474100 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 發明之背景 1.發明之 本1明係關於-種影像感測器封裝結構及其封震方法， 更具體而言，係關於直接將玻璃蓋板覆蓋在晶圓片上之$ 像感測器所形成的一種封裝結構及其方法。 ^ 2·先前技％之說明 影像感測器可以在空間中檢測光源並且將之轉換為電子 訊號’已經廣泛應用在各種光電產品中，而且為二= 件〈。多數個影像感測器形成於晶圓片上，經切割 個影像感測器，必須進一步加以封裝，而如何因應 袒溥短小的要求，有效地簡化封裝流程以及 1裝結構的尺寸，是業«常«的課題。 習知影像感測器封裝結構如圖j至圖3所示。如圖！所示， 影像f測器1係固^在具有—高度的封裝基板2上，經以一 玻璃盖3覆蓋後形成—影像感測器封裝結構；其中導線引腳 ϋ影像感測器！的内部電路與外界導通，其俯视圖則如 :2所不。圖3所示則為進一步將該影像感測器封裝結構封 ^在一印刷電路板5上。 習知的影像感測器封裝結構具有一些缺點，例如封裝基 ^與破瑪蓋佔據較大體積使得封裝結構無法進—步縮小， 衣造過程需要額外的封裝基板材料而且玻璃蓋用量較高， :且：像感測⑨無法直接接合到印刷電路基板，製造步驟 :比=多二對於要求輕薄短小且迅速多變的半導體封裝產 果而Τ ’實有必要發明一更先進的封裝結構以及方法以克 Μ氏張尺度翻（CNS)A4祕（2W χ --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) ^4i〇〇 A7 B7 五、 發明說明（ 服上述缺點。 發明之概述 本發明之一目的在提供一種影像感測器封裝結構及其封 裳方法，其主要係在影像感測器的光接收區周圍提供_用 以接著玻璃蓋的封裝接著劑，並且將玻璃蓋直接覆蓋在該 光接收區的上面，可以提高封裝效率以及提高影像感測器 封裝結構的良率，並且可以縮小封裝結構的尺寸，達到晶 粒級封裝（chip scaie package，CSP)的要求，更適合未 來高積集密度影像感測器封裝的應用，甚至將各種功能整 口到一顆晶粒上的單晶片系統（SyStem 0n a chip)，進而 達到輕薄短小的目的，以應用在行動電話或筆記型電腦 等。 本發明所揭7F之影像感測器封裝結構及其封裝方法能夠 整合級Klevel D以及級„Uevel 11}的封裝，達到晶才:位 於基板上（chip on board，c〇B)的要求，並且可以避免製 造過程的污染’而更由於破璃蓋、直接附著在影像感測器 的晶圓片丨，玻璃的應力可以分攤到晶圓片上，因此玻璃 蓋板的厚度可以降低。 進-步而言，本發明可以因應未來發展趨勢，由四邊接 合墊的設計轉向兩邊接合墊的設計。 為達成上述目的並避免先前技藝的缺點，本發明揭于一 種影像感測器封裝結構，包含： θ询$ (1) 一影像感測器，具有_朵垃 ., 光接收面以及—底表面，· JL中 該光接收面上包含： w _ 丁 本纸張尺度_鮮（CNS)A4驗 (請先閱讀背面之注意事項再填寫本頁) --------^---------'^一 經濟部智慧財產局員工消費合作社印製 ^41〇〇 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（3 ) (a) —光接收區，具有多數個感光元件，用以接收光源並 將之轉換成電子訊號； (b) —接著劑，形成於孩光接收區之周圍；以及 (c) 多數個接合整，其係形成於該接著劑之外緣； 以及 (2) —覆蓋於該影像感測器上之玻璃蓋，約略大於該接著 劑與光接受區所形成之區域且保持該等接合塾裸露，並且 貼合上該接著劑以密封該光接收區。 本發明更揭示一種形成上述影像感測器封裝結構的封裝 方法，包含下列步驟： (1)於一晶圓片上形成多數個影像感測器，其中，每一個 W像感測器具有一光接收面以及一底表面，且於該光接收 面上形成有一具有多數個感光元件之光接收區，用以接收 光源並將之轉換成電子訊號，以及形成於該光接收區外緣 至少一側邊之多數個接合墊； (2)於每個影像感測器之該光接收區周圍形成一接著劑， 其中，在每一個影像感測器上具有接合墊之光接收區的侧 邊，該接著劑係介於該光接收區侧邊與該等接合塾之間； (^ )覆蓋一玻璃盍板於該晶圓片上，使該玻璃蓋板貼合上 該接著劑，俾以密封每一影像感測器之光接收區；以及 (4)切割該晶圓片，以形成多數個影像感測器封裝結構。 圖式簡單說明 根據下列實施例配合圖式的詳細說明，本發明之上述與 其他目的、優點以及達成方式將更加清楚，其中： -6 - 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ' "'~ ---------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 474100 經濟部智慧財產局員工消費合作社印制π A7 五、發明說明（4 ) 圖1係習知影像感測器封裝結構之副面圖； 圖2係習知影像感測器封裝結構之俯視圖； 圖3係上述習知影像感測器封裝結構構裝在印刷電路板上 之剖面圖； 圖4係根據本發明之一實施例實施之影像感測器封裝結構 的侧視圖； 圖5係圖4之影像感測器封裝結構的俯視圖； 圖ό係本發明影像感測器封裝結構構裝在基板上之剖面 圖；以及 圖7a至圖7d係製造本發明之影像感測器封裝結構之步驟 的示意圖，其中， 圖7a例示形成接著劑在晶圓片上影像感測器的周圍； 圖7b例示圖7a之晶圓片上部分影像感測器的放大圖； 圖7 c例示將玻璃蓋板貼合至晶圓片；以及 圖7 d例示進行切害ij。 圖式元件符號說明 1 影像感測器 2 封裝基板 3 玻璃蓋 4 導線引腳 5 印刷電路板 11 影像感測器 12 玻璃蓋 13 接著劑 14 光接收區 1 5 接合塾 16 基板 17 導線引腳 18 保護層 19 晶圓片 20 玻璃蓋板 2 1 切割鋸 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公爱) -- --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 474100 A7 B7 I - 五、發明說明（5 ) 較佳具體實例之說明 首先’请參考圖4及5所例示之本發明之一具體實施例。 圖4所示為影像感測器封裝結構的侧面圖，玻璃蓋丨2是直接 覆蓋在影像感測器1 1之上，且兩者之間有一段位移而非完 全重疊，以露出影像感測器11上的接合墊15，如圖5所示。 請參考圖5。影像感測器1 1具有一光接收面以及一底表 面’為光接收面上包含一光接收區1 4、形成於該光接收區 1 4周園之接著劑1 3、以及形成於該接著劑〖3外緣之多數個 接合墊15。該光接收區14具有多數個感光元件，用以接收 光源並將之轉換成電子訊號，以達到影像感測的功能。 接著劑13係用以將玻璃蓋12黏著在影像感測器1丨之上， 並且得以將該光接收區1 4封閉於由玻璃蓋丨2與黏著劑丨3所 形成的密閉空間之中，其可以使用一般的樹脂，例如矽膠 (sillcon)、紫外線樹脂（uv ep〇xy)或環氧樹脂等。 接合塾1 5係用以將影像感測器1 1的内部電路與外部電路 連接，一般可以見到的形式是排列在光接收區丨4的四周， 於本實施例中，則是將接合墊15佈置在光接收區14相互相 鄰的兩侧邊，且位於同一側邊的接合墊有兩排，彼此交 錯，以利於後續導線引腳的構裝。接合墊丨5是位於接著劑 13的外緣側邊，以避免被玻璃蓋12所掩蓋，其排列形式可 以是位於該接著劑丨3外緣的一側邊或多個侧邊，而每一侧 邊的排列數可以是單數個也可以是多個。 該影像感測器封裝結構之玻璃蓋12，其約略大於該接著 劑1 3與光接受區丨4所形成之區域且保持該等接合墊1 5裸 ---------------------訂--------- (請先閱讀背面之注意事項再填寫本頁)474100 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (Background of the invention 1. The invention of the invention is about a kind of image sensor package structure and its method of sealing, more specifically, the system A packaging structure formed by an image sensor that directly covers a glass cover on a wafer and a method thereof. ^ 2. Description of the prior art The image sensor can detect a light source in space and convert it into The electronic signal has been widely used in various optoelectronic products, and it is two pieces. The majority of image sensors are formed on wafers. After cutting an image sensor, it must be further packaged. Requirements, which effectively simplify the packaging process and the size of the 1-pack structure, are the common problems of the industry. The packaging structure of the conventional image sensor is shown in Figures j to 3. As shown in Figure! 1 is fixed on a packaging substrate 2 having a height, and is covered with a glass cover 3 to form an image sensor package structure; the lead pins of the image sensor! The internal circuit is connected to the outside world, The top view is as shown in Figure 2. Figure 3 shows the packaging structure of the image sensor on a printed circuit board 5. The conventional packaging structure of the image sensor has some disadvantages, such as packaging. The large size of the substrate and the Poma cover make the packaging structure incapable of further shrinking. The garment manufacturing process requires additional packaging substrate materials and a high amount of glass cover. And: like the sensing sensor, it cannot be directly bonded to the printed circuit substrate. Manufacturing steps: ratio = more than two For the packaging of semiconductors that require lightness, thinness, shortness, and rapid change, it is necessary to invent a more advanced packaging structure and method (CNS) A4 secret (2W χ) -------------------- Order --------- line (Please read the notes on the back before filling in this page) ^ 4i〇〇A7 B7 V. Description of the invention (Serving the above disadvantages. Summary of the invention An object of the present invention is to provide an image sensor package structure and a method for sealing the same, which are mainly provided around the light receiving area of the image sensor for subsequent use. Encapsulant for glass cover, and cover the glass cover directly to the light receiving The above can improve the packaging efficiency and the yield of the image sensor package structure, and can reduce the size of the package structure to meet the requirements of the chip scaie package (CSP), which is more suitable for future high-accumulation density images The application of the sensor package, even a single-chip system (SyStem 0n a chip) with various functions on a die, thereby achieving the purpose of lightness, thinness, and shortness, and is applied to mobile phones or notebook computers. The disclosed image sensor package structure and packaging method of 7F can integrate the package of level Klevel D and level „Uevel 11}, and meet the requirements of chip: board on board (COB), and can be avoided The pollution of the manufacturing process is caused by the broken glass cover and the wafer directly attached to the image sensor. The stress of the glass can be spread on the wafer, so the thickness of the glass cover can be reduced. Further, according to the present invention, the design of the four-sided bonding pads can be changed to the design of the two-sided bonding pads in accordance with the future development trend. In order to achieve the above object and avoid the disadvantages of the prior art, the present invention discloses an image sensor package structure including: θ inquiry $ (1) An image sensor with a _Door., Light receiving surface and-bottom surface , · The light receiving surface in JL contains: w _ Ding Ben paper size _ fresh (CNS) A4 inspection (please read the precautions on the back before filling this page) -------- ^ --- ------ '^ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ 41〇〇 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3) (a) — light receiving area, Has a plurality of photosensitive elements for receiving a light source and converting it into an electronic signal; (b) a bonding agent formed around the light receiving area; and (c) a plurality of bonding units formed on the bonding agent Outer edge; and (2) —the glass cover covering the image sensor is slightly larger than the area formed by the adhesive and the light receiving area and the joints are exposed, and the adhesive is applied to The light receiving area is sealed. The present invention further discloses a packaging method for forming the above-mentioned image sensor packaging structure, including the following steps: (1) forming a plurality of image sensors on a wafer, wherein each W image sensor has a light receiving surface And a bottom surface, and a light receiving area having a plurality of photosensitive elements is formed on the light receiving surface for receiving the light source and converting it into an electronic signal, and is formed on at least one side of the outer edge of the light receiving area A plurality of bonding pads; (2) forming an adhesive around the light receiving area of each image sensor, wherein each image sensor has a side of the light receiving area of the bonding pad, the adhesive It is between the side of the light-receiving area and the joints; (^) A glass plate is covered on the wafer, and the glass cover is attached to the adhesive to seal each image. The light receiving area of the sensor; and (4) cutting the wafer to form a plurality of image sensor packaging structures. Brief description of the drawings According to the following examples and detailed descriptions of the drawings, the above and other objects, advantages and ways of achieving the present invention will be more clear, among which: -6-This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) '"' ~ --------------------- Order --------- line (Please read the note on the back first Please fill in this page again) 474100 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs π A7 V. Description of the invention (4) Figure 1 is a side view of the packaging structure of a conventional image sensor; Figure 2 is a conventional image sensor 3 is a cross-sectional view of the conventional image sensor package structure mounted on a printed circuit board; FIG. 4 is a side view of the image sensor package structure according to an embodiment of the present invention Figure 5 is a top view of the image sensor package structure of Figure 4; Figure 6 is a cross-sectional view of the image sensor package structure of the present invention mounted on a substrate; and Figures 7a to 7d are the image sensors of the present invention Schematic diagram of the steps of the device packaging structure, wherein FIG. 7a illustrates the formation of an adhesive on a wafer Around the image sensor; an enlarged view of a portion of the image sensor illustrated in FIG. 7b of FIG. 7a wafer; FIG. 7 c illustrates a glass cover plate bonded to the wafer; FIG. 7 d and illustrates for cutting harmful ij. Description of Symbols of Graphic Components 1 Image sensor 2 Package substrate 3 Glass cover 4 Lead pins 5 Printed circuit board 11 Image sensor 12 Glass cover 13 Adhesive 14 Light receiving area 1 5 Bonding 塾 16 Substrate 17 Lead pins 18 Protective layer 19 Wafer 20 Glass cover 2 1 Cutting saw The paper size is applicable to China National Standard (CNS) A4 (21〇X 297 public love)--------------- ------ Order --------- line (please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 474100 A7 B7 I-V. Description of the invention ( 5) Description of a preferred specific example First, please refer to a specific embodiment of the present invention illustrated in FIGS. 4 and 5. Figure 4 shows a side view of the packaging structure of the image sensor. The glass cover 2 is directly over the image sensor 1 and there is a displacement between the two rather than completely overlapping to expose the image sensor. The bonding pad 15 on the device 11 is shown in FIG. 5. Please refer to Figure 5. The image sensor 11 has a light-receiving surface and a bottom surface. The light-receiving surface includes a light-receiving region 14, an adhesive 13 formed in the light-receiving region 14, and a film formed on the adhesive.剂 〖3 outer edge of the plurality of bonding pads 15. The light receiving area 14 has a plurality of photosensitive elements for receiving light sources and converting them into electronic signals to achieve the function of image sensing. The adhesive 13 is used to adhere the glass cover 12 to the image sensor 1 丨, and the light receiving area 14 can be enclosed in a sealed space formed by the glass cover 2 and the adhesive 丨 3. It can use common resins, such as sillcon, UV resin, epoxy resin, and the like. The joint 塾 15 is used to connect the internal circuit of the image sensor 11 to the external circuit. Generally, the form can be seen around the light receiving area 丨 4. In this embodiment, the joint pad 15 is arranged on two sides adjacent to each other in the light receiving area 14, and there are two rows of bonding pads on the same side, which are staggered with each other to facilitate the subsequent assembly of the lead pins. The bonding pad 5 is located on the outer edge side of the adhesive 13 to avoid being covered by the glass cover 12. The arrangement form can be one or more sides on the outer edge of the adhesive 3, and each The number of permutations on the side may be singular or plural. The glass cover 12 of the image sensor packaging structure is slightly larger than the area formed by the adhesive 13 and the light receiving area 丨 4 and keeps the bonding pads 15 bare ----------- ---------- Order --------- (Please read the notes on the back before filling this page)
474100 經濟部智慧財產局員工消費合作社印製 A7 ____B7_______ 五、發明說明（6 ) 露’並且貼合上該接著劑1 3以密封該光接收區1 4。由於玻 璃蓋1 2係以接著劑1 3直接固定在影像感測器上，故可以大 幅縮小封裝結構的尺寸，而且在影像感測器1 1的形成過程 中直接進行玻璃蓋1 2的構裝，不僅製程更簡便，而且可以 避免污染，進一步更能提昇產品的良率。再者，由於玻璃 蓋1 2的尺寸縮小，而且部分應力得以由影像感測器丨丨承 受，因此，玻璃盖1 2的厚度可以降低，無論是體積或是重 量皆得以進一步縮小。 如圖6所示，係將本發明影像感測器封裝結構構裝在基板 上’ W像感測器封裝結構更包含一基板1 6以及多數個導線 引腳1 7 ’使遠影像感測器之底表面貼合在該基板1 6上，且 咸等導線引腳1 7之一端連接該等接合整（如圖5所示之標號 1 5 )，另一端則連接至該基板1 6，用以連接並導通影像感測 器1 1内部的電路至外部電路，而該基板丨6於較常應用的情 況中係一印刷電路板。該影像感測器封裝結構，為了進一 少保謾導線引腳1 7，更包含一保護層丨8分布在該影像感測 器Π具有接合墊的週邊，並且覆蓋包裹以保護該等導線引 腳1 7。 接著凊參考圖7 a至7 d說明本發明所揭示一種形成上述影 像感測器封裝結構的封裝方法。 首先，如圖7a所示，提供一晶圓片μ ’其上形成多數個 影像感測器11，該晶圓片丨9的局部放大圖則如圖7b所示， 其中，每一個影像感測器1丨具有一光接收面以及—底表 面，且於該光接收面上形成有一具有多數個感光元件之光 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱 (請先閱讀背面之注意事項再填寫本頁) 訂-------- .線S:· 474100 A7 B7 五、發明說明（7 ) 接收區1 4 ’用以接收光源並將之轉換成電子訊號，以及形 成於該光接收區外緣至少一侧邊之多數個接合塾1 5。 於每個影像感測器1 1之該光接收區1 4周圍形成一接著劑 13，如圖7b所示，其中，在每一個影像感測器丨丨上，於形 成有接合塾1 5之光接收區1 4的侧邊，該接著劑1 3係介於該 光接收區14侧邊與該等接合墊15之間。 覆盖一玻璃蓋板20於該晶圓片19上，如圖7C所示，使該 玻瑞蓋板2 0貼合至该接著劑，以密封每一影像感測器之光 接收區。 最後’以切割銀2 1切割該晶圓片1 9，如圖7 d所示，最終 形成多數個該等影像感測器封裝結構。 ' 以上，雖已例舉本發明之較佳實施例作一說明，但在不 背離本發明之精神與範圍下，仍可作任何等效之變更。因 此，任何熟習此項技術領域人士所顯而易見之變更或修 飾，都應包含在如下所附申請專利範圍之界定範圍内。 (請先閱讀背面之注意事項再填寫本頁) 訂---------線«· 經濟部智慧財產局員工消費合作社印製 -10 -474100 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ____B7_______ V. Description of the Invention (6) Exposure 'and attaching the adhesive 13 to seal the light receiving area 14. Since the glass cover 12 is directly fixed on the image sensor with the adhesive 13, the size of the packaging structure can be greatly reduced, and the glass cover 12 is directly configured during the formation of the image sensor 11 , Not only the process is simpler, but also can avoid pollution and further improve the yield of the product. In addition, since the size of the glass cover 12 is reduced and part of the stress is accepted by the image sensor, the thickness of the glass cover 12 can be reduced, and the volume or weight can be further reduced. As shown in FIG. 6, the image sensor package structure of the present invention is mounted on a substrate. The W image sensor package structure further includes a substrate 16 and a plurality of wire pins 17. The bottom surface is adhered to the substrate 16 and one end of the lead pins 17 such as the salt is connected to the joint (as shown by the reference numeral 15 in FIG. 5), and the other end is connected to the substrate 16 and In order to connect and conduct the internal circuit of the image sensor 11 to the external circuit, the substrate 6 is a printed circuit board in the case of more common applications. In order to further protect the lead pins 17 of the image sensor package structure, the image sensor package further includes a protective layer 8 distributed on the periphery of the image sensor Π with bonding pads, and is covered to protect the lead pins. 1 7. Next, a packaging method for forming the above-mentioned image sensor packaging structure disclosed by the present invention will be described with reference to FIGS. 7a to 7d. First, as shown in FIG. 7a, a wafer μ ′ is provided on which a plurality of image sensors 11 are formed. A partial enlarged view of the wafer 9 is shown in FIG. 7b, where each image sensor The device 1 丨 has a light receiving surface and a bottom surface, and a light with a plurality of photosensitive elements is formed on the light receiving surface. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love (please first Read the notes on the back and fill in this page) Order --------. Line S: · 474100 A7 B7 V. Description of the invention (7) Receiving area 1 4 'Receive light source and convert it into electronic signal And a plurality of joints 15 formed on at least one side of the outer edge of the light receiving area. An adhesive 13 is formed around the light receiving area 14 of each image sensor 11 as shown in FIG. 7b. Among them, on each image sensor, a side of the light receiving area 14 with a joint 塾 15 is formed, and the adhesive 13 is interposed between the light receiving area 14 and the side. Between the pads 15. A glass cover 20 is covered on the wafer 19, as shown in FIG. 7C, so that the Bory cover 20 is attached to the wafer 20. The adhesive is then used to seal the light receiving area of each image sensor. Finally, the wafer 19 is cut with silver 2 1, as shown in FIG. 7 d, and finally a plurality of such image sensor packaging structures are formed. ”Above, although the preferred embodiment of the present invention has been described as an example, any equivalent changes can be made without departing from the spirit and scope of the present invention. Therefore, anyone familiar with this technical field Obvious changes or modifications should be included within the scope of the patent application scope attached below. (Please read the precautions on the back before filling this page) Order --------- line «· Ministry of Economic Affairs wisdom Printed by the Property Agency Staff Consumer Cooperatives -10-