1298194 九、發明屬明： 【發明所屬之技術領域】 本發明係有關於一種半導體封裝件之製法，特別是有 關於一種卡式半導體封裝件之製法。 【先前技術】 諸如多媒體電路卡（Multi-Media Card，MMC)之記憶 卡為一種高容量的快閃記憶體電路模組，該電路模組可耦 接至一電子資訊平台，例如個人電腦、個人數位助理裝置 ♦ (Personal Digital Assistant，PDA)、數位照相機、多媒體瀏 覽器’以儲存各種數位型式之多媒體資料，例如數位相片 資料、視訊資料、或音訊資料。目前，多媒體卡之規格基 Μ 本上符合多媒體卡同盟（Multimediacard Association， ’ MMCA)所制定之標準。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of fabricating a semiconductor package, and more particularly to a method of fabricating a card type semiconductor package. [Prior Art] A memory card such as a Multi-Media Card (MMC) is a high-capacity flash memory circuit module that can be coupled to an electronic information platform, such as a personal computer or an individual. A digital assistant device (PDA), a digital camera, and a multimedia browser to store various digital types of multimedia materials, such as digital photo data, video data, or audio data. Currently, the specification of the multimedia card is based on the standards set by the Multimedia Card Association ('MMCA).
有關於多媒體電路卡的模組結構相關技術包括例如： 美國專利第 5,677,524 號"CHIP CARD AND A METHODRelated art related to module structure of a multimedia circuit card includes, for example, US Patent No. 5,677,524 "CHIP CARD AND A METHOD
• FOR PRODUCING IT” ；美國專利第 6,040,622 號 "SEMICONDUCTOR PACKAGE USING TERMINALS W FORMED ON A CONDUCTIVE LAYER OF A CIRCUIT BOARD n ;以及日本專利 62-239554 號 nIC CARD TYPE EP-ROMSTRUTURE” 等。 請參閱第1A至1C圖，即顯示習知之多媒體電路卡的 製作過程。 如第1A圖，預製一連串之基板100，且每一個基板 100上係預先劃分出至少一置晶區101和複數個被動元件 5 18631DP01D1 1298194 安置區102,且設置有複數個電性連接墊1〇3。此些電性連 接墊103係從基板⑽的正面直通背自，以作為最後完成 之多媒體電路卡的外接電性連接點。 曰如第1B圖，進行置晶程序，藉以於基板1〇〇上的置 晶區101上安置至少一半導體晶片12，並於該被動元件安 置區102上黏接被動元件13;接著利用如焊'線14等方式， 藉此將晶片12電性連接至基板〗⑼上的電性連接塾1〇3。 ，後形成-封裝龍15，心包覆基板⑽上所安置的晶 及銲、線14。如此，即可分離各封裝單元，以製得- 封裝件。 夕々二第1<：圖所不’於封裝件上覆蓋-披覆有黏膠層16 所/Γ體17 ’u將整個封裝件嵌人並黏附至該外殼體17 所形成之容納空間17G中。此即完成多媒體電路卡的製程。 外扭ί::上述製程缺點在於需在晶片封裝完成後，再額 體電=Γ體藉以形成標準尺寸（32mm*24mm)之多媒 此’不僅將造成額外提供該外殼體及將該外 =fpr封裝件上所導致之成本及—增加，而 不付經濟效益。 料閱第2圖，鑒於前述缺失，美國專利us6,54i，3〇7 係二種：ΓΓ外殼體之多媒體電路卡製程靜^ 數t板單元2〇〇之基板條2。，_ 程 ：土早70 0進仃置晶、打線及封裝膠體製 T亥封裝膠體形成有對應為多媒電路卡之標準尺寸 mm 4_) ’俾供後續對應各基板單元2〇α之位置進行 6 18631DP01D1 1298194 2割’而形成複數多媒體電路卡 體之成本與製程。 衣忏错以七去外叙 (c f隹於别述衣私中’因各該基板單位200係以連接桿 切7:广°21而與基板條2。相連結，故在後續利用 口J刀^切所該連接桿以分離各封農單元時，導致切單完 成之封裝件周邊殘留有連接桿 質。 逆丧杆21而影響產品之外觀及品 再者’吴國專利usMO·2592 使用外殼體且小型化之多姅體電路…U種毋而 尨— 夕呆耻电路卡之製程技術，其主要 進2有複數基板單元之基板模組片上對應各基板單元 藤二;及:?：業，心 卡外ΐΓ 用水刀或雷射以對應所欲形成之電路 卡外觀進行切割。 惟於前述製程中，因水刀之成本高，且 内需加入例如石柳砂之研磨好 又求柱 拋^ ^ 八研以才（ab刪吟惟該研磨材係為 古、^於使用過-次後即需丢棄而無法重覆使用，相對 二“壬成本’再者該水刀之切割道寬度受限於水刀壓力 研磨材之顆粒大小，因此極易造成不穩定現象，且 :之賀口常為研磨材所阻塞，相對亦提高製程之不穩‘ 產:另，可改以雷射方式進行切割’惟於雷射切割時亦合 林其！衣踢體及基板邊緣燒焦等問題，且該雷射切割機； 才。甚而，因而致使製程成本過高，而不符經濟效益。、 此外，前述多媒體電路卡中，因係採垂直 副分離各封裝單元，故切割分離後之各封裝件邊： 18631DP〇idj 7 1298194 直角狀恶，於使用上易造成直角處干涉或 1 致使用不便，因此即需額外於兮用 、，、，v 舍mi / Γ 件周園直角處進行導 » . ^ ,"相對“製程成本及複雜度。 因此’如何在不需使用外殼體 模組之半導體封裝件，同時達到美觀二，成卡式電路 及雷射切割所造成之缺失，'免因利用水刀 —& 及母需領外進行導角作紫， 貫為此相關研發領域所迫切待解之課題。 〃 【發明内容】 ' 在接術之缺點’本發明之主要目的便 在k供一種半導體封裝件製 更 之卡式電路模組之半導體封μ成*需使用外殼趙 ^本==二的係在於提供一種半導體封裝件之 衣法以避免在卡式電路模組之半導體 連接桿而影響產品之外觀及品質。 Λ 殘留有 製法本在於提供-種半軸 用水刀或雷射所導致赞筠屮 _ u 本發明之再—目的你/ t 雜度增加等問題。 製法，*需在卡=供—種半導體封農件之 下式电路杈組之半導體封裝件切到士击尨 名員外進行導角製程，蕻 口]疋成後， 為、幸上、十、月# 減少製程成本及簡化製程步驟。 為達上述及其他目的， 係包括：提供u知月之牛¥肢封裳件之製法 ,.έ μ 疋成日日片封裝模壓之基板模組片，节美妬 輪組片包含有複數基板單元， 片5亥基板 覆有-封裝膠體，且夂料壯…板早7^上分別獨立包 且。该封裝膠體周緣係形成有一傾斜平 18631DP01D1 8 1298194 :月:及沿各該基板單元㈣”該基板模組片 :周緣之部分傾斜平面，以形成複數具導角之半導體二： 该封裝膠體係形成有對應於卡式電路模組之外觀开:衣 狀’且該切割製程係可利用如側銑刀之機械式切割刀二 程式化控制方式直接沿該具卡式電路模組;觀 導角結構之卡式電路模組。成而使用外殼體且具 丨之半導體封裝件之製法中主要係於在具 =基板#之純模例上，對應各基板單元完成置曰 -=接後，於各該基板單元上形成一獨立之封裝膠曰曰 體旦，:非習知在整片基板模組片上形成―全面之封裝膠 —因本發明係在基板摸組片上之各基板單元上形成 膠體，因此，對應封裝模具之使料使各 一横形之傾斜平面’以供後㈣ 日士。，^ 〃（如側銑刀）進行分離各該完成封裝之封裝單元 =該側銑刀將同時切割基板模組片及封裝膠體周緣 =斜平面，藉此即可直接形成周圍形成有導角結構之封 :複雜使用水刀或雷射切割所導致製咖 少制ρΓ專問題，且舟需額外進行導角製程，藉以減 :-成本及簡化製程步驟。此外’可令該封裝膠體形成 化抑卡式電路模組之外觀形狀，以利用側銑刀及程式 工制其切割路徑而直接形成进需使用外殼體且具導角姓 稱之卡式電路模組。 ° 【實施方式】 18631DP01D1 9 1298194 以下係藉由特定的具體實施例說明本發明之實施 熟習此技藝之人士可由本說明書所揭 ：：： 瞭解本發明之其他優點與功效。本發明亦可藉由 的具體貫施例加以施行或應用，本說明書中的各項 可基於不同觀點與應用，在不惊離本發明之精神下進^ ί修飾與變更。另值得注意的是，以下圖式均為簡化=_ =二方式說明本發明之基本構想，遂圖: 料 ”本舍明有關之元件而非按照實際實施時之元件 —目、形狀及尺寸繪製，其實際實施時各元件之型能 =例可為-種隨意之變更’且其元件佈局型態;能更 製法圖3…圖’係為本發明之半導體封裝件之 如^ 3Α圖所#，提供一具有複數基板單元_ 板拉組片3〇 ,該基板單元3Q已完成線路佈局，且表= :::::::背面，爾最後一― 半導二3:圖所斤w 元300 ΓΓ 使該半導體晶片31電性導接至基板單 性連接塾。該半導體晶片3"系可以覆晶或 丁線方式而電性連接至該基板單元300。 時將:二卜之;Γ有需要搭配外接之被動元件，則㈣ 而之破動元件藕接至各個基板單元300上的被動元 10 18631DP01D1 1298194 件安置區。作甚曰 _ . ^ _ 則#$^ 右日日片之内部電路已整合所需之被動元件， 貝J便+需進行此步驟。 卞 封心Lc圖所示，對應各基板單元3〇。上形成-獨立 膠體…觀形狀係可利用模具直 成有一傾斜^'路核組外親’且各該封裝膠體周緣係形 單元。…、，猎以在該基板模組片30上形成複數封裝 1元上照第4A圖，係為對應本發明中在基板單 因此計上形成獨立之封裝膠體32, /應封裝模具之使用而使各該封裝 一如楔形之傾斜平面32〇。 门豕办成 "Γ甘圖所示，利用如側銑刀之機械式切割刀具並 f單 U虛線所不），以對應至各該封 ::二周:’以切割該基板模組片3〇及獅 >之部分傾斜平面32〇。 J豕 一，:月配合茶照第4B圖，係為對應本發明中進行基板 於各該封轉體32周㈣^ 面示讀，其中由 用-包括有側銳刀33及;=面 ^ 了耘式化控制該側銑刀切割路 ΓΓ)的切割裝置，俾使該側銳刀33先鑽 。又至：土板輪組片30 ’，再利用佈設於其 3; 經程式化控制其切割路徑，並刀 徑補償作用，以對應各ΜΛ過視見糸統進行切割路 。基板早兀3⑻周圍形成不規則之切 11 18631DP01D1 1298194• FOR PRODUCING IT”; US Patent No. 6,040,622 "SEMICONDUCTOR PACKAGE USING TERMINALS W FORMED ON A CONDUCTIVE LAYER OF A CIRCUIT BOARD n ; and Japanese Patent No. 62-239554 nIC CARD TYPE EP-ROMSTRUTURE” and the like. Please refer to Figures 1A to 1C for the fabrication process of the conventional multimedia circuit card. As shown in FIG. 1A, a series of substrates 100 are prefabricated, and each of the substrates 100 is pre-divided with at least one crystal region 101 and a plurality of passive components 5 18631DP01D1 1298194, and a plurality of electrical connection pads are disposed. 3. The electrical pads 103 are directly connected from the front side of the substrate (10) to serve as an external electrical connection point for the final completed multimedia circuit card. For example, in FIG. 1B, a crystallization process is performed, whereby at least one semiconductor wafer 12 is disposed on the crystallographic region 101 on the substrate 1 and the passive component 13 is bonded to the passive component placement region 102; 'Line 14 and the like, thereby electrically connecting the wafer 12 to the electrical connection 塾1〇3 on the substrate (9). After the formation of the package - 15 , the core and the solder and wire 14 disposed on the substrate (10). In this way, each package unit can be separated to produce a package.夕々二1<: The picture is not covered on the package - covered with the adhesive layer 16 / the body 17 'u embeds and adheres the entire package to the accommodation space 17G formed by the outer casing 17 in. This completes the process of the multimedia circuit card. External twist ί:: The above process is disadvantageous in that after the wafer package is completed, the excess body power = the body to form a standard size (32mm * 24mm) of the media will not only provide additional housing and the outside = The cost and increase in the fpr package is not economical. Referring to Fig. 2, in view of the aforementioned shortcomings, U.S. patents us6, 54i, 3〇7 are two types: the substrate strip 2 of the multimedia circuit card process of the outer casing of the outer casing. , _ Cheng: Tuzao 70 0 into the crystal, wire and encapsulation system T Hai package colloid formed with the corresponding standard size of the multi-media circuit card mm 4_) '俾 for subsequent correspondence of the substrate unit 2〇α position 6 18631DP01D1 1298194 2 The cost and process of forming a complex multimedia circuit card body. The clothing is wrong to go out of the way (cf 隹 别 别 别 ' ' 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因^When the connecting rod is cut to separate the sealing units, the connecting rod remains in the periphery of the package that has been cut and finished. Reversing the rod 21 and affecting the appearance and product of the product. 'Wu Guo patent usMO·2592 using the outer shell The body and the miniaturized multi-body circuit...U kind of 毋 毋 呆 耻 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路The outer card of the card is cut with a water knife or a laser to correspond to the appearance of the circuit card to be formed. However, in the foregoing process, the cost of the water jet is high, and the internal need to add, for example, the grinding of the stone willow is good and the column is thrown ^ ^ 八研才才 (ab deleted only the abrasive material is ancient, ^ after use - after the need to discard and can not be reused, relative to the two "壬 cost" and the water knife's cutting width is affected by Limited to the particle size of the waterjet pressure abrasive, so it is highly prone to instability, and : The mouth is often blocked by the abrasive material, which also increases the instability of the process. 'Production: Alternatively, it can be cut by laser. 'On the laser cutting, it is also suitable for the forest! The body of the garment and the edge of the substrate are burnt. The problem of coke and the like, and the laser cutting machine; even, thus causing the process cost is too high, and is not economical. In addition, in the aforementioned multimedia circuit card, since the vertical sub-separation of each package unit is adopted, after cutting and separating Each package side: 18631DP〇idj 7 1298194 Right-angled evil, easy to cause interference at right angles or inconvenient to use, so it is necessary to use extra, 、,, v, 舍, mi / Γ Conducting ». ^ ," Relative to the process cost and complexity. Therefore, 'how to use the semiconductor package of the outer casing module, at the same time to achieve the beauty, the lack of card-type circuit and laser cutting, 'Because the use of waterjets-& and the mother's needs to lead the purple, is a topic that needs to be solved in the related research and development field. 〃 【Abstract】 'The shortcomings of the invention' The main purpose of the invention In k The semiconductor package is made of a semiconductor package of a card type circuit module. The use of the housing is required to provide a semiconductor package to avoid the semiconductor connecting rod in the card circuit module. It affects the appearance and quality of the product. Λ The residual method is based on the provision of a kind of half-axis water knife or laser. _ u The re-invention of the invention - the purpose of your / t increase in complexity, etc. In the card = supply-type semiconductor sealing parts, the semiconductor package of the circuit group is cut to the outside of the squadron to carry out the lead-angle process, after the 疋口] 疋成,为,幸上,十,月# Reduce the process The cost and the simplification of the process steps. In order to achieve the above and other purposes, the system includes: a method for providing a u-knowing a cow, a limb-sealing piece, and a 基板 μ 疋 a day-day package-molding substrate module piece, a section of the 妒 妒 wheel The slab includes a plurality of substrate units, and the slabs of the slabs are covered with a package of colloids, and the slabs of the slabs are separately packaged separately. The periphery of the encapsulant is formed with an inclined flat 18631DP01D1 8 1298194: month: and along each of the substrate units (four) "the substrate module piece: a partial inclined plane of the periphery to form a plurality of semiconductors with a lead angle: the encapsulant system is formed There is a corresponding appearance of the card type circuit module: the clothing shape 'and the cutting process can be directly used along the card type circuit module by using a mechanical cutting knife such as a side milling cutter; the viewing angle structure The card type circuit module is formed by using the outer casing and the semiconductor package of the semiconductor package is mainly used in the pure mode of the substrate = the corresponding substrate unit is completed after the -= connection, Forming a separate package of adhesive body on the substrate unit: it is not conventional to form a “full package of adhesive” on the entire substrate module sheet. Since the present invention forms a gel on each substrate unit on the substrate assembly sheet, Therefore, the corresponding packaging molds make the inclined planes of each horizontal shape for the rear (four) Japanese, ^ (such as the side milling cutter) to separate the package unit that completes the package = the side milling cutter will simultaneously cut the substrate mold The periphery of the sheet and the encapsulant = the inclined plane, so that the seal formed around the corner structure can be directly formed: the complicated use of the water jet or the laser cutting causes the problem of the coffee making process, and the boat needs an additional lead angle process. By subtracting: - cost and simplifying the process steps. In addition, the encapsulation colloid can form the appearance of the card-type circuit module, and directly form the in-use outer casing by using the side milling cutter and the programmer to cut the cutting path. And a card type circuit module with a leading edge name. [Embodiment] 18631DP01D1 9 1298194 The following is a description of a specific embodiment of the present invention. Those skilled in the art can be disclosed by the present specification:: Other advantages and effects of the invention. The invention may also be embodied or applied by a specific embodiment, and the various items in the specification may be modified and modified without departing from the spirit and scope of the invention. It is also worth noting that the following figures are simplified = _ = two ways to illustrate the basic idea of the present invention, the figure: "Materials" The components of the time - the shape, shape and size of the drawing, the actual implementation of each component type of energy = examples can be - a random change 'and its component layout type; can be more law Figure 3 ... Figure ' is the invention The semiconductor package is provided with a plurality of substrate units _ board-pull assembly 3 〇, the substrate unit 3Q has completed the line layout, and the table = ::::::: back, the last ― The semiconductor wafer 31 is electrically connected to the substrate unitary connection port. The semiconductor wafer 3" can be electrically connected to the substrate unit 300 in a flip chip or a splicing manner. The time will be: two Bu; if there is a need to match the external passive component, then (4) and the broken component is connected to the passive element 10 18631DP01D1 1298194 placement area on each substrate unit 300. What to do _ . ^ _ Then #$^ The internal circuit of the right day film has integrated the required passive components, and it is necessary to perform this step.封 The sealing core Lc diagram corresponds to each substrate unit 3〇. The upper forming-independent colloidal shape can be directly formed by a mold having a tilted ''nucleus group outer' and each of the encapsulating colloidal peripheral shaped units. In order to form a plurality of packages on the substrate module sheet 30, the fourth embodiment is shown in Fig. 4A for the purpose of forming a separate encapsulant 32 on the substrate sheet according to the present invention. Each of the packages has a wedge-shaped inclined plane 32〇. The door is made into a "Γ甘图, using a mechanical cutting tool such as a side milling cutter and f single U-line does not), corresponding to each of the seals:: two weeks: 'to cut the substrate module piece 3〇 and lion> part of the inclined plane 32〇. J豕一,: The monthly matching tea photo 4B is for the corresponding substrate in the present invention, and the substrate is displayed on each of the 32 sides of the sealing body, wherein the surface includes a sharp knife 33 and a surface. The cutting device for controlling the side cutter cutting path is clamped, and the side sharp knife 33 is drilled first. It is also: the soil plate wheel piece 30 ′, and then laid on its 3; the cutting path is controlled by the program, and the tool diameter compensation function is used to cut the road corresponding to each ΜΛ ΜΛ 。 。. An irregular cut is formed around the substrate 3 (8) 11 18631DP01D1 1298194
割路徑，而予以切割哕I J邊基板模組片3〇及封裝膠體32周緣 之部分傾斜平面32〇，彿^^ 俾形成滿足需求形狀外觀且具導角 321之半導體封裝件。 本發明之卡式電路模組之半導體封裝件可應用為多 媒體電路卡（Multi-Media Card，MMC)或其它功能、尺寸的 電路卡或記憶卡，例如CF(Compact Flash Card)、 MS(Memory Stick)、SMC(Smart Media Card)、SD(Secure Digital Memory Card)、或其他基板桃格陣列（Land Grid 籲Array，LGA)封裝之電路卡或記憶卡等。 此外，應注意者，係本發明之基板模組片之各基板單 元之排列係可採用單排或多排設置，尤其是以多排設置排 列時，係可配合各基板單元及封裝膠體之位置設計，而將 • 切割刀具之切割路徑同時通過相鄰封裝單元之封裝膠體， 而得快速切割完成且節省製程作業及基板材料。 因此，本發明之半導體封裝件之製法中主要係於在具 ⑩複數基板單元之基板模組片上’對應各基板單元完成置晶 及電性連接後，於各該基板單元上形成一獨立之封裝膠 體，而非習知在整片基板模組片上形成一全面之封裝膠 體，且因本發明係在基板模組片上之各基板單元上形成獨 立之封裝膠體，因此，對應封裝模具之使用而使各該封裝 膠體周緣形成一如楔形之傾斜平面，以供後讀利甩機械式 切割刀具（如側銑刀）進行分離各該完成封裝之封裝單元 時，該側銑刀將同時切割基板模組片及封裝膠體周緣之部 分傾斜平面，藉此即可直接形成周圍形成有導角結構之封 12 18631DP01D1 1298194 4件’而可避免使用水刀或 Ά 、n 飞田射切剎所導致製程成本提高 及獲雜度增加等問m需額外進行導角製程，: 少製程成本及簡化製程步驟。 9 ' ^ ^ 此外可令该封農膠體形成 有對應於卡式電路模組之外_彡 r〇 喊形狀，以利用側銑刀及程式 化控制其切割路徑而直接形， 莰办成^雨使用外殼體且具導角结 構之卡式電路模組。 ^所制為本發明之較佳實施例而已，並非用以限 之貫質技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申諳衷| — T °月寻利靶圍中。若任何他人所完 成之技術貫體或方法與下述之申彳主直# 八4 π r2L之甲5月專利摩巳圍所定義者為完 王相同、或是為一種等效之轡# 于双您又更，均將被視為涵蓋於此專 利範圍之中。 【圖式簡單說明】 f 1A至1C圖為習知多媒體電路卡之製程示意圖； 第2圖係為美國專利us 6,541，3〇7所揭示之舟需使用 外殼體之多媒體電路卡之習知技術； 第 示意圖 3A至3D圖係為本發明之半導體封裝件之製法平面 第4A圖係為對應本發明中在基板單元上形成封裝膠 體之剖面示意圖；以及 第4B圖係為對應本發明中進行基板單元及部分封裝 膠體之切割作業時之剖面示意圖。 、 【主要元件符號說明】 1〇〇 基板 18631DP01D1 13 1298194The cutting path is cut, and the slanted plane 32 之 of the substrate module piece 3 〇 and the periphery of the encapsulant 32 is formed, and the semiconductor package having the lead angle 321 satisfying the required shape and appearance is formed. The semiconductor package of the card type circuit module of the present invention can be applied as a multi-media card (MMC) or a circuit card or a memory card of other functions and sizes, such as CF (Compact Flash Card), MS (Memory Stick). ), SMC (Smart Media Card), SD (Secure Digital Memory Card), or other substrate card array (LGA) package circuit card or memory card. In addition, it should be noted that the arrangement of the substrate units of the substrate module sheet of the present invention may be arranged in a single row or in multiple rows, especially when arranged in a plurality of rows, which can match the positions of the substrate units and the encapsulant. Design, and the cutting path of the cutting tool can pass through the encapsulation colloid of the adjacent packaging unit at the same time, which can be quickly cut and save the process and substrate material. Therefore, the method of fabricating the semiconductor package of the present invention is mainly for forming a separate package on each of the substrate units after the substrate and the substrate unit are completed on the substrate module sheet having the plurality of substrate units. The colloid, rather than the conventional one, forms a complete encapsulant on the whole substrate module sheet, and the invention forms a separate encapsulant on each substrate unit on the substrate module sheet, thereby making use of the corresponding package mold. Each of the encapsulating colloids forms a slanted plane such as a wedge shape for a post-reading mechanical cutting tool (such as a side milling cutter) to separate the package units of the completed package, the side milling cutter simultaneously cuts the substrate module The slanting plane of the periphery of the sheet and the encapsulant can directly form the seal 12 18631DP01D1 1298194 around which the guide structure is formed, and the process cost can be avoided by using the water jet or the 飞, n flying field cutting brake. And the increase in the degree of noise, etc., requires additional lead-in process: less process cost and simplified process steps. 9 ' ^ ^ In addition, the sealant colloid can be formed in a shape corresponding to the card circuit module to directly shape the cutting path by using a side cutter and a programmatic control. A card type circuit module using an outer casing and having a lead angle structure. The preferred embodiment of the invention is not intended to limit the scope of the technical content. The technical content of the present invention is broadly defined in the following claims. If the technical body or method completed by any other person is the same as the following application, the definition of the patent of the May 4th π r2L is the same as that of the King, or an equivalent 辔# Both you and more will be considered to be covered by this patent. [Simple diagram of the drawing] f 1A to 1C is a schematic diagram of a process of a conventional multimedia circuit card; and FIG. 2 is a conventional technique for using a multimedia circuit card of an outer casing disclosed in US Pat. No. 6,541,357. FIG. 3A to FIG. 3D are diagrams showing the manufacturing plane of the semiconductor package of the present invention. FIG. 4A is a schematic cross-sectional view showing the formation of the encapsulant on the substrate unit in accordance with the present invention; and FIG. 4B is a substrate corresponding to the present invention. Schematic diagram of the cutting operation of the unit and part of the encapsulant. , [Main component symbol description] 1〇〇 Substrate 18631DP01D1 13 1298194
101 置晶區 102 被動元件安置區 103 電性連接墊 12 半導體晶片 13 被動元件 14 銲線 15 封裝膠體 16 黏膠層 17 外殼體 170 容納空間 20 基板條 200 基板單元 21 連接桿 30 基板模組片 300 基板單元 31 半導體晶片 32 封裝膠體 320 傾斜平面 321 導角 33 侧銑刀 330 切割路徑 331 刀口 14 18631DP01D1101 Crystallization area 102 Passive component placement area 103 Electrical connection pad 12 Semiconductor wafer 13 Passive component 14 Bond wire 15 Package colloid 16 Adhesive layer 17 Outer casing 170 accommodating space 20 Substrate strip 200 Substrate unit 21 Connecting rod 30 Substrate module piece 300 substrate unit 31 semiconductor wafer 32 encapsulant 320 inclined plane 321 lead 33 side cutter 330 cutting path 331 edge 14 18631DP01D1