經濟部智慧財產局員工消費合作社印製 480218 A7 B7 五、發明說明（1 ) 發明領域與背景 本發明是關於一種用以施加焊接劑於例如印刷電路板 上之絲網印禪用刮板。 精緻的電子裝置已經需要大規模的元件的整合在印刷 電路板。更大規模的元件整合於小而精緻的裝置，這將更 加地增加可靠焊接劑黏貼之需求。 適當焊接劑的數量在電路零組件上的應用，除了可靠 的、焊接劑，需要如施加焊接劑於絲網印刷的工具之高可靠 性的刮板。 用於絲網印刷的刮板區分爲製造白硬質橡膠之聚尿橡 膠刮板，刮板製造自聚尿橡膠與金屬之複合刮板，等等。 藉由一已知刮板施加焊接劑在印刷電路板之問題被談 論於圖1 A和1 B。 一硬式橡膠刮板1 0移動於箭頭方向倒入焊接劑1 3 到電路板1 2上。經過金屬遮罩1 1的窗口 1 1 a ，如顯 示在圖1 A。 大型積體電路所使用的焊接劑1 3的數量愈大，金屬 遮面罩1 1上不可避免地形成愈大的窗口 1 1 a。 用於具有大型積體電路之電子裝置之焊接劑處理過程 需要精密的技巧。這是因爲部份的焊接劑1 3已經應用是 容易地磨擦離開這橡膠刮板1 〇的邊緣經過如此一個大的 窗口，如顯示於圖1 B。這導致不令人滿意的焊接劑的數 量應用在這電路板。如此不令人滿意的焊接劑數量將導致 電路板品質的降低同時也減少產率。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) --------------------訂---------線^ (請先閱讀背面之注意事項再填寫本頁) -4- 480218 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（2 ) 在另一方面，假如焊接劑1 3在刮板1 0上的壓力是 低到足以克服如此問題，這亦導致不令人滿意的焊接劑的 數量施加在電路板上，特別地用於具有細間距的電氣零組. 件。 發明槪述 本發明之目的爲提供一個刮板爲絲網印刷其提供可靠 的焊接劑應用爲電路板以任何尺度的元件的整合。 本發明提供一個刮板爲絲網印刷具備金屬製的刃在那 上面形成潤濕作爲應用焊接劑在電路板。 圖示簡單說明 圖1 A，1 B舉例說明使用一習用刮板之焊接劑應用 處理過程； 圖2是根據本發明的刮板的透視圖； 圖3是顯示於圖2之刮板金屬片的擴大平面圖； 圖4是根據本發明舉例明應用焊接劑的一階段處理過 程之擴大平面圖；及 圖5 A，5 B和5 C根據本發明更進一步舉例說明焊 接劑應用。 主要元件對照表 1 刮板 2 金屬遮罩 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) -5- 480218 A7 B7 窗口 片表面 〇 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4 較佳實施例之詳細說明 根據本發明之較佳實施例將被敘述於所附之圖式。 如圖2所示，根據本發明之刮板1 5是配置有金屬片 2 0，其藉由螺釘5 0固著在具有板4 0之夾持具3 0上 。此金屬片2 0是製造自彈性板，諸如：〇 · 2 5 Μ Μ — 厚 S U S 3 Ο 4。 經由一個化學的流程，諸如，光學-鈾刻，金屬片 2〇被形成具有精細的凹部2 1在一個刃表面2 0 a上， 如圖3和4所示。凹部2 1的直徑與深度分別地較佳是 1 5 0 v m，和5 // m到1 0 // m。凹部2 1是系統地配 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公爱） -6- 480218 A7 ___________ B7 五、發明說明（4 ) 置有例如2 5 0 // m的間距，如圖3所示。 (請先閱讀背面之注意事項再填寫本頁) 使用本發明之焊接劑6 〇較佳是由混合以1 〇 %的助 熔劑8 0之金屬微粒7 0構成。金屬微粒7 0較佳是SN 一 PB共融合金於直徑1 5#m到50//m，或者SN -PB — B I 8或SN — PB — B I L3的合金於直徑25 V m到4 5 // m。焊接劑6 0的黏度較佳2 0 0 土 5 0 Pa-C·或者22〇±30Pa.C·，經由在JIS 一Z3284標準下之實驗獲得。 每一凹部2 1的深度較佳地是小於每一金屬微粒7 0 的直徑。 闡明於圖4同時也於圖5 A到5 C是施加焊接劑6 0 流程，此焊接劑是由金屬微粒7 0所組成，其是經由使用 刮板1 5，1 5 # m到5 ◦ // m混合以1 〇 W T % —助熔 劑之80的共融合金SN — PB具有200±50Pa · C ·的黏度。 金屬片2 0移動以施加焊接劑6 0，其在片表面 2〇a上配置於金屬遮罩1 1的窗口 1 1 a上，，以焊接 劑6 0充塡此窗口。 經濟部智慧財產局員工消費合作社印製 如詳細地顯示在圖5 A，金屬片2 0於這箭頭方向F 移動，使金屬微粒7 0滾動於片表面2 0 a及形成於上的 凹部2 1。於金屬片2 0移動的當時，一些金屬微粒7 0 被深藏於凹部2 1，然而其他微粒7 0滾動於片表面 2 0 a上以局限凹部2 1中之先前金屬微粒。這將導致移 動時金屬微粒之間的速率不均衡。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 480218 A7 B7 五、發明說明（5 ) 不均衡狀態，亦即，由於凹部2 1的存在促成搖溶現 象所造成之金屬微粒7 0間之速率不均衡，其將促進焊接 劑6 0中助溶劑8 0的柔軟度。 金屬助熔劑8 0而成之混合焊接劑6 0被改變從一個 不溶的膠體到一個可溶的膠體以軟化助熔劑8 0，其增進 焊接劑6 0於片表面2 0 a上之流動性。 當刮板1 5移動時，金屬微粒7 0如此平滑地滾動於 片表面2 0 a上。然後是將金屬遮罩1 1的窗口 1 1 a充 滿以足夠的焊接劑6 0，如圖5 B中所示。 當焊接劑應用處理過程被完成，如圖5 C中顯示，焊 接劑往下移動至電路板1 2，此焊接劑6 0具備如窗口 1 1 a的相同形狀。 四氟乙烯樹脂塗覆於片表面2 0 a，將增加焊接劑 6 0在片表面2 0 a上的流動性和刮板1 5的可使用性。 此樹脂較佳是聚四氟乙烯（PTFE)。 如上所揭露，刮板1 5具有形成在片表面2 0 a上之 微細凹部2 1，提供焊接劑6 0相同於金屬遮罩1 1之厚 度，無需刮掉焊接劑，即使在電路板之上具有以細微的間 距配置的電子零組件。 凹部2 1的尺寸和焊.接劑6 0的金屬微粒7 0的外形 並不限於以上所述，然而視狀況需要而定。 如上所揭露，依據本發明形成在整個片表面上之具有 微細凹部之刮板，達成焊接劑的金屬微粒在刀表面上之平 滑滾動。此刮板的高度使用性將提供電路板高度品質。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂---------線^^-· (請先閱讀背面之注意事項再填寫本頁) -8 -Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 480218 A7 B7 V. Description of the Invention (1) Field and Background of the Invention The present invention relates to a screen printing squeegee for applying solder to, for example, a printed circuit board. Delicate electronic devices already require large-scale component integration on printed circuit boards. Larger-scale components are integrated into small and delicate devices, which will increase the need for reliable solder paste adhesion. The application of the proper amount of solder on circuit components, in addition to reliable, solder, requires highly reliable scrapers such as applying solder to screen printing tools. The squeegee used for screen printing is divided into a polyurethane rubber squeegee for manufacturing white hard rubber, a squeegee manufactured from a composite squeegee for polyurethane rubber and metal, and the like. The problem of applying solder to a printed circuit board by a known squeegee is discussed in Figs. 1A and 1B. A hard rubber scraper 10 moves in the direction of the arrow and pours solder 1 3 onto the circuit board 12. The window 1 1 a through the metal mask 11 is as shown in Fig. 1A. The larger the amount of soldering flux 1 3 used in the large-scale integrated circuit, the larger the window 1 1 a inevitably formed on the metal mask 1 1. Soldering processes for electronic devices with large integrated circuits require sophisticated skills. This is because part of the solder 13 has been applied and it is easy to rub off the edge of the rubber scraper 10 through such a large window, as shown in Figure 1B. This results in an unsatisfactory amount of solder being applied to the circuit board. Such an unsatisfactory amount of solder will result in a reduction in the quality of the circuit board and a reduction in yield. This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 g t) -------------------- Order --------- line ^ (Please read the precautions on the back before filling this page) -4- 218218 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (2) On the other hand, if the solder flux 1 3 is on the scraper The pressure on 10 is low enough to overcome such a problem, which also results in an unsatisfactory amount of solder being applied to the circuit board, especially for electrical components with fine pitch. SUMMARY OF THE INVENTION The object of the present invention is to provide a squeegee for screen printing which provides reliable soldering applications for the integration of components of any size on a circuit board. The present invention provides a squeegee for screen printing, which is provided with a metal blade to form a wetting thereon as a solder paste applied to a circuit board. 1A and 1B illustrate the application process of a flux using a conventional scraper; FIG. 2 is a perspective view of a scraper according to the present invention; FIG. 3 is a view of the scraper metal sheet shown in FIG. 2 Enlarged plan view; FIG. 4 is an enlarged plan view illustrating a one-stage process of applying a flux according to the present invention; and FIGS. 5 A, 5 B, and 5 C further illustrate the application of flux according to the present invention. Comparison table of main components 1 Scraper 2 Metal mask This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -------------------- Order --------- (Please read the precautions on the back before filling this page) -5- 480218 A7 B7 Window surface 〇 (Please read the precautions on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs Detailed description of the preferred embodiment printed by the Bureau's Consumer Cooperative 4 A preferred embodiment according to the present invention will be described in the accompanying drawings. As shown in FIG. 2, the squeegee 15 according to the present invention is configured with a metal sheet 20, which is fixed to a holder 30 having a plate 40 by screws 50. This metal sheet 20 is manufactured from an elastic plate, such as: 0 · 25 Μ Μ — thick S U S 3 〇 4. Through a chemical process, such as optical-uranium engraving, the metal sheet 20 is formed with fine recesses 21 on a blade surface 20 a, as shown in FIGS. 3 and 4. The diameter and depth of the recesses 21 are preferably 1 50 v m, and 5 // m to 1 0 // m, respectively. The recess 21 is systematically configured with this paper. The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (21〇x 297 public love) -6- 480218 A7 ___________ B7 V. Description of the invention (4) For example, 2 5 0 // m Pitch, as shown in Figure 3. (Please read the precautions on the back before filling this page) The soldering flux 60 used in the present invention is preferably composed of metal particles 70 mixed with 10% flux 80. Metal particles 70 are preferably SN-PB co-fusion gold at a diameter of 15 # m to 50 // m, or SN-PB — BI 8 or SN — PB — BI L3 alloy at a diameter of 25 V m to 4 5 / / m. The viscosity of the solder 60 is preferably 200 to 50 Pa-C · or 22 ± 30 Pa.C ·, which is obtained through experiments under the JIS-Z3284 standard. The depth of each recess 21 is preferably smaller than the diameter of each metal particle 7 0. It is illustrated in Fig. 4 and also in Fig. 5 A to 5 C. The process of applying flux 60 is composed of metal particles 70, which is achieved by using a scraper 1 5 and 1 5 # m to 5 ◦ / / m mixed with 10 WT%-co-fusion gold SN of 80 of flux-PB has a viscosity of 200 ± 50 Pa · C ·. The metal sheet 20 is moved to apply a soldering flux 60, which is arranged on the sheet surface 20a on the window 11a of the metal mask 11, and the window is filled with the soldering flux 60. Printed in detail in Figure 5A by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the metal sheet 2 0 moves in the direction of this arrow F, so that the metal particles 7 0 roll on the sheet surface 2 0 a and the recess 2 1 formed on it . When the metal sheet 20 moved, some metal particles 70 were buried deep in the recess 21, while other particles 70 rolled on the sheet surface 20a to limit the previous metal particles in the recess 21. This will result in an imbalance in the velocity between the metal particles as they move. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480218 A7 B7 V. Description of the invention (5) Unbalanced state, that is, due to the recess 2 1 The presence of the metal promotes the uneven rate of the metal particles 70 caused by the shake-off phenomenon, which will promote the softness of the co-solvent 80 in the solder 60. The mixed flux 60 made of metal flux 80 is changed from an insoluble colloid to a soluble colloid to soften flux 80, which improves the fluidity of flux 60 on the surface of the sheet 20a. When the squeegee 15 moves, the metal particles 70 roll so smoothly on the sheet surface 20a. Then the window 1 1 a of the metal mask 11 is filled with sufficient solder 60, as shown in Fig. 5B. When the solder application process is completed, as shown in FIG. 5C, the solder is moved down to the circuit board 12, and the solder 60 has the same shape as the window 11a. The application of tetrafluoroethylene resin on the surface of the sheet 20 a will increase the flowability of the solder 60 on the sheet surface 20 a and the usability of the squeegee 15. The resin is preferably polytetrafluoroethylene (PTFE). As disclosed above, the squeegee 15 has fine recesses 21 formed on the surface 2 a of the sheet, and the solder 60 is provided with the same thickness as the metal mask 11 without the need to scrape the solder, even on the circuit board. Electronic components with fine pitch. The size of the recess 21 and the shape of the solder. The shape of the metal particles 70 of the solder 60 is not limited to the above, but it depends on the situation. As disclosed above, the squeegee having fine recesses formed on the entire surface of the sheet according to the present invention achieves smooth rolling of metal particles of the solder on the surface of the blade. The high usability of this squeegee will provide a high degree of circuit board quality. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ------------------- Order --------- Line ^ ^-· (Please read the notes on the back before filling this page) -8-