hole by the tape pin is completely plugged above, even when the flux contained in the solder is vaporized during reflow soldering, the vaporized flux can be suppressed from rising through the hole. Inside. Furthermore, since the adhesive tape is above the formation surface of the pin through hole, the adhesive of the adhesive tape can be prevented from adhering to the forming surface, and the dust caused by the adhesive can be prevented.
497294 A7 五、發明説明（4 ) 埃朝銷貫穿孔附著。 再者’本發明之安裝方法其特徵在於將形成於前述舌 片前端部位置於比前述插座上面還上方之把持部作為抓手 可取起該舌片。 依據本發明，自插座分離舌片時，將把持部作為抓手 一可谷易地自插座拿起該舌片。 而且’本發明之安裝方法其特徵係將在對應前述把持 _ 部位置形成第2開放部之前述膠帶，由該第2開放部卸下該 把持部黏貼於前述插頭上面。 依據本發明，黏貼於插頭上面之膠帶藉比在插座上面 還上方之把持部隆起，可迴避因舌片引起膠帶朝上方之支 稽力變脆弱之事態。 再者’本發明之安裝方法其特徵在於將前述膠帶周緣 部之一部份作成非黏貼於前述插頭上面狀態所成之游離片 部作為抓手可自該插座上面剝離該膠帶。 依據本發明，將游離片部作為抓手可容易地自插座剝 > 離膠帶。 前述方法藉以下的插座、膠帶能適當的實施。 為解決前述課題，本發明之插座其特徵在於在内圍部 藉連結部由作成不連續之槽孔圍繞，由於在該連結部折斷 後除去，包含可形成中央貫穿孔之舌片。 再者’本發明之插座其特徵為包含位於比前述舌片之 前端部上面還上方之把持部。 而且，本發明之插座係在前述外圍部遍及外周緣及内 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公爱） -7 - .......................裝..................訂................線· (請先閲讀背面之注意事項再填窝本頁) 497294 A7 — —___B7 _ 五、發明説明（5 ) 周緣全周，其特徵為包含有位於比前述銷貫穿孔形成面還 上方之外周緣部及内周緣部。 (請先閲讀背面之注意事項再填寫本頁) 為解決前述課題本發明之膠帶係前述插座在外圍部包 含裝置之銷插入用之銷貫穿孔，包含在内圍部藉連結部由 作成不連續之槽孔圍繞，由於在該連結部折斷後除去可形 成中央貫穿孔之舌片時，其特徵為該槽孔至少一部份向上 方開放，形成可黏貼於該插座上面之第1開放部。 再者，本發明之膠帶其特徵為前述舌片前端部包含位 於比前述插座上面還上方之把持部時，卸下該把持部形成 可黏貼於該插座上面之第2開放部。 而且，本發明之膠帶其特徵係在周緣部之一部份，設 置有非黏貼於前述插座上面狀態之游離片部。 [發明之實施形態] - 關於本發明之插座、帶、插座安裝方法之實施形態利 用圖式予以說明。第1圖係本實施形態之插座構成說明圖， 第2圖係第1圖之II-II線部份截面圖，第3圖〜第5圖係本實 施形態之插座安裝方法之說明圖。 首先，使用第1圖及第2圖就本實施形態安裝方法對象 之插座1之構成予以說明。插座10係略矩形板狀，安裝於電 路基板30，略矩形狀之中央處理器（裝置）4〇係可調換安裝 者。插座10由上部10a與藉上部l〇a覆蓋對面於電路基板30 之下部10b所構成。 在上部10a之周圍部，透過在基部之連結部丨丨連結於上 述10a，在連結部11以外之部份形成由略口字形狀之槽孔12 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 497294 A7 B7 五、發明説明（6 圍繞之略矩形狀之舌片13。舌片13包含有與上部i〇a上面略 同樣高度之平坦部13x與在其前端部比上部i〇a上面略段狀 起立之把持部13y。如後述由於舌片13自連結部11之上部 l〇a分離，在上部i〇a之内圍部形成略矩形狀之上部中央貫 穿孔14a。 再者，在上部10a外圍部設置有突設於中央處理器4〇 下方之銷41插入之複數上部銷貫穿孔15a。在上部l〇a外圍 部之外周緣及内周緣形成比上部銷貫穿孔l5a形成面高的 位置延伸至全長同一高度之外周緣部16及内周緣部π。 在下部10b之内圍部設置有與舌片13略同樣大小略矩 形狀之下部中央貫穿孔14b。在下部10b之外圍部設置有中 央處理器40之銷41可插入下部銷貫穿孔15b。在下部銷貫穿 孔15b内設置與中央處理器40·之銷41之連接端子18及夾持 在連接端子18下部，後述之回流焊接用略圓柱狀之焊錫19。 上部中央貫穿孔14a及下部中央貫穿孔14b構成中央貫 穿孔14，而，上部銷貫穿孔15a及下部銷貫穿孔i5b則構成 銷貫穿孔。再者，插座10包含臂L，詳細的機構雖省略了 說明，但由於臂L可起立、橫臥，上部l〇a面對下部i〇b作 成可滑進。藉該滑進中央處理器40之銷41固定於插座1〇之 連接端子18。 接著，關於在上述構成之插座10安裝於電路基板3〇之 方法使用第3圖〜第5圖說明之。 首先，如在第3 (a)圖所示，與插座10上面面積及形狀 略同一之膠帶20黏貼於插座1〇之上部l〇a上面。在膠帶20 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 9 .......................裝..................訂…...............線- (請先閲讀背面之注意事項再填寫本頁) A7 B7 五、發明説明（7 ) 之内圍部形成略：7字形狀之開放部21。開放部21由對應插 座10之槽孔12基部略π字形狀之第1開放部211與由第1開 放部211圍繞三方，對應舌片13之把持部ι3χ略矩形狀在所 謂第2開放部212之圖中點線區分之兩個部份所構成。由第i 開放部211如在第3(b)圖所示在開放槽孔12之一部份之狀 態、膠帶20黏貼於插座上面。再者，由第2開放部212同樣 如在第3(b)圖所示，卸下舌片13之把持部i3y將膠帶2〇黏貼 於插座10上面。又，在膠帶20之一邊設置沒有貼著力之游 離片部22。而且，膠帶20具有後述使用於回流焊接面對熱 風之耐熱性。 再者’如在第4(a)圖所示膠帶20係在插座10之上部l〇a 外圍部，除了上部銷貫穿孔15a之形成面以外黏貼遍及外周 緣部16上面及内周緣部π上面全周。由此膠帶20自上部銷 貫穿孔15a之形成面露出，且在閉塞銷貫穿孔15其上方之狀 態黏貼於插座10上面。 其次，將在第3(b)圖點線所示略吸盤狀之吸附夾具50 在含舌片13基部之吸附部份X密接膠帶20,吸附保持且移動 到電路基板30之規定位置載置插座10，由此如在第4(a)圖 所示變成插座10之焊錫19下端頂接電路基板30之電路端子 31狀態。此外，吸附部份X從藉吸附夾具50略水平地維持吸 附時插座10之姿勢而言即使在插座10之重心位置近旁也 可° 接著，面向插座10之載置位置喷吹熱風。該熱風係如 在將第4(a)圖箭頭所示經膠帶20之開放部21及插座10之槽 本紙張尺度適用中國國家標準（CNS) A4規格（210 X 297公釐） 10 請 先 閲· 面 之 注 意 事 項 再 填 寫 本 頁 497294 A7 ______B7 _ 五、發明説明（8 ) 孔12到達插座10之下方，藉該熱熔化焊錫19回流焊接電路 端子31。 然而，將把持部13y作為抓手如在第4(b)圖所示抬起舌 片13，由此折斷了連結部h，舌片π在連結部自插座1〇分 離。隨著如在第4(b)圖所示，將游離片部22作抓手自插座 10上面剝離膠帶20。 由此如在第5圖所示，插座1〇之連接端子18透過焊錫19 連接電路基板30之電路端子31。又，雖未圖示，但由於中 央處理器40之銷41插入鎖貫穿孔15、中央處理器40可安裝 在插座10。 依據本發明，在插座10之吸附部份X黏貼於該插座10 上面之膠帶20藉舌片13之平坦部13x支撐於上方（參閱第 3(b)圖、第4(a)圖.。因而，藉吸附夾具5〇透過膠帶20防止插 座10之吸附保持力之降低。進而可謀求插座10朝電路基板 30安裝精確度之提高。而且，由於安裝後在連結部Η自插 座10分離舌片13而形成中央貫穿孔14，在此可作成可插著 中央處理器40等裝置之狀態（參閱第5圖）。 再者，通過形成於膠帶20之第1開放部211與插座1〇之 槽孔12，則回流焊接時之熱風流入插座丨〇之下方（參照第 4(a)圖）。因而，藉熱風有效地燙熱插座1〇及電路基板3〇, 可迅速且確實地回流焊接兩者。 而且，鎖貫穿孔15之形成面其上方藉膠帶2〇完全塞 住’作成可抑制自銷貫穿孔15下方朝上方之熱風移動。因 而’即使當回流焊接時含於焊錫之焊劑有氣化的情形，也 11 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（21〇><297公爱） 497294 A7 — _B7_ 五、發明説明（9 ) 可抑制氣化之焊劑上升銷貫穿孔15内。由此，因在安裝於 銷貫穿孔15内之連接端子18之上方部份不易附著焊劑，當 、 中央處理器40安裝於插座10時，可作好中央處理器40之銷 41與連接端子18之連接（參閱第4(a)圖）。 再者，由於膠帶20在插座10中比銷貫穿孔15之形成面 還上方，可防止膠^20之黏著劑朝該形成面附著，進而可 防止因該黏著劑引起之塵埃朝貫穿孔15附著。 而且，由形成於膠帶20之第2開放部212，卸下舌片13 之把持部13y可將膠帶20黏貼於插座10上面（參閱第3(b)圖） 因此，迴避黏貼於插座10之膠帶20在比插座10上面還上方 之把持部13y部份隆起，可迴避在插座10之吸附部份X因舌 片13引起膠帶20之支撐力變脆弱之事態。 再者，自插座10分離舌片-13時，將把持部13y作為抓手 可容易地拿起該舌片13。 而且，將游離片部22作為抓手，可容易地自插座1〇上 面剝離膠帶20。 此外，本實施形態係藉吸附夾具，雖插座1〇係透過黏 貼於其上面之膠帶20吸附保持，但作為其他實施形態省略 膠帶20之黏貼，藉吸附夾具50直接吸附保持插座1〇也可。 [圖式之簡單的說明] [第1圖] 本實施形態之插座之構成說明圖。 [第2圖] 第1圖之II-II線部份截面圖。 本紙張尺度適用中國國家標準（CNS) A4規格（210X 297公釐） · 12 -497294 A7 V. Description of the invention (4) The Egyptian pin is attached to the through hole. Furthermore, the mounting method of the present invention is characterized in that the tongue piece can be picked up by using a grip portion formed on the front end portion of the tongue piece above the upper surface of the socket as a gripper. According to the present invention, when the tongue is separated from the socket, the grip portion is used as a gripper, and the tongue can be easily lifted from the socket. In addition, the installation method of the present invention is characterized in that the second tape is formed with the second opening at a position corresponding to the holding portion, and the second opening is removed and the holding portion is adhered to the plug. According to the present invention, the adhesive tape stuck on the plug is raised than the grip on the socket and above the socket, so as to avoid the situation where the supporting force of the tape becomes weak due to the tongue. Furthermore, the installation method of the present invention is characterized in that a part of the peripheral edge portion of the tape is made into a free sheet portion which is not adhered to the upper surface of the plug as a gripper to peel the tape from the upper surface of the socket. According to the present invention, the release sheet can be easily peeled from the socket by using the free sheet portion as a gripper > The aforementioned method can be appropriately implemented by the following sockets and tapes. In order to solve the foregoing problem, the socket of the present invention is characterized in that the inner peripheral portion is surrounded by a discontinuous slot formed by a connecting portion, and is removed after the connecting portion is broken, and includes a tongue that can form a central through hole. Furthermore, the socket of the present invention is characterized in that it includes a gripping portion located above the front end portion of the tongue. In addition, the socket of the present invention applies the Chinese National Standard (CNS) A4 specification (210X297 public love) in the aforementioned peripheral part throughout the outer periphery and the inner paper size. -7-.............. ..................... Order ...... line · (please first Read the precautions on the back and fill in this page again) 497294 A7 — —___ B7 _ V. Description of the invention (5) The entire perimeter of the perimeter is characterized by including the outer perimeter portion and the inner perimeter located above the pin through hole formation surface. unit. (Please read the precautions on the back before filling this page.) In order to solve the above-mentioned problems, the tape of the present invention is a pin through hole for the pin insertion of the device in the outer part of the socket, and the inner part is made discontinuous by the connecting part. The slot is surrounded. When the tongue that can form the central through hole is removed after the connecting portion is broken, it is characterized in that at least a part of the slot is opened upward to form a first open portion that can be adhered to the socket. Furthermore, the tape of the present invention is characterized in that when the front end portion of the tongue includes a gripping portion located above the upper surface of the socket, the gripping portion is removed to form a second opening portion that can be adhered to the upper surface of the socket. Moreover, the tape of the present invention is characterized in that a part of the peripheral portion is provided with a free sheet portion which is not adhered to the upper surface of the socket. [Embodiments of the invention]-The embodiments of the socket, tape, and socket mounting method of the present invention will be described with reference to drawings. Fig. 1 is an explanatory diagram of the structure of the socket of the present embodiment, Fig. 2 is a partial cross-sectional view taken along line II-II of Fig. 1, and Figs. 3 to 5 are explanatory diagrams of the socket installation method of this embodiment. First, the structure of the socket 1 which is the object of the mounting method according to this embodiment will be described with reference to Figs. 1 and 2. The socket 10 has a slightly rectangular plate shape and is mounted on the circuit substrate 30. The slightly rectangular central processing unit (device) 40 is a replaceable installer. The socket 10 is composed of an upper portion 10a and an upper portion 10a covering the lower portion 10b opposite to the circuit board 30. Around the upper part 10a, through the connecting part at the base part 丨 丨 is connected to the above 10a, and a slot with a slightly rectangular shape is formed in the part other than the connecting part 12 The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 497294 A7 B7 V. Description of the invention (6 A slightly rectangular tongue piece 13 surrounding it. The tongue piece 13 includes a flat portion 13x which is approximately the same height as the upper surface of the upper part i〇a and a front part which is higher than the upper part i. 〇a The upper portion of the holding portion 13y is slightly raised. As described later, since the tongue piece 13 is separated from the upper portion 10a of the connecting portion 11, a slightly rectangular upper portion central through hole 14a is formed in the inner peripheral portion of the upper portion i0a. In the peripheral portion of the upper portion 10a, a plurality of upper pin through-holes 15a inserted by pins 41 protruding below the CPU 40 are provided. The outer peripheral edge and the inner peripheral edge of the peripheral portion of the upper portion 10a are formed more than the upper pin through-holes 15a. The position where the surface height is formed extends to the outer peripheral portion 16 and the inner peripheral portion π of the same height over the entire length. An inner peripheral portion of the lower portion 10b is provided with a central rectangular through hole 14b of a lower portion that is slightly the same size as the tongue piece 13. In the lower portion 10b Center The pin 41 of the processor 40 can be inserted into the lower pin penetrating hole 15b. The lower pin penetrating hole 15b is provided with a connection terminal 18 connected to the pin 41 of the central processing unit 40 · and clamped at the lower portion of the connection terminal 18. Columnar solder 19. The upper central through hole 14a and the lower central through hole 14b constitute the central through hole 14, and the upper pin through hole 15a and the lower pin through hole i5b constitute a pin through hole. Furthermore, the socket 10 includes an arm L Although the detailed mechanism is omitted, since the arm L can stand and lie horizontally, the upper portion 10a faces the lower portion i0b and can be slid in. The pin 41 of the central processing unit 40 is fixed to the socket 1 by this sliding in. The connection terminal 18. Next, the method of mounting the socket 10 having the above-mentioned structure on the circuit board 30 will be described using FIGS. 3 to 5. First, as shown in FIG. The tape 20 with the same area and shape is stuck on the upper part 10a of the socket 10. The paper size of the tape 20 applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 9 ......... .............. install ......... order ............... Line-( Please read the precautions on the back before filling this page) A7 B7 V. Description of the invention (7) The inner part is formed slightly: a 7-shaped opening 21. The opening 21 is slightly π from the base of the slot 12 corresponding to the socket 10. The letter-shaped first opening portion 211 and the first opening portion 211 surround three sides, and are formed by two portions separated by dotted lines in the so-called second opening portion 212 corresponding to the grip portion ι3χ of the tongue piece 13. As shown in FIG. 3 (b), the i-th opening portion 211 is in a state where one part of the slot 12 is opened, and the adhesive tape 20 is stuck on the socket. Furthermore, as shown in FIG. 3 (b), the second opening portion 212 also removes the grip portion i3y of the tongue piece 13 and attaches the tape 20 to the socket 10. A free-moving sheet portion 22 is provided on one side of the adhesive tape 20. In addition, the adhesive tape 20 has heat resistance which will be described later for use in reflow soldering facing hot air. Furthermore, as shown in FIG. 4 (a), the adhesive tape 20 is attached to the outer portion 10a of the socket 10, and is adhered to the upper surface of the outer peripheral portion 16 and the upper surface of the inner peripheral portion π except for the formation surface of the upper pin through hole 15a. All week. As a result, the adhesive tape 20 is exposed from the formation surface of the upper pin through-hole 15a, and is stuck on the socket 10 in a state above the closed pin through-hole 15. Next, the suction jig 50, which is slightly sucker-shaped as shown by the dotted line in FIG. 3 (b), is attached to the suction part X of the tongue 13 with the adhesive tape 20, and is held and moved to a predetermined position on the circuit board 30 to mount the socket. 10, as shown in FIG. 4 (a), the lower end of the solder 19 of the socket 10 is brought into contact with the circuit terminals 31 of the circuit board 30. In addition, the suction part X can maintain the posture of the socket 10 at the time of suction slightly horizontally by the suction jig 50 even if it is near the center of gravity position of the socket 10. Then, the hot air is blown toward the mounting position of the socket 10. The hot air is as shown in the arrow in Figure 4 (a) through the open part 21 of the adhesive tape 20 and the slot of the socket 10. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 10 Please read first · Please fill in this page again for further information on this page 497294 A7 ______B7 _ V. Description of the invention (8) The hole 12 reaches below the socket 10, and the circuit terminal 31 is reflow soldered by the hot-melt solder 19. However, as shown in FIG. 4 (b), the tongue piece 13 is lifted by using the holding portion 13y as a grip, thereby breaking the connecting portion h, and the tongue piece π is separated from the socket 10 at the connecting portion. As shown in Fig. 4 (b), the free sheet portion 22 is used as a gripper to peel the adhesive tape 20 from the upper surface of the socket 10. Therefore, as shown in FIG. 5, the connection terminal 18 of the socket 10 is connected to the circuit terminal 31 of the circuit board 30 through the solder 19. Although not shown, since the pin 41 of the central processing unit 40 is inserted into the lock penetration hole 15, the central processing unit 40 can be mounted on the socket 10. According to the present invention, the adhesive portion 20 of the socket 10 adhered to the upper surface of the socket 10 is supported by the flat portion 13x of the tongue piece 13 above (refer to FIG. 3 (b) and FIG. 4 (a) ..) The adsorption fixture 50 is used to prevent the decrease in the adsorption and holding force of the socket 10 through the adhesive tape 20. Further, it is possible to improve the mounting accuracy of the socket 10 toward the circuit substrate 30. In addition, the tongue 13 is separated from the socket 10 at the connection portion after installation. The central through hole 14 is formed, and a state in which devices such as the central processing unit 40 can be inserted therein (see FIG. 5). Furthermore, a slot hole formed in the first opening portion 211 of the adhesive tape 20 and the socket 10 is formed. 12, the hot air during reflow solder flows below the socket 丨 0 (refer to Figure 4 (a)). Therefore, the hot air can effectively heat the socket 10 and the circuit board 30, so that both can be reflow soldered quickly and reliably. In addition, the formation surface of the lock penetration hole 15 is completely plugged with an adhesive tape 20 'to prevent the hot air from moving downward from the pin penetration hole 15 upwards. Therefore, even when reflow soldering, the flux contained in the solder is vaporized. Case, also 11 (please read the back first Please fill in this page again for this matter.) This paper size is in accordance with Chinese National Standard (CNS) A4 specification (21〇 > < 297 public love) 497294 A7 — _B7_ V. Description of the invention (9) Rising pin which can inhibit gasification In the hole 15. Therefore, since the solder is not easy to adhere to the upper part of the connecting terminal 18 installed in the pin through hole 15, when the CPU 40 is installed in the socket 10, the pin 41 of the CPU 40 can be made. Connection to the connection terminal 18 (see Figure 4 (a)). Furthermore, since the adhesive tape 20 is above the formation surface of the pin penetration hole 15 in the socket 10, the adhesive of the adhesive 20 can be prevented from adhering to the formation surface. Therefore, it is possible to prevent the dust caused by the adhesive from adhering to the through hole 15. In addition, the second opening portion 212 formed in the adhesive tape 20 can be used to attach the adhesive tape 20 to the socket 10 by removing the grip portion 13y of the tongue piece 13 ( (See Figure 3 (b)) Therefore, avoiding the sticking of the adhesive tape 20 on the socket 10 in the holding portion 13y above the socket 10, the adhesive portion X of the socket 10 can be avoided because the tongue 20 causes the tape 20 The supporting force becomes fragile. Moreover, since the socket 10 When leaving the tongue piece-13, the tongue piece 13 can be easily picked up by using the grip portion 13y as a gripper. Moreover, the free piece portion 22 can be used as a gripper to easily peel off the adhesive tape 20 from the top of the socket 10. In addition, this In the embodiment, the socket 10 is adsorbed and held by the adhesive tape 20 attached to the socket 10, but the adhesive tape 20 is omitted in other embodiments, and the socket 10 may be directly adsorbed and retained by the suction clamp 50. [Schematic drawing] Simple description] [Fig. 1] An explanatory diagram of the structure of the socket of this embodiment. [Fig. 2] Sectional view taken along line II-II in Fig. 1. This paper size applies to China National Standard (CNS) A4 (210X 297 mm) · 12-
f請先閲讀背面之注意事項再填寫本頁)f Please read the notes on the back before filling in this page)
497294 Α7 Β7 Φ 五、發明説明（1〇) [第 3(a)-(b)圖] 本實施形態之插座安裝方法說明圖 [第 4(a)-(b)圖] 本實施形態之插座安裝方法說明圖 [第5圖] 本實施形態之插座安裝方法說明圖 (請先閲讀背面之注意事項再填窝本頁) 鲁 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 13 497294 A7 _B7 五、發明説明（11) 元件標號對照 10…插座 17·.·内周緣部 10a...上部 18...連接端子 10b…下部 19…焊錫 11...連結部 20...膠帶 12…槽孔 21...開放部 13…舌片 22...游離片部 13x…平坦部 30...電路基板 13y...把持部 31…電路端子 14…中央貫穿孔 40.··中央處理器（裝置) 14a...上部中央貫穿孔 41···銷 14b...下部中央貫穿孔 • 50…吸附夾具 15...銷貫穿孔 211…第1開放部 15a...上部銷貫穿孔 212…第2開放部 15b...下部銷貫穿孔 L···臂 16...外周緣部 (請先閲讀背面之注意事項再填寫本頁) .訂丨 :線秦 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 14497294 Α7 Β7 Φ V. Description of the invention (10) [Figures 3 (a)-(b)] Illustration of the method for installing the socket in this embodiment [Figure 4 (a)-(b)] Socket in this embodiment Illustrative drawing of installation method [Figure 5] Illustrative drawing of installation method of socket in this embodiment (please read the precautions on the back before filling in this page) The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) 13 497294 A7 _B7 V. Description of the invention (11) Comparison of component numbers 10 ... socket 17 ... inner peripheral portion 10a ... upper 18 ... connecting terminal 10b ... lower portion 19 ... solder 11 ... connecting portion 20. .Tape 12 ... Slot hole 21 ... Open portion 13 ... Tangle piece 22 ... Free piece portion 13x ... Flat portion 30 ... Circuit substrate 13y ... Grip portion 31 ... Circuit terminal 14 ... Central through hole 40. ·· Central Processing Unit (apparatus) 14a ... Upper central through hole 41 ··· Pin 14b ... Lower central through hole · 50 ······································· Through-holes 211 ... first opening 15a Upper pin through hole 212 ... 2nd opening 15b ... Lower pin through hole L ... Arm 16 ... Outer peripheral edge (Please read the precautions on the back before filling P) set Shu: Qin This paper line scale applicable Chinese National Standard (CNS) A4 size (210X297 mm) 14