經濟部中央標準局員工消費合作社印裝 474779 A7 ____ B7 五、發明説明（1 ) 【發明領域】 *本發明係有關於-種並菜栽植方法，尤指一種在除葉韭 菜上鋪蓋-層遮光層，以使莖部增長成長的栽植方法。 【習知技術說明】 -般絲可為三種，分別為花韭菜、韭黃及葉韭菜，其 中該韭黃及葉韭菜可食用的部位分別為莖部及葉部，以葉韭 菜而言’其栽植過程只是將韭菜種苗栽植後，並施以適當的 肥料與灌规’經過4〜6個月長成後，即可採收，然而習知 的栽植方法所長成的韭菜，其莖部因直接受陽光照射，而會 提前分葉形成葉部，致使莖部如附件一韭菜的白色部份所示 較為短小，而由☆韭菜在品質的評定上係端看莖部的長短而 定，且韭菜的莖部在食用的口感也較葉部為佳，而以目前栽 植韭菜的方法，尚無法使韭菜的莖部長度有效增長，以提昇 並菜品質，本案發明人有雲於此，乃潛心研究，終有本發明 產生。 【發明概要】 本發明之目的，即在提供—種可增長韭菜莖部，以提昇 韭菜品質的栽植方法。 本發明增長莖部的韭菜栽植方法，包含有一栽植種苗步 驟、一割除步驟及一鋪蓋步驟，其中： 該栽植種苗步驟，係將韭菜種苗植栽於土壤中並經一 段時間後長成初始韭菜； 該割除步驟，係將初始韭菜長於土壤上方的部位割除， 而使初始韭菜形成為除葉韭菜； 第3頁 (請先閱讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準（匚灿）八4規格（21(^297公楚） 經濟部中央標準局員工消費合作‘社印製 A7 -------B7 五、發明説明（2 ) ' 該鋪蓋步驟，係在除葉韭菜上方鋪蓋一遮光層； 该除葉韭菜的莖部可成長穿經遮光層，並在遮光層上方 繼續刀葉成長，藉此増長莖部的長度，進而提昇症菜的品質。 【圖式之簡單說明】 本發明之其他特徵及優點，在以下配合參考圖式之較佳 實施例的詳細說明中，將可清楚的明白，在圖式中： 第一圖係本發明一較佳實施例的流程圖。 第一圖係本發明一較佳實施例一剖視圖，說明除葉韭菜 上鋪蓋一遮光層。 第二圖係本發明一較佳實施例另一剖視圖，說明韭菜穿 過遮光層長成的狀態。 附件一係為以習知方法栽植的韭菜的相片。 附件二係為以本發明一較佳實施例的栽植方法栽培出 的韭菜的相片。 附件二係為附件一、二所示的韭菜相比較的相片。 【較佳實施例之詳細說明】 參閱第一圖，本發明韭菜栽植方法，其主要目的係用以 栽植出莖部較長的韭菜，進而提昇韭菜的品質及食用的口 感，為達到前述目的，其包含有一栽植種苗步驟i、一割除 步驟2及一鋪蓋步驟3，其中： 該栽植種苗步驟1，係將韭菜種苗植栽於土壤中，並施 以適當的施肥及灌慨，大約經過4〜ό個月後，此韭菜種苗 即長成初始韭菜。 配合參閱第二圖，該割除步驟2，係將初始韭菜長於土 第4頁 本紙張尺度適用中國國家標準（CNS ) Α4規格（2】0Χ297公楚） ----'1------ (請先閱讀背面之注意事項再填寫本頁) -訂 經濟部中央標準局員工消費合作社印製 第 A7 B7 五、發明説明（3 ) ~ 一-- 壤上方的部位騎’岐初始轉形成為除葉絲4，此時 該除葉韭菜4具有較強壯的根部41與短莖部42。 該鋪蓋步驟3,係在除葉韭菜4上方鋪蓋一遮光層5, 此遮光層5可遮擋陽光直接照射除葉韭菜4的短莖部42， 而該遮光層5可選用碎椰子殼、泥碳土、稻殼、木屑或泡棉 所鋪設而成。 配合參閱第三圖’經過上述各步驟後，再歷經大约兩個 月適當的灌溉及施肥，在此兩個月中，該除葉韭菜4的根部 41足以吸收養份，使除葉韭菜4的短莖部42能夠成長穿過 遮光層5，而長成具有長莖部61的韭菜6。 值得進一步說明的是，一般除葉後的韭菜生長特性是先 由短莖部42長成，在短莖部42不直接受陽光照射的情況 下：該短莖部42可繼續成長為長莖部6卜並穿突出遮光層 5爻陽光直接照射後開始分葉’也就是說，在此階段，即開 始葉部62的成長，待長成後，利用收割卫具由土壞與遮光 層5間將韭菜6的長莖部61切斷，即可將韭菜6由遮光層 5上方抽出，而此收割後的韭菜6,其長莖部61長度大約可 達18〜20公分長，如附件二所示，再由附件三比較可知， 本發明所栽植出的絲6明顯較以習知栽植方法栽植而成 的韭菜莖部長，除此之外，韭菜6整體的高度也較高，因此， 本發明的方法栽植而成的韭菜6,確實可達到提高韭菜品質 之功效。 上述遮光層5的鋪設高度經實驗，最佳高度為18〜2〇 公为，其理由是：超過2〇公分雖然仍可培育出更長莖部的 頁 (請先閱讀背面之注意事項再填寫本頁) 衣- 本紙張尺舰财ϋ準（CNS) Α4規格（210χ297^· 丨 ly A7 B7 五、發明説明（4 ) 韭菜’但該遮光層5的透光率舍士沾丁议 尤年會大幅下降，反而使短莖邻 42成長驅於遲緩’因此’該遮光層5高度不宜超過20公八 更進-步說明’當韭菜6收割後，其剩餘刀 續成長，直到老化為止。 厂崔 綜觀上述，本發明增長莖部的迫菜栽植方法，的確能培 植出較長莖部的韭菜’而達到提昇韭菜品質之功效；亦即， 本發明前述步驟不僅新穎、進步，更可供產業上利用。 惟以上所述僅為本發明較佳可行實施例，舉凡熟習此項 技藝人仕，其依本發明精神範疇所作之修飾或變更，均理應 包含在本案申請專利範圍内。 • HI _ --1--- (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 474779 A7 ____ B7 V. Description of the Invention (1) [Field of Invention] * The present invention relates to a method of planting and cultivating vegetables, especially a method of covering the leaves with a light-proof layer. Layer to grow the stems. [Known technical description]-There are three types of silk, which are flower leek, leek, and leaf leek. The edible parts of the leek and leaf leek are the stem and leaf, respectively. In the case of leaf leek, its planting process Only after the leek seedlings are planted and applied with appropriate fertilizers and irrigation rules, they can be harvested after 4 to 6 months of growth. However, the stems of the leek grown by the conventional planting method are directly exposed to sunlight. Irradiate, and the leaves will be divided in advance to form leaves, so that the stem is shorter as shown in the white part of the leek in Annex 1. The quality of the leek depends on the length of the stem, and the stem of the leek The taste of the edible part is better than that of the leaves. With the current method of planting chives, the length of the stem of the chives cannot be effectively increased to improve the quality of the vegetables. The inventor of this case has the wisdom to study this. There is the present invention. [Summary of the Invention] The object of the present invention is to provide a planting method capable of increasing the quality of leeks by increasing the length of leeks. The leek planting method for growing stems of the present invention includes a step of planting seedlings, a cutting step, and a covering step, wherein: the step of planting seedlings is to plant leek seedlings in the soil and grow into the initial leek after a period of time; This cutting step is to remove the initial leek that is longer than the soil, so that the initial leek is formed as a leaf-removing leek. Page 3 (Please read the precautions on the back before filling this page)匚 Chan) 8 specifications (21 (^ 297 Gongchu) Consumer Co-operation of the Central Standards Bureau of the Ministry of Economic Affairs 'printed by the society A7 ------- B7 V. Description of the invention (2)' The laying step is to remove A light-shielding layer is covered on the leaf leek; the stem of the de-leaved leek can grow through the light-shielding layer, and continue to grow leaves on the light-shielding layer, thereby lengthening the length of the stem and thereby improving the quality of the disease. Brief Description] Other features and advantages of the present invention will be clearly understood in the following detailed description of the preferred embodiments with reference to the drawings. In the drawings, the first diagram is a first The first diagram is a cross-sectional view of a preferred embodiment of the present invention, illustrating a light-shielding layer on the leek removing leaf. The second diagram is another cross-sectional view of a preferred embodiment of the present invention, illustrating the leek passing through The state of the light-shielding layer is grown. Attachment 1 is a photo of leeks planted by a conventional method. Attachment 2 is a photo of leeks cultivated by a planting method according to a preferred embodiment of the present invention. Attachment 2 is an appendix 1. Comparative photos of leeks shown in Figure 2. [Detailed description of the preferred embodiment] Referring to the first figure, the main purpose of the leeks planting method of the present invention is to plant leeks with longer stems, thereby improving the quality of leeks. In order to achieve the aforementioned purpose, it includes a step i of planting seedlings, a step of removing 2 and a step of covering 3, wherein: the step of planting seedlings is to plant leek seedlings in the soil and apply appropriate After about 4 to 6 months of fertilization and irrigation, the leek seedlings have grown into the initial leek. Refer to the second figure for the removal step 2. The initial leek is longer than the soil on page 4 This paper size applies to China National Standard (CNS) Α4 specifications (2) 0 × 297 Gongchu ---- '1 ------ (Please read the notes on the back before filling this page)-Set the central standard of the Ministry of Economic Affairs A7 B7 printed by the Bureau ’s Consumer Cooperatives V. Description of the Invention (3) ~ 1-The part above the soil is initially transformed into a shredded leaf 4, and the leeked leaf 4 has a strong root 41 and Short stem part 42. In the covering step 3, a light-shielding layer 5 is covered above the leaf-removing leeks 4. This light-shielding layer 5 can block the sun and directly irradiate the short stem-receiving parts 42 of the leaf-removing leeks 4. The light-shielding layer 5 can be crushed Coconut shell, peat soil, rice husk, wood shavings or foam. Lay it together. Refer to the third picture after going through the above steps, and then go through about two months of proper irrigation and fertilization. During these two months, The root portion 41 of the leaf-removing leek 4 is sufficient to absorb nutrients, so that the short stem portion 42 of the leaf-removing leek 4 can grow through the light-shielding layer 5 and grow into a chive 6 having a long stem portion 61. It is worth further explaining that the general growth characteristics of leeks after leaf removal is that the short stem portion 42 is first grown, and when the short stem portion 42 is not directly exposed to sunlight: the short stem portion 42 can continue to grow into a long stem portion 6 and the protruding light-shielding layer 5 爻 The leaves begin to split after direct sunlight '. That is to say, at this stage, the growth of the leaf portion 62 begins. After the growth is completed, the harvesting harness is used to remove the soil between the soil layer and the light-shielding layer 5. After cutting the long stem portion 61 of the leek 6, the leek 6 can be extracted from above the light-shielding layer 5, and the length of the long stem portion 61 of the harvested leek 6 can be about 18-20 cm, as shown in Annex 2. It can be seen from the comparison of Annex III that the silk 6 planted by the present invention is obviously higher than the leek stems grown by the conventional planting method. In addition, the overall height of the leek 6 is also higher. Therefore, the present invention The chives planted in the 6 method can indeed improve the quality of chives. The height of the above-mentioned light-shielding layer 5 has been experimentally tested, and the optimal height is 18 to 20 cm. The reason is that although it is longer than 20 cm, pages with longer stems can still be cultivated (please read the precautions on the back before filling out) (This page) Clothing-This paper ruler Caishang Standard (CNS) A4 specification (210x297 ^ · 丨 ly A7 B7 V. Description of the invention (4) Leek 'but the light transmittance of the light-shielding layer 5 It will drop sharply, but it will slow the growth of the short-stemmer 42. Therefore, 'the height of the light-shielding layer 5 should not exceed 20 meters. Step-by-step description' When the leek 6 is harvested, its remaining knife continues to grow until it ages. According to Cui's observation above, the forced vegetable planting method for growing stems of the present invention can indeed cultivate chives with longer stems to achieve the effect of improving the quality of chives; that is, the foregoing steps of the present invention are not only novel and progressive, but also can be used by the industry However, the above is only the preferred and feasible embodiment of the present invention. For those skilled in the art, any modifications or changes made in accordance with the spirit of the present invention should be included in the scope of patent application in this case. HI _ --1 --- (Please Read the back of the precautions to fill out this page)
、1T 經濟部中央標準局員工消費合作社印製 第6頁 ㈣張尺度適财 474779 A7 B7 五、發明説明（5 ) 【元件標號對照】 1 栽植種苗步驟 42 短莖部 2 割除步驟 5 遮光層 3 鋪蓋步驟 6 韭菜 4 除葉韭菜 61 長莖部 41 根部 62 葉部 I . I I n 訂 ; I (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 頁 7 第 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）， 1T Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs, page 6 Zhang Zhangshi Shicai 474779 A7 B7 V. Description of the invention (5) [Element number comparison] 1 Step of planting seedlings 42 Short stem part 2 Cutting step 5 Shading layer 3 Covering step 6 Chinese chives 4 Chinese chives 61 Long stems 41 Roots 62 Roots 62 I. II n Order; I (Please read the precautions on the back before filling out this page) Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X297 mm)