484102 A7 B7 五、發明說明（ 發明領 本發 項之前 相關技 該塑 輸票卡 用於 電結構 版印刷 合物所 層法， 熱作法 〇為了 對該箔 。藉由 之該箔 置一個 若非使 域 明有關於一 言的導電結 術說明 膠物體的實 、標籤、詢 製造該塑膠 俗首先固箸 法。一般的 組成。亦可 一金屬箔層 而疊層於該 在後續的塑 層的黏箸性 網販印刷法 層及導電結 電子晶片並 用反轉晶Η 種用於製造含有如申請專利範圍第1 構之塑膠物體的方法。 例偽無 答機、 物體的 於箔層 箔層係 為諸如 (主要 箔層以 膠射出 ，該箔 ,銀導 構上。 包覆於 技術直 接觸使 玩具以 方法為 表面， 由ABS PET等 為一銅 及藉蝕 成形時 層偽於 電糊劑 具有該 模具中 接安裝 用晶片 及行動 所熟知 其係藉 或PVC 其他塑 或鋁箔 刻所形 ，獲得 叠層前 印刷於 導電結 的塑_ 於該導 卡、電 墊子通 ，藉此 由諸如 或該二 顧所製 層）偽 成之導 適當之 以一黏 以本方 構的箔 物體中 電結構 子鎖、運 訊裝置。 ，一種導 叠層或網 塑膠的混 成。藉疊 以冷作或 電結構上 導電結構 著劑塗覆 法所形成 層接著設 〇 該晶片 的接觸表484102 A7 B7 V. Description of the invention (Relevant technology before the invention of this invention. The plastic ticket card is used for the electrical structure plate printing composition layer method. Hot work method. In order to the foil. By placing a Yu Mingming has a word about conductive junctions to explain the reality, labeling, and manufacturing of plastic objects. The general method of solidification. General composition. A metal foil layer can also be laminated on the adhesive of the subsequent plastic layer. An online retailer prints a method layer and a conductive junction electronic wafer and uses a reverse crystal. A method for manufacturing a plastic object containing a structure such as the scope of the patent application. For example, a pseudo-non-answering machine, the object on the foil layer is Such as (the main foil layer is shot with glue, the foil, silver guide structure. Covered with technical direct contact to make the toy to the surface, ABS PET, etc. is a copper and the layer is pseudo-electric paste when the layer is formed. The chip used for mounting and installation in the mold is well known as the shape of the plastic or aluminum foil engraved with PVC, and the plastic printed on the conductive junction before lamination is obtained. The layer made by the second company) is a pseudo guide, which is suitable for an electrical structure sublock and a communication device in a foil object adhered to the square structure. A guide laminate or a mixture of mesh plastic. The layer formed by the conductive structure coating method on the electrical structure is then set to the contact table of the wafer.
訂 經濟部智慧財產局員工消費合作社印製 導點 的缺 中的 具層 模箔 在之 埋化 鑲強 於劑 箸箸 固黏 是以 便力 ，著 、黏 下之 向層 面屬 表金 即 〇 亦構 ί 結 面電 上 層 箔 該 於 置 留 仍。 劑合 著接 黏弱 該微 ，有 時具 構僅 結膠 電塑 導出 該射 刻該 蝕與 當常 於經 在且 法 方 的 體 物 膠 塑 造 0 於 用 Η1 種 1 出 提 於 在 的 巨 之 述明 概發 明本 發 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 484102 A7 B7 五、發明說明（ ，藉此 根據 項之待 請專利 圖式簡 本發 其傺 經濟部智慧財產局員工消費合作社印製 第1 。該箔 構2上 與導電 硬化的 有射出 中該塑 箔層1 箔層1 2與晶 體係為 導電結 之螺旋 件間的 容器的 可省略該箔 本發明之目 徵的方法而 範圍。 單說明 明的實施例 表示於：第 第 第 圖表示一導 層1 設有一 (反轉晶片 結構2直接 物質所覆蓋 開口 6安置 膠最好與箔 的一側後， 亦可射出成 片3鑲埋於 諸如具有導 構2包含多 狀印刷導體 互連導體等 表面。 層與該導電結構間的黏 的係藉由申請專利範圍 解決。有用的實施例係 著層。 第1項及第5 根源於所附申 俗基於圖 具有 說明如下。 層的平面圖； 平面圖 導電結 使得其The missing layered foil of the printed consumer guide of the Intellectual Property Bureau of the Ministry of Economic Affairs's consumer cooperatives is embedded in it and is stronger than the agent. The structure of the upper electrical layer foil should be left in place. The adhesion of the adhesive sticks to the micro, sometimes the structure is only cemented, and the plastic is used to derive the etch, the etch, and the body glue that is often used in the traditional method. The description of the invention is based on the paper size of the Chinese National Standard (CNS) A4 (210 X 297 mm) 484102 A7 B7. 5. Description of the invention (, according to the pending patent drawing of this item, issued by the Ministry of Economic Affairs Printed by the Consumer Property Cooperative of the Intellectual Property Bureau. The foil structure 2 and the conductive hardened injection have the plastic foil layer 1 foil layer 12 and the container between the crystal system and the spiral member with a conductive junction can be omitted. The method and scope of the purpose of the invention are described in the single description. The first figure shows that the first layer is provided with a guide layer 1 provided with an (inverted wafer structure 2 directly covered by the opening 6) the side where the glue is preferably placed on the foil Later, it can also be ejected into a sheet 3 and embedded on a surface such as a conductive structure 2 including a multi-shaped printed conductor interconnecting conductor. The adhesion between the layer and the conductive structure is solved by applying for a patent. Useful embodiments . The first and second 5 layer Item appended rooted popular application-based plan view of a layer described below;. A plan view such that the conductive junction
ft ^ - (請先閱讀背面之注意事項再填寫本頁) •ϋ 1« ϋ 1ϋ ^^1 ι_ϋ iMmm ^ ^ I ϋ. I ^^1 i^i ^^1 ^^1 ^^1 I · - 矣 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 484102 A7 B7_ 五、發明說明（3 ) 當射出塑膠時，清漆4將保護導電結構2不受損傷和 /或破壞。受損傷的多數一方面偽為安置在鄰接於射出 開口 6的導電結構2部分，而另一方面偽為橫向排列於 以箭號所標示之射出方向的導電結構2部分。僅部分的 導電結構2 (如第1圖中的實線7所示）或者整個導電 結構2 (如第1圖中的虛線8所示）是否已由清漆4所 覆蓋主要偽取決於該導電結構2黏著於該箔層1的程度 ，以及在射出塑膠時作用在導電結構2上的力量有多大。 . 該清漆4對於箔層1必須具有良好的黏著性、可在典 型地小於5 G °C的相當低溫硬化而使得該箔層不會彎曲， 以及具有抗熱性（因為在射出塑膠時會上升至200 °C的 溫度）。清漆最好使用可以紫外光硬化者。通常使用於 遮罩焊料的清漆已證實待別地適用。然而，該物質亦可 為諸如P r 〇 t a v i c ® L 1 1 7等樹脂，其可於5 0 °C硬化。除 此之外，其他的適用物質係為所謂的填底材料，其通常 使用於填充晶片3 (被安裝為反轉晶Η )及箔層1之間 的孔洞。這些種類的填底材料可於諸如液態形式之命名 為Epotek U300及Hysol FP4526的商品獲得。其亦可由 使用於網版印刷的糊劑獲得。該被指名的物質可以諸如 網販印刷刷法、壓塞印刷法、藉分配法或噴霧法而施加 於箔層1上。 其已證實通常經硬化的清漆4與射出的塑膠並不會接 合在一起，因而不會或幾乎不會彼此黏著。因此，使得 清漆4覆蓋於該箔層1的面積如所需般大且盡可能小傺 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） # (請先閱讀背面之注意事項再填寫本頁) r-------訂·--------- 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 484102 A7 B7_ 五、發明說明（4 ) 為適當地。其亦應觀察到的是一適當的間隙存在於該導 電結構2與塑膠物體的邊緣之間，以使得該被包覆的塑 膠沿箸晶Η卡邊緣良好地黏箸於該箔層1 ，而避免箔層 1的剝離。 第2圖表示該箔層1未設置一空白晶Η3而設置一該 晶片3鑲埋於其中的模組9的實施例。模組9具有直接 接觸導電結構2 (作為天線）的二個端子。基於該原因 ，模組9俗橫向安置於該導電結構2的印刷導體。至此 ,該清漆4亦覆蓋穿經模組9的印刷導體，而藉以磷保 該印刷導體與模組9之間的電絶緣。此外，另外二個相 對較小的導電結構2區域1 G傺以清漆4覆蓋，以使得該 箔層1可在清漆4硬化後疊層於彼此的頂端。 第3圖及第4圖像表示以清漆4覆蓋之導電結構2的 橫剖面積（在此包含有四個印刷導體）。在第3圖中， 清漆4傺以最小髙度Η覆蓋於該導電結構2上；而在第 4圖中，該清漆4僅填充導電結構2之印刷導體之間的 間隙1 1。因為該清漆4完好地黏著於箔層1 ，所以在本 最後一個實例中，其亦可在射出製程期間於該射出塑膠 材料的前端有效地吸收力量，並保護該印刷導體不受損 傷。 一種用於製造塑膠物體的另一個方法僳說明如下，其 中一個衝壓天線設置作為導電結構2 ，該方法最好包含 下列步驟： a )設置一個由極薄金屬箔層所形成的導線架（特別是亦 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 484102 A7 B7_ 五、發明說明（5 ) 包含天線線圏之諸如70微米厚的銅箔層），其具有晶 片3或模組9以及其他電子元件（所有所需）， b )施加清漆4於箔層1上方的預定位置， c) 在該導線架之中衝壓導電結構2 ， d) 將該導電結構2安置於箔層1上，導電結構2由此在 預定位置深入清漆4 ， e )將清漆4硬化， f)將箔層1包覆或叠層於該塑膠物體中。 本方法可以不同方式改良，諸如導電結構2 (在固定 於箔層1之前或之後）僅為設有模組9及其他電子元件 (若有所需）的衝壓天線。本方法之步驟的特徽在於步 驟b ，d及e 。藉本方法，清漆4不僅用於在塑膠射出 或後續之疊層於塑膠物體的期間保護該導電結構2 ，且 亦用於將該導電結構固定於箔層1 。 藉由一種不同的方法，導電結構2傺藉由將天線由薄 線環繞成線圏而形成。本方法包含下列步驟： a )施加清漆4於箔層1上方的預定位置， b)將薄線製的天線安置於箔層1上，導電結構2由此在 預定位置深入清漆4 ， c )將清漆4硬化， d) 將模組9及其他電子元件（若有所需）施加於箔層1 ，該模組9或電子元件藉此接觸導電結構2 ， e) 將箔層1包覆或叠層於該塑膠物體中。 藉由對於本方法之改良，該線圈天線在步驟a之前而 -7 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)ft ^-(Please read the notes on the back before filling this page) • ϋ 1 «ϋ 1ϋ ^^ 1 ι_ϋ iMmm ^ ^ I ϋ. I ^^ 1 i ^ i ^^ 1 I ^^ 1 ^^ 1 I · -矣 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 484102 A7 B7_ V. Description of the invention (3) When plastic is injected, the varnish 4 will protect the conductive structure 2 from damage and / or damage . Most of the damaged parts are assumed to be disposed on the conductive structure 2 portion adjacent to the ejection opening 6, and on the other hand, they are assumed to be laterally arranged in the conductive structure 2 portion indicated by the arrow. Whether only part of the conductive structure 2 (as shown by the solid line 7 in Figure 1) or the entire conductive structure 2 (as shown by the dotted line 8 in Figure 1) has been covered by the varnish 4 mainly depends on the conductive structure 2 The degree of adhesion to the foil layer 1 and how much the force acts on the conductive structure 2 when the plastic is ejected. The varnish 4 must have good adhesion to the foil layer 1, can be hardened at a relatively low temperature, typically less than 5 G ° C, so that the foil layer does not bend, and has heat resistance (because it will rise to 200 ° C). The varnish is best to use UV-curable. Varnishes commonly used in mask solders have proven to be applicable elsewhere. However, the substance may also be a resin such as Pr Ot avic ® L 1 17 which can be hardened at 50 ° C. In addition, other applicable substances are so-called underfill materials, which are generally used to fill holes between the wafer 3 (installed as an inverted crystal wafer) and the foil layer 1. These types of underfills are available in products such as liquid forms named Potek U300 and Hysol FP4526. It can also be obtained from a paste for screen printing. The named substance may be applied to the foil layer 1 such as a web dealer printing brush method, a tampon printing method, a dispensing method, or a spray method. It has been confirmed that usually the hardened varnish 4 and the injected plastic do not join together and therefore do not or hardly adhere to each other. Therefore, the area where the varnish 4 covers the foil layer 1 is as large as necessary and as small as possible. -5- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) # (Please read first Note on the back, please fill out this page) r ------- Order · --------- Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by 484102 A7 B7_ 5. Description of the invention (4) is appropriate. It should also be observed that an appropriate gap exists between the conductive structure 2 and the edge of the plastic object, so that the coated plastic adheres well to the foil layer 1 along the edge of the crystal card, and Avoid peeling of the foil layer 1. Fig. 2 shows an embodiment in which the foil layer 1 is provided with a blank crystal wafer 3 and a module 9 in which the wafer 3 is embedded. The module 9 has two terminals that directly contact the conductive structure 2 (as an antenna). For this reason, the module 9 is generally disposed laterally on the printed conductor of the conductive structure 2. So far, the varnish 4 also covers the printed conductor passing through the module 9, and the electrical insulation between the printed conductor and the module 9 is guaranteed by phosphorus. In addition, the other two relatively small conductive structures 2 areas 1 G 傺 are covered with a varnish 4 so that the foil layer 1 can be laminated on top of each other after the varnish 4 is hardened. Figures 3 and 4 show the cross-sectional area of the conductive structure 2 covered with varnish 4 (there are four printed conductors included here). In Fig. 3, the varnish 4 傺 covers the conductive structure 2 with a minimum degree; and in Fig. 4, the varnish 4 only fills the gap 11 between the printed conductors of the conductive structure 2. Since the varnish 4 is perfectly adhered to the foil layer 1, in this last example, it can also effectively absorb the force at the front end of the injection plastic material during the injection process, and protect the printed conductor from damage. Another method for manufacturing plastic objects is described below. One of the stamped antennas is provided as a conductive structure. The method preferably includes the following steps: a) Setting up a lead frame formed by an extremely thin metal foil layer (especially Also this paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------------- Order --------- Line (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 484102 A7 B7_ V. Description of the invention (5) Including the antenna wire (such as 70 micron thick copper foil layer) Wafer 3 or module 9 and other electronic components (all required), b) applying varnish 4 at a predetermined position above foil layer 1, c) stamping a conductive structure 2 in the lead frame, d) placing the conductive structure 2 Placed on the foil layer 1, the conductive structure 2 is thereby penetrated into the varnish 4 at a predetermined position, e) the varnish 4 is hardened, and f) the foil layer 1 is covered or laminated in the plastic object. This method can be improved in different ways, such as the conductive structure 2 (before or after being fixed to the foil layer 1) is only a stamped antenna provided with a module 9 and other electronic components (if required). The features of the steps of this method are steps b, d, and e. By this method, the varnish 4 is not only used to protect the conductive structure 2 during the injection of plastic or subsequent lamination on plastic objects, but also to fix the conductive structure to the foil layer 1. By a different method, the conductive structure 2 傺 is formed by surrounding the antenna from a thin wire to a wire 圏. The method includes the following steps: a) applying a varnish 4 to a predetermined position above the foil layer 1, b) placing a thin wire antenna on the foil layer 1, and thereby the conductive structure 2 penetrates the varnish 4 at a predetermined position, c) applying The varnish 4 is hardened, d) the module 9 and other electronic components (if necessary) are applied to the foil layer 1 so that the module 9 or the electronic component contacts the conductive structure 2, e) the foil layer 1 is covered or stacked Layered in the plastic object. With the improvement of this method, the coil antenna is -7 before step a-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page )
484102 A7 B7 五、發明說明（ 造 的 體 〇物 置顧 設塑 被等 已籤 便標 0 , 如寸 中諸尺 d 於 的 驟用小 步適當 的別相 1 恃需 層皆僅 箔法線 於方天明 著種該説 固二中之· 在該其號 非 ，符 8 構 結 孔 層電片漆具出線線組域隙 箔導晶清模射實虛模區間 (請先閱讀背面之注意事項再填寫本頁) --------線· 經濟部智慧財產局員工消費合作社印製 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）484102 A7 B7 V. Description of the invention (the body, the object, the plastic quilt, etc., have been signed and marked 0. For example, the steps in the inch are in small steps, and the appropriate phase is 1. The required layers are only foil normals. Fang Tianming writes what should be said in Gu Erzhong. In this case, the symbol 8 is a structured hole layer electric sheet lacquer with an outgoing line group domain gap foil guide crystal clear mold shooting real virtual mode interval (please read the note on the back first) Please fill in this page for more details) -------- Line · Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 8 The paper size applies to China National Standard (CNS) A4 (210 X 297 mm)