TW480741B - Method to produce an opto-electronic component with lens - Google Patents
Method to produce an opto-electronic component with lens Download PDFInfo
- Publication number
- TW480741B TW480741B TW089117061A TW89117061A TW480741B TW 480741 B TW480741 B TW 480741B TW 089117061 A TW089117061 A TW 089117061A TW 89117061 A TW89117061 A TW 89117061A TW 480741 B TW480741 B TW 480741B
- Authority
- TW
- Taiwan
- Prior art keywords
- notch
- recess
- optical element
- substance
- lens
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000005693 optoelectronics Effects 0.000 title description 5
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000000126 substance Substances 0.000 claims description 20
- 238000005266 casting Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 16
- 239000004065 semiconductor Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1999140319 DE19940319B4 (de) | 1999-08-25 | 1999-08-25 | Verfahren zum spannungsarmen Aufsetzen einer Linse auf ein oberflächenmontierbares optoelektronisches Bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW480741B true TW480741B (en) | 2002-03-21 |
Family
ID=7919563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089117061A TW480741B (en) | 1999-08-25 | 2000-08-24 | Method to produce an opto-electronic component with lens |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19940319B4 (fr) |
| TW (1) | TW480741B (fr) |
| WO (1) | WO2001015242A1 (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10329081A1 (de) * | 2003-05-30 | 2004-12-30 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
| EP1484802B1 (fr) * | 2003-06-06 | 2018-06-13 | Stanley Electric Co., Ltd. | Composant optique semi-conducteur |
| US7517728B2 (en) | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| US7279346B2 (en) | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
| US7326583B2 (en) | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
| DE102004028350A1 (de) * | 2004-06-11 | 2006-01-12 | Marquardt Gmbh | Härtung von Vergußmassen |
| US7939842B2 (en) | 2005-01-27 | 2011-05-10 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
| US7646035B2 (en) | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
| US8835952B2 (en) | 2005-08-04 | 2014-09-16 | Cree, Inc. | Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants |
| US7808013B2 (en) | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
| DE102012101573B3 (de) * | 2012-02-27 | 2013-05-08 | Sick Ag | Reflektor für einen optoelektronischen Sensor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2593930B1 (fr) * | 1986-01-24 | 1989-11-24 | Radiotechnique Compelec | Dispositif opto-electronique pour montage en surface |
| DE58909875D1 (de) * | 1989-05-31 | 2000-08-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
| JPH0343750U (fr) * | 1989-09-04 | 1991-04-24 | ||
| DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
| DE19705303C2 (de) * | 1996-02-16 | 2002-11-21 | Karlsruhe Forschzent | Verfahren zur Herstellung von Klein- und Mikroteilen |
| DE19608667C2 (de) * | 1996-03-06 | 2001-02-15 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Einrichtung zur Abformung eines Mikrostruktursubstrates |
| US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
| DE19746893B4 (de) * | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung |
| DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
-
1999
- 1999-08-25 DE DE1999140319 patent/DE19940319B4/de not_active Expired - Lifetime
-
2000
- 2000-08-18 WO PCT/DE2000/002795 patent/WO2001015242A1/fr active Application Filing
- 2000-08-24 TW TW089117061A patent/TW480741B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001015242A1 (fr) | 2001-03-01 |
| DE19940319B4 (de) | 2004-10-14 |
| DE19940319A1 (de) | 2001-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |