TW483075B - Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet - Google Patents

Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet Download PDF

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TW483075B
TW483075B TW089113633A TW89113633A TW483075B TW 483075 B TW483075 B TW 483075B TW 089113633 A TW089113633 A TW 089113633A TW 89113633 A TW89113633 A TW 89113633A TW 483075 B TW483075 B TW 483075B
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microchip
substrate
adhesive material
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patent application
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TW089113633A
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Wolfgang Wehl
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Ekra Eduard Kraft Gmbh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

The invention relates to a process for applying connecting materials for a connection between a microchip and a substrate, for the electrical connection an electrically conductive material and for the mechanical connection of substrate and microchip a filling material being applied to the microchip and/or the substrate. It is provided that the electrically conductive material (3) and/or the filling material (5) are squirted successively or simultaneously onto the substrate (6) and/or the microchip (1) by means of at least one printing head (9) working according to the ink-jet printing principle.

Description

483075 A7 -—_ B7_ 句_ 五、發明說明（1 ) 描述 本發明與施加黏合材料以連接微晶片與基體的方法有 關’與製造微晶片與基體間之電氣與機械連接的方法有關 ，也與依據噴墨原理動作的印刷頭之使用有關。 經濟部智慧財產局員工消費合作社印製 在微晶片與基體間施加連接的黏合材料，以及製造微 晶片與基體間此種連接的方法已是習知技術。按照習知技 術’製造此所謂的倒裝晶片連接（jr C )以及此倒裝晶片 連接所使用的黏合材料，是按照一連串不一致的製程步驟 ’ ^別7H在此種倒裝晶片連接的情況中，絕大部分的情況 是基體與微晶片間需要製造機械連接與電氣連接。就電氣 連接而言，基體及/或微晶片上具有供稍後相互連接的電 氣接點，這些電氣接點上必須提供導電的黏合材料。特別 是爲吾人所熟知的金屬焊料，按照習知技術，是以電鍍方 式施加到電氣接點。不過，也有焊糊型式的金屬焊料，是 以遮罩印刷的方式施加到接點上。之後，塗有焊糊的基體 及/或微晶片需要進行所謂的回流處理。焊料固化後，將 微曰Η片與基體相互堆疊在一起，形如二明治，動作必須小 心仔細以確保電氣接點相對面地連接在一起。因此，晶片 必須放置在基體上的正確位置。之後，由基體與微晶片所 構成的封裝必須再次加熱，以使金屬焊料再變成液態，以 得到良好的電氣連接。在很多情況，此電氣連接同時也做 爲機械連接。不過，由於基體與微晶片的熱膨脹係數不同 ’如果溫度改變，兩者會導致很小的移動，此移動會破壞 倒1¾晶片連接。基於此一理由，在焊接後，在微晶片與基 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -4 - 483075 經濟部智慧財產局員工消費合作社印製 A7 B7___ 五、發明說明（2 ) 體間會塡充一物質’也就是所謂的下方塡料（underfiller) ，此下方塡料連接基體與晶片，將兩者相互固定以防止溫 度引起的移動。在很多情況會有問題產生，特別是當電氣 連接非常多時，很難將下方塡料引入微晶片與基體間的小 間隙內。此外，也無法保證下方塡料能流滿微晶片的整個 下方，致使無法確保良好的化學連接。微晶片與基體一旦 連接構成封裝，下方塡料是否將微晶片的下方塡滿，只能 以複雜的方法測定。 本發明的目的是提供一種施加黏合材料的方法以及一 種製造微晶片與基體間電氣及機械連接的方法，這些方法 沒有上述的缺點。 此項目的藉由申請專利範圍第1項所描述的方法達成 。本方法用以施加連接微晶片與基體的黏合材料，用以電 氣連接的導電材料以及用以機械連接微晶片及/或基體的 塡充材料施加於基體及/或微晶片。按照本發明，方法的 差異在於導電材料及/或塡充材料是藉由至少一個按照噴 墨原理動作J勺印刷頭連續或同時噴到基體及/或微晶片上 。此印刷頭可將黏合材料以很精確的方式噴到任何或既定 位置。既定位置即是在基體及/或微晶片上的電氣接點， 這些接點後續要與導電材料連接。與習知技術所使用的電 鍍導電材料相較，按照本發明之方法的優點是可以非常快 速地施加導電材料。事實上，黏合材料是以液相噴出，因 此’不需要加熱基體及/或微晶片的回流製程。在習知技 術中’如果是以遮罩印刷的方法施加導電材料，絕對需要 本紙張尺@ S 家鮮（CNS)A4 娜（21G X 297 公爱)7^Z------ --------------裝--- (請先閱讀背面之注意事項頁) ^7: -線- 483075 A7 B7 五、發明說明（3 ) 此回流製程，因爲它一開始是呈糊狀，例如包括金屬焊料 的糊。 按照本發明，由於塡充材料也可施加到基體及/或微 晶片，因此，按照本發明的方法，可以避免連接後才將塡 充材料注入微晶片與基體間。此外，塡充材料無法完全充 滿微晶片下方的情況也可避免。整體而言，製程步驟減少 ’因此，製造連接的速度可以加快。 本發明的發展之一是液體的黏合材料從印刷頭呈滴狀 噴出。液滴可使黏合材料很精確地定位在基體及/或微晶 片上。它可以使複數滴噴在同一位置，以便形成較7多材料 的附著。此外，複數滴可以相互相鄰，以便提供一較大面 積的材料。在此情況，也可以使噴出的滴部分重疊。 在特定的較佳實施例中’導電材料使用金屬焊料，塡 充材料使用玻璃，焊料與玻璃呈現高溫液態以便能噴出， 特別是要使用鎔點低的玻璃與焊料。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 ---------I--I I --- * (請先閱讀背面之注意事項再頁) -丨線- 如果是使用金屬焊料，液態的輔助劑，例如助焊劑最 好也能藉由印刷頭一倂噴到基體及/或微晶片上。此可在 基體與微晶片間得到高品質的電氣連接。 在特定的較佳實施例中，使用一或多個印刷頭噴出黏 合材料。如果只使用一個印刷頭，它最好具有多個噴孔， 在此情況，一種黏合材料可以從每一個噴孔噴出。如果使 用多個印刷頭，黏合材料可以從每一個印刷頭噴出。 藉由申請專利範圍第5項所說明之製造基體與微晶片 間電氣與機械連接的步驟，也可達成本目的。首先，黏合 483075 A7 五、發明說明（4 ) --------------裝--- (請先閱讀背面之注意事項再^1^4頁) 丰才料*’亦即導電及機械黏合材料施加到基體及/或微晶片 上’黏合材料呈液態，因此，它們可藉由按照噴墨原理動 ί乍的E卩刷頭施加。接下來，特別是在所施加的黏合材料固 化後’將基體與微晶片其中之一放置到其中另一上方正確 的kS ’基體及/或微晶片的電氣接點區域已配置了導電 的1占合材料’且基體與微晶片的各個電氣接點區域相互面 ¥寸面。接下來，微晶片與基體其中之一放置於其中另一之 上所構成的封裝被加熱，以使電氣及機械黏合材料再度變 爲液態。在冷卻的過程中，易言之，當材料固化時，微晶 片與基體相互間被穩固地連接在一起。所發明之製造微晶 片與基體電氣與機械連接的方法，可以價廉、快速、及可 靠地製造倒裝晶片連接。可獲致這些優點特別是由於使用 按照噴墨原理動作的印刷頭施加黏合材料。 .線· 本發明的發展之一是使用金屬焊料做爲導電的黏合材 料’當焊料被噴出時是呈高溫液體。 經濟部智慧財產局員工消費合作社印製 本方法之典型實施例的特佳情況是當用於機械連接之 材料的物理狀態從液態改變成固態時，即在微晶片與基體 鄰接的表面上產生黏合效果。因此，與慣常不同，它不需 要等到基體與微晶片間的黏合硬化。 本發明的發展之一是提供低鎔點的玻璃做爲機械連接 的黏合材料。在玻璃固化或冷卻的過程中產生機械連接， 此爲永久性連接，且基本上避免了前述基體與微晶片間的 機械移動。 在一典型的實施例中，複數個微晶片呈晶圓的型式， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 483075 A7 五、發明說明（5 ) 此晶圓中的每一個微晶片都施加黏合材料，因此，接下來 ，可以在每一個微晶片上施加一基體，並接著被固定。不 消說，黏合材料也可在基體連接到晶圓之前施加到基體上 。一旦基體與晶圓完成連接’即可將晶圓切割成微晶片尺 寸。 此典型實施例的的特佳情況是印刷頭 ，且最好具有不同的截面尺寸，從噴孔噴 噴到基體及/或微晶片上。因此，例如， 以使用較大截面的噴嘴或出口，以便簡單 面積的連接點。 經濟部智慧財產局員工消費合作社印製 具有複數個噴孔 出的黏合材料被 機械黏合材料可 且快速地產生大 作且具有至少一 ，隔膜是藉由一 相的黏合材料， 上。由於致動器 合材料不會影響 致動器。當偏移 ’此點特別有利 倒裝晶片之黏合 --線· --------------裝--- (請先閱讀背面之注意事項再^^^頁) 本發明的目的可藉由按照噴墨原理動 個具有可偏移隔膜之媒體室的印刷頭達成 致動器產生偏移，且媒體室內含有高溫液 黏合材料從媒體室噴到基體及/或微晶片 與隔膜間熱去耦，因此，媒體室中熱的黏 致動器的功能，因爲隔膜的熱不會傳導到 隔膜的致動器是由電氣驅動的壓電元件時 。此類型的印刷頭特別可以執行上述連接 材料的施加，並用以製造倒裝晶片連接。 進一步的細節見於申請專利範圍的各子項。 以下將使用典型的實施例並參考圖式詳細解釋本發明 其中： 圖1簡單顯示微晶片的表面上已噴有黏合材料， 圖2顯示圖1的微晶片，此微晶片連接到一基體上； 483075 A7 ^ ___B7_ 五、發明說明（6 ) 以及 圖3顯示按照噴墨原理動作的印刷頭。 元件對照表 1 :微晶片 2 :電氣接點區 3:導電黏合材料 4 :側 5 :塡充材料 6 :基體 7 :封裝 8 :電氣接點區 -------------裝—— (請先閱讀背面之注意事項再頁) 訂： 經濟部智慧財產局員工消費合作社印製483075 A7 -__ B7_ sentence _ V. Description of the invention (1) The invention is related to the method of applying an adhesive material to connect the microchip and the substrate. It is related to the method of manufacturing the electrical and mechanical connection between the microchip and the substrate. The use of a print head that operates according to the inkjet principle is related. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. It is a well-known technique to apply adhesive materials for the connection between the microchip and the substrate, and the method of making such a connection between the microchip and the substrate. According to the conventional technology, 'the so-called flip chip connection (jr C) and the bonding material used for this flip chip connection are in accordance with a series of inconsistent process steps' ^ Do not 7H in the case of this type of flip chip connection In most cases, mechanical and electrical connections need to be made between the substrate and the microchip. For electrical connections, the substrate and / or microchip have electrical contacts for later interconnection, and these electrical contacts must be provided with a conductive adhesive material. In particular, the metal solder, which is well known to me, is applied to the electrical contacts by electroplating according to conventional techniques. However, there are also solder paste types of metal solder that are applied to the contacts by mask printing. Thereafter, the solder-coated substrate and / or the microchip need to be subjected to a so-called reflow process. After the solder is cured, the micro chip and the substrate are stacked on top of each other in the shape of Ermeiji. Care must be taken to ensure that the electrical contacts are connected oppositely. Therefore, the wafer must be placed in the correct position on the substrate. After that, the package composed of the base body and the microchip must be heated again to make the metal solder liquid again to obtain a good electrical connection. In many cases, this electrical connection also serves as a mechanical connection. However, because the thermal expansion coefficients of the substrate and the microchip are different, ’if the temperature changes, the two will cause a small movement, and this movement will break the 1¾ chip connection. For this reason, after welding, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied to the microchip and basic paper dimensions. -4-483075 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7___ V. Description of the invention (2) There will be a substance filled in the body, which is the so-called underfiller. This underfiller connects the substrate and the wafer and fixes the two to prevent temperature-induced movement. In many cases, problems can occur, especially when there are many electrical connections, and it is difficult to introduce the lower material into the small gap between the microchip and the substrate. In addition, there is no guarantee that the bottom material can flow over the entire underside of the microchip, making it impossible to ensure a good chemical connection. Once the microchip and the substrate are connected to form a package, whether the bottom material fills the bottom of the microchip can only be determined by a complicated method. An object of the present invention is to provide a method for applying an adhesive material and a method for manufacturing an electrical and mechanical connection between a microchip and a substrate, which methods do not have the above-mentioned disadvantages. This project was achieved by the method described in item 1 of the patent application scope. The method is used to apply an adhesive material connecting the microchip and the substrate, a conductive material for electrical connection, and a filling material for mechanically connecting the microchip and / or the substrate to the substrate and / or the microchip. According to the present invention, the method differs in that the conductive material and / or the filling material is sprayed onto the substrate and / or the microchip continuously or simultaneously by at least one print head that operates according to the inkjet principle. This print head sprays the adhesive material to any or desired location in a very precise manner. The predetermined positions are the electrical contacts on the substrate and / or the microchip, and these contacts are subsequently connected to the conductive material. The advantage of the method according to the invention is that the conductive material can be applied very quickly compared to electroplated conductive materials used in the conventional art. In fact, the bonding material is ejected in a liquid phase, so 'reflowing processes for heating the substrate and / or the microchip are not required. In the conventional technology, 'If applying conductive materials by mask printing, this paper ruler @ S 家 鲜 （CNS) A4 娜 （21G X 297 Public Love) 7 ^ Z ------- ------------ Installation --- (Please read the precautionary page on the back first) ^ 7: -line- 483075 A7 B7 V. Description of the invention (3) This reflow process, because it started at the beginning It is a paste, such as a paste including metal solder. According to the present invention, since the filling material can also be applied to the substrate and / or the microchip, the method according to the present invention can avoid injecting the filling material between the microchip and the substrate after the connection. In addition, the situation where the filling material cannot completely fill the underside of the microchip can be avoided. Overall, the number of process steps is reduced, so the speed of manufacturing connections can be increased. One of the developments of the present invention is that the liquid adhesive material is ejected from the print head in a droplet shape. The droplets allow the adhesive material to be positioned very precisely on the substrate and / or the wafer. It can spray multiple drops in the same position, so as to form more than 7 materials. In addition, multiple drops may be adjacent to each other to provide a larger area of material. In this case, the ejected droplets may be partially overlapped. In a specific preferred embodiment, the conductive material is metal solder, and the filling material is glass. The solder and glass are in a high-temperature liquid state so as to be able to be sprayed out, especially glass and solder having a low pour point are used. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs --------- I--II --- * (Please read the precautions on the back before the page)-丨 Line-If using metal solder, liquid Adjuvants, such as fluxes, are also preferably sprayed onto the substrate and / or the microchips at one stroke by the print head. This results in a high-quality electrical connection between the substrate and the microchip. In a particularly preferred embodiment, one or more print heads are used to eject the adhesive material. If only one printing head is used, it preferably has a plurality of nozzle holes, in which case an adhesive material can be ejected from each nozzle hole. If multiple print heads are used, the bonding material can be ejected from each print head. Costs can also be achieved through the steps of manufacturing the electrical and mechanical connection between the substrate and the microchip as described in item 5 of the scope of the patent application. First, glue 483075 A7. 5. Description of the invention (4) -------------- install --- (please read the precautions on the back before ^ 1 ^ 4 pages) That is, the conductive and mechanical adhesive materials are applied to the substrate and / or the microchip. The adhesive materials are in a liquid state, so they can be applied by using an E 卩 brush head that moves according to the inkjet principle. Next, especially after the applied adhesive material is cured, one of the substrate and the microchip is placed on top of the other. The correct kS substrate and / or the electrical contact area of the microchip has been configured with a conductive 1% Composite material ', and the electrical contact areas of the substrate and the microchip face each other. Next, the package formed by placing one of the microchip and the substrate on the other is heated, so that the electrical and mechanical bonding materials become liquid again. In the process of cooling, in other words, when the material is solidified, the microchip and the substrate are firmly connected to each other. The invented method for electrically and mechanically connecting a microchip to a substrate can make a flip chip connection inexpensively, quickly, and reliably. These advantages are achieved in particular due to the application of adhesive material using a print head which operates according to the inkjet principle. Line · One of the developments of the present invention is the use of metallic solder as a conductive bonding material 'when the solder is sprayed, which is a high temperature liquid. A special case of printing a typical embodiment of this method by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is when the physical state of the material used for the mechanical connection is changed from liquid to solid, i.e. adhesion occurs on the surface adjacent to the microchip and the substrate effect. Therefore, unlike usual, it does not need to wait for the adhesion between the substrate and the microchip to harden. One of the developments of the present invention is to provide glass with a low threshold as a bonding material for mechanical connection. A mechanical connection is created during the process of glass curing or cooling. This is a permanent connection and basically avoids the mechanical movement between the aforementioned substrate and the microchip. In a typical embodiment, a plurality of microchips are in the form of a wafer. The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 483075 A7. 5. Description of the invention (5) In this wafer Adhesive material is applied to each of the microchips, so, next, a substrate can be applied to each microchip and then fixed. Needless to say, the bonding material can also be applied to the substrate before the substrate is connected to the wafer. Once the substrate is connected to the wafer, the wafer can be cut to microchip size. A particularly preferred case of this exemplary embodiment is a print head, which preferably has a different cross-sectional size, and is sprayed from a nozzle onto a substrate and / or a microchip. So, for example, to use nozzles or outlets with larger cross-sections for simple area connection points. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The adhesive material with a plurality of spray holes is mechanically bonded and can quickly produce a masterpiece with at least one. The diaphragm is a one-phase adhesive material. Because the actuator and the material do not affect the actuator. When offset 'This point is particularly beneficial for the adhesion of flip-chips-lines--------------- mounting --- (Please read the precautions on the back before ^^^ page) The purpose of the invention can be achieved by moving the printing head of a media chamber with a displaceable diaphragm according to the inkjet principle, and the media chamber contains a high-temperature liquid adhesive material sprayed from the media chamber to the substrate and / or microchip Thermal decoupling from the diaphragm, therefore, the function of a hot viscous actuator in the media chamber, because the heat of the diaphragm is not conducted to the diaphragm when the actuator is an electrically driven piezoelectric element. This type of print head can particularly perform the application of the above-mentioned connection materials and is used to make flip-chip connections. Further details can be found in the various sub-items of the patent application. Hereinafter, the present invention will be explained in detail using typical embodiments and with reference to the drawings: FIG. 1 simply shows that the surface of the microchip has been sprayed with adhesive material, and FIG. 2 shows the microchip of FIG. 1, which is connected to a substrate; 483075 A7 ^ _B7_ 5. Description of the Invention (6) and Fig. 3 show a print head that operates according to the inkjet principle. Component comparison table 1: Microchip 2: Electrical contact area 3: Conductive adhesive material 4: Side 5: Filling material 6: Base body 7: Package 8: Electrical contact area ------------ -Installed-(Please read the precautions on the back and then the page) Order: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

底 孔器 的件 置開應 室 器區室元 裝的感 頭體孔膜動點體熱殼熱殻度 刷媒噴隔致接媒隔外加外溫 「一.j ··········· ·_ ··· ····· -丨線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ，9 - 483075 A7 B7 五、發明說明（7 ) 以下所描述基體與微晶片之倒裝晶片連接的製造實例 純粹只是用以說明。不用說，按照本發明的方法及/或使 用按照本發明之按照噴墨原理動作的印刷頭，也可用於其 它任何不同組件間的耐溫連接。在下文中，假設基體的材 料與微晶片的材料具有不同的熱膨脹係數，因此需要使用 塡充材料做爲機械連接。不過，如果兩材料的熱膨脹係數 非常接近或完全相同，塡充材料或可省卻，因此，在形成 基體與微晶片間之電氣連接的同時也形成機械連接。 圖1簡單顯示微晶片1 ，其上可能包括微電子及/或 微機械組件或結構（未顯示）。圖1中微晶片1的一側4 具有電氣接點區2。電氣接點區2是引自微電子電路及/ 或微機械結構的電氣端點。電氣接點區2配置有導電黏合 材料3，它構成一材料堆積。在較佳實施例中，材料堆積 或導電黏合材料3是金屬焊料，它在電氣接點區2構成塊 狀的焊料堆積。 微晶片1之一側4 (其上有電氣接點區2 )的空區基 本上全部配置塡充材料5，做爲與基體6的機械連接，如 圖2所示。施加在側4的塡充材料5同樣是滴狀，在該情 況，其配置是複數個滴相互間至少部分連接在一起或覆蓋 。塡充材料5及電氣接點區2的配置選擇爲四邊形，特別 是正方形，如圖1的典型實施例所不。不用說’如果微電 子電路或微機械結構的電氣端點有需要，可以排列成任何 其它形狀。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再 頁) 經濟部智慧財產局員工消費合作社印製 -10- 經濟部智慧財產局員工消費合作社印製 483075 A7 B7 五、發明說明（8 ) &quot;&quot;— -- 爲與基體6連接以製浩所细的柯f壯 衣迫所s目的倒裝晶片連接，配置有 導電黏合材料3及塡充材料^的n曰士你丨故^ _ u科b的微晶片倒放到基體6上的 正確位置，按此方式，具有導電黏合材料3的電氣接點區 2被正確地放置到基體6上與其匹配的電氣接點區8。由 微晶片1及基體6構成的封裝7培芙、、隹 」⑷衣〈佞者進仃吾人所熟知的回 流’特別是將導電黏合材料3及塡充材料5加熱到變爲液 態的溫度。接著冷卻封裝7以使導電黏合材料3及塡充材 料5固化，因此，一方面，電氣接點區2與基體6上配對 的電氣接點區8間形成電氣連接，另一方面，塡充材料5 在微晶片1與基體6鄰接的表面產生機械連接，以使微晶 片1與基體6機械性地相互穩固地連接在一起。 填充材料5所使用的材料，亦即機械連接的材料，當 它們的物理狀態從液體變爲固體時，易言之，是在上述回 流製程的冷卻過程中’材料即在基體6與微晶片1鄰接的 表面上產生黏著效果。爲此目的，以使用低熔點的玻璃爲 佳。 不用說’當複數個微晶片1仍結合在一起是所謂的晶 圓時’也可製造上述的倒裝晶片連接。將基體覆蓋於晶圓 上要藉由導電黏合材料3及塡充材料5固定於正確位置的 一側，接著回流製程，以完成各個連接。經由接下來的分 割作業，將各個微晶片連同它們的基體相互分開。 當然，也可以將各個獨立的基體分派給晶圓上的每一 個微晶片，且可以藉由倒裝晶片連接固定於微晶片1。 圖3說明在基體6及/或微晶片1上施加導電黏合材 :-------------裝— (請先閱讀背面之注意事項再頁) 訂·· •線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -11 - 483075 A7 __B7 五、發明說明（9 ) --------------裝--- (請先閱讀背面之注意事項再頁) 料3及塡充材料5之按照噴墨原理動作的印刷頭9。£卩_ 頭包括一媒體室1 〇，內爲導電黏合材料3或塡充材料5 。如果兩種材料都是由印刷頭9施加到基體6或微晶片丄 上’印刷頭9最好具有2個相互獨立的媒體室1 〇，或使 用兩個印刷頭9。 媒體室1 0具有一個噴孔1 1 ，黏合材料3或5從其 --線· 經濟部智慧財產局員工消費合作社印製 噴到微晶片1及/或基體6的一側4。爲此目的，媒體室 其中的一壁是由可偏移的隔膜1 2構成，因此，從噴孔 11噴出的黏合材料3或5呈滴的形狀。爲偏移隔膜12 ’印刷頭9具有一致動器1 3，它是壓電元件式設計，具 有兩個接點區用以電氣驅動，在圖3中只顯示一個接點區 1 4 °致動器1 3被電氣驅動時長度改變，致使隔膜1 2 朝媒體室之底部1 6的方向移動，或離開底部1 6，在此 情況’隔膜1 2以凸出的方式偏移。如果從媒體室1 〇中 噴出的黏合材料3或5是熱的，則需要一隔熱元件1 7以 阻止隔膜1 2與致動器1 3間的熱傳。此確保致動器1 3 的壓電動作部分保持在壓電的c u r i e溫度以下，藉以 確保致動器1 3的操作正常，易言之，保持它的長度改變 是施加之電壓的定函數，因此，從噴孔1 1噴出之滴的體 積保持固定。 很明顯，致動器1 3是裝在印刷頭9的外殼1 8內， 尾端具有接點區1 4。印刷頭9最好具有一加熱裝置1 9 ，以使媒體室1 〇中的黏合材料3或5保持在液態的適當 溫度。不過，被送入媒體室1 〇的黏合材料已是高溫的液 -12- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 483075 A7 B7 五、發明說明（1〇) 態時，也可以不使用加熱裝置1 9。 視驅動致動器1 3的方式而定，它可以噴出個別單獨 的滴，或者，在很短的時間周期內，從噴孔1 1中噴出大 量的滴。例如，爲此目的可提供電脈衝以驅動致動器1 3 。爲確保致動器1 3適當的操作溫度，也可經由外殼的開 孔2 1將冷卻媒體引入外殼內，其適當的位置是在噴孔 1 1的附近。 圖3中也顯示一溫度感應器2 2，配置在隔膜1 2不 在媒體室1 0的一側，溫度感應器偵測媒體室1 0中黏合 材料的溫度，因此，如果適當，可以據以控制加熱裝置 1 9 ，即開或關。 如果使用複數個印刷頭9 ，印刷頭9之噴孔1 1的截 面可有不同尺寸，以便能噴出不同大小的滴。如果只使用 一個具有多個媒體室1 〇的印刷頭，不用說.，噴孔也可有 不同的截面大小。 1--I I I I I · I I (請先閱讀背面之注意事項再^||^本頁) . .線- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13-The parts of the bottom hole device are installed in the sensor body hole chamber, the sensor body hole film, the moving point body, the hot shell, the hot shell degree, the brush media, the spray media, the external temperature, and the external temperature. ··· · _ · · · · · · · ·-·· This paper size applies to China National Standard (CNS) A4 (210 X 297 mm), 9-483075 A7 B7 V. Description of the invention (7) The manufacturing example of the flip chip connection between the substrate and the microchip described below is purely for illustration. Needless to say, the method according to the present invention and / or the use of a printing head that operates according to the inkjet principle according to the present invention can also be used for other Temperature-resistant connection between any different components. In the following, it is assumed that the material of the substrate and the material of the microchip have different thermal expansion coefficients, so the filling material needs to be used as a mechanical connection. However, if the thermal expansion coefficients of the two materials are very close or complete Similarly, the filling material may be omitted, so the mechanical connection is formed at the same time as the electrical connection between the substrate and the microchip. Figure 1 shows a microchip 1 briefly, which may include microelectronics and / or micromechanical components or structures. ( (Not shown). One side 4 of the microchip 1 in FIG. 1 has an electrical contact area 2. The electrical contact area 2 is an electrical terminal derived from a microelectronic circuit and / or micromechanical structure. The electrical contact area 2 is configured with The conductive adhesive material 3 constitutes a material deposit. In a preferred embodiment, the material deposit or the conductive adhesive material 3 is a metallic solder which forms a block-like solder deposit in the electrical contact area 2. One side 4 of the microchip 1 The empty area (on which there is an electrical contact area 2) is basically all equipped with the filling material 5 as a mechanical connection with the base 6, as shown in Figure 2. The filling material 5 applied to the side 4 is also in a drop shape. In this case, the configuration is that a plurality of drops are at least partially connected or covered with each other. The configuration of the filling material 5 and the electrical contact area 2 is selected to be a quadrangle, especially a square, as shown in the typical embodiment of FIG. . Needless to say, if the electrical end points of the microelectronic circuit or micromechanical structure are needed, they can be arranged in any other shape. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (please read the back first) (Notes on page 2) Economy Printed by the Consumer Property Cooperative of the Intellectual Property Bureau-10- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 483075 A7 B7 V. Description of the Invention (8) f Zhuangyi forced flip chip connection, the conductive adhesive material 3 and the filling material ^ n said you 丨 so ^ _ u Branch b's microchip is inverted to the correct position on the substrate 6, click here By way of example, the electric contact area 2 with the conductive adhesive material 3 is correctly placed on the base 6 to match with the electric contact area 8. The package 7 composed of the microchip 1 and the base 6 is made of Puff, 隹 隹 衣 < The person who enters into the reflow which is well known to the people, in particular, heats the conductive adhesive material 3 and the filling material 5 to a temperature at which they become liquid. Then, the package 7 is cooled to solidify the conductive adhesive material 3 and the filling material 5. Therefore, on the one hand, the electrical contact area 2 and the mating electrical contact area 8 on the base body 6 form an electrical connection. On the other hand, the filling material 5 A mechanical connection is created on the surface adjacent to the microchip 1 and the base body 6 so that the microchip 1 and the base body 6 are mechanically and firmly connected to each other. The material used for the filling material 5, that is, the material for mechanical connection, when their physical state changes from liquid to solid, in other words, during the cooling process of the above-mentioned reflow process, the 'material is in the substrate 6 and the microchip 1 Adhesive effects occur on adjacent surfaces. For this purpose, it is preferable to use glass with a low melting point. Needless to say, "when a plurality of microchips 1 are still bonded together is a so-called wafer", the above-mentioned flip-chip connection can also be manufactured. The substrate is covered on the wafer by the conductive adhesive material 3 and the filling material 5 and fixed on one side, and then the reflow process is performed to complete each connection. Through the subsequent singulation operation, the individual microchips and their substrates are separated from each other. Of course, it is also possible to assign each independent substrate to each microchip on the wafer, and it can be fixed to the microchip 1 by flip chip connection. Figure 3 illustrates the application of a conductive adhesive on the substrate 6 and / or the microchip 1: ------------- installation-(Please read the precautions on the back before the page) This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -11-483075 A7 __B7 V. Description of the invention (9) -------------- Package ----- (Please read the precautions on the back first, and then the page) The print head 9 that operates on the principle of inkjet for material 3 and filling material 5. The head includes a media chamber 10, which contains a conductive adhesive material 3 or a filling material 5. If both materials are applied to the substrate 6 or the microchip 或 by the print head 9, the print head 9 preferably has two independent media chambers 10, or two print heads 9 are used. The media room 10 has a spray hole 1 1 from which the adhesive material 3 or 5 is printed. It is printed on the consumer chip of the Intellectual Property Bureau of the Ministry of Economic Affairs and sprayed onto one side 4 of the microchip 1 and / or the substrate 6. For this purpose, one of the walls of the media chamber is constituted by a displaceable diaphragm 12 so that the adhesive material 3 or 5 ejected from the nozzle hole 11 has a drop shape. To offset the diaphragm 12 'the print head 9 has an actuator 1 3, which is a piezo-element design with two contact areas for electrical drive. Only one contact area is shown in FIG. When the device 13 is electrically driven, the length changes, causing the diaphragm 1 2 to move toward or away from the bottom 16 of the media chamber. In this case, the 'diaphragm 12' is displaced in a convex manner. If the adhesive material 3 or 5 ejected from the media chamber 10 is hot, a heat insulating element 17 is required to prevent heat transfer between the diaphragm 12 and the actuator 13. This ensures that the piezoelectric action part of the actuator 1 3 is kept below the piezoelectric curie temperature, thereby ensuring that the operation of the actuator 1 3 is normal. In other words, keeping its length change is a constant function of the applied voltage, so The volume of the droplets ejected from the nozzle holes 11 remains fixed. It is clear that the actuator 13 is housed in the housing 18 of the print head 9 and has a contact area 14 at the tail end. The print head 9 preferably has a heating device 19 to keep the adhesive material 3 or 5 in the media chamber 10 at a suitable temperature in the liquid state. However, the adhesive material sent to the media room 10 is already a high-temperature liquid-12- This paper is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 483075 A7 B7 V. Description of the invention (1〇) In the state, the heating device 19 may not be used. Depending on how the actuator 13 is driven, it can eject individual drops, or, in a short period of time, a large number of droplets can be ejected from the ejection holes 11. For example, electrical pulses may be provided for this purpose to drive the actuator 1 3. To ensure the proper operating temperature of the actuator 13, the cooling medium can also be introduced into the housing through the opening 21 of the housing, and its proper position is near the spray hole 11. Figure 3 also shows a temperature sensor 22, which is located on the side of the diaphragm 12 that is not in the media chamber 10. The temperature sensor detects the temperature of the bonding material in the media chamber 10, so if appropriate, it can be controlled accordingly The heating device 19 is turned on or off. If a plurality of print heads 9 are used, the cross-sections of the nozzle holes 11 of the print head 9 may have different sizes so as to be able to eject drops of different sizes. If only one print head with multiple media chambers 10 is used, needless to say, the nozzle holes can also have different cross-sectional sizes. 1--IIIII · II (please read the precautions on the back before ^ || ^ this page) ..-Printed on paper standards of the Ministry of Economic Affairs, Intellectual Property Bureau, Employees' Cooperatives, this paper applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) -13-

Claims (1)

483075 六、申請專利範圍 附件一： 曰 修正483075 VI. Scope of Patent Application Annex 1: Revision 經濟部智慧財產局員工消費合作社印製 第8 9 1 1 3 6 3 3號專利申請案 中文申請專利範圍修正本 民國.9 1年1月修正 1 · 一種施加連接微晶片與基體之黏合材料的方法， 在微μ片及/或基體上施加用於電氣連接的導電材料以及 用於機械連接基體與微晶片的塡充材料，其特徵在於，導 電黏合材料（3)及，或塡充材料（5 )目由至少一個按 照噴墨原理動作的印刷頭（9 )連續地或同時地噴到基體 (6 )及/或微晶片（· 1 )。 2.如申請專利範圍第1項的方法，其中從印刷頭（ 9 )噴出的液態黏合材料（3、5 )是呈滴狀。 3 ·如申請專利範圍第1項或第2項的方法，其中輔 助液體，例如助焊劑，藉由印刷頭（9 )〜同噴到基體（ 6 )及/或微晶片（1 )上用以連接。 4 ·如申請專利範圍第1項或第2項的方法，其中使 用一個或多個印刷頭（9 )噴出黏合材料（3、5 )。 5 ·如申§靑專利範圍第1項或第2項的方法，其中導 電黏合材料（3 )使用金屬焊料，塡充材料（5 )使用玻 璃’金屬焊料與玻璃呈高溫液狀以便噴出。 6 · —種用以在微晶片與基體間製造電氣及機械連接 的方法，其步驟如下： -藉由按照噴墨原理動作的印刷頭（Q丨將導電黏合 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) •裝_ 絲 483075 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 ___D8 申請專利範圍 材料（.3 )與可做爲機械連接的黏合材料（5 )施 體（1 )及/或微晶片（6 ); -基體（6 )與微晶片（1 )其中之一定位於 上方的正確位置，微晶片（1 )的電氣接點區（2 體（6 )的電氣接點區（8 )上配置有導電黏合材 、5 ) ’且微晶片（1 )上的電氣接點區（2 )分 體（6 )上匹配的電氣接點區（8 )相互面對，以及 -接著’加熱由微晶片（1 )與基體（6 )其 覆於另一個之上所構成的封裝（7 )，以使電氣及 合材料（3、5 )再度變爲液體。 7 ·如申請專利範圍第6項的方法，其中導電 料（3 )是使用金屬焊料。 8 ·如申請專利範圍第6或7項的方法，其中 接所使用的黏合材料（5 )，當它的物理狀態從液 成固體時，即在基體（6 )與微晶片（1 )鄰接的 產生黏合效果。 9 .如申請專利範圍第6或7項的方法，其中 接所使用的黏合材料（5 )，以低熔點的玻璃爲佳。 1 0 ·如申請專利範圍第6或7項的方法，其 個微晶片（1 )呈一晶圓型態，每一個微晶片（1 接到基體（6 )。 1 1 ·如申請專利範圍第6或7項的方法，其 頭（9).具有複數個噴孔（11)，以具有不同之 小爲佳，黏合材料（3、5 )從噴孔噴到基體（6 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -2 - 加到基 另一個 )及基 料（3 別與基 中之一 機’械黏 黏合材 機械連 體改變 表面上 機械連 中複數 )被連 中印刷 截面大 )及/ (請先閱讀背面之注意事項再填寫本頁) 483075 A8 B8 C8 D8 ____ — ^、申請專利乾圍 或微晶片（1)上。 1 2 · —種按照噴墨原理動作的印刷頭（9 ) ’它具 有至少一個具有可偏移之隔膜（1 2 )的媒體室（1 〇 ) ，隔膜（1 2 )藉由致動器（1 3 )偏移，致動器（1 3 )與隔膜（1 2 )間熱去耦，且媒體室（1 0 )內含要被 施加於基體（6 )及/或微晶片（1 )之高溫液相的黏合 材料（3、5 )。 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂 錄' 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs No. 8 9 1 1 3 6 3 3 Chinese Patent Application Amendment Scope of the Republic of China. 9 Amendment in January 1 · An application of an adhesive material connecting the microchip and the substrate A method in which a conductive material for electrical connection and a filling material for mechanically connecting the base and the microchip are applied to the micro-chip and / or the substrate, characterized in that the conductive adhesive material (3) and the filling material ( 5) At least one print head (9) which operates according to the inkjet principle is sprayed onto the substrate (6) and / or the microchip (· 1) continuously or simultaneously. 2. The method according to item 1 of the scope of patent application, wherein the liquid adhesive material (3, 5) ejected from the print head (9) is in a drop shape. 3. The method according to item 1 or item 2 of the patent application range, wherein the auxiliary liquid, such as a flux, is sprayed onto the substrate (6) and / or the microchip (1) by the printing head (9) ~ connection. 4. The method according to item 1 or 2 of the scope of patent application, wherein the adhesive material (3, 5) is ejected using one or more print heads (9). 5. The method of claim 1 or item 2 of the patent scope, wherein the conductive adhesive material (3) uses metal solder, and the filling material (5) uses glass' metal solder and the glass is in a high temperature liquid state for spraying. 6 · —A method for making electrical and mechanical connections between a microchip and a substrate, the steps are as follows:-By using a print head (Q 丨 which is conductively bonded to the paper according to the principle of inkjet), the paper size applies the Chinese national standard (CNS ) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page) • Packing _ Silk 483075 Printed by A8 B8 C8 ___D8 Patent Scope Materials (.3) and applicable materials As the adhesive material (5) for the mechanical connection, the donor (1) and / or the microchip (6);-one of the substrate (6) and the microchip (1) is positioned in the correct position above, the microchip (1) Electrical contact area (2 body (6), electrical contact area (8) is provided with a conductive adhesive, 5) ', and electrical contact area (2) on the microchip (1) is matched on the split (6) The electrical contact areas (8) face each other, and then-the package (7) formed by the microchip (1) and the base (6) overlying one another is heated to make the electrical and composite materials ( 3, 5) becomes liquid again. 7 · As in the 6th of the scope of patent application Method, in which the conductive material (3) is a metal solder. 8 · The method according to item 6 or 7 of the patent application scope, wherein the used bonding material (5) is used when its physical state changes from liquid to solid, ie Adhesive effect occurs when the substrate (6) is adjacent to the microchip (1). 9. For example, the method of item 6 or 7 of the scope of patent application, wherein the adhesive material (5) used is preferably a low melting glass. 10 · If the method of the patent application scope item 6 or 7, the microchips (1) are in the form of a wafer, and each microchip (1 is connected to the substrate (6). 1 1 Method 6 or 7, the head (9). Has a plurality of nozzle holes (11), preferably with different sizes, the adhesive material (3, 5) is sprayed from the nozzle holes to the substrate (6 paper standards for China National Standard (CNS) A4 specification (210X 297 mm) -2-added to the base) and the base material (3 mechanical joints with mechanical bonding of one of the bases to change the number of mechanical links on the surface) are Lianzhong printing section is large) and / (Please read the precautions on the back before filling this page) 48307 5 A8 B8 C8 D8 ____ — ^, apply for a patent or a microchip (1). 1 2 · — a printing head (9) that operates according to the principle of inkjet 'It has at least one diaphragm (1 2) the media chamber (1 0), the diaphragm (1 2) is offset by the actuator (1 3), the actuator (1 3) and the diaphragm (1 2) are thermally decoupled, and the media chamber (1 0) contains a high-temperature liquid phase adhesive material (3, 5) to be applied to the substrate (6) and / or the microchip (1). (Please read the precautions on the back before filling out this page) Binding and ordering 'Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X297 mm)
TW089113633A 1999-07-06 2000-07-31 Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet TW483075B (en)

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US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus

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WO2001003183A3 (en) 2001-05-25

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