AU2294100A - Packaging for a semiconductor chip - Google Patents

Packaging for a semiconductor chip

Info

Publication number
AU2294100A
AU2294100A AU22941/00A AU2294100A AU2294100A AU 2294100 A AU2294100 A AU 2294100A AU 22941/00 A AU22941/00 A AU 22941/00A AU 2294100 A AU2294100 A AU 2294100A AU 2294100 A AU2294100 A AU 2294100A
Authority
AU
Australia
Prior art keywords
packaging
semiconductor chip
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU22941/00A
Inventor
Gerold Klotzig
Jorg Ludewig
Werner Schneider
Kay Schone
Gregor Woldt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WICHMANN WORKX AG INFORMATION TECHNOLOGY
First Sensor Microelectronic Packaging GmbH
Original Assignee
WICHMANN WORKX AG INFORMATION
Microelectronic Packaging Dresden GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE29902754U external-priority patent/DE29902754U1/en
Application filed by WICHMANN WORKX AG INFORMATION, Microelectronic Packaging Dresden GmbH filed Critical WICHMANN WORKX AG INFORMATION
Publication of AU2294100A publication Critical patent/AU2294100A/en
Abandoned legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
AU22941/00A 1999-02-16 2000-01-28 Packaging for a semiconductor chip Abandoned AU2294100A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE29902754U DE29902754U1 (en) 1998-02-20 1999-02-16 Package for a semiconductor chip
DE29902754 1999-02-16
PCT/EP2000/000678 WO2000048444A2 (en) 1999-02-16 2000-01-28 Packaging for a semiconductor chip

Publications (1)

Publication Number Publication Date
AU2294100A true AU2294100A (en) 2000-09-04

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AU22941/00A Abandoned AU2294100A (en) 1999-02-16 2000-01-28 Packaging for a semiconductor chip

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AU (1) AU2294100A (en)
WO (1) WO2000048444A2 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428260A (en) * 1990-05-23 1992-01-30 Matsushita Electric Ind Co Ltd Method of mounting semiconductor chip
US5703405A (en) * 1993-03-15 1997-12-30 Motorola, Inc. Integrated circuit chip formed from processing two opposing surfaces of a wafer
JP3146849B2 (en) * 1994-05-27 2001-03-19 松下電器産業株式会社 Electronic component and method of manufacturing electronic component
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
JPH09260441A (en) * 1996-03-26 1997-10-03 Mitsubishi Electric Corp Semiconductor device
US6667560B2 (en) * 1996-05-29 2003-12-23 Texas Instruments Incorporated Board on chip ball grid array
KR100231276B1 (en) * 1996-06-21 1999-11-15 황인길 Semiconductor package structure and its manufacturing method
KR100248792B1 (en) * 1996-12-18 2000-03-15 김영환 Chip size semiconductor package using single layer ceramic substrate
JPH1154537A (en) * 1997-07-31 1999-02-26 Mitsui High Tec Inc Semiconductor device and its manufacture
JPH11219984A (en) * 1997-11-06 1999-08-10 Sharp Corp Semiconductor device package, its manufacture and circuit board therefor

Also Published As

Publication number Publication date
WO2000048444A2 (en) 2000-08-24
WO2000048444A3 (en) 2003-05-22

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