TW483081B - Optimized optical system design for endpoint detection - Google Patents

Optimized optical system design for endpoint detection Download PDF

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Publication number
TW483081B
TW483081B TW089123265A TW89123265A TW483081B TW 483081 B TW483081 B TW 483081B TW 089123265 A TW089123265 A TW 089123265A TW 89123265 A TW89123265 A TW 89123265A TW 483081 B TW483081 B TW 483081B
Authority
TW
Taiwan
Prior art keywords
wafer processing
wafer
patent application
coating
light
Prior art date
Application number
TW089123265A
Other languages
English (en)
Chinese (zh)
Inventor
Alan Charles Janos
Andre Gil Cardoso
Daniel Brian Richardson
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Application granted granted Critical
Publication of TW483081B publication Critical patent/TW483081B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW089123265A 1999-11-24 2000-11-04 Optimized optical system design for endpoint detection TW483081B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/449,338 US6547458B1 (en) 1999-11-24 1999-11-24 Optimized optical system design for endpoint detection

Publications (1)

Publication Number Publication Date
TW483081B true TW483081B (en) 2002-04-11

Family

ID=23783782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089123265A TW483081B (en) 1999-11-24 2000-11-04 Optimized optical system design for endpoint detection

Country Status (5)

Country Link
US (1) US6547458B1 (https=)
EP (1) EP1104018A3 (https=)
JP (1) JP4725873B2 (https=)
KR (1) KR20010051930A (https=)
TW (1) TW483081B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6585908B2 (en) * 2001-07-13 2003-07-01 Axcelis Technologies, Inc. Shallow angle interference process and apparatus for determining real-time etching rate
US20030215962A1 (en) * 2002-05-14 2003-11-20 Applied Materials, Inc. Integration of multiple processes within a single chamber
US6863772B2 (en) * 2002-10-09 2005-03-08 Taiwan Semiconductor Manufacturing Co., Ltd Dual-port end point window for plasma etcher
US7892357B2 (en) * 2004-01-12 2011-02-22 Axcelis Technologies, Inc. Gas distribution plate assembly for plasma reactors
US7821655B2 (en) * 2004-02-09 2010-10-26 Axcelis Technologies, Inc. In-situ absolute measurement process and apparatus for film thickness, film removal rate, and removal endpoint prediction
KR100549955B1 (ko) * 2004-07-20 2006-02-07 삼성전자주식회사 반도체 제조 설비의 식각종말점 검출장치
US7120553B2 (en) * 2004-07-22 2006-10-10 Applied Materials, Inc. Iso-reflectance wavelengths
US7479191B1 (en) 2005-04-22 2009-01-20 Novellus Systems, Inc. Method for endpointing CVD chamber cleans following ultra low-k film treatments
KR100688980B1 (ko) * 2005-07-01 2007-03-08 삼성전자주식회사 플라즈마 모니터링장치와 플라즈마 모니터링 방법
US8262800B1 (en) 2008-02-12 2012-09-11 Novellus Systems, Inc. Methods and apparatus for cleaning deposition reactors
US20110083721A1 (en) * 2008-11-20 2011-04-14 Behzad Imani Concentrating photovoltaic system
US8591659B1 (en) 2009-01-16 2013-11-26 Novellus Systems, Inc. Plasma clean method for deposition chamber
US9111729B2 (en) * 2009-12-03 2015-08-18 Lam Research Corporation Small plasma chamber systems and methods
JP2012141291A (ja) * 2010-12-16 2012-07-26 Fujifilm Corp 放射線撮影装置
KR102396143B1 (ko) 2018-02-09 2022-05-09 삼성전자주식회사 Oes 장치와 이를 포함하는 플라즈마 처리 장치, 및 반도체 장치의 제조 방법

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US4394237A (en) * 1981-07-17 1983-07-19 Bell Telephone Laboratories, Incorporated Spectroscopic monitoring of gas-solid processes
US4491499A (en) 1984-03-29 1985-01-01 At&T Technologies, Inc. Optical emission end point detector
US4695700A (en) 1984-10-22 1987-09-22 Texas Instruments Incorporated Dual detector system for determining endpoint of plasma etch process
US4675072A (en) * 1986-06-25 1987-06-23 International Business Machines Corporation Trench etch endpoint detection by LIF
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US4859277A (en) * 1988-05-03 1989-08-22 Texas Instruments Incorporated Method for measuring plasma properties in semiconductor processing
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US5097430A (en) * 1990-01-16 1992-03-17 Applied Materials, Inc. Method and apparatus for displaying process end point signal based on emission concentration within a processing chamber
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US5943130A (en) * 1996-10-21 1999-08-24 Insitec, Inc. In situ sensor for near wafer particle monitoring in semiconductor device manufacturing equipment
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
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Also Published As

Publication number Publication date
JP4725873B2 (ja) 2011-07-13
EP1104018A2 (en) 2001-05-30
EP1104018A3 (en) 2004-05-19
KR20010051930A (ko) 2001-06-25
US6547458B1 (en) 2003-04-15
JP2001210629A (ja) 2001-08-03

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