TW452187U - Contacting structure of flip chip bond - Google Patents

Contacting structure of flip chip bond

Info

Publication number
TW452187U
TW452187U TW89215132U TW89215132U TW452187U TW 452187 U TW452187 U TW 452187U TW 89215132 U TW89215132 U TW 89215132U TW 89215132 U TW89215132 U TW 89215132U TW 452187 U TW452187 U TW 452187U
Authority
TW
Taiwan
Prior art keywords
flip chip
contacting structure
chip bond
bond
contacting
Prior art date
Application number
TW89215132U
Other languages
Chinese (zh)
Inventor
Yuan-Ping Tzeng
An-Hung Liou
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89215132U priority Critical patent/TW452187U/en
Publication of TW452187U publication Critical patent/TW452187U/en

Links

TW89215132U 2000-09-01 2000-09-01 Contacting structure of flip chip bond TW452187U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89215132U TW452187U (en) 2000-09-01 2000-09-01 Contacting structure of flip chip bond

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89215132U TW452187U (en) 2000-09-01 2000-09-01 Contacting structure of flip chip bond

Publications (1)

Publication Number Publication Date
TW452187U true TW452187U (en) 2001-08-21

Family

ID=21672231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89215132U TW452187U (en) 2000-09-01 2000-09-01 Contacting structure of flip chip bond

Country Status (1)

Country Link
TW (1) TW452187U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees