TW202333545A - Printing device - Google Patents
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- TW202333545A TW202333545A TW111104986A TW111104986A TW202333545A TW 202333545 A TW202333545 A TW 202333545A TW 111104986 A TW111104986 A TW 111104986A TW 111104986 A TW111104986 A TW 111104986A TW 202333545 A TW202333545 A TW 202333545A
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 42
- 239000003292 glue Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- Dot-Matrix Printers And Others (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本發明是有關於一種印刷裝置,特別是有關於一種能夠直接對表面具有多個電子元件的基板進行印刷的印刷裝置。The present invention relates to a printing device, and in particular to a printing device that can directly print on a substrate having a plurality of electronic components on its surface.
現有的基板印刷技術或裝置是為了將膠材如錫膏或光學膠等印刷至待印刷基板上,主要是先將待印刷的圖案轉印至印刷鋼板後加工形成鋼板上的通孔。以錫膏印刷為例,印刷時先以人工或印刷機將膠材預先塗布於印刷鋼板的一側,並將印刷鋼板對位至待印刷基板。接著運用刮刀的推力將膠材推入這些通孔,使膠材黏附至待印刷基板對應的印刷位置上。最後移離印刷鋼板即可將電子元件黏附於錫膏上並後送至回焊爐以凝固錫膏。Existing substrate printing technology or devices are used to print adhesive materials such as solder paste or optical glue onto the substrate to be printed. They mainly transfer the pattern to be printed to a printed steel plate and then process it to form through holes on the steel plate. Taking solder paste printing as an example, during printing, adhesive material is pre-coated on one side of the printed steel plate manually or with a printing machine, and the printed steel plate is aligned to the substrate to be printed. Then use the thrust of the scraper to push the adhesive material into these through holes, so that the adhesive material adheres to the corresponding printing position of the substrate to be printed. Finally, by removing the printed steel plate, the electronic components can be adhered to the solder paste and then sent to the reflow oven to solidify the solder paste.
隨著現有半導體製程的演進,為了使這些電子元件或晶片的運作穩定度加以提升,待印刷基板上必須事先在印刷膠材前先行安裝多個被動元件。然而,現有的印刷裝置在對這種已經安裝被動元件的待印刷基板進行印刷時,過程中難以將膠材轉印至待印刷基板上的預定位置,也容易造成被動元件的損壞。因此,仍有必要對現有的印刷設備進行改良以解決上述問題。With the evolution of existing semiconductor manufacturing processes, in order to improve the operational stability of these electronic components or chips, multiple passive components must be installed on the substrate to be printed before printing the adhesive material. However, when existing printing devices print on such a substrate to be printed that has passive components installed on it, it is difficult to transfer the adhesive material to a predetermined position on the substrate to be printed, and it is also easy to cause damage to the passive components. Therefore, it is still necessary to improve existing printing equipment to solve the above problems.
根據現有技術所面臨的問題,本發明的目的是提供一種印刷裝置,適合對表面具有多個電子元件的基板進行印刷。Based on the problems faced by the prior art, an object of the present invention is to provide a printing device suitable for printing a substrate with multiple electronic components on its surface.
本發明的另一目的是提供一種印刷裝置,可在印刷時減少膠材的浪費。Another object of the present invention is to provide a printing device that can reduce the waste of glue material during printing.
為達到上述目的,本發明提供一種印刷裝置,用以對表面上設有多個電子元件的基板進行印刷。印刷裝置包括金屬板材以及刮刀。金屬板材用以貼設於基板上,金屬板材包括第一面與相對該第一面的第二面,第一面朝向基板的表面,其中第一面布設有多個盲孔,這些盲孔對位該些電子元件,以及第二面上開設有至少一凹槽以容置膠材。刮刀的刮膠端可伸入凹槽並移動以進行印刷。金屬板材還設有多個連通第一面與至少一凹槽的貫孔,以及刮膠端透過這些貫孔將膠材刮至基板的表面。In order to achieve the above object, the present invention provides a printing device for printing a substrate with a plurality of electronic components on the surface. The printing device includes a metal plate and a scraper. The metal plate is used to be attached to the substrate. The metal plate includes a first side and a second side opposite to the first side. The first side faces the surface of the substrate. The first side is provided with a plurality of blind holes. These blind holes are opposite to the first side. These electronic components are located, and at least one groove is formed on the second surface to accommodate the adhesive material. The squeegee end of the squeegee can extend into the groove and move to print. The metal plate is also provided with a plurality of through holes connecting the first surface and at least one groove, and the scraper end scrapes the adhesive material to the surface of the substrate through these through holes.
為達到上述目的,本發明還提供一種印刷裝置,用以對表面上設有多個電子元件的基板進行印刷。印刷裝置包括金屬板材與刮刀。金屬板材,具有第一面與相對該第一面的第二面,第一面朝向基板的表面,用以貼設於基板上,其中第一面配置有多個盲孔,這些盲孔對位這些電子元件,以及第二面上開設有至少凹槽以容置膠材。刮刀具有刮膠端,其中刮膠端還具有至少一子刮膠端,以及每個子刮膠端可伸入對應的凹槽並移動以進行印刷。其中金屬板材的至少一凹槽中還設有多個連通第一面與至少一凹槽的貫孔,以及刮膠端透過這些貫孔將膠材印刷至基板的表面。In order to achieve the above object, the present invention also provides a printing device for printing a substrate with a plurality of electronic components on the surface. The printing device includes a metal plate and a scraper. A metal plate has a first side and a second side opposite to the first side. The first side faces the surface of the substrate for being attached to the substrate. The first side is provided with a plurality of blind holes, and these blind holes are aligned. These electronic components, and at least a groove is formed on the second surface to accommodate the adhesive material. The squeegee has a squeegee end, wherein the squeegee end also has at least one sub-squeegee end, and each sub-squeegee end can extend into a corresponding groove and move for printing. The at least one groove of the metal plate is further provided with a plurality of through holes connecting the first surface and the at least one groove, and the squeegee end prints the glue material onto the surface of the substrate through these through holes.
在一較佳實施例中,盲孔於第一面上的投影長度大於電子元件於表面上的投影長度。In a preferred embodiment, the projected length of the blind hole on the first surface is greater than the projected length of the electronic component on the surface.
在一較佳實施例中,盲孔於第一面上的最大深度大於電子元件於表面上的最大高度。In a preferred embodiment, the maximum depth of the blind hole on the first surface is greater than the maximum height of the electronic component on the surface.
在一較佳實施例中,刮膠端於第二面上的投影長度小於凹槽於第二面上的投影長度。In a preferred embodiment, the projected length of the squeegee end on the second surface is smaller than the projected length of the groove on the second surface.
在一較佳實施例中,刮膠端於第二面上的投影長度大於貫孔於第二面上的投影長度。In a preferred embodiment, the projected length of the squeegee end on the second surface is greater than the projected length of the through hole on the second surface.
在一較佳實施例中,凹槽還具有至少兩個子凹槽,刮刀端具有至少兩個子刮刀端,以及此至少兩個子刮刀端對應於此至少兩個子凹槽。In a preferred embodiment, the groove also has at least two sub-grooves, the scraper end has at least two sub-scraper ends, and the at least two sub-scraper ends correspond to the at least two sub-grooves.
在一較佳實施例中,凹槽還具有至少一個凸起,刮刀端具有至少一個凹陷,以及此至少一個凹陷對應並容置此至少一個凸起。In a preferred embodiment, the groove also has at least one protrusion, the scraper end has at least one recess, and the at least one recess corresponds to and accommodates the at least one protrusion.
在一較佳實施例中,凸起於第一面上的投影長度小於凹陷於第二面上的投影長度。In a preferred embodiment, the projected length of the protrusion on the first surface is smaller than the projected length of the recess on the second surface.
在一較佳實施例中,子刮刀端於第二面上的投影長度小於此至少一子凹槽於第一面上的投影長度。In a preferred embodiment, the projected length of the sub-scraper end on the second surface is smaller than the projected length of the at least one sub-groove on the first surface.
根據上述,本發明的實施例中,金屬板材的第一面具有多個盲孔可分別對位於基板上的多個電子元件,第二面上開設有凹槽以容置膠材,金屬板材還設有多個連通第一面與凹槽的貫孔,以及刮膠端透過這些貫孔將膠材刮至基板的表面並移動以進行印刷。如此一來,本發明的印刷裝置即可對表面具有多個電子元件的基板進行印刷,可避免在印刷的過程中造成電子元件的損壞,也能夠減少膠材的浪費。According to the above, in the embodiment of the present invention, the first side of the metal plate has a plurality of blind holes that can respectively face the plurality of electronic components located on the substrate, and the second side has grooves to accommodate the glue material. The metal plate also has a plurality of blind holes. A plurality of through holes are provided to connect the first surface and the groove, and the scraper end scrapes the adhesive material to the surface of the substrate through these through holes and moves it for printing. In this way, the printing device of the present invention can print on a substrate with multiple electronic components on the surface, thereby avoiding damage to the electronic components during the printing process and reducing the waste of glue material.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。此外,圖式中的XYZ座標軸僅用於說明本發明的實施例,而非用於限制本發明的申請專利範圍。The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the invention. In addition, the XYZ coordinate axes in the drawings are only used to illustrate the embodiments of the present invention, but are not used to limit the patentable scope of the present invention.
請參考圖1A,是根據本發明的一種實施例,是表示印刷裝置的剖面示意圖。首先,如圖1A所示,印刷裝置10用於對基板20進行印刷,基板20可為印刷電路板(PCB)、金屬基印刷電路板(MPCB)、可撓性印刷電路板(FPCB)或其他合適的基板,其中,基板上20設有多個電子元件(圖1A中示意性的繪示3個電子元件211、212、213,其中,電子元件可以是各種主動元件或是被動元件等,本發明皆不以此為限)。此外,印刷裝置10包括金屬板材11與刮刀12,而金屬板材11包括第一面111與相對於第一面111的第二面112,刮刀12則具有刮膠端121。金屬板材11的材質可為不鏽鋼或其他適合加工的合金板材,其中,金屬板材11的第一面111朝向基板20的表面21,使得第一面111可貼設於基板20上。此外特別的是,金屬板材11的第一面111上設有多個盲孔14,這些盲孔14是對位於基板20上的電子元件,也就是說,基板20上的每個電子元件211、212或213都可以對位至第一面111上的其中一個盲孔14。Please refer to FIG. 1A , which is a schematic cross-sectional view of a printing device according to an embodiment of the present invention. First, as shown in FIG. 1A , the
接著,請參考圖1B,是根據圖1A的實施例,是表示印刷裝置10的局部放大剖面示意圖。詳細而言,請同時參考圖1A與圖1B,金屬板材11的第一面111平行於基板20的表面21,在第一面111上則配置有多個盲孔14,而每個盲孔14的位置是相應於已經固接在基板20的表面21上一個或是多個電子元件。例如: 因此,盲孔14是凹向第二面112設置,其中盲孔14在X方向上的長度為L1,電子元件211在X方向上的長度為L2,且L1大於L2。此外,盲孔14在Z方向上的最大深度為H1,而電子元件211在Z方向上的最大高度為H2,且H1大於H2。Next, please refer to FIG. 1B , which is a partially enlarged cross-sectional view of the
接著,請參考圖2,圖2是根據圖1A的實施例,表示印刷裝置10工作時的剖面示意圖。如圖2所示,當金屬板材11貼合於基板20時,由於上述長度L1大於L2且上述高度H1大於H2,相互對應的盲孔14即可很安全的容置電子元件211,而不會在印刷的過程中碰撞電子元件211,而造成電子元件211的損傷,也能防止印刷時,產生膠材13溢出,造成基板20上電子元件211附近線路的短路或斷路。特別的是,圖1A、圖1B與圖2中,盲孔14的截面形狀繪示為矩形,然而,本發明並不限於此,盲孔14的形狀可為任何合適的幾何形狀,例如半球形、圓柱形或其他合適於容置電子元件211的形狀。Next, please refer to FIG. 2 . FIG. 2 is a schematic cross-sectional view of the
請繼續參考圖1A,金屬板材11的第二面112上設有至少一個凹槽113,凹槽113內適於放置或是填充一些膠材13,其中,凹槽113是凹向第一面111。接著,刮刀12具有刮膠端121,而刮膠端121是對應於凹槽113,故刮膠端121可以伸入凹槽113內,用以刮動膠材13來進行印刷。此外,金屬板材11還具有多個貫孔15(圖1A中示意性的繪示出3個貫孔15,但並不以此為限),且每個貫孔15都是配置在凹槽113中,通過貫孔15可以連通凹槽113與金屬板材11的第一面111。如此一來,當凹槽113中配置有膠材13時,即可通過各貫孔15將膠材13印刷至基板20的表面21上。本實施例中,膠材13可為各種導電膠、絕緣膠、光學膠或其他能夠用於印刷的可固化膠體,本發明並不加以限制。而凹槽113與貫孔15的截面形狀為便於說明皆繪示為矩形,然而,本發明並不限於此,凹槽113也可為其他合適於容置膠材13的任何幾何形狀,貫孔15也可設計為具有適於令膠材13通過的截面形狀。Please continue to refer to FIG. 1A . The
再接著,請參考圖1C,是根據圖1A的實施例,表示印刷裝置的局部放大剖面示意圖。請同時參考圖1A與圖1C,詳細而言,本實施例中刮膠端121的端面在第二面上的投影長度為L3,凹槽113在第二面112上的投影長度為L4,且L3小於L4。此外,每個貫孔15在第一面111上的投影長度為L5(圖1C中示意性的繪示出1個L5),且L3大於L5,L4大於L5。請一併參考圖2,當金屬板材11貼合於基板20時,由於上述長度L3小於L4,因此,刮刀12的刮膠端121能夠伸入凹槽13內並可於Y方向上移動,而不會令膠材13溢出至金屬板材11的第二面112,提高膠材13的使用比例並降低製造成本。此外,由於長度L3大於L5,且L4大於L5,因此膠材13也能被刮膠端121直接刮入各貫孔15而不會在基板20的表面21溢散。Next, please refer to FIG. 1C , which is a partial enlarged cross-sectional view of the printing device according to the embodiment of FIG. 1A . Please refer to Figure 1A and Figure 1C at the same time. Specifically, in this embodiment, the projected length of the end surface of the
接著,請參考圖3,圖3是根據圖1的實施例,表示印刷裝置10工作後的剖面示意圖。如圖3所示,膠材13被刮入各貫孔15後,膠材13會固接在基板20的表面21上,之後,在控制印刷裝置10的金屬板材11與刮刀12移離基板20後,膠材13即可透過各貫孔15以預定的形態及位置印刷固接至基板20的表面21上,其中,膠材13在基板20的表面21上預定的形態及位置可由各貫孔15的形態及對應位置決定。很明顯的,通過金屬板材11的第一面111具有多個盲孔14的設計,使得完成印刷後,電子元件211、電子元件212及電子元件213能夠曝露出來。Next, please refer to FIG. 3 . FIG. 3 is a schematic cross-sectional view of the
請繼續參考圖4,是根據本發明的另一實施例,表示印刷裝置的剖面示意圖。首先,如圖4所示,印刷裝置10A與圖1A的印刷裝置10相似,故給予相同的元件以相同的標號表示,在此不再贅述。如圖4所示,印刷裝置10A與印刷裝置10的差異在於,當基板20的表面21的電子元件212是配置在金屬板材11的凹槽113位置之中時,必須在金屬板材11的凹槽113對應於電子元件212的位置處,配置一個盲孔14a,此盲孔14a於金屬板材11的凹槽113中形成凸起部1133,凸起部1133可將凹槽113中區分出兩個子凹槽區1131及凹槽區1132,也因此,在刮刀12的刮刀端121在相應盲孔14a的凸起部1133處,也必須形成一個凹陷部1213。通過刮刀12的凹陷部1213將刮刀端121區分為兩個子刮膠端1211、1212,很明顯的,子刮膠端1211及子刮刀端1212可分別對應於子凹槽區1131、1132。Please continue to refer to FIG. 4 , which is a schematic cross-sectional view of a printing device according to another embodiment of the present invention. First, as shown in FIG. 4 , the
請再參考圖5A,是根據圖4的實施例,表示印刷裝置10A工作時的剖面示意圖。如圖5A所示,具體而言,本實施例中使用印刷裝置10A進行膠材13的印刷時,膠材13是填充於子凹槽區1131及子凹槽區1132中,當金屬板材11貼合於基板20時,刮膠端121上的兩個子刮膠端1211及子刮膠端1212可分別伸入凹槽113的兩個子凹槽區1131及子凹槽區1132中以刮動膠材13進行印刷,子刮膠端1211及子刮刀端1212可於Y方向上移動以將膠材13刮入貫孔15中。如此一來,膠材13即可透過各貫孔15以預定的形態及位置印刷至基板20的表面21。很明顯的,通過金屬板材11的第一面111配置有多個盲孔14的設計,使得完成印刷後,電子元件211、電子元件212及電子元件213能夠曝露出來。Please refer to FIG. 5A again, which is a schematic cross-sectional view of the
圖5B是根據圖4的實施例,表示印刷裝置10A工作時的局部放大剖面示意圖,請參考圖5A與圖5B。本實施例中,子刮膠端1211在金屬板材11的第一面111上具有投影長度L6,子凹槽1131於第二面112上的投影長度為L9,其中L6小於L9以使子刮膠端1211可伸入子凹槽1131中。子刮膠端1212在第一面上的投影長度為L7,子凹槽1132於第二面112上的投影長度為L10,其中L7小於L10以使子刮膠端1212可伸入子凹槽1132中。此外,刮膠端121還具有至少一凹陷部1213,金屬板材11還具有至少一對應於凹陷部1213的凸起部1133,其中凹陷部1213在第一面111上的投影長度為L8,凸起部1133在第二面上的投影長度為L11,且L11小於L8,刮膠端121的凹陷部1133即可容置金屬板材11的凸起部1133。如此一來,本發明的印刷裝置10A即可對應不同基板20上表面21的設計,對應更動刮膠端121與金屬板材11上凹槽113的配置,令膠材13可精準印刷至表面21的待印刷位置例如焊墊,也可減少膠材13的浪費以降低製造成本。另外,由於刮膠端121整體可容置於金屬板材11的凹槽113中,因此投影長度L6、L7、8的加總小於投影長度L9、L10、L11的加總,也就是L6+L7+L8小於L9+L10+L11。本實施例中,圖5A、圖5B中示意性的繪示一個凹陷1213可對應並容置一個凸起部1133,然而根據基板20的預定印刷位置與表面21上電子元件的安置狀況,一個刮膠端121的凹陷也可以同時對應並容置多個金屬板材11上的凸起,本發明對此並不加以限制。FIG. 5B is a partially enlarged cross-sectional schematic diagram showing the
綜上所述,本發明的實施例中,金屬板材的第一面具有多個盲孔可分別對位於基板上的多個電子元件,第二面上開設有凹槽以容置膠材,金屬板材還設有多個連通第一面與凹槽的貫孔,以及刮膠端透過這些貫孔將膠材刮至基板的表面並移動以進行印刷。如此一來,本發明的印刷裝置即可對表面具有多個電子元件的基板進行印刷,可避免在印刷的過程中造成電子元件的損壞,也能夠減少膠材的浪費。To sum up, in the embodiment of the present invention, the first side of the metal plate has a plurality of blind holes that can respectively face a plurality of electronic components on the substrate, and the second side has grooves to accommodate the glue material. The plate is also provided with a plurality of through holes connecting the first surface and the groove, and the squeegee end scrapes the adhesive material to the surface of the substrate through these through holes and moves it for printing. In this way, the printing device of the present invention can print on a substrate with multiple electronic components on the surface, thereby avoiding damage to the electronic components during the printing process and reducing the waste of glue material.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。此外,本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名元件的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。However, the above are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, all simple equivalent changes and modifications made based on the patentable scope and content of the present invention are It is still within the scope of the patent of this invention. In addition, the terms "first" and "second" mentioned in this specification or the patent application are only used to name components or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit on the number of components. .
10、10A:印刷裝置
11:金屬板材
111:第一面
112:第二面
113:凹槽
1131、1132:子凹槽區
1133:凸起部
12:刮刀
121:刮膠端
1211、1212:子刮膠端
1213:凹陷
13:膠材
14、14a:盲孔
15:貫孔
20:基板
21:表面
211、212、213:電子元件
L1、L2、L3、L4、L5、L6、L7、L8、L9、L10、L11:投影長度
10, 10A: Printing device
11:Metal sheet
111: Side 1
112:Second side
113:
圖1A是根據本發明的一種實施例中印刷裝置的剖面示意圖; 圖1B是根據圖1A的實施例,表示印刷裝置的局部放大剖面示意圖; 圖1C是根據圖1A的實施例,表示印刷裝置的局部放大剖面示意圖; 圖2是根據圖1A的實施例,表示印刷裝置工作時的剖面示意圖; 圖3是根據圖1A的實施例,表示印刷裝置工作完成後的剖面示意圖; 圖4是根據本發明另一種實施例中印刷裝置的剖面示意圖; 圖5A是根據圖4的實施例,表示印刷裝置工作時的剖面示意圖;以及 圖5B是根據圖4的實施例,表示印刷裝置工作時的局部剖面放大示意圖。 Figure 1A is a schematic cross-sectional view of a printing device according to an embodiment of the present invention; Figure 1B is a partial enlarged cross-sectional schematic view of the printing device according to the embodiment of Figure 1A; Figure 1C is a partial enlarged cross-sectional schematic view of the printing device according to the embodiment of Figure 1A; Figure 2 is a schematic cross-sectional view showing the printing device during operation according to the embodiment of Figure 1A; Figure 3 is a schematic cross-sectional view of the printing device after completion of work according to the embodiment of Figure 1A; Figure 4 is a schematic cross-sectional view of a printing device according to another embodiment of the present invention; Figure 5A is a schematic cross-sectional view showing the printing device during operation according to the embodiment of Figure 4; and FIG. 5B is a partial cross-sectional enlarged schematic diagram showing the operation of the printing device according to the embodiment of FIG. 4 .
10:印刷裝置 10:Printing device
11:金屬板材 11:Metal sheet
111:第一面 111: Side 1
112:第二面 112:Second side
12:刮刀 12:Scraper
121:刮膠端 121: Squeegee end
13:膠材 13: Adhesive material
14:盲孔 14:Blind hole
15:貫孔 15:Through hole
20:基板 20:Substrate
21:表面 21:Surface
211、212、213:電子元件 211, 212, 213: Electronic components
Claims (10)
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TW111104986A TWI803185B (en) | 2022-02-10 | 2022-02-10 | Printing device |
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TW111104986A TWI803185B (en) | 2022-02-10 | 2022-02-10 | Printing device |
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CN112272616B (en) * | 2018-06-08 | 2022-04-12 | 东伸工业株式会社 | Screen printing apparatus and screen printing method |
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