TW201014674A - Printing apparatus for printed circuit board - Google Patents

Abstract

The present invention provides a printing apparatus for a printed circuit board including a mask with openings; a table which is positioned at a lower part of the mask and receives the printed circuit board; elastic support structures for supporting the mask by being positioned at both lower parts of the mask respectively; and a squeegee unit moving on an upper part of the mask.

Description

201014674

TW5255PA VI. Description of the Invention: [Technical Field] The present invention relates to a printing device for a printed circuit board, and more particularly to a printing device including a flexible supporting structure for a printed circuit board under the mask. Prevents warpage of the mask when printing the solder and automatically separates the mask and the printed circuit board. [Prior Art] • Printed circuit boards are widely used in a variety of electronic products, including home devices and technology communication devices. The printed circuit board plays an important role in electrical connection such as electronic components such as semi-conductive wafers and chip resistors (reSist〇rchip). The printed circuit board includes circuit patterns for electrically connecting a plurality of electronic components. The printed circuit board herein includes bumps that are electrically connected to the circuit pattern. At this time, the electronic component is electrically connected to the bump and disposed on the printed circuit board, and the electronic component and the circuit pattern are electrically connected to each other. The bumps can be formed through a lithography process. In the method of forming bumps through the lithography process, a thin metal mask having a thickness of several tens of μm is first aligned on the stamp, and the conductive solder is placed on the upper surface of the metal shield. Then, when the squeegee unit (SqUeegeeunit) moves on the metal mask in a compressive manner, the solder fills the opening of the metal mask to form a bump on the printed circuit board. The metal mask is separated from the printed circuit board after the bumps are formed. In this step, the metal mask may adhere to the printed circuit board due to the viscous force of the solder, causing the metal mask to sag downward (Mrpage), that is, 3 201014674 l

The TW5255PA warps toward the printed circuit board. As a result, the bumps formed on the printed board are damaged. # The damage of the bumps causes the bumps to be uneven in height, resulting in defects in the product and further reducing the reliability of the electronic products using the printed circuit board. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. Therefore, the printing apparatus of the printed circuit board of the present invention can prevent the distortion of the mask. The printing apparatus of the present invention includes an elastic floor structure located at a lower portion of the mask. When printing fresh materials, the printing device can automatically separate the mask and the printed circuit board. x 罾 According to the present invention, a printing apparatus for a printed circuit board is provided which includes a mask, a table, an elastic fulcrum structure, and a knive unit. The mask has an opening. The table is under the mask and houses the printed circuit board. The elastic support Yin system is located at the lower part of the mask to support the mask. The scraper 2 moves over the mask. Here, each of the elastic support structures includes an elastic body and a base. The elastic system is used to support the mask, and the base is used to support the elastomer. ❿ In addition, the base can be wrapped around the groove for inserting the elastomer. Further, the printing device of the printed circuit board may include a fixing member for fixing the elastic supporting structure to the table. In addition, the printed circuit board is separated from the mask by an elastic fulcrum structure. In addition, the other knife unit is located on the mask and the elastic branch structure and compresses the elastic support structure and the mask. In addition, the elastic support structures can be located on either side of the table. 4 201014674

TW5255PA In addition, the 'elastic support structure can be fixed to the table. The brace structure may include a plurality of parallel-arranged spring pins. Additionally, the resilient support structure can include a base for securing and supporting the spring positioning pins. Further, the spring positioning pin may include a spring, a compression unit, and a housing. The compression unit is located on the spring and the housing is wrapped with a spring. Further, the printing device of the printed circuit board may include a fixing member coated on the compression unit W. Additionally, the printing device of the printed circuit board can include at least one auxiliary resilient support structure located outside of the resilient support structure. In order to make the above description of the present invention more comprehensible, the following detailed description of the preferred embodiments and the accompanying drawings will be described in detail below. A preferred embodiment of a printing apparatus for printing an electric circuit board. The following examples are provided by way of example for those of ordinary skill in the art to which this invention pertains. Therefore, the invention is not limited to the following embodiments but may be other forms. Moreover, the size and thickness of the device in the drawings may be more exaggerated. The same components are denoted by the same reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing a printing apparatus for a printed circuit board according to a first embodiment of the present invention. Referring to FIG. 1, a printing device for a printed circuit board includes a metal mask 120, a table 100, an elastic support structure 150, and a doctor unit 160° 5 201014674. The mask 120 is placed on the table 100, and the printed circuit board 11 is tied. On the table 100. The mask 120 has a plurality of openings 121, and the openings 121 correspond to the bump forming regions of the printed circuit board 110. Therefore, after the solder is placed on the mask 120 and the printed circuit board 110, when the doctor unit 16 is compressed to move, the bump is formed on the printed circuit board 11 at a position corresponding to the opening 121 of the mask 120. The mask 120 may be formed of a metal such as nickel or a nickel alloy. Since the thickness of the mask 120 here is several tens, the mask is easily deformed. Specifically, after the bumps are formed, in the process of separating the mask 12 and the printed circuit board no, the adhesion of the solder causes the mask 12 to warp downward, possibly resulting in the formation of the printed circuit board 11 Broken bump

Therefore, the reliable sound of the electronic product using the printed circuit board 11 is reduced, and the reliability of the printed circuit board 110 is also reduced. J

And the printed circuit board 11〇,: and the outside of the separate mask 120 to produce a distortion to prevent the separation of the process in the mask 120 I axis 1 ^ 1 Ί 5 Γ 丄 从 从 丨 之 之 之 之 之Life, from 160

Elastic support structure 15〇±±200914674

TW5255PA In other words, the width of the resilient support structure 150 can be perpendicular to the width of the doctor unit 16A. Each of the resilient support structures 150 can include an elastomer 14 and a base 130. The elastomer 140 supports the mask 12 and has an elastic restoring force. The base 130 supports and fixes the elastic body 140. The elastomer 140 herein may be any artificial rubber, natural rubber, and combinations thereof. Specifically, the elastomer 140 may be formed of a single rubber, such as butadiene styrene rubber, butyl rubber, nitriie rubber, butadiene rubber. A rubber (chloroprene rubber), a urethane rubber, a silicon rubber, and a fiuorine rubber or a mixed rubber formed by mixing at least two of the above single rubbers. The pedestal 130 can include a groove into which the elastomer 140 is inserted. The elastomer 140 herein can be inserted and secured in the groove such that the elastomer 140 can be attached or detached from the base 130.

A When the doctor unit 160 moves over the mask 120, a bump is formed on the printed circuit board 110 corresponding to the opening 121, and the solder is filled into the opening 121 of the mask 120. In the process of printing fresh material, the doctor unit 160 here is compressively moved over the elastic support structure 150 and the mask 120, and the process is performed by placing the doctor unit 160 on the elastic support structure 150 and the mask. 120 is completed. The printing process of the printing apparatus according to the first embodiment of the present invention will be described in detail below with reference to Figs. 2 to 4 . 7 201014674 4

TW5255PA Fig. 2 is a side view showing the printing apparatus in accordance with the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing a portion A of Fig. 2. Fig. 4 is a cross-sectional view showing a portion b of Fig. 2; Referring to Figures 2 and 3, the printed circuit board 11 is placed on the table 1〇0 of the printing apparatus. Although the printed circuit board 110 herein may have different shapes 'e.g., a single printed circuit board, a double-sided printed circuit board, and a multi-layer printed circuit board', embodiments of the present invention are not limited thereto. The printed circuit board U 〇 includes a plurality of pad units 111 electrically connected to a circuit layer, and the circuit 10 layers are not shown in the drawings. Next, the mask 12 having an opening is aligned with the printed circuit board 110. The mask 120 is supported by the elastic supporting structure 150, and the elastic supporting structures 150 are respectively located at the lower portions of the mask 120. At this time, the elastic supporting structure 150 separates the mask 120 and the printed circuit board 11 at a predetermined interval. After the solder 170 is applied to the mask 12, the knife unit 16 is compressively moved over the mask 120. At this time, when the solder 17 is printed, the knive unit 160 is compressively moved over the elastic support structure 15 and the cover 12A. When the doctor unit 160 here passes through the mask 12, the elastic structure 150 is compressed by the pressure of the doctor unit 16〇, so that the mask 12 and the printed circuit board 110 are in contact with each other. At this time, the solder 17 is filled in the opening of the mask 12 to form the bump 112 on the pad unit lu of the printed circuit board 110. Referring to FIGS. 2 and 3, when the tool unit 16 is reached After the passage, 8 201014674

The TW5255PA spring force restores the resilient support structure I50 to its previous state and automatically separates the mask 120 from the printed circuit board. When the bumps 112 are formed, the mask 120 and the printed circuit board 110 are partially separated. Therefore, the mask 120 is less affected by the viscous force of the solder, so that the mask 120 can be separated from the board 110 without being bent. In addition, since the mask 120 is automatically separated from the printed circuit board 110 in the printing process, there is no need to consider the factors for improving the warpage of the printing, such as the viscosity of the solder, the printing speed, and the printing pressure. Ensure consistent brush quality and increase productivity. In an embodiment of the invention, the resilient support structure 150 is separate from the lower portions of the mask 120. Therefore, when the doctor unit 160 prints the fresh material, the elastic supporting structure 150 is compressed so that the mask 120 and the printed circuit board 110 are in contact with each other. When the doctor unit 160 is passed, the portions of the mask 120 and the printed circuit board 11 are automatically separated by the elastic restoring force of the elastic supporting structure. Accordingly, the mask 120 and the printed circuit board Π0' can be separated without requiring an additional process to prevent warping of the mask caused by the process of separating the mask no and the printed circuit board 110, and simplifying the process. In addition, since the mask 120 is not warped, cracking of the bumps can be prevented, and thus a printed circuit board having a relatively large interval can be manufactured. Fig. 5 is a cross-sectional view showing a printing apparatus for a printed circuit board according to a second embodiment of the present invention. The printing apparatus of the printed circuit board of the second embodiment of the present invention has the same elements as those of the printing apparatus of the first embodiment except for the fixing member. Because 9 201014674

TW5255PA In the second embodiment of the present invention, the same components are denoted by the same reference numerals, and the same description as the first embodiment will be omitted. Referring to Fig. 5, the printing apparatus of the printed circuit board includes a mask 120, a table 100, a resilient support structure 15A, and a cutter unit 16A. The mask 120 has an opening 121. The table 100 is located below the mask 12 and accommodates the printed circuit board no. The elastic truss structures 15 are respectively located at the lower two portions of the hood 120 for the louver covering 12G. The doctor unit (10) moves on the mask 20 . In addition, the printing apparatus of the printed circuit board 110 may include a fixing member 18G for fixing the elastic branch structure (9) to the table (10). The structure 150 includes an elastomer 140 and a pedestal 130. Here ^ 数 a number of through holes. The table 100 includes a through-hole that passes through the through-hole and is inserted into the receptacle for securing the resilient support structure 150 to the table 100. As a result, the elastic support structure 150 also moves vertically when the table 100 is moved vertically. Therefore, the bullet is steeply branched and constructed for 1 s. No need to rely on * child 1. . The location is reset. The printed circuit board 110 on the table 100 must be separated from the mask (10) by the elastic support structure 15G. When the table 1 is moved, it would cause a lot of trouble if the material needs to be placed. The printing apparatus of the printed circuit board 110 of the embodiment of the present invention includes a fixing member 18 which fixes the elastic baffle structure 150 to the side of the table 100. Therefore, the printing apparatus of the printed circuit board 11 of the embodiment of the present invention can be simplified in the case where the elastic supporting structure is not required to be moved in the moving position of the table 100. Figure 6 is a diagram showing a printed circuit board according to a third embodiment of the present invention 201014674

Cross-sectional view of the printing unit of TW5255PA. The printing apparatus of the printed circuit board of the third embodiment of the present invention has the same elements as those of the printing apparatus of the first embodiment except for the elastic supporting structure. Therefore, in the third embodiment of the present invention, the same elements are denoted by the same reference numerals, and the description overlapping with the first embodiment will be omitted. Referring to Fig. 6, the printing apparatus of the printed circuit board includes a mask 120, a table 1 〇〇, an elastic fulcrum structure 190, and a knive unit 160. The mask 120 has an opening 121. The table 1 is located below the mask 120 and is used to place the printed circuit board 110. The elastic support structures 190 are respectively located at two lower portions of the mask 120 for supporting the mask 120. The doctor unit 160 is moved over the mask 120. Here, the elastic support structure 190 can be fixed to the table. ^ 100 ° The elastic support structure 190 includes an elastic body and can be fixed to the table 100. The resilient support structure 190 can be secured by the adhesive member or by being inserted into the slot of the table 100. Moreover, although not shown in the figures, the resilient support structure 190 can include a base for supporting the elastomer. Since the elastic support structure 190 is fixed to the table 100, the position of the elastic support structure 190 also moves as the table 100 moves. Therefore, there is no need to reset the printing device, thus simplifying the process. Figure 7 is a diagram showing the displacement of the mask of the conventional printed circuit board printing device during printing. Figure 8 is a diagram showing the displacement of the mask of the printing device of the printed circuit board according to the embodiment of the present invention during printing. As shown in Fig. 7, by observing the mask of the conventional printing device on the printing 11 201014674,

The displacement in TW5255PA time knows that the displacement of the mask changes significantly when the mask is separated from the printed circuit board, i.e., the S1 portion, resulting in cracked bumps as shown in the photograph of Attachment 1. Meanwhile, as shown in FIG. 8, when the printing apparatus according to the embodiment of the present invention has an elastic supporting structure, by observing the displacement of the mask of the printing apparatus in the printing time, when the mask is separated from the printed circuit board, That is, the S2 portion has almost no change in the displacement of the mask, thus forming an unbroken bump as shown in the photograph of Attachment 2. In an embodiment in accordance with the invention, the resilient support structure of the printed circuit board is located below the mask. Therefore, the warpage of the mask and the cracking of the bumps can be prevented when the mask and the printed circuit board are separated, and a printed circuit board having a relatively dense interval can be manufactured. 9 and 10 are cross-sectional views showing a printing apparatus of a printed circuit board according to a fourth embodiment of the present invention. The printing device of the printed circuit board according to the fourth embodiment of the present invention has the same 70 members as the printing device of the first embodiment except for the elastic structure. Therefore, in the fourth embodiment of the present invention, the description of the first embodiment will be omitted, and the same elements will be designated by the same reference numerals. Figure 9 is a cross-sectional view showing a printing apparatus for a printed circuit board according to a fourth embodiment of the present invention. The figure shows a cross-sectional view of the spring positioning pin in Fig. 9. Referring to Figure 9 and Figure 1, the printing device of the printed circuit board includes a mask 120, a table 100, an elastic support structure 25A, and a doctor unit 16A. The female one elastic branch structure 250 includes a compression unit 242 on the spring 241 and a housing 243 covering the spring 241. Compression unit 12 201014674

The TW5255PA 242 supports the top of the mask 12〇. Although the compression unit 242 is spherical, the invention is not limited thereto. For example, compression unit 242 can be a polygonal shape, such as a rectangle or a diamond. The material of the shrink unit 242 can be plastic or metal. The mask 120 is typically spaced apart from the printed board 110 by a predetermined spacing by the resilient support structure 25Q. However, when the doctor unit (10) moves over the mask, the compression unit 242 presses the spring such as 'by the doctor unit 16' so that the compression unit 242 comes into contact with the spring 241. And the ^ mask W and the printed circuit board 11 are in contact with each other. After the doctor unit (10) is moved, the collapsing unit 242 is pressed down to the spring to return to the previous state by the elastic restoring force. As such, the mask (10) is separated from the printed circuit board 1H by a predetermined distance. In other words, when the printing job is completed, the mask 120 is separated from the printed circuit board 11A. After the brush is finished, there is no need to ride an extra process to divide the printed circuit board UG. In addition, since no additional knife-off process is required, the warp of the mask 12 产生 generated during the separation process can be avoided. The shell 2^43 may be in the shape of a covered ridge 241. At the same time, the housing 243 is resistant to contamination by the soil spring 241* during printing. The mi positioning pin 24G manages the dimensional error, and thus the quality difference caused by the different parts is reduced. Therefore, the elastic support bud: the magazine 2 includes a spring positioning lock 240 having a uniform characteristic. Thus, the rigidity difference ί4 scale 240 can reduce the difference in the degree of printing according to the position of the spring positioning pin μ by reducing the movement position of the blade unit 160. 13 201014674 ,

TW5255PA Further, the spring positioning pin 240 has high heat resistance, flame retardancy, and chemical resistance as compared with other elastomers such as rubber. Further, although not shown in the drawings, the protective member may be coated on the compression unit 242. The protector plays the role of a protection compression unit 242 in the printing process. Since the protective member is made of a material resistant to chemicals and durability, the protective member can also protect the compressing unit 242 during the cleaning process. The protective member is formed of an elastic material. Therefore, the protector prevents the compression unit 242 from damaging the mask 120. For example, the material of the protective member may be enamel resin, acrylic resin, epoxy resin, fluororesin or the like.弹簧 The spring positioning pins 240 of the elastic branch structure 250 are arranged along a long axis direction, and the long axis direction corresponds to the moving direction of the doctor unit 16〇 such that the mask 120 is automatically separated from the printed circuit board 11 () . The resilient support structure 250 can further include a base 230 for securing and supporting the spring positioning pins 240. The base 230 can further include a groove for inserting the spring positioning pin 240. That is, the spring positioning pin 240 can be fixed to the base 230 by being inserted into the groove. The printed circuit board 11 on the table 100 should be spaced apart from the mask 120 by a predetermined distance by elastically supporting the structure 150. Therefore, the elastic support structure 150 must be reset when the table 1 is moved, causing a lot of trouble. To avoid this problem, the base 230 has a fixing member fixed to the table. When the table 100 is moved vertically, the elastic support structure 25 is also moved vertically. Thus, it is not necessary to reset the elastic support structure 250 according to the position of the table 100, thereby simplifying the process. Although the embodiment of the present invention includes the elastic support structure 250, the invention is not limited thereto. For example, the elastic support structure 25A can include an additional 14 201014674

The moving part of the TW5255PA is used to move in the vertical direction simultaneously with the table 100. When the doctor unit 160 moves over the mask 120, the solder fills the opening 121 of the mask 120 such that the bumps are formed in portions of the printed circuit board 11 corresponding to the openings 121. In the process of printing solder, the doctor unit 16 is placed on the elastic support structure 250 and the mask 120 to be compressively moved over the elastic support knot 250 and the mask 120. Hereinafter, a printing process of a printing apparatus according to a fourth embodiment of the present invention will be described in detail with reference to Figs. 11 to 14 . For ease of explanation, the housing of the elastic support structure is not shown in the drawings. Figure U is a side view showing a printing apparatus in accordance with a fourth embodiment of the present invention. Fig. 12 is a cross-sectional view showing a portion a in Fig. 11. Figure 13 is a cross-sectional view showing a portion b in the nth figure. Figure 14 is a cross-sectional view showing a portion C in Fig. 11. Referring to Figures 11 and 12, the printed circuit board 11 is placed on the table 1 of the printing device. The printed circuit board 11A herein includes a plurality of pad pads 111. The pad unit U1 is electrically connected to a circuit layer. However, the circuit layers are not shown in the drawings. The mask 12 having an opening is then aligned over the printed circuit board 11A. Here, the mask 120 is supported by the elastic support structure 250, and the elastic support structure 250 is located at the lower portions of the mask 120. At this time, the mask 12 and the printed circuit board U0 are separated by the elastic supporting structure 250 to a predetermined interval. After the solder 17 is applied to the mask 120, the doctor unit 16 presses the pressure 15 201014674 TW5255PA 12 () to move the Q. At this time, the process of printing the fresh material i7〇 is π 160, and is compressively The elastically-retaining structure 250 and the cover 120 move. The core η is the rb2S 120 before the unit 160 moves over the mask 120. At this time, the mask 120 and the printed circuit board 110 are separated by the impurity structure 25 (four) - a predetermined interval. Please refer to the η to 13th drawings, when the squeegee unit 16 〇 passes through the mask

When the solder is 17G, the unit 16Gm force compresses the elastic branch structure 250' so that the material 12 and the printed circuit board are in contact with each other. At this time, the solder 170 is filled in the opening of the mask 120 to form the bumps 112 on the pad unit of the printed circuit board 110. Referring to Figures 11 through 14, after the blade unit 16 has passed, the resilient support structure 250 is restored to its previous state by the elastic restoring force so that the mask 120 is automatically separated from the printed circuit board 11A.

When the bumps 112 are formed, the mask 120 and the printed circuit board are partially separated. At this time, the mask 120 is less affected by the viscous force of the solder 17 ’ so that the mask 120 can be made public with the printed circuit without warping. In addition, during the printing process, the mask 120 is automatically separated from the printed circuit board 110, so that it is not necessary to consider factors for preventing printing warpage, such as solder viscous force, printing speed, and printing pressure, thereby ensuring Consistency in print quality and improved productivity. In the embodiment of the present invention, the elastic support structures 250 are respectively located at the lower portions of the mask 120. Although the elastic support structure 250 is compressed when the doctor unit 16 is printing the solder, the mask 12 and the printed circuit board 16 are compressed. 201014674

The TW5255PA 110 is in contact with each other. However, after the blade unit 160 is passed, the mask 120 and the printed circuit board 110 are automatically separated from each other by the elastic restoring force of the elastic supporting structure in the portion where the printing work is completed. Accordingly, since the additional process for separating the mask 120 and the printed circuit board 110 is not required, the warpage of the mask 120 occurring in the process of separating the mask 12 and the printed circuit board Π 0 can be prevented, thereby simplifying The process. Further, when the warpage of the mask 120 is avoided, the bumps are prevented from being broken, so that the printed circuit board 110 having a relatively large pitch can be manufactured. Next, a printing apparatus for a printed circuit board according to a fifth embodiment of the present invention will be described. The printing apparatus of the printed circuit board according to the fifth embodiment of the present invention has the same components as the printing apparatus of the fourth embodiment, except for the auxiliary elastic supporting structure. Therefore, in the fifth embodiment of the present invention, the same description as the fourth embodiment will not be repeated, and the same elements will be designated by the same reference numerals. Figure 15 is a cross-sectional view showing a printing apparatus in accordance with a fifth embodiment of the present invention. Referring to Fig. 15, the printing apparatus of the printed circuit board includes a mask 120, a table 1A, an elastic support structure 25A, and a doctor unit 160. The mask 120 has a plurality of openings 121. The table 100 is located below the mask 12〇 and the printed circuit board 110 is placed on the table. The elastic support structures 25 are respectively located at the lower portions of the mask 120, and the elastic support structure 25A includes at least a plurality of parallel alignment spring positioning pins 24A. The doctor unit 16 is moved over the cover 120. The printing device of the printed circuit board may further include a plurality of auxiliary elastic support structures 350. Each of the auxiliary elastic support structures 35 is located on the elastic support 17 201014674

The TW5255PA is placed on the outside of the scraping structure 250. Here, the auxiliary elastic support structure 35 is on the outer side of the cutter unit 160. Pin 340 and auxiliary base 330. The auxiliary base 330 is secured to each of the auxiliary resilient support structures 350 and may include an auxiliary play support support that may include an auxiliary auxiliary spring positioning pin 340. Here, the auxiliary spring positioning lining 34 辅助 auxiliary spring 341, auxiliary compression unit 342, and auxiliary housing 343 compression unit 342 are attached to the auxiliary spring 341. The auxiliary housing 343 is covered with an auxiliary spring 341. In addition, the auxiliary base 330 can be integrated with the base 230 of the elastic branch package 250. The structure of the auxiliary elastic branch structure 350 is used to support the mask 12 〇 + < At the same time, when the mask 120 and the printed circuit board 11 are automatically divided into p, the elastic supporting structure 350 prevents the vibration of the mask 120. In other words: when the printed circuit board 110 is separated from the mask 120, the auxiliary spring positioning pin 340 of the auxiliary elastic support 吸收 absorbs the 350 parts of the surrounding portion of the mask 12 to prevent the vibration of the mask 120 from degrading the printing quality. . Blade Shock In an embodiment of the invention, there is only one auxiliary resilient support structure 35〇 on each elastic support side. However, the present zero externally assists the number of resilient support structures 350. It is not limited in accordance with the present invention that the printing of the printed circuit board includes at least one auxiliary spring iUf structure, thereby preventing the mask from being moved and thereby improving the printing quality. As described above, the printing apparatus of the printed circuit board according to the present invention passes over the undercut of the mask at the lower portions of the mask automatically and away from the mask and the printed circuit board. Therefore, it is possible to prevent the convex soil from being broken due to the warpage of the mask when the mask and the printed circuit board are separated. 18 201014674

TW5255PA Furthermore, since the bumps are prevented from being broken, a printed circuit board having a denser interval can be manufactured. In addition, since the mask and the printed circuit board are automatically separated during the printing process, the influence of the solder's viscosity 'printing speed and printing pressure can be minimized. This ensures consistent print quality and increased productivity. In view of the above, the present invention has been disclosed above in a preferred embodiment, and is not intended to limit the invention. It is common for those skilled in the art to make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is subject to the definition of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a printing apparatus of a printed circuit board according to a first embodiment of the present invention; and FIG. 2 is a side view showing a printing apparatus according to a first embodiment of the present invention. 3 is a cross-sectional view of a portion A of FIG. 2; FIG. 4 is a cross-sectional view of a portion B of FIG. 2; and FIG. 5 is a view showing printing of a printed circuit board according to a second embodiment of the present invention; FIG. 6 is a cross-sectional view showing a printing apparatus for a printed circuit board according to a third embodiment of the present invention; and FIG. 7 is a prior art drawing showing a printing apparatus of a conventional printed circuit board in a printing process. Displacement of the middle mask; 201014674

TW5255PA FIG. 8 is a view showing a displacement of a mask of a printing device of a printed circuit board according to an embodiment of the present invention during printing; FIG. 9 is a cross section of a printing apparatus for a printed circuit board according to a fourth embodiment of the present invention; Figure 10 is a cross-sectional view of the spring positioning pin in Figure 9; Figure 11 is a side view of the printing device in accordance with the fourth embodiment of the present invention; and Figure 12 is a portion A in Figure 11 FIG. 13 is a cross-sectional view showing a portion B in FIG. 11; FIG. 14 is a cross-sectional view showing a portion C in FIG. 11; and FIG. 15 is a view showing printing according to a fifth embodiment of the present invention. A cross-sectional view of a printing device for a circuit board. [Main component symbol description] 100: Table 110: Printed circuit board 111: Pad unit 112: Bump 120: Mask 121: Opening 130, 230: Base 140: Elastomer 150, 190, 250: Elastic support structure 160 : doctor unit 170: solder 20 201014674

TW5255PA

180 Mounting member 240 Spring locating pin 241 Spring 242 Compression unit 243 Housing 330 Auxiliary base 340 Auxiliary spring locating pin 341 Auxiliary spring 342 Auxiliary compression unit 343 Auxiliary housing 350 Auxiliary spring support structure

twenty one

Claims (1)

201014674 VII. Patent application scope: 1. A printing device for a printed circuit board, the device comprising: a mask having a plurality of openings; a table located below the mask for receiving a printed circuit board; Elastic support structures are respectively located at two lower portions of the mask for supporting the mask; and a doctor unit is moved on the mask. 2. The printing device of claim 1, wherein each of the elastic support structures comprises an elastomer for supporting the mask and a base for supporting the elastomer. 3. The printing device of claim 2, wherein the structure comprises a groove for inserting the elastomer. 4. The printing device of claim 2, further comprising: a fixing member for fixing the elastic supporting structure on the table. The printed circuit (4)# is separated from the cover by the rotating support structure. 5. The printing device of claim 1, wherein the printing device £, wherein the printing device for compressing the 'the knuckle-elastic cut structure Γ唷 Γ唷 Scope of the Scope' is attached to the table. Wherein, wherein the printing device of claim i, the 22 201014674 TW5255PA elastic support structure comprises a plurality of spring positioning pins arranged in parallel. 10. The printing device of claim 9, wherein the resilient support structure comprises a base for securing and supporting the spring positioning pin. 11. The printing device of claim 9, wherein each of the spring positioning pins comprises a spring, a compression unit and a casing, the compression unit is located on the spring, and the casing covers the casing spring. 12. The printing device of claim 11, wherein the spring positioning pin further comprises a protective member coated on the compression unit. 13. The printing apparatus of claim 9, further comprising: at least one auxiliary elastic support structure on the outer side of the elastic support structure. twenty three