經濟部中央標準局員工消費合作社印裝 A7 -- -------- B7 五、發明説明（Y" " ~~ 本發明係有關於一種單晶片之多媒體卡 (MulUMe^iaCard’MMCard)之生產製程，尤指其具有降低 成本、提高生產良品率及增進產品品質之製造方法者。-由於電子積體電路技術與材料之日新月異，其應用益 加廣泛’制電子積體電路為主所生產之f品則種類繁 多，不但功能強大，其產品之趨勢亦朝向輕薄短小之型態’ 舉凡電子辭典、t位相機及各種數位產品等等不勝枚舉， 而其中以數位相機為例，因其必須紀錄大量影像資料，故 需要如記憶體類之電子媒體，然、而以—般電腦所應用之磁 性記憶裝置而[其體積均具有—定之限制，無法達到輕 薄短小之要求’因此印發展出—種將記憶晶片與—薄型‘ 片相結合而形成一多媒體卡（MMCard)，不但具有儲存資料 之自b力，其體積輕巧更符合電子產品未來之走向，渐成為 各種電子產品所廣泛應用之記憶媒體者；如第一圖所示， 係現今一般產製單晶片MMCard之製程流程圖，其主^區 分為兩部分之製造方式，一為薄型卡體部分，係以pvc或 ABS材質事先成型成卡片形狀，再於其上進行鑽孔作業: 以形成置入晶片所需之空間；另一方面，取—導，線薄膜， 植入一晶片與該導線薄膜連接，在晶片上連接導線（可為 金線或鋁線等）’最後將晶片以封裝材料封裝成—完整之 晶粒；爾後’將分別形成之薄型卡體與封裝完成之晶粒以 冷膠或热勝之材料將兩者接合，最後再於卡體表面加以印 刷而完成。然而，在實際之生產過程當中，此—過程並不 盡理想’而時有不良品之產生，產品之品質亦不穩定，其 2 本紙張尺度通用中國®家標牟（CMS ) A4規格（2丨0X297公釐〉 ----------抽衣------ir------.4 (請先閑讀背而之注意事項再填寫本頁) 6 2 0 3 1 A7 —------- ----B7 五、發明説明（） 亟需改進之因素可歸納如下： 、生產速度無法提昇：由於卡體、晶片係分開之製 程，連貫性不足，相對影響生產速度的提昇，在今日電子 業講求高速產能之現實環境下，競爭能力相對下降。 —、成本較高：因卡體產出後必須鑽孔以預留晶片之 容置空間，且與晶片結合時則需以膠合之方式粘合，故在 生產步驟上若無法減少，其生產之成本勢必較高。 二、使用壽命較不穩定：因晶片封裝時係與導線薄膜 封裝成為一體，再與卡體結合’但導線薄膜雖利於封裝作 業之進行，但在使用上卻不耐磨，作為連接之接點時，使 用日久必產生磨損而接觸不良，造成使用壽命因而縮短。 有鑑於此，發明者乃秉持精益求精之精神及從事此業 i經驗，希望對隨Card之生產製程加以改良 '經多次設 計規劃與實際試作以證明其可行性之後，終產生本發明「單 晶片I多媒體卡（MultiMediaCard)製程」，主要目的在提 供：種具有-貫化、連續、且快速產製單晶片之多媒體卡 之製程万法，並可使產品品質得到控制、提高良品率，競 爭力可因此提昇者。 經濟部中央標準局員工消费合作社印装 為俾審查委員能對本發明之完整流程與應用上之特 色有更進—步之了M，以下即配合流程圖作一詳細解說如 后。 圖式之簡要說明： 第—圖.係習用之單晶片MMCard之製程流程圖。 3 '本錄尺錢财 B7 ^6203^ 五、發明説明（ /第二㈣本發明之單晶片MMCard之製程 二考：二圖所示，係本發明之單晶“Mc 其王要之特色乃在於其為-連續之生產過程， 其步騾可區分如下： ^王 首先，先取-预先設計完成且已成形之導線架 ，常為：：質材料所製成，具有耐磨之特性者； 外部=述之導線架前端之接脚彎腳成形，以形成__ 將已彎脚成形之導線架送入成形機，並與卡體材料— 體射出成型，而成為—薄型卡體錐形，卡體上並預留有晶 片之植入空間，且透過該空間可接觸導線架者； 取一晶片植入該卡片上所預留之空間内’並與前述導 線架連接； ' 於晶片上連接導線，該導線為金線或鋁線所構成： 將晶片以封裝材料封裝於卡片内固定為—體； 再於卡片之表面上印刷文字圖樣以形成成品。 囡此’本製程與傳統製造方法具有相當之差異性，其 所產生之優點足以改逕習用製程不盡理想之處，綜合有如 下之特點： 一、生產速度快：探連續 '一貫化之生產製程，其速 度較習用製程乃大幅提昇，適合快速且大量之生產流程。 二 '生產成本降低：由於簡化了生產步騾，加工之成 本可降低’且大量生產亦有助於成本進一步減少，相對可 _________ 4 本41張尺歧财關家料 裝— (請先聞讀背面之注意事項再填寫本頁) M濟部中央揉準局員工消费合作社印«. ------------- - 203 1 A7 ------B7 五、發明説明（） 成朋_爭力的提高。Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs A7--------- B7 V. Description of the invention (Y " " ~~ This invention relates to a single-chip multimedia card (MulUMe ^ iaCard'MMCard ) Production processes, especially those who have manufacturing methods that reduce costs, increase production yield and improve product quality.-Due to the rapid development of electronic integrated circuit technology and materials, its applications are increasingly widely used to make electronic integrated circuits. There are many types of f products produced. Not only are they powerful, but their products are also trending toward thin, thin and short ones. ”There are numerous electronic dictionaries, t-cameras, and various digital products. Among them are digital cameras. Because it must record a large amount of image data, it needs electronic media such as memory, but with a magnetic memory device applied by a computer [its volume has a certain limit, it cannot meet the requirements of thin, short, and short ' Developed a kind of combination of memory chip and thin type to form a multi-media card (MMCard), which not only has the self-power for storing data, but also has a compact size and is more compact. The future trend of electronic products has gradually become a widely used memory media for various electronic products; as shown in the first figure, it is a process flow chart of the current general production of single-chip MMCard. The main part is divided into two parts of the manufacturing method First, the thin card body is made of PVC or ABS material in advance into a card shape, and then drilling is performed on it: to form the space required for the wafer; on the other hand, take-guide, wire film, A chip is implanted to connect with the wire film, and the wire is connected to the chip (may be gold wire or aluminum wire, etc.) 'Finally, the chip is packaged with packaging material into a complete grain; thereafter, the thin card bodies are formed with The packaged die is joined by cold glue or hot material, and then printed on the surface of the card body. However, in the actual production process, this process is not ideal, and sometimes there are defective products. The quality of the product is also unstable. The 2 paper sizes are common to China® House Standard Mou (CMS) A4 specifications (2 丨 0X297 mm) ---------- Sliding -------- -ir ------. 4 (please read back first Please fill in this page again for the matters needing attention) 6 2 0 3 1 A7 —------- ---- B7 V. Description of the invention () The factors that need to be improved can be summarized as follows: 1. The production speed cannot be improved: due to the card body The separate process of wafers has insufficient continuity, which relatively affects the increase of production speed. In the current environment of today's electronics industry that requires high-speed production capacity, the competitiveness is relatively reduced. — Higher costs: drilling must be drilled after the output of the card body It is necessary to reserve the space for the wafer, and when bonding with the wafer, it needs to be glued. Therefore, if the production steps cannot be reduced, the cost of production is bound to be higher. Second, the service life is unstable: due to the wafer When encapsulating, it is integrated with the lead film packaging and then combined with the card body. However, although the lead film is beneficial for the packaging operation, it is not abrasion-resistant in use. When used as a connection point, it will be worn and contacted over time. Defective, resulting in shortened service life. In view of this, the inventor is adhering to the spirit of excellence and experience in this industry, hoping to improve the production process with Card '. After multiple design planning and actual trials to prove its feasibility, the present invention "single chip" "MultiMediaCard manufacturing process", the main purpose is to provide: a multi-media, continuous, and rapid production of single-chip multimedia card manufacturing process, and can control product quality, improve yield, competitiveness Can be ascended. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs In order that the review committee can further improve the complete process and application characteristics of the present invention-it is a step M. The following is a detailed explanation in conjunction with the flowchart below. Brief description of the drawings: Figure-is the process flow chart of the conventional single-chip MMCard. 3 'This ruler money B7 ^ 6203 ^ V. Description of the invention (/ Second test of the second process of the single-chip MMCard of the present invention: as shown in the second figure, it is the single crystal of the present invention "Mc. Because it is a continuous production process, its steps can be distinguished as follows: ^ Wang first, first take-pre-designed and formed lead frame, often :: made of high quality materials, with wear resistance; external = The legs of the lead frame at the front end are bent to form __ The bent lead frame is fed into the forming machine, and is molded with the body material of the body to form a thin-shaped tapered body. There is an implanted space reserved for the chip on the body, and the lead frame can be accessed through the space; take a chip and implant it into the reserved space on the card 'and connect with the lead frame; The wire is composed of gold wire or aluminum wire: the chip is sealed with a packaging material and fixed in the card as a body; and then a text pattern is printed on the surface of the card to form a finished product. This process is equivalent to the traditional manufacturing method Differences, and the superiority they produce The point is enough to change the path of the conventional manufacturing process, which has the following characteristics. First, the production speed is fast: the continuous production process is explored. Its speed is greatly improved compared with the conventional manufacturing process, which is suitable for fast and large-scale production processes. Second, 'production costs are reduced: because the production steps are simplified, the cost of processing can be reduced', and mass production can also help reduce costs further, which is relatively possible _________ 4 41-foot Qiqi Caiguan Home Decoration — (please listen first (Please read the notes on the back and fill in this page) M. Printed by the Consumers' Cooperatives of the Central Bureau of the Ministry of Economic Affairs «. --------------203 1 A7 ------ B7 V. Invention Explanation () Cheng Peng _ improvement in competitiveness.
二、品質穩定、使用壽命長：由於使用銅製之導線架， 其耐磨性較習用導線薄膜更高，自然品質穩定，使用壽命 更長。 四、晶片耗損率低：由於採用導線架彎腳成型後隨即 射出成型形成卡體，爾後再植入晶片，如此做法可減少晶 片之耗損；若令導線架與晶片封裝後再射出成型，有時可 能因射出作業不良，將造成已封裝之晶片無法再使用之 虞’故本發明之方式可避免此種狀況產生，大幅降低晶片 之耗損率。 η2. Stable quality and long service life: Due to the use of copper lead frame, its abrasion resistance is higher than that of conventional wire film. The natural quality is stable and the service life is longer. 4. Wafer loss rate is low: because the lead frame bent legs are used to form the card body after injection molding, and then the wafer is implanted, this method can reduce the loss of the wafer; if the lead frame and the chip are packaged and then injection molding, sometimes There may be a risk that the packaged wafer cannot be used again due to poor injection operation. Therefore, the method of the present invention can avoid such a situation and greatly reduce the wear rate of the wafer. n
經 濟 部 中 標 準% 員 工 消 費 合 作 社 印 X 五、外型美觀··由於晶片乃於卡體上封裝完成，一體 成型而不需如習周製法需用膠合之方式結合，外型上具有 完整一體之特點者。 综合以上所述，本發明「單晶片之多媒體卡 (MuitiMediaCard)製程」’以有別於習用製法，而探用連 續、一貫化之製程，採用導線架成型後先與卡體一體射出 成型’再進行晶片植入與封裝之過程，可適於快速且大量 生產之製程，具有降低成本、提高競爭力之特點者。故本 發明之製程方法實具有新穎性與創作性，更具有高度之產 業利用性，符合專利之申請要件，爱依法申請專利之。請 速予審查，惠予專利是禱。 I_ 5 — 本紙张尺度適用中國國家揉S { CNS ) A4現格（210X297公Standards in the Ministry of Economic Affairs% of employees' consumer cooperatives. X. Beautiful appearance. · Since the chip is packaged on the card body, it is integrally molded, and does not need to be bonded by gluing as in the conventional manufacturing method. Features. To sum up, the "MuitiMediaCard manufacturing process of the present invention" of the present invention is different from the conventional manufacturing method, and a continuous and consistent manufacturing process is explored. After the lead frame is used for molding, it is integrally shot with the card body. The process of chip implantation and packaging can be suitable for rapid and mass production processes, and has the characteristics of reducing costs and improving competitiveness. Therefore, the process method of the present invention is truly novel and creative, and has a high degree of industrial applicability. It meets the requirements for patent application, and loves to apply for a patent according to law. Please review it quickly. Praying for patents is a prayer. I_ 5 — The size of this paper is applicable to the Chinese national government S {CNS) A4 (210X297)
閱 讀 背 之 襞 訂 ，泉Read the book of the back, Quan
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