AU6432500A - Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing principle - Google Patents
Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing principleInfo
- Publication number
- AU6432500A AU6432500A AU64325/00A AU6432500A AU6432500A AU 6432500 A AU6432500 A AU 6432500A AU 64325/00 A AU64325/00 A AU 64325/00A AU 6432500 A AU6432500 A AU 6432500A AU 6432500 A AU6432500 A AU 6432500A
- Authority
- AU
- Australia
- Prior art keywords
- microchip
- substrate
- utilization
- producing
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19931113 | 1999-07-06 | ||
DE19931113A DE19931113A1 (en) | 1999-07-06 | 1999-07-06 | Method for applying connecting materials for a connection between a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and use of a printhead which works according to the ink printing principle |
PCT/EP2000/006406 WO2001003183A2 (en) | 1999-07-06 | 2000-07-06 | Method for applying connecting materials for connecting a microchip and a substrate and utilization of a printing head working according to the ink printing principle |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6432500A true AU6432500A (en) | 2001-01-22 |
Family
ID=7913787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU64325/00A Abandoned AU6432500A (en) | 1999-07-06 | 2000-07-06 | Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing principle |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU6432500A (en) |
DE (1) | DE19931113A1 (en) |
TW (1) | TW483075B (en) |
WO (1) | WO2001003183A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10141753A1 (en) * | 2001-08-29 | 2003-03-20 | Orga Kartensysteme Gmbh | Method for installing electronic component on support structure, involves using face-down technology |
US7997288B2 (en) | 2002-09-30 | 2011-08-16 | Lam Research Corporation | Single phase proximity head having a controlled meniscus for treating a substrate |
US7675000B2 (en) | 2003-06-24 | 2010-03-09 | Lam Research Corporation | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
WO2005087497A2 (en) * | 2004-03-12 | 2005-09-22 | Siemens Aktiengesellschaft | 3d-ink jet structuring of highly topographic surfaces |
US7354794B2 (en) | 2005-02-18 | 2008-04-08 | Lexmark International, Inc. | Printed conductive connectors |
US7928366B2 (en) | 2006-10-06 | 2011-04-19 | Lam Research Corporation | Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access |
US8146902B2 (en) | 2006-12-21 | 2012-04-03 | Lam Research Corporation | Hybrid composite wafer carrier for wet clean equipment |
US8464736B1 (en) | 2007-03-30 | 2013-06-18 | Lam Research Corporation | Reclaim chemistry |
US8141566B2 (en) | 2007-06-19 | 2012-03-27 | Lam Research Corporation | System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3107079A1 (en) * | 1981-02-25 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Partial coating of contact components with noble metals |
DE3637631C1 (en) * | 1986-11-05 | 1987-08-20 | Philips Patentverwaltung | Process for applying small amounts of molten, drop-shaped solder from a nozzle to surfaces to be wetted and device for carrying out the process |
DE3910201A1 (en) * | 1989-03-30 | 1990-10-04 | Asea Brown Boveri | Bonding device |
US5152456A (en) * | 1989-12-12 | 1992-10-06 | Bespak, Plc | Dispensing apparatus having a perforate outlet member and a vibrating device |
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
US5415679A (en) * | 1994-06-20 | 1995-05-16 | Microfab Technologies, Inc. | Methods and apparatus for forming microdroplets of liquids at elevated temperatures |
US5560543A (en) * | 1994-09-19 | 1996-10-01 | Board Of Regents, The University Of Texas System | Heat-resistant broad-bandwidth liquid droplet generators |
US5783867A (en) * | 1995-11-06 | 1998-07-21 | Ford Motor Company | Repairable flip-chip undercoating assembly and method and material for same |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
-
1999
- 1999-07-06 DE DE19931113A patent/DE19931113A1/en not_active Withdrawn
-
2000
- 2000-07-06 WO PCT/EP2000/006406 patent/WO2001003183A2/en active Application Filing
- 2000-07-06 AU AU64325/00A patent/AU6432500A/en not_active Abandoned
- 2000-07-31 TW TW089113633A patent/TW483075B/en active
Also Published As
Publication number | Publication date |
---|---|
DE19931113A1 (en) | 2001-01-25 |
WO2001003183A3 (en) | 2001-05-25 |
TW483075B (en) | 2002-04-11 |
WO2001003183A2 (en) | 2001-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001289869A1 (en) | Data carrier, method for the production thereof and gravure printing plate | |
AUPQ633200A0 (en) | Process and solution for providing a conversion coating on a metallic surface I | |
AU2002354401A1 (en) | Aqueous coating composition for wide format ink jet recording material | |
AU2002236023A1 (en) | Formulation for depositing a material on a substrate using ink jet printing | |
HK1045126A1 (en) | High speed embossing and adhesive printing process. | |
AU2003207354A1 (en) | Ink-jet printing process and ink-jet inks used therein | |
AU6432500A (en) | Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing principle | |
EG23434A (en) | Improved high speed embossing and adhesive printing process. | |
AU2002356980A1 (en) | Method for simultaneously imprinting a pattern and bonding cellulose webs using ultrasonic energy | |
AU1153101A (en) | A printing ink | |
AU2003290431A1 (en) | Substrate for ink jet head, ink jet head using the same, and manufacturing method thereof | |
AU2003295234A1 (en) | Substrate for ink jet head, ink jet head utilizing the same and producing method therefor | |
AU2501801A (en) | Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer | |
WO2003039879A3 (en) | Printing specific print zones using a print head shuttle assembly | |
AU2002300097A1 (en) | Novel electrode patterns for piezo-electric ink jet printer | |
GB2362605B (en) | A process of digitally printing on a substrate using an inkjettable paint, an inkjettable paint composition and a method of forming a paint composition | |
AUPQ417399A0 (en) | Intaglio printing inks | |
AU2002223671A1 (en) | Method for generating a coating on a substrate | |
AU8299298A (en) | Method for applying a color-plus-clear composite coating to substrate | |
AU2003292991A1 (en) | Printing blanket assembly for a blanket cylinder and method for producing said printing blanket assembly | |
AU2003292990A1 (en) | Printing blanket assembly for a blanket cylinder and method for producing the same | |
AU1103901A (en) | Method for manufacturing an ink reservoir for an inkjet printer | |
AU6028000A (en) | Method for the formation of pixel elements and print head and inkjet printing device for application of the method | |
AU2001260060A1 (en) | Method for the production of printed structures, screen printing machine, screenprinting doctor blade and surface printed with structures | |
AU2001285902A1 (en) | Method for producing a solid electrolyte layer on a substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |