經濟部智慧財產局員工消費合作社印製 447 092 A7 1 - B7 五'發明説明。^-----— [發明領域] 本發明係有關於積想電路封裝件(πη_“丨咖 packag侧用之封裝模具’特別是有關於-種新穎之積 趙電路封裝用之封裝模具結構，其可適用於積體電路之封 裝製程（molding process)中，用以形成一封裝膠體 (encapsnlatn)，以將積體電路晶片包覆者。 [發明背景] 封裝製程為一項重要的積體電路封裝技術，其中利用 一組特製之模具來形成包覆積體電路晶片之封裝膠體。此 特製之模具組包含一下模具及一上模具，並於該下模具與 上模具之至少一者上形成一模穴（Cavity);將模料（通常為 樹脂）注入此模穴之後’便可形成所需之封裝膠體〇 習知技術上’已發展出許多種封裝模具。例如美國專 利第5,971，734號即提出一種先進之封裝模具結構。 然而習知之封裝模具結構的一項缺點在於其下模具與 上模具之接合面並無法達到完全密接之程度，亦即其間仍 會有一間隙存在《此間隙雖小，但卻足以讓封裝製程中所 用的流體狀模料流入其内，因此而造成溢料現象。 請參閱第1A-1B圖’以美國專利第5,971,734號之 封裝模具結構為例，其包含一下模具1〇及一上模具20; 且此下模具10與上模具20二者合模後，其間形成有一注 料槽 11、一 主流道（runner )12、一 次流道（subrunner )13、 以及一模穴14 (此些構件之詳鈿圖式及說明，請參閱美 國專利第5,971，734號之專利說明書，於此僅簡略繪出 本紙張尺度適用中國國家揉準（CNS ) /\4規格（210 X 297公釐） 1 15950 I ;^------1T------,i (請先閲讀背面之注意事項再填窝本頁) A7 五、發明説明（2 ) " ^ " 〜--- 友說明）。於封驻制 裝製程中’流體狀之樹脂材料將灌入至注 料槽1 1中，並fL菩士、，古、* 。著主乂道12及次流道13而流入至各個 模六14，即可太欠μ 在各個模穴丨4中形成一封裝膠體（未顯 示）。 然而’如第1B圖所示，由於下模具10與上模具20 之接口面並無法達到完全密接之程度其間即會有—間隙 3〇存在。此間隙30雖小，但卻足以讓封裝製程中所用的 流體狀樹脂材料流人其中而形成溢料現象。如帛1A圖所 不’於封裝製程完成後’於下模具1〇及上模具2〇上位 於注料槽11、主流道12、及次流道13之周緣處會有殘留 溢料15。 由於此些殘留溢料之產生，因此於進行下一次之封裝 裝程之4，均須首先進行一清洗程序，以將模具接合面上 之殘留溢料完全清除。然而此清洗程序卻易造成殘留溢料 到處飛揚’反而對封裝設備造成污染，容易在進行下一次 之封裝製程時’冑附至τ一批之積冑電路封裝件成品上， 造成此下一批封裝件成品外觀上之瑕疵，而影響產品之品 質。 σ [發明概述] 鑒於以上所述習知技術之缺點，本發明之主要目的便 是在於提供一種新穎之積想電路封裝模具結構，其可在封 裝製程中，防止模料之溢料現象。 本發明之另一目的在於提供一種新穎之積體電路封裝 模具結構’其可確保積體電路封裝件成品之品質。 耒纸張尺度璉用申國國家標準（CNS ) A4規格（2丨Ox 297公釐） 15950 ---------裝-- (請先鬩讀背面之注意事項再填寫本頁〕 訂 經濟部智慧財產局Μ工消費合作社印製 線------------ i »: - I I I . 2 經濟部智慧財產局員工消费合作社印製 447092 A7 ________B7 _ 五、發明説明（3 ) 本發明的又一目的在於提供一種新穎之積體電路封裝 模具結構’其可在封裝製程中，不會對封裝設備造成污染。 根據以上所述之目的，本發明提供了一種可防止溢料 之積體電路封裝模具結構.本發明之封裝模具結構包含（a) 一下模具’其具有一接合面；（b) 一上模具，其具有—接 合面；以及（C) 一模料流道’其形成於該下模具與上模具 任一者之接合面上；於封裝膠體製程中，該上模具之接合 面係接合至該下模具之接合面。 本發明之特徵在於該模料流道的開口邊緣處形成一階 梯狀切空部分；該階梯狀切空部分於該上模具與該下模具 接合時’係相當於一狹道結構；於封裝製程中所用之模料 流進該階梯狀切空部分時，由於該階梯狀切空部分之深度 甚淺’使模料會快速吸收模溫’使模料之黏度變大而令流 速減緩’從而防止模料溢入該上模具與該下模具間的間 隙，故不會於上模具與下模具的接合面上造成溢料現象。 與習知技術相比較，使用本發明之封裝模具結構不會 在注料槽、主模料流道、及次模料流道的周緣上形成殘留 溢料’因此不會對封裝設備造成污染、且不會在模面上產 生殘留溢料、也不會致使殘留溢料粘附至下一批之封裝件 成品上。本發明因此較習知技術具有更佳之優點及實用 性。 [圖式簡述] 為讓本發明之上述和其它目的、特徵、和優點能更明 顯易懂，下文將舉本發明之較佳實施例，並配合所附圊式， I^------ΪΤ------^ (請先閲讀背面之注意事項一4:4.寫本頁) ,. 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） 3 15950Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 447 092 A7 1-B7 Five 'invention description. ^ -----— [Invention Field] The present invention relates to a packaging mold for a package circuit (πη_ "丨 packag side of a coffee pack '), and in particular to a novel packaging mold structure for a packaging circuit of a product It can be used in the packaging process of integrated circuits (molding process) to form an encapsnlatn to encapsulate integrated circuit chips. [Background of the Invention] The packaging process is an important integration Circuit packaging technology, in which a set of special molds is used to form a package gel covering an integrated circuit wafer. The special mold set includes a lower mold and an upper mold, and is formed on at least one of the lower mold and the upper mold. A Cavity; after molding material (usually resin) is injected into this cavity, 'the required packaging colloid can be formed. Conventionally,' many types of packaging molds have been developed. For example, US Patent No. 5,971,734 No. is to propose an advanced packaging mold structure. However, a disadvantage of the conventional packaging mold structure is that the joint surface of the lower mold and the upper mold cannot reach a degree of complete tightness, that is, in the meantime There will be a gap "Although this gap is small, it is sufficient to allow the fluid-like molding material used in the packaging process to flow into it, resulting in flashover phenomenon. Please refer to Figures 1A-1B 'in the package of US Patent No. 5,971,734 The mold structure is taken as an example, which includes a lower mold 10 and an upper mold 20; and after the lower mold 10 and the upper mold 20 are closed, a filling slot 11, a runner 12, and a primary flow are formed therebetween. Road (subrunner) 13, and a mold cavity 14 (For detailed drawings and descriptions of these components, please refer to the patent specification of US Patent No. 5,971,734. Here, only the paper size is drawn to apply the Chinese national standard. (CNS) / \ 4 specifications (210 X 297 mm) 1 15950 I; ^ ------ 1T ------, i (Please read the precautions on the back before filling in this page) A7 5 Description of the invention (2) " ^ " ~ --- Friends description). In the sealing process, the 'fluid resin material will be poured into the injection tank 11 and fL. , *. It flows into each mold six 14 toward the main channel 12 and the secondary flow channel 13, and it can be too short μ to form one in each mold cavity 丨 4. A colloid (not shown) is installed. However, as shown in FIG. 1B, since the interface between the lower mold 10 and the upper mold 20 cannot reach a complete tightness, there will be a gap of 30. Although this gap 30 is small, However, it is enough to allow the fluid resin material used in the packaging process to flow into it and form a flashover phenomenon. As shown in Figure 1A, it is not located in the injection mold slot on the lower mold 10 and the upper mold 20 after the packaging process is completed. 11. There will be residual flash 15 at the periphery of the main flow channel 12 and the secondary flow channel 13. Due to the generation of these residual flashes, a cleaning process must be performed first in order to perform the next packaging process 4 to completely remove the residual flashes on the mold joint surface. However, this cleaning procedure is easy to cause residual flashes to fly everywhere, but to cause pollution to the packaging equipment, and it is easy to 'attach to the finished product of the circuit pack of τ batches during the next packaging process, causing this next batch. Imperfections in the appearance of the finished product of the package affect the quality of the product. σ [Summary of the Invention] In view of the shortcomings of the conventional technology described above, the main object of the present invention is to provide a novel integrated circuit packaging mold structure which can prevent the overflow of the mold during the packaging process. Another object of the present invention is to provide a novel integrated circuit package mold structure 'which can ensure the quality of the integrated circuit package finished product.耒 Paper Size: Apply National Standard (CNS) A4 (2 丨 Ox 297 mm) 15950 --------- install-(Please read the precautions on the back before filling in this page) Order the printing line of the Consumer Goods Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------ i »:-III. 2 Printed by the Consumer Goods Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 447092 A7 ________B7 _ V. Description of the Invention (3) Another object of the present invention is to provide a novel integrated circuit packaging mold structure 'which can be used in the packaging process without causing pollution to the packaging equipment. According to the above-mentioned object, the present invention provides a method for preventing Flash mold integrated circuit packaging mold structure. The packaging mold structure of the present invention includes (a) a lower mold having a joint surface; (b) an upper mold having a joint surface; and (C) a mold stream It is formed on the joint surface of any one of the lower mold and the upper mold; during the sealing process, the joint surface of the upper mold is joined to the joint surface of the lower mold. The present invention is characterized by the mold stream A stepped cutout is formed at the opening edge of the channel; The stepped cutout portion is equivalent to a narrow structure when the upper mold and the lower mold are joined; when the mold material used in the packaging process flows into the stepped cutout portion, the stepped cutout portion The depth is very shallow, 'making the mold material quickly absorb the mold temperature', making the viscosity of the mold material larger and slowing down the flow rate, thereby preventing the mold material from overflowing into the gap between the upper mold and the lower mold, so it will not Flashover phenomenon is caused on the joint surface of the lower mold. Compared with the conventional technology, the use of the packaging mold structure of the present invention does not cause residual flashover on the periphery of the injection groove, the main mold flow channel, and the secondary mold flow channel. Therefore, it will not cause pollution to the packaging equipment, and will not cause residual flash on the mold surface, nor will it cause the residual flash to adhere to the next batch of packaged finished products. The present invention therefore has [Brief description of the drawings] In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described below, in conjunction with the attached formula , I ^ ------ ΪΤ ------ ^ (Please Notes Read the back of a 4: 4 written on this page), this paper applies China National rub scale quasi (CNS) A4 size (210X297 mm) 315 950.
五、發明説明（4 ) 詳細說明本發明之實質 下： 術内容。所附圖式之内容簡述如 第1A圖（習知技術）為 糞剎笛c ）马—上視示意圖’用以顯示美國 專利第5,971，734號之封裝捃目一 裝楔具結構所造成之溢料現象： 第1B圖（習知技術）氧 钗佝）為一剖面示意圖，用以顯示習知 ’裝模具結構中之下模且 .'、與上模具之間會造成溢料現象 之間隙；且 第2圖為一剖面示意圖’其顯示本發明之第一實施例 之封裂模具結構於合模時的形態；以及 第3圖為一剖面不意圖’其顯示本發明之第二實施例 之封裝膠體模具結構於合模時的形態。 [圖式之標號] 10 12 14 20 30 1〇〇 200 202 203 204 下模具 主流道（runner) 模穴 上模具 11 13 15 21 注料槽 次流道（subrunner) 殘留溢料（flash) 上模具20中之模料流道 下模具20與上模具30之間之間隙 下模具 下模具100之接合面 上模具 201 上模具200之接合面 上模具200中之模料流道 上模具200中之階梯狀切空部分 上模片200中之多階梯狀狭道結構 [發明實施例詳細說明] 差實施铷丨 尽紙張尺度適用中國國家棣準（) Λ4Λ格2丨0X297公釐） 4 15950 装 Ϊ H ^ 1» 1 線 (讀先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消资合作社印製 447 09 2 A7 —— ___________ 五、發明説明（5 ) " ~ *" 第2囷為—剖面示意圖’其顯示本發明之第一實施例 之封裝模具結構於合模時的形態。如圖所示，本發明之封 裝模具結構包含一下模具100及一上模具2,下模具1〇〇 之上表自ΗΠ(以下稱為下模具之接合面）用以接合至上模 具200之下表面2〇1(以下稱為上模具之接合面下模具 100與上模具200接合後之形態即如第2圖所示β 上模具200之接合面201上形成—模料流道2〇2 ;此 模料流道202即為用以在封裝製程中，用來傳送流體狀之 樹脂材料以形成包覆積體電路晶片之封裝膠體（未顯示）。 此外’該模料流道亦得形成於該下模具1〇〇上，並無特定 限制& 本發明之特徵即在於上模具200中之模料流道202的 開口邊緣處’形成一階梯狀切空部分203»根據本發明之 較佳實施例，此階梯狀切空部分203之寬度妒宜為〇.5 mm 至1·5 mm之間’而深度Z)則宜為0.05 mm至0.15 mni之 間。如第2圖所示，下模具100與上模具200接合後，此 階梯狀切空部分203之尺寸與模料流道202之尺寸相較之 下，相當於一狭道結構。因此在封裝膠體製程中，灌入至 模料流道202的流體狀樹脂材料於流進此階梯狀切空部分 203時，由於該狹道狀之階梯狀切空部分203之深度與寬 度甚小，流經該處之樹脂材料即會快速地吸收模溫，造成 其黏度增大，因而使得其流速變緩’不易衝入下模具100 與上模具200之接合面之間所形成之間隙，從而可防土溢 料現象之發生。 本紙張尺度逋用中國國家棵準（CNS ) A4規格（2丨0X297公釐） 5 15950 —.1 I I I I __ I 裝 i I II 訂 I— J— ^ (請先閲讀背面之注意事項H寫本頁) A7 _____B7 五、發明説明（6 ) 以上之第2圖中所示之上模具200中之模料流道202 可為第1A-1B圖中所示之習知封裝模具結構中之注料槽、 主流道、及次流道。廣義而言，本發明可適用於封裝模具 結構中’易發生溢料現象之任何地點，用以防止溢料現象 之_發生。 差二實施例 第3圖顯示本發明之第二實施例。於此圖式中，與第 2圖所示之實施例相同之部分，係以相同之標號表示。 此實施例與上述第一實施例不同之處在於狹道結構係 形成一多階梯狀，如標號204所示之部位。此多階梯狀狹 道結構204之開口寬度#為〇.5111111至l 5mm之間，而深 度D則為0.05mm至0.15mm之間。在封裝製程令，灌入 至模料流道202的流體狀樹脂材料於流進此多階梯狀狹道 結構204時，此多階梯狀狹道結構2〇4將快速地吸收樹脂 材料之熱量，造成其黏度增大，因而使得其流速變緩，不 易衝入下模具100與上模具200之接合面之間所形成之間 隙’從而可防止溢料現象之發生。 综而言之，本發明提供了 一種可防止溢料之積體電路 封裝模具結構。與習知技術相比較，使用本發明之封裝模 具結構不會在注料槽、主流道、及次流道的周緣上形成殘 留溢料，因此於再度使用前毋須清洗處理’不會對封裝設 備造成污染、且不會在模面上產生殘留溢料、也不會致使 殘留溢㈣附至下—批之封裝件成品上。本發明因此較習 知技術具有更佳之優點及實用性。 表紙狀度適财國-5^i^7cNS) M規格（210x 297公)------- 15950 (請先閱讀背面之注意事項再填寫本頁} .裝. 訂 經濟部智憨財產局員工消費合作社印製 6 4 47 0 9 2 A7 B7 五、發明説明（7 ) . 以上所述僅為本發明之較佳實施例而已，並非用以限 疋本發明之實質技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申請專利範圍中。任何他人所完成 之技術實體，若是與下述之申請專利範圍所定義者為=全 相同、或《為-《等效之變^：’均將被視為涵蓋於此:利 範圍之中。V. Description of the invention (4) The essence of the present invention is explained in detail as follows: Technical contents. The content of the drawings is briefly described in Figure 1A (the conventional technology) is a feces brake c. Horse-a schematic diagram of the top view 'is used to show the overflow caused by the packaged wedge structure of the US Pat. No. 5,971,734. Material phenomenon: Figure 1B (conventional technology) is a schematic cross-section diagram, which shows the gap between the upper mold and the lower mold, which is known in the conventional mold mounting structure; And FIG. 2 is a schematic cross-sectional view 'showing the shape of the sealing mold structure of the first embodiment of the present invention when the mold is closed; and FIG. 3 is a cross-sectional view not intended' which shows the second embodiment of the present invention. The shape of the encapsulated colloidal mold structure when the mold is closed. [Symbol of the figure] 10 12 14 20 30 1 200 200 202 203 204 lower mold main runner runner upper mold 11 13 15 21 injection tank subrunner residual flash (flash) upper mold The gap between the mold runner 20 in the mold 20 and the upper mold 30. The joint surface of the lower mold 100 and the mold 201 on the joint surface of the upper mold 200. The step in the mold 200 on the joint surface of the mold 200. Multi-step-like narrow channel structure in the die 200 on the cutout part [Detailed description of the embodiment of the invention] Poor implementation 铷 丨 The paper size is applicable to Chinese national standards () Λ4ΛGrid 2 丨 0X297 mm) 4 15950 Installation H ^ 1 »1 line (read the precautions on the back before filling out this page) Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 447 09 2 A7 —— ___________ V. Description of Invention (5) " ~ * " Section 2囷 is-a schematic sectional view 'which shows the shape of the packaging mold structure of the first embodiment of the present invention when the mold is closed. As shown in the figure, the package mold structure of the present invention includes a lower mold 100 and an upper mold 2, and the upper mold 100 and the upper table are self-aligned (hereinafter referred to as the joint surface of the lower mold) for joining to the lower surface of the upper mold 200 2〇1 (hereinafter referred to as the joint surface of the upper mold 200 and the upper mold 200 after joining the shape is as shown in Figure 2 β on the joint surface 201 of the upper mold 200-mold runner 202; this The molding material runner 202 is a packaging gel (not shown) used to transfer a fluid resin material to form a packaged integrated circuit chip during the packaging process. In addition, 'the molding material runner must also be formed in the There is no specific limitation on the lower mold 100. The present invention is characterized in that a stepped cutout portion 203 is formed at the opening edge of the mold material flow channel 202 in the upper mold 200. According to a preferred embodiment of the present invention, For example, the width of the stepped cutout 203 is preferably between 0.5 mm and 1.5 mm, and the depth Z) is between 0.05 mm and 0.15 mni. As shown in Fig. 2, after the lower mold 100 and the upper mold 200 are joined, the size of the stepped cutout portion 203 is compared with the size of the mold material flow path 202, which is equivalent to a narrow structure. Therefore, in the course of the encapsulation system, when the fluid resin material poured into the mold flow channel 202 flows into the stepped cutout portion 203, the depth and width of the narrow stepped cutout portion 203 are very small. The resin material flowing there will quickly absorb the mold temperature, causing its viscosity to increase, thus making its flow rate slower. It is not easy to punch into the gap formed between the joint surface of the lower mold 100 and the upper mold 200, thereby It can prevent the occurrence of soil overflow. This paper uses China National Standards (CNS) A4 specifications (2 丨 0X297 mm) 5 15950 —.1 IIII __ I installed i I II ordered I — J — ^ (Please read the precautions on the back first. (Page) A7 _____B7 V. Description of the invention (6) The mold runner 202 in the upper mold 200 shown in the second figure above can be the injection material in the conventional package mold structure shown in Figures 1A-1B. Trough, main channel, and secondary channel. Broadly speaking, the present invention can be applied to any place where the flashover phenomenon is likely to occur in the package mold structure, to prevent the occurrence of flashover phenomenon. Second Embodiment Fig. 3 shows a second embodiment of the present invention. In this figure, the same parts as the embodiment shown in Fig. 2 are denoted by the same reference numerals. This embodiment is different from the first embodiment described above in that the narrow channel structure is formed in a multi-stepped shape, as shown by reference numeral 204. The opening width # of the multi-stepped narrow structure 204 is between 0.5111111 and 15mm, and the depth D is between 0.05mm and 0.15mm. When the packaging process order, the fluid-like resin material poured into the molding material flow channel 202 flows into the multi-stepped narrow structure 204, the multi-stepped narrow structure 204 will quickly absorb the heat of the resin material, As a result, its viscosity is increased, so that its flow rate is slowed, and it is difficult to punch into the gap formed between the joint surface of the lower mold 100 and the upper mold 200, thereby preventing the occurrence of flashover. In summary, the present invention provides an integrated circuit package mold structure capable of preventing flashover. Compared with the conventional technology, the use of the packaging mold structure of the present invention does not form residual flash on the periphery of the injection groove, the main flow channel and the secondary flow channel, so no cleaning treatment is required before re-use. Causes pollution, and does not cause residual flash on the mold surface, and does not cause residual spill to attach to the next batch of packaged finished products. The present invention therefore has better advantages and practicability than conventional techniques. The degree of form of the paper is suitable for the country of wealth-5 ^ i ^ 7cNS) M size (210x 297) ---- 15950 (Please read the precautions on the back before filling out this page}. Packing. Printed by the Bureau's Consumer Cooperatives 6 4 47 0 9 2 A7 B7 V. Description of the Invention (7). The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the essential technical content of the present invention. The essential technical content of the present invention is broadly defined in the scope of the following patent applications. Any technical entity completed by another person, if defined by the scope of the following patent applications, is = identical, or "is-" equivalent The changes ^: 'will be considered to be included in this: Lee scope.
I--------- 裝-- (請先閲讀背面之注意事項—填寫本頁J 訂 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） 15950 7I --------- Install-(Please read the note on the back first-fill in this page. J. Thread printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Employee Consumer Cooperatives. This paper is printed in accordance with China National Standards (CNS) A4. Specifications (210X297 mm) 15950 7