TW447148B - Manufacturing method and structure of white light LED - Google Patents

Abstract

The manufacturing method and structure of white light LED of the present invention mainly disposes the fluorescent glue spots in the cup of the light emitting diode, then fix the die in the fluorescent glue, bake and fix the fluorescent glue and die by high-temperature baking, and connect the block without fluorescent glue in the horizontal plane of the die to the lead of the diode by gold wire, and cover it with a white-light insulation glue at the same time and bake it in high-temperature. The white light LED product can be finished with two baking procedures for the whole process, which has the advantages of speeding up the process, increasing the productivity, and effectively controlling the quality of product; furthermore, it is not necessary to use the conduction silver glue to bake and fix the die in the cup of the diode in the die of white light LED made, and the emitting of light won't be affected, and the block without fluorescent glue in the horizontal plane of the die is covered by the white light insulation glue to effectively prevent the color light of the die from emitting out directly, so that the light-emitting effect of white light and brightness is even more stable.

Description

Xiang Beibei was requested to indicate% year > printed on July 7th by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Amendment 4 There are 4 changes to whether the internal customers are allowed to amend. . Said March > Shanghai Correction / Correction / Supplement 447148 V. Creative Instructions (h The "Method for Manufacturing White Light-Emitting Diodes and Its Structure" of the present invention aims to provide an overall manufacturing process that requires only a secondary baking process, ie White light emitting diode can be completed, and has the advantages of speeding up the process to increase yield and effective control of product quality, and a method for manufacturing white light emitting diode; meanwhile, the white light emitting diode made by this method has better light emitting quality , The advantage of white light emitting effect is more stable.

According to the continuous improvement of light-emitting diode technology, light-emitting diodes can be made from large panels, and the annual growth rate of fields such as Christmas lights, flashlights, and traffic signs that are applied by the light-emitting diode industry has increased. Extremely fast market expansion of the diode industry. At present, in the field of producing light-emitting diodes, white light-emitting diodes cannot be produced in a way that the light-emitting wafer directly generates white light. It mainly uses the spectral characteristics of the wavelength of the light wave to which various colored lights belong. The colored light produced by the light-emitting chip is emitted through the fluorescent glue with a specific light wavelength, so that the light wavelengths of the two are combined into a white light wavelength range to show the white light emitting effect; first, as shown in the first figure, it is a traditional The white light emitting diode structure manufactured by the manufacturing method is that the light emitting chip (2) is firstly adhered to the bowl (13) of the diode body with conductive silver glue ⑶ and baked at a high temperature of 150 & C during the manufacturing process. After being fixed for two hours, the gold wire (5) and the pins (11) and (12) of the two poles are respectively overlapped, and the entire light-emitting chip (2) is covered by the fluorescent glue (4), and then 130 ° C g scale is applicable to Chinese National Standard < CNS) A4 size (210 X 297 mm) bucket -----.----------------- tr—illlili (Please read first Note on the back, please fill out this page again.) A7 B7 V. Description of the invention (2) Hours of work complete the process of baking and fixing. Not only is the processing time long and it is easy to produce defective products during the baking process, and its conductive silver glue (3) must not exceed the light-emitting chip (2). One-half of the coverage, its excessively large coverage will directly affect the white light-emitting quality of the overall white light-emitting diode, so that too many secondary products are generated. In addition, there is another white light emitting diode structure completed in a three-baking process. As shown in the second figure, it is also manufactured by first bonding the light-emitting chip (2) with conductive silver glue (3) to The bowl (13) of the diode (!) Is baked at 150 ° C for two hours to fix it, and then the gold wire (5) is put together with the pins (11) and (12) of the diode Cover the whole light-emitting chip (2) with transparent glue (6), bake it at 150 ° C for two hours and fix it, and then coat the whole light-emitting chip (2) with fluorescent glue (4) at 150 ° C High-temperature baking is one hour after baking. It needs to complete the baking and fixing process in a total of five hours in three processes in the overall process. Not only the processing time is longer, the yield is reduced, but it is also easy in the baking process. The occurrence of defective products and the coverage of the conductive silver glue (3) will directly affect the white light emitting quality of the overall white light emitting diode. That is, the "manufacturing method and structure of white light emitting diode" of the present invention is to firstly distribute fluorescent glue in the bowl of the diode, and then fix the light emitting chip in the fluorescent glue, and then High-temperature baking fixes the fluorescent glue to the chip, and then overlaps the gold pins with the pins of the diode on the section of the chip that is not covered with the fluorescent glue, and covers it with white insulating glue. Paper size for high-temperature baking is applicable to China National Sample (CNS) A4 (210X 297 mm) (please read the precautions on the back before filling this page) A7 _____B7___ V. Description of the invention (3) The combined process requires only two baking processes for a total of 2 hours to complete the white light-emitting diode finished product, which has the advantages of speeding up the process, increasing yield and effectively controlling product quality. For its main purpose. The second purpose of the "manufacturing method and structure of the white light emitting diode" of the present invention is that the white light emitting diode wafer made by the invention does not use conductive silver glue and the wafer in the bowl of the diode is adhered and baked. It is fixed so as not to affect the efficiency of light emission, and the top surface of the chip is not covered with fluorescent glue, which is covered by white light insulating glue, which can effectively prevent the colored light of the chip from emitting directly and make the emitted light more bright. High effect is more stable. Description of the drawings: The first diagram is a schematic diagram of the structure of a white light-emitting diode completed by a conventional processing process. The second diagram is a diagram of the structure of another white-light-emitting diode completed by a conventional processing process. The third figure is a structural view of a preferred embodiment of the present invention. The fourth figure is an overall structural appearance of the white light emitting diode of the present invention. (I) Diodes (12) Pins (II) Pins (13) Bowls (Please read the precautions on the back before filling this K) Packing-· ding- * This paper size applies to China National Standard (CNS) Λ4 specifications (2 丨 0 × 297 mm) C7 D7 447148? C year to date ΓΙΘΠ correction / Yin Zheng / -resignation V. Creation instructions (4) (2) Light-emitting chip ⑹ transparent glue (3) Conductive silver glue (7) White light insulation glue (4) Fluorescent glue (8) Cover (5) Gold wire The "manufacturing method and structure of white light emitting diode" of the present invention, the main structure of the white light emitting diode produced by it is shown in the third figure It is mainly to distribute the fluorescent expansion (4) dots in the bowl (Π) of the diode (1), then fix the chip in the fluorescent glue, and use a gold wire (5) to illuminate the light emitting chip (2 ) Is overlapped with the pins (11) and (12) of the diode (1), and the overlap of the gold wire (5) of the light-emitting chip (2) is covered with white light-emitting insulating glue (7), and the other is made of fluorescent glue (4) Coating and covering the outer layer of the light-emitting wafer (2) 'make the colored light generated by the light-emitting wafer (2) pass through the fluorescent glue (4) with a specific light wavelength, and combine the light wavelengths of the two into White light wavelength range Glow effect of white light. As for the manufacturing process of the "manufacturing method and structure of the white light emitting diode" of the present invention, the fluorescent glue (4) is first placed in the bowl (13) of the diode (1), and then the light is emitted. The wafer (2) is fixed in the fluorescent glue (4), and the fluorescent glue (4) and the light-emitting chip (2) are baked and fixed at 130 ° C for one hour, and then the light-emitting chip is not covered. The sections are gold wire (5) and the diode inserting script. The paper size is applicable to China National Standard (CNS) A4 (210〆297 mm) (Please read the precautions on the back before filling this page)

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I A7 447148 V. Description of the invention (5) (11), (12) are overlapped, and at the same time covered with white light insulation adhesive (7), then 150 ------ ^-install-(Please read first Note on the back, please fill in this page again) ° (: High-temperature baking for one hour, synthetic type, finally, the outer layer of the diode (1) can be covered with a transparent outer cover (8) to protect it according to the actual finished product style. The whole The white light emitting diode finished product can be completed by only a second baking process, which has the advantages of accelerating the production process and increasing the output and effectively controlling the quality of the product. The Consumer Cooperative of the Central Ministry of Economic Affairs of the Ministry of Economic Affairs printed the present invention "white light emitting diode" The manufacturing process of "manufacturing method and structure" can complete the white light emitting diode finished product only by the second baking process, and has the advantages of speeding up the production process and increasing the output and effectively controlling the quality of the product. The polar body of the wafer does not use conductive silver glue and the wafer in the diode bowl is bonded and fixed, so as not to affect the phenomenon of light emission, and the top surface of the wafer is not covered with fluorescent glue. Covered with white light insulation It can effectively prevent the colored light of the wafer from being directly emitted, making the white light emitting effect and brightness more stable and improving the product quality. It provides another better and feasible method and structure for manufacturing white light emitting diodes. Application. This paper size applies to Chinese national standards (CNS > A4 size (210x 297 cm)

Claims (1)

(\ 0 (\ 0 Α8 Β8 C8 D8 4471 4 6. Scope of patent application 1. — A "method for manufacturing white light emitting diodes", the manufacturing process of white light emitting diodes is: A. First, fluorescent Glue dots are placed in the bowl of the diode; B. The wafer is fixed in the fluorescent glue, and the fluorescent glue and the wafer are baked and fixed at a high temperature; C. There is no cloth on the top surface of the wafer The sections of the fluorescent glue are overlapped with gold wires and the pins of the diode, respectively, and covered with white light insulating glue, and then baked at high temperature. 2. As described in item 1, "White light emission" The manufacturing method of the diode ", in which the fluorescent glue and the light-emitting chip can be fixed by baking at 130 ° C for one hour. 3." White light-emitting diode "described in item 1. "Manufacturing method", in which the white light insulating glue and the entire structure can be baked and synthesized at a high temperature of 130 ° C for one hour. 4. The "manufacturing method of white light emitting diode" as described in item 1. of the scope of patent application, where White light-emitting diodes can be baked and synthesized according to the actual needs of the finished product. The outer layer of the diode is covered with a transparent outer cover to protect it. 5_ — a kind of "structure of white light emitting diode", the white light emitting diode of this paper applies the Chinese National Standard (CNS) A4 specification (210X297) ) (Please read the precautions on the back before filling out this page) τ Printed by the Consumer Cooperatives of the Central Rubbing Bureau of the Ministry of Economic Affairs 47 1 4 8 r, ___S_ VI. The scope of patent application is the colored light transmitting device produced by the light emitting chip The fluorescent glue with a specific light wavelength is emitted, so that the wavelength of the former light wave excites the wavelength of the fluorescent light glue of the latter into a wavelength range of white light to exhibit a white light emitting effect; it is characterized in that: the fluorescent glue dots are distributed on the bowl of the diode In the cup, the light-emitting chip is overlapped with the pins of the diode with gold wires, and the light-emitting chip's gold wire overlap is covered with white light-insulating glue, and the outer surface of the light-emitting chip is coated and covered by fluorescent glue. The colored light generated by the light-emitting chip is emitted through the fluorescent glue with a specific wavelength, so that the wavelength of the former light wave excites the wavelength of the latter glue light and the wavelength range of white light is combined into a wavelength range of white light. Those who show the effect of white light. (Please read the notes on the back before filling in this page.) 'IX Printed paper scale of the Ministry of Economic Affairs, China Standards Bureau, Shellfisher Consumer Cooperative, applies Chinese National Standard (CNS) A4 specifications (210X297 Mm)