DE29902754U1 - Package for a semiconductor chip - Google Patents

Package for a semiconductor chip

Info

Publication number
DE29902754U1
DE29902754U1 DE29902754U DE29902754U DE29902754U1 DE 29902754 U1 DE29902754 U1 DE 29902754U1 DE 29902754 U DE29902754 U DE 29902754U DE 29902754 U DE29902754 U DE 29902754U DE 29902754 U1 DE29902754 U1 DE 29902754U1
Authority
DE
Germany
Prior art keywords
package
semiconductor chip
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29902754U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
First Sensor Microelectronic Packaging GmbH
Original Assignee
MIKROELEKTRONIK PACKAGING DRES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MIKROELEKTRONIK PACKAGING DRES filed Critical MIKROELEKTRONIK PACKAGING DRES
Priority to DE29902754U priority Critical patent/DE29902754U1/en
Publication of DE29902754U1 publication Critical patent/DE29902754U1/en
Priority to AU22941/00A priority patent/AU2294100A/en
Priority to PCT/EP2000/000678 priority patent/WO2000048444A2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
DE29902754U 1998-02-20 1999-02-16 Package for a semiconductor chip Expired - Lifetime DE29902754U1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE29902754U DE29902754U1 (en) 1998-02-20 1999-02-16 Package for a semiconductor chip
AU22941/00A AU2294100A (en) 1999-02-16 2000-01-28 Packaging for a semiconductor chip
PCT/EP2000/000678 WO2000048444A2 (en) 1999-02-16 2000-01-28 Packaging for a semiconductor chip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29803001U DE29803001U1 (en) 1998-02-20 1998-02-20 Package for a semiconductor chip
DE29902754U DE29902754U1 (en) 1998-02-20 1999-02-16 Package for a semiconductor chip

Publications (1)

Publication Number Publication Date
DE29902754U1 true DE29902754U1 (en) 1999-05-06

Family

ID=8052994

Family Applications (2)

Application Number Title Priority Date Filing Date
DE29803001U Expired - Lifetime DE29803001U1 (en) 1998-02-20 1998-02-20 Package for a semiconductor chip
DE29902754U Expired - Lifetime DE29902754U1 (en) 1998-02-20 1999-02-16 Package for a semiconductor chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE29803001U Expired - Lifetime DE29803001U1 (en) 1998-02-20 1998-02-20 Package for a semiconductor chip

Country Status (1)

Country Link
DE (2) DE29803001U1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001037335A2 (en) * 1999-11-15 2001-05-25 Infineon Technologies Ag Packaging for a semiconductor chip
DE10003670A1 (en) * 2000-01-28 2001-08-09 Wichmann Workx Ag Information Semiconductor device for integrated circuits esp. with reference to housing technology, uses first and second contact pads, and has the electrically connected external connections
DE10023823A1 (en) * 2000-05-15 2001-12-06 Infineon Technologies Ag Multi-chip housing device has carrier supporting stacked chip components with lowermost chip component having contact coupled to terminal surface of carrier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001037335A2 (en) * 1999-11-15 2001-05-25 Infineon Technologies Ag Packaging for a semiconductor chip
WO2001037335A3 (en) * 1999-11-15 2001-12-13 Infineon Technologies Ag Packaging for a semiconductor chip
US6724076B1 (en) 1999-11-15 2004-04-20 Infineon Technologies Ag Package for a semiconductor chip
DE10003670A1 (en) * 2000-01-28 2001-08-09 Wichmann Workx Ag Information Semiconductor device for integrated circuits esp. with reference to housing technology, uses first and second contact pads, and has the electrically connected external connections
DE10023823A1 (en) * 2000-05-15 2001-12-06 Infineon Technologies Ag Multi-chip housing device has carrier supporting stacked chip components with lowermost chip component having contact coupled to terminal surface of carrier

Also Published As

Publication number Publication date
DE29803001U1 (en) 1998-04-09

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19990617

R081 Change of applicant/patentee

Owner name: MICROELECTRONIC PACKAGING DRESDEN GMBH, DE

Free format text: FORMER OWNER: MIKROELEKTRONIK PACKAGING DRESDEN GMBH, 01109 DRESDEN, DE

Effective date: 20020711

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20020717

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20050322

R158 Lapse of ip right after 8 years

Effective date: 20070901