TW440063U - Semiconductor package substrate having a label pad - Google Patents

Semiconductor package substrate having a label pad

Info

Publication number
TW440063U
TW440063U TW89200163U TW89200163U TW440063U TW 440063 U TW440063 U TW 440063U TW 89200163 U TW89200163 U TW 89200163U TW 89200163 U TW89200163 U TW 89200163U TW 440063 U TW440063 U TW 440063U
Authority
TW
Taiwan
Prior art keywords
semiconductor package
package substrate
label pad
label
pad
Prior art date
Application number
TW89200163U
Other languages
English (en)
Inventor
Mark Chung
H S Liu
C I Tsai
M L Huang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89200163U priority Critical patent/TW440063U/zh
Publication of TW440063U publication Critical patent/TW440063U/zh

Links

TW89200163U 2000-01-05 2000-01-05 Semiconductor package substrate having a label pad TW440063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89200163U TW440063U (en) 2000-01-05 2000-01-05 Semiconductor package substrate having a label pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89200163U TW440063U (en) 2000-01-05 2000-01-05 Semiconductor package substrate having a label pad

Publications (1)

Publication Number Publication Date
TW440063U true TW440063U (en) 2001-06-07

Family

ID=21662696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89200163U TW440063U (en) 2000-01-05 2000-01-05 Semiconductor package substrate having a label pad

Country Status (1)

Country Link
TW (1) TW440063U (zh)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees