A7 B7___ 五、發明說明（） 5-1發明領域 本發明是有關於一種測試裝置，特別是有關於一種 可以應用在液晶顯示器（LCD)等產業之測試裝置。然而， 本發明測試裝置並不限定於應用在LCD產業，其他只要能 用到測試的領域，皆屬本發明應用之範圍。 5-2發明背景 請參照第一圖，其繪示為傳統的一種探針總成示意圖， 其中一根一根細細的探計（needle) 12被直接固定在一基座 14上。傳統探針12的放大示意則如第二圖所示，事實上， 該些探針應該是一片一片的，但厚度很薄。此外，該些探 針12從側面看起來，有部分位置16是掏空的，以減少產 生在探針12之間的電容效應。倘若將像第二圖那樣部分掏 空的探針12疊加起來，就是第一圖所繪示的傳統探針總 成。此外，具有探針總成12之傳統測試頭，常用於測試液 晶顯示面板（LCD panel)。 經濟部智慧財產局員工消費合作社印製 ----Γ---^--------- (請先閱讀背面之注意事項再填寫本頁) 然而，請參照第一圖，上述傳統之測試頭有時也會有 損壞的情形而必須作維修。舉例來說，各探針12之間太密 集，因而有時會有污染粒子存於其中而必須清除。此外， 在多次使用以後，各個探針12會因為彎曲變形，而在測試 時發生接觸時間不一致的情形，故需要作π整型π。此外， 傳統測試頭的維修必須將整個測試頭（包括基座）送回原 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 A7 __B7___ 五、發明說明（） 廉，且維修費用較高，維護保養（maintain)也不方便。 綜上所述，吾人將先前技術的做法與缺點大致整理如 下： 1. 對一般測試領域而言，傳統之測試頭（Probe Block) 是由探針所組成。 2. 傳統之測試頭因由探針作電性傳導，其電性傳導能 力較差。 3. 傳統之測試頭其維修必須將整個測試頭（包括基座） 送回原廠，且維修費用較高，維護保養（maintain)也不方便。 4. 傳統之測試頭，是以機械加工的方式製作，而機械 加工有其精密度的極限存在，故所製得之針與針的間距較 大，較不符合輕、薄、短、小之產業趨勢； 5. 請參照第二圖，傳統之測試頭的針在針頭的地方是 —種斜向的構造，用以使針與測試墊$間的接觸良好。然 而，在進行測試時，下壓的力量會因為該斜向構造而分別 產生垂直與水平的分力，其中的水平分力就是會在測試墊 (Pad)上刮出較大面積的原因之一，而且這種水平磨刮（scrub) 的方式對測試墊（Pad)的傷害較大，因而可重測次數較少， 且測試墊（Pad)接合特性較差，不利於後製程。 5-3發明目的及概述 為解決以上所述之缺點，本發明提供一種模組化測試 頭。該模組化測試頭可具有一第一設備、一第二設備和一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------^------裝--- (請先閱讀背面之注意事項再填寫本頁) I . A7 _B7_ 五、發明說明（) 第三設備。其中，第一設備具有複數個測試裝置，該些測 試裝置可以是複數個薄膜凸塊，且每個該些薄膜凸塊上最 好分別配置有緩衝墊；而第二設備係用以對該第一設備提 供測試訊號；至於第三設備則用以懸吊該第一設備和該第 二設備。 根據本發明較佳實施例，上述之第三設備可包括彈簧、 螺絲（screw)、第一懸吊座、第二懸吊座及第三懸吊座等裝 置。其中的彈簧係配置在該第二懸吊座與該第三懸吊座之 間。此外，上述之第三設備更可包括一套蓋裝置，配置在 上述之第一設備和第二設備上。 除此之外，本發明之模組化測試頭更可包括一電路連 接裝置，用以電性連接該第一設備與第二設備。更且，還 可包括一軟板電路總成，電性連接該第二設備。 本發明測試頭具有由薄膜（membrane)所組成的凸塊， 可獲得較佳的電性傳導。此外，本發明之測試頭其第一設 備與第二設備可視作一種類似消耗性元件，故可於生產現 場直接更換。甚者，本發明之測試頭，其製程與半導體廠（Fab) 之積體電路（1C)製程接近，是使用微影蝕刻等技術完成的， 故所製得之凸塊（bump)與凸塊（bump)之間的間距可以很小 (fine pitch)，小到甚至無法用肉目艮辨別，符合輕、薄、短、 小之產業趨勢。更且，本發明之測試頭，其凸塊（bumps)是 以垂直下壓的方式作用在測試墊（Pad)上，故其對測試墊 (pad)之傷害小，可重測次數多，且測試墊（Pad)接合特性較 佳，利於後製程。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------^--------- (請先閱讀背面之注意事項再填寫本頁) 訂丨 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（） 5-4圖式簡單說明 第一圖繪示傳統的一種探針總成示意圖； 第二圖繪示傳統探針的放大示意圖； 第三圖繪示根據本發明實施例，一種模組化測試頭的 立體示意圖； 第四圖繪示根據本發明實施例，一種測試頭的爆炸示 意圖； 第五A圖至第五B圖繪示根據本發明實施例，一種第 —高密度轉接線（High Density Interconnection ; HDI)裝置 的製程流程剖面示意圖； 第六A圖至第六B圖繪示根據本發明實施例，一種第 二HDI裝置的製程流程剖面示意圖；以及 第七圖繪示根據本發明實施例，一種測試頭的剖面示 意圖。 ---------“-------裝--- (請先閱讀背面之注意事項再填寫本頁) 訂-_ 經濟部智慧財產局員工消費合作社印製 圖示標記說明： 12 探針 14 基座 16 部分掏空 17 斜向構造 18 水平分力 19 垂直分力 100 第二HDI裝置 102 凸塊 104 緩衝墊 105 玻璃基底 106 高分子膜 108 金屬線路 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 B7 五、發明說明（） 114a 光阻圖案 114b 光阻圖案 300 懸吊總成 200 驅動1C裝置 302 彈簧 304 螺絲 310 第一懸吊座 312 導針 320 第二懸吊座 322 線性軸承 330 第三懸吊座 340 保護蓋 342 保護蓋螺絲 350 懸吊裝置 353 停止器 360 HDI套蓋 362 導孔 400 第一HDI裝置 405 玻璃基板 406 高分子膜 408 金屬線路 414 光阻圖案 502 軟板電路 500 軟板電路總成 600 HDI總成 504 FPC轉接頭 ---------：------裝—— (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 5-5發明詳細說明 請參照第三圖，其所繪示為根據本發明實施例，一種 模組化測試頭的立體示意圖。本發明結構大致可分成兩個 部分，其中一部份是高密度轉接線總成（High Density Interconnect unit ;以下簡稱HDI總成）600，另一部分則是 懸吊總成（suspension unit)300。 請參照第四圖，其所繪示為根據本發明實施例，一種 測試頭的爆炸示意圖。請參照第三圖與第四圖，懸吊總成 300的組件可分為： 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（） (1)懸吊裝置（Suspension Stage)350，1 系一種支樓用的 結構，可用以懸吊本發明之驅動1C裝置200與第二HDI 裝置100。該懸吊裝置350由上而下更可依序包括一第一 懸用座（Suspension 1)310、一第二懸吊座（Suspension 11)3 20、以及一第三懸吊座（Suspension 111)330。此夕卜，該 懸吊裝置350可更具有線性軸承（Linear guide)322、彈簧 (spring)3 02、以及保護蓋（protect cover)340 等裝置。其中， 彈簧302係在進行測試時，用以提供下壓行程所須要的力， 以確保HDI總成600上的凸塊（bump) 102與待測物的測試 墊（Pad)緊密接觸。另外線性軸承322乃是提供下壓行程的 精確度，使其不致使凸塊102與待測物線路有偏移或對不 準的情形發生。換言之，線性軸承322乃是確保下壓行程 中仍能有直線運動，沒有偏斜，以利凸塊（Bump) 102可定 在待測物線路（Trace)之上。 此外，請同時參照第七圖和第三圖，其中第七圖係繪 示根據本發明實施例，一種測試頭的剖面示意圖。根據該 些圖式，懸吊裝置350可更包括螺絲304，用以調整整個 懸吊裝置350在x-y平面上的偏移量。這項功能乃是用在 當以第二HDI裝置100之凸塊102與待測物線路有微量偏 移時之微調。 甚者，懸吊裝置 350可更包括有一行程螺絲（travel screw)304，用於調整出一個位在第二懸浮座320和第三懸 浮座3 3 0之間的空間，以吸收在待測機台有故障而產生的 過度行程（over travel)。其中，由於第三懸浮座330前端底 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----r---.-------裝--- (請先閱讀背面之注意事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 A7 B7 _ 五、發明說明（） 部設有一停止器（Stopper)353，可使過度行程的吸收得以獲 得控制，以使第二HDI裝置100的凸塊102與待測物免於 受到破壞。 (2)高密度轉接線套蓋（HDI cover ;以下簡稱HDI套 蓋;)3 60，係一種可置換式的模組結構，且配置在本發明之 第二HDI裝置100與驅動1C裝置200上。該HDI套蓋360 上更可具有導孔（Guide Hole)362，可配合第一懸吊座310 底部的導針312，作懸吊裝置（Suspension Stag e)350定位之 用0 請參照第三圖，HDI總成600則可分為： (1) 第一高密度轉接線裝置（以下簡稱第一HDI裝 置；)4〇〇 :或稱界面（interface)轉接板，用於電性連接本發明 之第二HDI裝置100與驅動1C裝置200。 (2) 第二高密度轉接線裝置（以下簡稱第二HDI裝 置；)1 〇〇，其具有複數個探測裝置，例如是複數個實質上向 下垂直於水平面的凸塊102配置在前端。此外，第二HDI 裝置100内可形成有複數個緩衝墊104(第六B圖），分別對 應並配置在每個上述之凸塊102上，用以凸塊102接觸到 不平整的待測物線路時，仍能保持良好的接觸效果。 (3) 驅動積體電路裝置（Driver 1C :或Tape Carrier Package ; TCP，以下簡稱驅動1C裝置）200，用以對第二HDI 裝置提供測試之訊號。此外，該驅動1C裝置200與上述第 二HDI裝置100，可透過第一HDI裝置400作電性連接。 至於配置在此驅動1C裝置200與第二HDI裝置100上的， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)A7 B7___ 5. Description of the Invention (5-1) Field of the Invention The present invention relates to a test device, and more particularly to a test device that can be applied to industries such as liquid crystal display (LCD). However, the test device of the present invention is not limited to the application in the LCD industry, and other fields as long as it can be used for testing are within the scope of application of the present invention. 5-2 Background of the Invention Please refer to the first figure, which is a schematic diagram of a conventional probe assembly, in which a thin needle 12 is fixed directly on a base 14. The enlarged schematic diagram of the conventional probe 12 is shown in the second figure. In fact, the probes should be piece by piece, but the thickness is very thin. In addition, when the probes 12 are viewed from the side, some of the positions 16 are hollowed out to reduce the capacitive effect between the probes 12. If the probes 12 partially hollowed out as shown in the second figure are superimposed, it is the conventional probe assembly shown in the first figure. In addition, the traditional test head with a probe assembly 12 is often used to test LCD panels. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ---- Γ --- ^ --------- (Please read the notes on the back before filling this page) Traditional test heads are sometimes damaged and must be repaired. For example, the probes 12 are so densely packed that sometimes there are contaminating particles in them that must be removed. In addition, after repeated use, each probe 12 will be deformed due to bending, and the contact time will be inconsistent during the test. Therefore, it is necessary to make π integer π. In addition, the maintenance of the traditional test head must return the entire test head (including the base) to the original paper size applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __B7___ V. Description of the invention () It is cheap, and the maintenance cost is high, and maintenance is not convenient. In summary, I have summarized the methods and disadvantages of the prior art as follows: 1. For the general testing field, the traditional probe block is composed of probes. 2. The traditional test head has poor electrical conductivity because it is electrically conducted by the probe. 3. For traditional test heads, the entire test head (including the base) must be returned to the original factory for repair, and the repair cost is high, and maintenance is not convenient. 4. The traditional test head is made by mechanical processing, and there is a limit to the precision of mechanical processing. Therefore, the distance between the needle and the needle produced is larger, which is less suitable for light, thin, short, and small. Industry trend; 5. Please refer to the second figure. The needle of the traditional test head is a kind of oblique structure at the needle position to make the contact between the needle and the test pad $ good. However, during the test, the downward force will cause vertical and horizontal component forces due to the oblique structure, and the horizontal component force is one of the reasons for scraping a large area on the test pad (Pad). In addition, this horizontal scrubbing method has a greater damage to the test pad, so it can be re-tested less frequently, and the test pad's bonding characteristics are poor, which is not conducive to post-processing. 5-3 Purpose and Summary of the Invention In order to solve the disadvantages described above, the present invention provides a modular test head. The modular test head can have a first device, a second device and a paper size applicable to China National Standard (CNS) A4 (210 X 297 mm) --------- ^- ---- Install --- (Please read the precautions on the back before filling this page) I. A7 _B7_ V. Description of the invention () The third device. The first device has a plurality of test devices, and the test devices may be a plurality of thin film bumps, and each of the thin film bumps is preferably provided with a buffer pad respectively; and the second device is used for the first device. A device provides a test signal; as for the third device, the first device and the second device are suspended. According to a preferred embodiment of the present invention, the above-mentioned third device may include devices such as a spring, a screw, a first suspension base, a second suspension base, and a third suspension base. The spring is arranged between the second suspension base and the third suspension base. In addition, the above-mentioned third device may further include a cover device arranged on the above-mentioned first device and second device. In addition, the modular test head of the present invention may further include a circuit connection device for electrically connecting the first device and the second device. Furthermore, it may further include a flexible board circuit assembly electrically connected to the second device. The test head of the present invention has a bump composed of a film (membrane), which can obtain better electrical conductivity. In addition, the first device and the second device of the test head of the present invention can be regarded as a similar consumable component, so they can be directly replaced at the production site. In addition, the test head of the present invention has a manufacturing process close to the integrated circuit (1C) process of a semiconductor factory (Fab) and is completed using lithography and other techniques. Therefore, the bumps and bumps produced are The pitch between bumps can be very small, so small that it cannot even be discerned with the naked eye, and it is in line with the industry trend of lightness, thinness, shortness, and smallness. Moreover, the bumps of the test head of the present invention act on the test pad in a vertical downward manner, so the damage to the test pad is small, and the number of retests is large, and The test pad (Pad) has better bonding characteristics, which is beneficial to the later process. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --------- ^ --------- (Please read the precautions on the back before filling this page ) Order 丨 Printed by A7 B7_, Consumer Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 5-4 Schematic description The first picture shows a schematic diagram of a traditional probe assembly; the second picture shows a traditional probe assembly The third diagram shows a three-dimensional schematic diagram of a modular test head according to an embodiment of the present invention; the fourth diagram shows an exploded schematic diagram of a test head according to an embodiment of the present invention; FIGS. 5A to 5 Figure B is a schematic cross-sectional view of the process flow of a first high density interconnect (HDI) device according to an embodiment of the present invention; Figures 6A to 6B are diagrams showing a method according to an embodiment of the present invention. A schematic cross-sectional view of the manufacturing process of the second HDI device; and a seventh view illustrates a cross-sectional view of a test head according to an embodiment of the present invention. --------- "------- install --- (Please read the precautions on the back before filling out this page) Order-_Icon printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives Description: 12 probes 14 base 16 partially hollowed out 17 oblique structure 18 horizontal component 19 vertical component 100 second HDI device 102 bump 104 cushion pad 105 glass substrate 106 polymer film 108 metal circuit 4 applicable to paper size China National Standard (CNS) A4 specification (210 X 297 mm) A7 B7 V. Description of the invention () 114a Photoresist pattern 114b Photoresist pattern 300 Suspension assembly 200 Drive 1C device 302 Spring 304 Screw 310 First suspension bracket 312 Guide pin 320 Second suspension bracket 322 Linear bearing 330 Third suspension bracket 340 Protective cover 342 Protective cover screw 350 Suspension device 353 Stopper 360 HDI cover 362 Guide hole 400 First HDI device 405 Glass substrate 406 Polymer Film 408 Metal line 414 Photoresist pattern 502 Soft board circuit 500 Soft board circuit assembly 600 HDI assembly 504 FPC adapter ---------: ------ install-(Please read first (Notes on the back, please fill out this page) The detailed description of the 5-5 invention printed by the employee consumer cooperative is shown in the third figure, which shows a three-dimensional schematic diagram of a modular test head according to an embodiment of the present invention. The structure of the present invention can be roughly divided into two parts, one of which is One part is a High Density Interconnect unit (hereinafter referred to as HDI assembly) 600, and the other part is a suspension unit 300. Please refer to the fourth figure, which is shown as the basis An embodiment of the present invention is a schematic diagram of an explosion of a test head. Please refer to the third and fourth figures. The components of the suspension assembly 300 can be divided into: This paper size is applicable to China National Standard (CNS) A4 (210 X 297) (B) A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () (1) Suspension stage 350, 1 is a structure for branch buildings, which can be used to suspend the drive 1C of the present invention. The device 200 and the second HDI device 100. The suspension device 350 may include a first suspension seat (Suspension 1) 310, a second suspension seat (Suspension 11) 3 20, and a Third suspension Suspension 111) 330. Bu this evening, the hanger 350 may have a more linear bearings (Linear guide) 322, a spring (spring) 3 02, 340 and other protective device cover (protect cover). Among them, the spring 302 is used to provide the force required for the downward stroke during the test to ensure that the bump 102 on the HDI assembly 600 is in close contact with the test pad of the object to be tested. In addition, the linear bearing 322 provides the accuracy of the down stroke so that it does not cause the bump 102 to be misaligned or misaligned with the circuit to be measured. In other words, the linear bearing 322 ensures that there can still be linear motion during the down stroke, without deflection, so that the bump 102 can be set on the trace of the object to be measured. In addition, please refer to the seventh figure and the third figure at the same time, wherein the seventh figure is a schematic cross-sectional view of a test head according to an embodiment of the present invention. According to the drawings, the suspension device 350 may further include a screw 304 for adjusting the offset of the entire suspension device 350 on the x-y plane. This function is used for fine adjustment when there is a slight offset between the bump 102 of the second HDI device 100 and the circuit to be measured. Furthermore, the suspension device 350 may further include a travel screw 304 for adjusting a space between the second suspension base 320 and the third suspension base 3 3 0 to absorb the space in the machine under test. Over travel caused by a faulty station. Among them, because the paper size of the front end of the third suspension base 330 is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- r ---.------- install --- ( Please read the notes on the back before filling this page) · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 _ V. Description of the invention () A Stopper 353 is set up in the department to allow the absorption of excessive travel to be obtained Control to prevent the bump 102 and the object under test of the second HDI device 100 from being damaged. (2) HDI cover (HDI cover; hereinafter referred to as HDI cover); 3 60, which is a replaceable module structure, and is configured in the second HDI device 100 and the drive 1C device 200 of the present invention. on. The HDI sleeve cover 360 can further have a guide hole 362, which can be used with the guide pin 312 at the bottom of the first suspension base 310 for positioning of the suspension device (Suspension Stag e) 350. Please refer to the third figure HDI assembly 600 can be divided into: (1) the first high-density transfer wiring device (hereinafter referred to as the first HDI device;) 400: or interface (interface) adapter board, used to electrically connect this Invented second HDI device 100 and drive 1C device 200. (2) The second high-density transfer line device (hereinafter referred to as the second HDI device;) 100, which has a plurality of detection devices, for example, a plurality of bumps 102 substantially downward perpendicular to the horizontal plane are arranged at the front end. In addition, a plurality of cushion pads 104 (sixth B) can be formed in the second HDI device 100, respectively corresponding to and arranged on each of the above bumps 102, so that the bumps 102 can contact the uneven test object. It can still maintain good contact effect when wiring. (3) The driver integrated circuit device (Driver 1C: or Tape Carrier Package; TCP, hereinafter referred to as the driver 1C device) 200 is used to provide a test signal to the second HDI device. In addition, the driving 1C device 200 and the above-mentioned second HDI device 100 can be electrically connected through the first HDI device 400. As for the configuration on the drive 1C device 200 and the second HDI device 100, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)
經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（） 則是之前提及的懸吊總成300。 (4)軟板電路總成502、5 04，電性連接驅動1C裝置 200，可分為軟板電路（Flexible Printed Circuit ; FPC)502， 以及軟板電路轉接頭（FPC Changeable Head ;以下簡稱FPC 轉接頭”04 〇 上述各種HDI裝置100、400的設計，以及它們彼此或 它們與驅動1C裝置200之間連接方式的設計，其最終目的 之一，都是為了使本發明測試頭的HDI總成600，成為一 種可置換的HDI總成，使其得以搭配各種不同懸吊總成 3 00。本發明同時可用在不同針（pin)數、間距（pitch)數之檢 測，故在更換產品時，只須更換HDI總成600即可。 第五A圖至第五B圖繪示根據本發明實施例，一種第 一 HDI裝置的製程流程剖面示意圖。請參照第五A圖，首 先提供一玻璃基板（glass substrate)405。接著，於清洗玻璃 基板405之後，以旋轉塗佈的方式塗佈一層感光性高分子 膜，成形之後再經過高溫燒烤（curing)而得到所要的高分子 保護膜（polymer passivation layer)406，或稱高分子絕緣層 (polymer insulation layer)。然後，以避镀的方式打一·層金 屬層，之後再塗佈一層光阻層，並經曝光顯影後定義出線 路圖案414來。接著，再以電鍍的方式成長出金屬線路408 來。最後再去除光阻，而如第五B圖所示。Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7_ 5. The description of the invention () is the suspension assembly 300 mentioned earlier. (4) Flexible board circuit assemblies 502 and 504, electrically connected to drive the 1C device 200, can be divided into flexible printed circuit (FPC) 502, and flexible board circuit adapter (FPC Changeable Head; hereinafter referred to as FPC adapter "04 〇 The design of the above-mentioned various HDI devices 100 and 400 and the design of the connection methods between them or between them and the drive 1C device 200 is one of the ultimate purposes of the HDI of the test head of the present invention. The assembly 600 becomes a replaceable HDI assembly, enabling it to be used with a variety of different suspension assemblies 3 00. The present invention can be used for the detection of different pin numbers and pitch numbers at the same time, so the product is being replaced In this case, only the HDI assembly 600 needs to be replaced. Figures 5A to 5B show cross-sectional schematic diagrams of the process flow of a first HDI device according to an embodiment of the present invention. Please refer to Figure 5A, first provide a A glass substrate 405. Next, after the glass substrate 405 is cleaned, a photosensitive polymer film is applied by spin coating, and after molding, it is subjected to high-temperature grilling to obtain the desired polymer substrate. Film (polymer passivation layer) 406, or polymer insulation layer (polymer insulation layer). Then, a metal layer is applied in a way that avoids plating, and then a photoresist layer is applied, which is defined after exposure and development. The circuit pattern 414 comes. Then, a metal circuit 408 is grown by electroplating. Finally, the photoresist is removed, as shown in FIG. 5B.
第六A圖至第六B圖繪示根據本發明實施例，一種第 二HDI裝置的製程流程剖面示意圖，其中第二HDI裝置1 00 與第一HDI裝置400(第五B圖）的差異之一，在於第二HDI 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------Ί ------装--- (請先閱讀背面之注意事項再填寫本頁) 訂·- A7 B7_ 五、發明說明（） 裝置100具有凸塊（bump)102與緩衝墊（buffer pad)104。 請參照第六 A 圖，首先提供一玻璃基板（glass substrate) 105。接著，於清洗玻璃基板 105之後，以旋轉 塗佈的方式塗佈一層感光性高分子膜（polymer) 106，再經 高溫燒結及旋轉塗佈，之後再利用曝光顯影等技術將該高 分子膜定義出緩衝堅（buffer pad) 1 04。 在高溫燒烤（curing)之後，再以濺鍍的方式形成一層金 屬導電層，之後塗佈一層光阻並以微影製程定義其圖案 (pattern) 114a，接著以電鍍方式形成金屬線路108。 金屬線路108形成後再以微影方式定義出凸塊（bump) 圖案，並以電鍍方式形成金屬凸塊102。最後再去除光阻 圖案114b、並進行切害1J，即可以得到第二HDI裝置100， 其另一剖面示意圖如第六B圖所繪示。 請繼續參照第七圖，第二HDI裝置100的凸塊102是 以垂直下壓的方式和待測物之測試墊接觸，不會像傳統的 探針（第二圖）會在測試墊上產生水平磨刮（scrub)，故本發 明對測試墊傷害的程度也就減少。 經濟部智慧財產局員工消費合作社印製 ----*---j------裝--- (請先閱讀背面之注意事項再填寫本頁) 關於傳統探針水平磨刮的情形，請參照第二圖所示， 其中傳統探針12在針頭的地方具有一種斜向的構造17, 用以使針12與測試墊之間的接觸良好。然而，在進行測試 時，下壓的力量會因為該斜向構造1 7而分別產生垂直與冰 平的分力19、1 8，其中的水平分力1 8就是會在測試墊（Pad) 上刮出較大面積的原因之一，而且這種水平磨（scrub)的 方式對測試堅（Pad)的傷害較大，因而可重測次數較少。反 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 觀本發明之測試頭（第七圖），其凸塊（bump) 102是以垂直下 壓的方式作用在測試墊（Pad)上，故其傷害小，可重測次數 多，且測試墊（pad)接合特性較佳，較利於後製程。 請回到第六B圖，其所繪示為根據本發明實施例，一 種第二HDI裝置100的剖面示意圖，其中的緩衝墊（buffer pad) 104具有一種細部緩衝之效果。為使熟習該項技術者 得以理解該效果，吾人將其與傳統探針作一比較： 請回到第二圖，其所繪示為傳統探針12的放大示意圖。 傳統探針12針頭具有一種斜向構造 1 7，用以使針頭具有 彈性。然而，這種斜向構造17易在測試墊上造成水平方向 的磨刮（scrub)，是吾人所不願見到的。因此，吾人設計了 另一種彈性機制，也就是第六B圖中的緩衝墊104，以代 替傳統的彈性機制。 更且，在凸塊製程中所製作出來的各個測試凸塊1 02(第 六A圖;)高低可能很難完全相同，亦或者待測物線路本身高 低並不平整，因此本發明之緩衝墊104尚具有吸收上述高 低誤差的功能。換言之，即使待測物本身線路，或本發明 凸塊102有高低不平整的情形，透過吾人所設計的緩衝墊 1 〇4，仍能使該些凸塊102在測試時有平整的效果，進而保 證本產品在進行測試時，每個凸塊 102都能與待測物有接 觸0 應注意的是，本發明之每個凸塊 102不但可以和測試 墊有平整接觸，而且其接觸是一種很良好的接觸。事實上， 在進行測試時，除了凸塊102垂直下壓的力量外，待測物 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -n n n n n t— n n n an I · n n (請先閱讀背面之注意事項再填寫本頁) 訂- 經濟部智慧財產局員工消費合作社印製 A7 B7___ 五、發明說明（） 也會受力而向上頂，以與測試凸塊 102有良好接觸。為了 吸收這股向上頂的力量，本發明在懸吊總成3 00中設計了 彈簧302(—種避震裝置），如第四圖所示，位在第二懸吊座 320和第三懸吊座330之間。因為可吸收較精細行程，故 在第二懸吊座320和第三懸吊座330中可提供較多的犧牲 空間來供彈簧作吸收。 以下吾人將本發明與先前技術作比較分析，以使熟習 該項技術者得以瞭解本發明之功效： 1. 對一般測試領域而言，傳統之測試頭（Probe Block) 其由探針所組成；本發明測試頭則可以由薄膜（membrane) 所組成。 2. 傳統之測試頭因由探針作電性傳導，其電性傳導能 力較差；本發明之測試頭因為是薄膜結構，可獲得較佳的 電性傳導。 3. 傳統之測試頭其維修必須將整個測試頭（包括基座） 送回原廠，且維修費用較高，維護保養（maintain)也不方便； 本發明之測試頭其薄膜部分可視作一種類似消耗性元件， 故可於生產現場直接更換。 4. 傳統之測試頭其針與針的間距較大，較不符合輕、 薄、短、小之產業趨勢；本發明之測試頭，其製程與半導 體廠（Fab)之積體電路（1C)製程接近，是使用微影蝕刻等技 術完成的，故所製得之凸塊（bump)與凸塊（bump)之間的間 距可以很+ (Hne pitch)，小到甚至無法用肉目艮辨別，符合 輕、薄、短、小之產業趨勢。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------------·— (請先閱讀背面之注意事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（） 此外，由於本發明設計上係以微影蝕刻等先進技術製 作所要的凸塊，故其線路間距應用不再受傳統機構方式之 限制，而可達到極細微之可能。 更且，由於由於科技化之趨勢朝輕、薄、短、小之方 向發展，未來電子產品線路間距將逐步縮小，且依據晶圓 製程之發展，其已達到0.13微米之境界，而本發明之特點 之一，即在於可依具產業之發展，製作出符合產業現有及 未來微細線路之需求，且不需增加太多成本。 5.傳統之測試頭的探針對液晶顯示面板（待測物）上之 測試墊（pad)傷害大，因此可重測次數較少且測試墊（Pad接 合特性較差，不利於後製程；反觀本發明之測試頭，其凸 塊Cbump)是以垂直下壓的方式作用在測試墊（Pad)上，故其 傷害小，可重測次數多。 此外，本發明可大量應用於例如液晶顯示器等產品製 程中的檢測，其中包含了薄膜電晶體（Thin Film Transistor ; 以下簡稱TFT)、超扭轉向列式（Super Twist Nematic ;以下 簡稱STN)型等的液晶顯示製品；亦可廣泛應用於微細線路 須進行電性檢測之產品。 甚者，本發明可配合不同的針（pin)數，間距（pitch)數 作修正，故沒有間距（pitch)上的限制。為了配合不同的針 數，可更換懸吊裝置中的彈簧，即可達成因不同針數而需 之不同彈力。另外，本發明模組化的設計，不僅可用在不 同的針數，不同的間距數的需求上；亦可用在相同間距， 但不同針數的檢測上，只要更換HDI總成即可使用。 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） •----r---^--------- (請先閱讀背面之注意事項再填寫本頁) A7 B7_ 五、發明說明（) 更且，本發明結構並不複雜，且其模組化的設計可針 對具磨耗性的消耗元件作更換，故可大量降低成本。這些 成本包括：初期投資成本、維護成本、備用元件庫存成本、 生產維護人力成本、待機時間及待機成本。 總之，近來的科技產品，在一遍輕、薄、短、小，省 能源的聲浪中，已成為這個世代的必須。例如液晶顯示器 (LCD)，亦是為了能滿足這種需求所生，且大量應用到電 腦、電視、行動電話...等等，所以為了確認像液晶顯示器 等產品的品質，在生產過程中無不要求能達到上述需求， 所以在某些生產站上，有必要有檢驗的動作。因此，利用 本發明測試頭之HDI總成，可適用多種懸吊總成。此外， 本發明測試頭，亦可用來測試，故不但維修容易，且可節 省維修時間及維修費用。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 • ^—------J------.— (請先閱讀背面之注意事項再填寫本頁) 訂· · --線· 經濟部智慧財產局員工消費合作社印制衣 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）6A to 6B are schematic cross-sectional views showing a process flow of a second HDI device according to an embodiment of the present invention. The difference between the second HDI device 100 and the first HDI device 400 (fifth B) is shown in FIG. First, it lies in the second HDI. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). -------- 装 ------ Loading --- (Please read the Please fill in this page again before ordering)-· A7 B7_ V. Description of the invention () The device 100 has a bump 102 and a buffer pad 104. Referring to FIG. 6A, a glass substrate 105 is first provided. Next, after cleaning the glass substrate 105, a layer of a photosensitive polymer film 106 is applied by spin coating, and then subjected to high temperature sintering and spin coating, and then using exposure and development techniques to define the polymer film Out of buffer pad 1 04. After high temperature grilling, a metal conductive layer is formed by sputtering, a photoresist is applied, and a pattern 114a is defined by a lithography process, and then a metal circuit 108 is formed by electroplating. After the metal circuit 108 is formed, a bump pattern is defined in a lithographic manner, and the metal bump 102 is formed by electroplating. Finally, the photoresist pattern 114b is removed and cut 1J to obtain a second HDI device 100. Another schematic cross-sectional view is shown in FIG. 6B. Please continue to refer to the seventh figure. The bump 102 of the second HDI device 100 is vertically pressed down to contact the test pad of the object to be tested. It will not produce a horizontal level on the test pad like the traditional probe (second picture). Scrub, so the degree of damage to the test pad by the present invention is reduced. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ---- * --- j ------ pack --- (Please read the precautions on the back before filling this page) For the situation, please refer to the second figure, in which the traditional probe 12 has an oblique structure 17 at the position of the needle to make the contact between the needle 12 and the test pad good. However, when testing, the downward force will generate vertical and ice component forces 19 and 18 respectively due to the oblique structure 17 and the horizontal component force 18 will be on the test pad (Pad). One of the reasons for scraping out a large area, and this horizontal scrubbing method is more harmful to the test pad, so it can be retested less often. The size of the paper is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A7 B7. 5. Description of the invention () View the test head of the invention (picture 7), Its bump 102 acts on the test pad in a vertical downward manner, so it has less damage, can be retested many times, and has better bonding characteristics of the test pad, which is more conducive to post-processing. Please return to FIG. 6B, which is a schematic cross-sectional view of a second HDI device 100 according to an embodiment of the present invention. The buffer pad 104 has a detailed cushioning effect. To enable those skilled in the art to understand the effect, I will compare it with traditional probes: Please return to the second figure, which shows an enlarged schematic diagram of the traditional probe 12. The conventional probe 12 needle has an oblique structure 17 to make the needle elastic. However, this oblique structure 17 easily causes horizontal scrubbing on the test pad, which I would not like to see. Therefore, I designed another elastic mechanism, that is, the cushion pad 104 in Fig. 6B, to replace the traditional elastic mechanism. In addition, the height of each test bump 102 (Figure 6A;) produced in the bump manufacturing process may be difficult to be exactly the same, or the height of the test object line itself is not flat, so the cushion pad of the present invention 104 also has the function of absorbing the above-mentioned high and low errors. In other words, even if the circuit of the object to be tested or the bump 102 of the present invention is uneven, the bumps 102 designed by us can still make the bumps 102 have a flat effect during the test, and then It is guaranteed that when this product is tested, each bump 102 can be in contact with the object to be tested. 0 It should be noted that each bump 102 of the present invention can not only make flat contact with the test pad, but also its contact is very Good contact. In fact, when testing, in addition to the force of the vertical depression of the bump 102, the paper size of the object to be tested applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -nnnnnt— nnn an I · nn ( Please read the notes on the back before filling this page) Order-Printed by A7 B7___, Employee Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. The description of the invention () will also be forced upwards to make good contact with the test bump 102. In order to absorb this upward force, a spring 302 (a kind of suspension device) is designed in the suspension assembly 300 according to the present invention. As shown in the fourth figure, it is located on the second suspension base 320 and the third suspension Suspended between 330. Because the finer stroke can be absorbed, more sacrifice space can be provided in the second suspension bracket 320 and the third suspension bracket 330 for the spring to absorb. In the following, we will compare and analyze the present invention with the prior art, so that those skilled in the art can understand the efficacy of the present invention: 1. For the general testing field, the traditional probe block is composed of probes; The test head of the present invention may be composed of a membrane. 2. The traditional test head has poor electrical conductivity due to the electrical conductivity of the probe; the test head of the present invention can obtain better electrical conductivity because it has a thin film structure. 3. For traditional test heads, the entire test head (including the base) must be returned to the original factory for repair, and the repair cost is high, and maintenance is not convenient; the film part of the test head of the present invention can be regarded as a similar Consumable components can be replaced directly at the production site. 4. The traditional test head has a larger pin-to-pin distance, which is not in line with the industrial trend of light, thin, short, and small; the test head of the present invention, its manufacturing process and semiconductor integrated circuit (Fab) integrated circuit (1C) The process is close, and it is completed using lithographic etching and other techniques. Therefore, the distance between the bump and the bump can be very + (Hne pitch), so small that it can not even be discerned by naked eyes. , In line with the light, thin, short and small industry trends. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --------------- · — (Please read the precautions on the back before filling this page) · Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7_ 5. Description of the invention () In addition, because the invention is designed to produce the bumps required by advanced technology such as lithographic etching, the application of line spacing is no longer affected by traditional institutional methods Restrictions, but can reach extremely subtle possibilities. Moreover, due to the development of technology toward light, thin, short, and small, the spacing of electronic product lines will gradually decrease in the future, and according to the development of wafer processing, it has reached the realm of 0.13 microns, and the invention One of the characteristics is that according to the development of the industry, it can meet the needs of the industry's existing and future micro-circuits without adding too much cost. 5. The probe of the traditional test head hurts the test pad on the liquid crystal display panel (object under test), so it can be re-tested less and the test pad (Pad has poor bonding characteristics, which is not conducive to post-processing; The test head of the invention has a bump (Cbump) which acts on the test pad (Pad) by pressing down vertically, so its damage is small and the number of retests is large. In addition, the present invention can be applied to a large number of products such as liquid crystal displays, including thin film transistors (hereinafter referred to as TFT), super twisted nematic (hereinafter referred to as STN), etc. Liquid crystal display products; can also be widely used in products with micro-circuits that require electrical testing. Furthermore, the present invention can be modified with different numbers of pins and pitches, so there is no limitation on pitches. In order to match different stitch numbers, the spring in the suspension device can be replaced to achieve different elastic forces required for different stitch numbers. In addition, the modular design of the present invention can be used not only for different stitch numbers and different pitch numbers, but also for detection of the same pitch but different stitch numbers, as long as the HDI assembly is replaced. 12 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) • ---- r --- ^ --------- (Please read the notes on the back before filling in this Page) A7 B7_ 5. Description of the invention () Moreover, the structure of the present invention is not complicated, and its modular design can be replaced for wearable consumable components, so the cost can be greatly reduced. These costs include: initial investment costs, maintenance costs, spare component inventory costs, production and maintenance labor costs, standby time, and standby costs. In short, recent technology products have become a must for this generation in a wave of lightness, thinness, shortness, smallness, and energy saving. For example, the liquid crystal display (LCD) is also produced to meet this demand and is widely used in computers, televisions, mobile phones, etc., so in order to confirm the quality of products such as liquid crystal displays, there is no It is not required to meet the above requirements, so inspection action is necessary at some production stations. Therefore, with the HDI assembly of the test head of the present invention, a variety of suspension assemblies can be applied. In addition, the test head of the present invention can also be used for testing, so it is not only easy to maintain, but also saves maintenance time and costs. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application. • ^ —------ J ------.— (Please read the precautions on the back before filling out this page) Order · ·-Line · Printed clothes by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Paper size applies to China National Standard (CNS) A4 (210 X 297 mm)