項請委貝明示%年>月7日所提之 經濟部智慧財產局員工消費合作社印製 修正4有4變更實質内客是否准予修正。 . 说年3月>沪修正/更正/補充 447148 五、創作說明（h 本發明「白光發光二極體之製造方法及其結構」旨在 提供一種整體製程僅需以二次烘烤程序即可完成白光發光 二極體成品，而具有加快製程提升產量以及有效控制產品 品質等優點之白光發光二極體之製造方法；同時以該方法 所製成之白光發光二極體更具有發光品質良好、白光發光 效果更爲穩定之優點。Xiang Beibei was requested to indicate% year > printed on July 7th by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Amendment 4 There are 4 changes to whether the internal customers are allowed to amend. . Said March > Shanghai Correction / Correction / Supplement 447148 V. Creative Instructions (h The "Method for Manufacturing White Light-Emitting Diodes and Its Structure" of the present invention aims to provide an overall manufacturing process that requires only a secondary baking process, ie White light emitting diode can be completed, and has the advantages of speeding up the process to increase yield and effective control of product quality, and a method for manufacturing white light emitting diode; meanwhile, the white light emitting diode made by this method has better light emitting quality , The advantage of white light emitting effect is more stable.
按，在發光二極體製程技術不斷改良下，發光二極體 已可由大型面板製作，且如聖誕燈飾、手電筒、交通標誌 等由發光二極體產業應用之領域每年成長速度提高’其正 以極爲快速之速度擴張二極體產業之市場版圖。目前在發 光二極體之製作領域中無法以發光晶片直接產生白光之方 式製成白光發光二極體，其主要係利用各種有色光所具有 其所屬光波波長之光譜特性’藉由發光二極體之發光晶片 所產生之有色光透過具特定光波波長之螢光膠射出’使二 者之光波波長結合成白光之波長範圍而呈現白光之發光效 果；首先如第一圖所示，其係爲傳統製造方法所製造之白 光發光二極體結構，在於製造時係先將發光晶片(2)以導電 銀膠⑶黏著於二極體⑴之碗杯(13)裡並以150&C之高溫烘烤 二小時加以固定後，再以金線(5)分別與二極之插腳(11)、（12) 相搭接藉由螢光膠(4)將整體發光晶片(2)覆蓋’再以130°C g張尺度適用中國國家標準<CNS)A4規格（210 X 297公釐）斗 ---—.—---------------tr—illlili (請先閱讀背面之注意事項再填寫本頁). 447148 經濟部中央樣準局員工消費合作·社印敦 A7 B7 五、發明説明（2) 時之工時完成烘烤固定之程序，不但加工時間長而易於烘 烤過程中產生不良品，並且其導電銀膠(3)不得超過發光晶 片(2)三分之一之覆蓋面，其過大之覆蓋面將直接影響整體 白光發光二極體之白光發光品質，以致於產生過多之次級 品。 再者，另有一款以三次烘烤製程完成之白光發光二極 體結構 > 如第二圖所示，其在製造時同樣係先將發光晶片(2) 以導電銀膠(3)黏著於二極體（!)之碗杯（13)裡並以150°C之 高溫烘烤二小時加以固定後，再以金線(5)分別與二極之插 腳（11)、（12)相搭接藉由透明膠(6)將整體發光晶片(2)覆蓋， 以150°C高溫烘烤二小時固定後，再於整體發光晶片(2)之 上層塗佈螢光膠(4)以150°C高溫烘烤一小時後烤合而成， 其在整體製程中需以三次製程總計五小時之工時完成烘烤 固定之程序，不但加工時間更長產量減低，且同樣容易在 烘烤過程中產生不良品，以及導電銀膠(3)之覆蓋面將直接 影響整體白光發光二極體之白光發光品質等缺點。 爰是，本發明「白光發光二極體之製造方法及其結構」 即藉由先將螢光膠點佈於二極體之碗杯裡，再將發光晶片 固定於螢光膠中，並以高溫烘烤將螢光膠與晶片烤合固定， 再於晶片之俯視面未佈有螢光膠之區段以金線分別與二極 體之插腳相搭接，同時以白光絕緣膠加以遮蓋後以高溫烤 本紙張尺度適用中國國家樣隼（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝. 經濟部中央標準局貝工消費合作杜印製 447148 A7 _____B7___ 五、發明説明（3) 合而成’其整體製程只需兩次烘烤共2個小時之程序即可 完成白光發光二極體成品，具有加快製程提升產量以及有 效控制產品品質之優點，爲其主要目的者。 本發明「白光發光二極體之製造方法及其結構」之次 一目的係其所製成之白光發光二極體之晶片不使用導電銀 膠與二極體碗杯裡之晶片相膠黏烤合固定，而不至於有影 響發光之效率，且晶片之俯視面未佈有螢光膠之區段藉由 白光絕緣膠加以遮蓋，可有效防止晶片之有色光直接射出， 使其發出的亮度更高效果更爲穩定者。 圖式說明： 第一圖係爲一以習用加工製程所完成之白光發光二極 體之結構示意圖β 第二圖係爲另一款以習用加工製程所完成之白光發光 二極體之結構示意圖。 第三圖係爲本發明一較佳實施例之結構意圖。 第四圖係爲本發明之白光發光二極體之整體結構外觀 圖。 (I) 二極體 （12)插腳 (II) 插腳 （13)碗杯 (請先閲讀背面之注意事項再填寫本K ) 裝 -·丁 -* 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2丨0Χ297公釐） C7 D7 447148 ?c年今ΓΙΘΠ修正/尹正/-辞免 五、創作說明（4) (2) 發光晶片 ⑹透明膠 (3) 導電銀膠 （7)白光絕緣膠 (4) 螢光膠 （8)外罩 (5) 金線 本發明「白光發光二極體之製造方法及其結構」，其所 製成之白光發光二極體之主要結構如第三圖所示，其主要 係將螢光膨(4)點佈於二極體(1)之碗杯(Π)裡，再將晶片固 定於螢光膠中，並以金線(5)將發光晶片(2)與二極體(1)之插 腳（11)、（12)相搭接，且在發光晶片(2)之金線(5)搭接處覆蓋 白光絕緣膠(7)，另由螢光膠(4)將發光晶片(2)之外表層加以 塗佈遮蓋’使發光晶片(2)所產生之有色光透過具特定光波 波長之螢光膠(4)射出，使二者之光波波長結合成白光之波 長範圍而呈現白光之發光效果。 至於，本發明「白光發光二極體之製造方法及其結構」 之製造流程則爲先將螢光膠(4)點怖於二極體(1)之碗杯(13) 裡，再於發光晶片(2)固定在於螢光膠(4)中，並以130°C之 高溫一小時烘烤將螢光膠(4)與發光晶片(2)烤合固定，再於 發光晶片⑺未覆蓋之區段以金線(5)分別與二極體⑴之插腳 本紙張尺度適用中國國家標準（CNS)A4規格（210〆297公釐） (請先閱讀背面之注意事項再填寫本頁)According to the continuous improvement of light-emitting diode technology, light-emitting diodes can be made from large panels, and the annual growth rate of fields such as Christmas lights, flashlights, and traffic signs that are applied by the light-emitting diode industry has increased. Extremely fast market expansion of the diode industry. At present, in the field of producing light-emitting diodes, white light-emitting diodes cannot be produced in a way that the light-emitting wafer directly generates white light. It mainly uses the spectral characteristics of the wavelength of the light wave to which various colored lights belong. The colored light produced by the light-emitting chip is emitted through the fluorescent glue with a specific light wavelength, so that the light wavelengths of the two are combined into a white light wavelength range to show the white light emitting effect; first, as shown in the first figure, it is a traditional The white light emitting diode structure manufactured by the manufacturing method is that the light emitting chip (2) is firstly adhered to the bowl (13) of the diode body with conductive silver glue ⑶ and baked at a high temperature of 150 & C during the manufacturing process. After being fixed for two hours, the gold wire (5) and the pins (11) and (12) of the two poles are respectively overlapped, and the entire light-emitting chip (2) is covered by the fluorescent glue (4), and then 130 ° C g scale is applicable to Chinese National Standard < CNS) A4 size (210 X 297 mm) bucket -----.----------------- tr—illlili (Please read first Note on the back, please fill out this page again.) A7 B7 V. Description of the invention (2) Hours of work complete the process of baking and fixing. Not only is the processing time long and it is easy to produce defective products during the baking process, and its conductive silver glue (3) must not exceed the light-emitting chip (2). One-half of the coverage, its excessively large coverage will directly affect the white light-emitting quality of the overall white light-emitting diode, so that too many secondary products are generated. In addition, there is another white light emitting diode structure completed in a three-baking process. As shown in the second figure, it is also manufactured by first bonding the light-emitting chip (2) with conductive silver glue (3) to The bowl (13) of the diode (!) Is baked at 150 ° C for two hours to fix it, and then the gold wire (5) is put together with the pins (11) and (12) of the diode Cover the whole light-emitting chip (2) with transparent glue (6), bake it at 150 ° C for two hours and fix it, and then coat the whole light-emitting chip (2) with fluorescent glue (4) at 150 ° C High-temperature baking is one hour after baking. It needs to complete the baking and fixing process in a total of five hours in three processes in the overall process. Not only the processing time is longer, the yield is reduced, but it is also easy in the baking process. The occurrence of defective products and the coverage of the conductive silver glue (3) will directly affect the white light emitting quality of the overall white light emitting diode. That is, the "manufacturing method and structure of white light emitting diode" of the present invention is to firstly distribute fluorescent glue in the bowl of the diode, and then fix the light emitting chip in the fluorescent glue, and then High-temperature baking fixes the fluorescent glue to the chip, and then overlaps the gold pins with the pins of the diode on the section of the chip that is not covered with the fluorescent glue, and covers it with white insulating glue. Paper size for high-temperature baking is applicable to China National Sample (CNS) A4 (210X 297 mm) (please read the precautions on the back before filling this page) A7 _____B7___ V. Description of the invention (3) The combined process requires only two baking processes for a total of 2 hours to complete the white light-emitting diode finished product, which has the advantages of speeding up the process, increasing yield and effectively controlling product quality. For its main purpose. The second purpose of the "manufacturing method and structure of the white light emitting diode" of the present invention is that the white light emitting diode wafer made by the invention does not use conductive silver glue and the wafer in the bowl of the diode is adhered and baked. It is fixed so as not to affect the efficiency of light emission, and the top surface of the chip is not covered with fluorescent glue, which is covered by white light insulating glue, which can effectively prevent the colored light of the chip from emitting directly and make the emitted light more bright. High effect is more stable. Description of the drawings: The first diagram is a schematic diagram of the structure of a white light-emitting diode completed by a conventional processing process. The second diagram is a diagram of the structure of another white-light-emitting diode completed by a conventional processing process. The third figure is a structural view of a preferred embodiment of the present invention. The fourth figure is an overall structural appearance of the white light emitting diode of the present invention. (I) Diodes (12) Pins (II) Pins (13) Bowls (Please read the precautions on the back before filling this K) Packing-· ding- * This paper size applies to China National Standard (CNS) Λ4 specifications (2 丨 0 × 297 mm) C7 D7 447148? C year to date ΓΙΘΠ correction / Yin Zheng / -resignation V. Creation instructions (4) (2) Light-emitting chip ⑹ transparent glue (3) Conductive silver glue (7) White light insulation glue (4) Fluorescent glue (8) Cover (5) Gold wire The "manufacturing method and structure of white light emitting diode" of the present invention, the main structure of the white light emitting diode produced by it is shown in the third figure It is mainly to distribute the fluorescent expansion (4) dots in the bowl (Π) of the diode (1), then fix the chip in the fluorescent glue, and use a gold wire (5) to illuminate the light emitting chip (2 ) Is overlapped with the pins (11) and (12) of the diode (1), and the overlap of the gold wire (5) of the light-emitting chip (2) is covered with white light-emitting insulating glue (7), and the other is made of fluorescent glue (4) Coating and covering the outer layer of the light-emitting wafer (2) 'make the colored light generated by the light-emitting wafer (2) pass through the fluorescent glue (4) with a specific light wavelength, and combine the light wavelengths of the two into White light wavelength range Glow effect of white light. As for the manufacturing process of the "manufacturing method and structure of the white light emitting diode" of the present invention, the fluorescent glue (4) is first placed in the bowl (13) of the diode (1), and then the light is emitted. The wafer (2) is fixed in the fluorescent glue (4), and the fluorescent glue (4) and the light-emitting chip (2) are baked and fixed at 130 ° C for one hour, and then the light-emitting chip is not covered. The sections are gold wire (5) and the diode inserting script. The paper size is applicable to China National Standard (CNS) A4 (210〆297 mm) (Please read the precautions on the back before filling this page)
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I A7 447148 五、發明説明（5) (11)、（12)相搭接，同時以白光絕緣膠(7)加以遮蓋後以150 ------^--裝-- (請先閱讀背面之注意事項再填寫本頁) °(：之高溫一小時烤合成型，最後可依實際成品樣式之需要 於二極體（1)之外層包覆透明之外罩(8)予以保護。其整體製 程僅以二次烘烤程序即可完成白光發光二極體成品，具有 加快製程提升產量以及有效控制產品品質之優點。 經濟部中央橾牟局員工消費合作社印製 本發明「白光發光二極體之製造方法及其結構」之整 體製程僅以二次烘烤程序即可完成白光發光二極體成品， 且具有加快製程提升產量以及有效控制產品品質之優點， 同時其所製成之白光發光二極體之晶片不使用導電銀膠與 二極體碗杯裡之晶片相膠黏烤合固定，而不至於有影響發 光之現象，且晶片之俯視面未佈有螢光膠之區段藉由白光 絕緣膠加以遮蓋，可有效防止晶片之有色光直接射出，使 其白光發光效果與亮度更爲穩定提昇產品品質。提供了白 光發光二極體之製造另一較佳可行之方法及結構，爰依法 提呈發明專利之申請。 本紙張尺度適用中國國家標準（CNS >A4規格（210x 297公楚）I A7 447148 V. Description of the invention (5) (11), (12) are overlapped, and at the same time covered with white light insulation adhesive (7), then 150 ------ ^-install-(Please read first Note on the back, please fill in this page again) ° (: High-temperature baking for one hour, synthetic type, finally, the outer layer of the diode (1) can be covered with a transparent outer cover (8) to protect it according to the actual finished product style. The whole The white light emitting diode finished product can be completed by only a second baking process, which has the advantages of accelerating the production process and increasing the output and effectively controlling the quality of the product. The Consumer Cooperative of the Central Ministry of Economic Affairs of the Ministry of Economic Affairs printed the present invention "white light emitting diode" The manufacturing process of "manufacturing method and structure" can complete the white light emitting diode finished product only by the second baking process, and has the advantages of speeding up the production process and increasing the output and effectively controlling the quality of the product. The polar body of the wafer does not use conductive silver glue and the wafer in the diode bowl is bonded and fixed, so as not to affect the phenomenon of light emission, and the top surface of the wafer is not covered with fluorescent glue. Covered with white light insulation It can effectively prevent the colored light of the wafer from being directly emitted, making the white light emitting effect and brightness more stable and improving the product quality. It provides another better and feasible method and structure for manufacturing white light emitting diodes. Application. This paper size applies to Chinese national standards (CNS > A4 size (210x 297 cm)