TW436819B - Chip type variable resistor and its installing method - Google Patents

Chip type variable resistor and its installing method Download PDF

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Publication number
TW436819B
TW436819B TW088115845A TW88115845A TW436819B TW 436819 B TW436819 B TW 436819B TW 088115845 A TW088115845 A TW 088115845A TW 88115845 A TW88115845 A TW 88115845A TW 436819 B TW436819 B TW 436819B
Authority
TW
Taiwan
Prior art keywords
insulating substrate
chip
electrode
variable resistor
terminal
Prior art date
Application number
TW088115845A
Other languages
Chinese (zh)
Inventor
Toshio Honma
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28973598A external-priority patent/JP3768355B2/en
Priority claimed from JP28973798A external-priority patent/JP3967833B2/en
Priority claimed from JP11104192A external-priority patent/JP2000299208A/en
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of TW436819B publication Critical patent/TW436819B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/16—Adjustable resistors including plural resistive elements
    • H01C10/20—Contact structure or movable resistive elements being ganged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/30—Adjustable resistors the contact sliding along resistive element
    • H01C10/32—Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path
    • H01C10/34—Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path the contact or the associated conducting structure riding on collector formed as a ring or portion thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

Previous chip type variable resistor is electrically connected to the printed circuit board 20 through the soft solder. Because this chip type variable resistor is installed on the printed circuit board, in the soft solder, the second electrode 32 and the third electrode 23 formed by the silver paste of chip type variable resistor are diffused through the consumption of soft solder material. Therefore, the electrical type and the mechanical type connections with the printed circuit board are not definitely adequate. A kind of chip-type variable resistor is provided with the following characteristics: an insulating substrate 1; a resistor 2; a pair of electrodes 3 connected to both ends of the resistor; terminals 5, which are connected to the electrodes 3 and are composed of metallic sheets. Each terminal 5 has a bottom plate 5a, which is in contact with the lower surface 1b of the substrate 1 and first and second leg sections 5b and 5c, which are extended toward the upper surface 1a of the substrate 1 from the lower surface of the substrate 1 in bent states along the two orthogonal side faces 1c at one corner section of the substrate 1 and the front end sections 5g and 5f of the second leg section 5c are bent to the upper surface side and soldered to one electrode.

Description

A7 B7 436819 五、發明說明（1 ) (發明所屬之技術領域） 請 先 閱 讀 背 © 之 注 意 事 項 再 填八 寫〇 本 頁 I w I I I I I I 訂 本發明係關於一種片型可變電阻器，特別是關於一種 半固定型片型可變電阻器，或是適用於音響機器等的片型 •可變電阻器及其安裝方法。 (以往之說明） 首先，使用圖式說明以往之片型可變電阻器β 第2 1圖係表示以往之片型可變電阻器的斜視圖；第 2 2圖係表示將以往之片型可變電阻器安裝於印刷配線基 板之狀態的剖面圖。 如第2 1圖與第2 2圖所示，絕緣基板3 0係由陶瓷 材所構成，被燒成加工且形成大約矩形。具有上面3 0 a 及下面3 0 b及側面。又具有設於大約中央部的粗徑孔 3 0 d，及設於一側面3 0 c的圓弧狀缺口部3 0 e。 在絕緣基板3 0之上面3 0 a ，藉印刷形成能圍繞孔 3 Od的圓弧狀電阻體（未圖示）。又該縱X橫X厚度尺 寸係約4 m m X約3 . 5 m m X約〇 . 8 m m大小（體積 爲約 1 1 . 2 m m 2 ) » 經濟部智慧財產局員工消費合作社印製 第1電極3 1係例如由銀與玻璃料所構成，於設於絕 緣基板3 0之上面3 0 a的電阻體，（未圖示）之兩端部設 置一對，分別與電阻體電氣式地連接》 第2電極3 2係例如由銀與玻璃料所構成，被連接於 絕緣基板3 0之上面3 0 a及側面3 0 c及下面3 0 b並 被塗布，其剖面呈c狀，在上面3 0 a中，與第1電極 本紙張尺度適用申國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 4 3 68 1 9 A7 • B7 五、發明說明（2 ) 31電氣式地連接。 第3電極3 3係例如由銀與玻璃料所構成’能圍繞絕 綠基板3 0之下面3 0 b的孔3 0 d地被塗布。 中心軸3 4係具有：圓柱狀中心軸部3 4 a ’及設於 中心軸部3 4 a之其中一方之端部（上方向）的操作部 34b ，及設於中心軸部34a之另一端部（下方向）的 卡止部3 4 c 。該中心軸3 4之中心軸3 4 a係在插穿於 絕緣基板3 0之孔3 4 d的狀態下，可轉動地被歛縫於絕 緣基板3 0之下面3 0 b，以藉由該歛縫所形成的卡止部 3 4 c被電氣式及機械式地連接於第3電極3 3。 滑動件3 5係由具彈性之金屬板所構成’具有大約矩 形之保持部3 5 a，及從保持部圓弧狀地設置的接點部 3 5 b。該滑動件3 5係以適當手段固定於中心軸部 3 4 a ，同時配置成接點部3 5 b彈接於電阻體（未圖示 )。由此，滑動件35係轉動自如地被保持於絕緣基板 3 0 ° 以下，說明將以往之片型可變電阻器安裝於印刷配線 基板之狀態。 如第2 2圖所示，印刷配線基板2 0係例如由具玻璃 之合成樹脂材料等所構成呈平板狀，在印刷配線基板2 0 之至少其中一方之面，形成一所期望之導電圖案2 1。於 該印刷配線基板2 0之導電圖案2 1上載置上述以往之片 型可變電阻器。 該狀態時，第2電極3 2與第3電極3 3及中心軸 -諳先閱讀背面之生意事項再填寫本頁) --------訂---------線 — -i n 1 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） .5 - A7 436819 _B7___ 五、發明說明（3 ) 3 4之卡止部3 4 c直接抵接於印刷配線基板2 0 °此時 ，在所定導電圖案21上塗布焊糊（未圖示）’載置片型 可變電阻器之第2電極3 2與第3電極3 3成爲連接於該 •焊糊。被搬運至回流爐（未圖示施以軟焊）。 如此，被軟焊於印刷配線基板之片型可變電阻器’係 於電氣式及機械式地連接於印刷配線基板。 此等以往之片型可變電阻器之實裝後’藉由修理等從 印刷配線基板2 0拆下時，藉由以烙鐵溶解焊劑3 6即可 容易地拆下，同時可再軟焊於印刷配線基板2 0 ’另一方 面藉由長期間保管與使用，產生第1、第2電極3 1， 3 2之硫化，或軟焊之焊劑耗費。 以下使用第2 3圖及第2 4圖說明將其他以往之片型 可變電阻器安裝於印刷配線基板之狀態。 端子4 3係由鋼或銅或其合金等之金屬板所構成，施 以沖孔，彎曲加工，並經鍍金屬，具有其中一方端部之下 面端子部4 3 a ，及另一方端部之上面端子部4 3 b。又 ，該端子43係被插穿於絕緣基板40之孔40 e，同時 下面端子部4 3 a係平行地被折彎於絕緣基板4 0之下面 4 0 b側，上面端子部4 3 b係折彎成上面4 〇 a及缺口 部4 0 f內。 滑動件4 4係具有圓柱狀中心軸部4 4 a ，及設於中 心軸部4 4 a之外周面的滑動件片4 4 b。該滑動件4 4 之中心軸部4 4 a ，係從上面4 0 a側至下面4 〇 b側插 穿於絕緣基板4 0之孔4 0 d，而中心軸部4 4 a之其中 本紙張尺度適用令國國家標準（CNS>A4規格（210 X 297公茇） -6 - 广請先閱讀背面之注意事項再填寫本頁) ------訂---------線1 J、> 經濟部智慧財產局員工消費合作社印製 4368 1 9 A7 ----- B7 五、發明說明（4 ) 一方之端部係歛縫安裝於下面9 〇 b側。在該狀態下，滑 動件4 4之滑動件片44b係彈接於電阻體4 1 ，又滑動 件4 4係轉動自如地被保持於絕緣基板$ 〇。 ‘ 焊劑4 5係一般性熔點（例如約1 8 0度）之焊劑， 藉由將該:)：旱劑4 5軟焊連接各電極4 2與端子4 3之上面 端子部4 3 b。 如第2 4圖.所示，印刷配線基板2 〇係例如由具玻璃 之合成樹脂材料或陶瓷材料等所構成呈平板狀，在印刷配 線基板2 0之至少其中一方之面，形成一所期望之導電圖 案（未圖示）。在該印刷配線基板20之導電圖案（未圖 示）上載置上述之以往的片型可變電阻器之端子4 3的下 面端子部4 3 a。 此時於所定導電圖案上塗布具有一般性熔點（例如約 1 8 0度）之焊糊4 6，載置片型可變電阻器之端子4 3 之下面端子部4 3 a成爲連接於該焊糊4 6。 該焊糊4 6之熔點係使用具有與端子4 3之上面端子 部4 3 b與電極4 2被軟焊之焊劑4 5之熔點大約相同之 熔點的焊劑。 在該狀態下，將載置片型可變電阻器之印刷配線基板 2 0配置於回流爐（未圖示；回流爐內之溫度係約2 2 0 度）內，以焊糊4 6軟焊片型可變電阻器之端子4 3之下 面端子部4 3 a與印刷配線基板2 0之導電圖案。此時， 由於以焊劑4 5焊接片型可變電阻器之端子4 3之上面端 子部4 3 b與電極4 2 ，因此在該回流爐內之溫度，一旦 本紙張尺度適用_國國家標準（CNS)A4規格（210 X 297公釐） (，請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -------- 訂--------•線 I }.!--------Ί —1 J ------------ A7 4-3 68 I 9 _B7____ 五、發明說明（5 ) 再熔融後流出，之後取出回流爐外，焊劑係再固定’因此 被軟焊。又具有設於大約中央部之粗徑孔4 0 d ’及設於 其中一方之端部之三個細徑孔4 0 e，及位於各孔4 0 e ‘之近旁，於側面40c具有三個缺口部40f。又其縱X 橫X厚度尺寸係約4mmx約3.5mmx約0.8mm 之大小（體積爲約1 1 · 2 m 2 )。 電阻體4 1係例如於玻璃成分混入金屬等所形成之陶 瓷冶金糊，或在接合樹脂混入碳的碳糊等所構成；於絕緣 基板4 0之上面4 0 a圓弧狀地印刷形成成爲圍繞孔 4 0 d。 電極4 2係例如於玻璃或樹脂混入銀粉之銀糊等所構 成，設於絕緣基板4 0之上面4 0 a之電阻體4 1之兩端 部，及設於兩端部之間，同時設成圍繞各孔4 0 e。設於 電阻體4 1之兩端部之間（中央部）的電極4 2，係與設 於電阻體4 1之內側成爲圍繞孔4 0 d的圓環狀導電部（ 未圖示）相連接。 該回流爐內之溫度係考慮配置於印刷配線基板上之積 體電路I C或片型電阻器等之耐熱溫度時，設成較低溫度 較理想。一般由於未將回流爐內之溫度提高比焊劑熔點高 約4 0〜5 0度則無法充分地熔融焊劑，故設成該程度之 溫度。 (發明欲解決之課題） 現在，例如組裝於行動電話等之發送，接收電路部， (，請先閱讀背面之注意事項再填寫本頁) -IO一--------訂---------線— 經濟部智慧財產局員工消費合作社印製 Ί I----------- III — — — — — — —--- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -8 - A7 436819 ____B7__ 五、發明說明（6 ) 係爲了滿足行動電話之小型化，輕量化之要求，.被要求發 送，接收電路部之更小型化與輕量化，在使用於發送，接 收信號之頻率調整電路的以往之半固定型之片型可變電阻 •器，係片型可變電阻器呈較大體積，故使用該片型可變電 阻器之發送，接收電路部具有較大體積，成爲妨礙行動電 路之小型化與輕量化。 又，將以往之片型可變電阻器藉由軟焊電氣式地連接 於印刷配線基板，雖將該片型可變電阻器安裝於印刷配線 基板，但是該軟焊中，藉由焊劑耗費片型可變電阻器之銀 糊所成之第2電極與第3電極，因被擴散，導致與印刷配 線基板之電氣式及機械式之連接並不一定成爲充分者之問 題。 又由於在以往之片型可變電阻器之絕緣基板之上，下 ，側面必須使用高價格之銀糊將第2電極與第3電極以不 同過程來形成，因此有片型可變電阻器之成本成爲高價格 之問題。 又以往之片型可變電阻器係在長時間保管中，暴露於 硫化氣體時，第1 ，第2電極3 1 ，32變爲絕緣物之硫 化銀，不容易附著焊糊，又有電阻體與第1，第2電極 3 1 ，3 2成爲電氣式開放，或第2電極3 2與導電圖案 2 1間成爲開放之問題。 又片型可變電阻器實裝於印刷配線基板2 0時，在回 流爐中須費較久時間施以軟焊，同時藉由焊糊之組成’或 軟焊條件，第2電極3 2中之銀成分被溶出’產生所謂焊 f,諳先閲讀背面之注意事項再填寫本頁) C3 !| 訂------線 * 丫 經濟部智慧財產局員工消費合作社印製 n ϋ n n 1 1— n I— 1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9- A7 436819 ___B7 ____ 五、發明說明（7 ) 劑耗費。在電阻體與導電圖案2 1有發生電氣式開放之問 題。 又實裝片型可變電阻器長期間地使用時，在露出狀態 之第1 ，第2電極3 1 ，32藉由硫化氣體變爲絕緣物之 硫化銀，有電阻體與導電圖案2 1成爲電氣式開放之問題 〇 又以往之片型可變電阻器係端子4 3之下面端子部 4 3 a藉由焊糊4 6連接於印刷配線基板之導電圖案時， 該焊糊4 6之熔點，連接電極4 2與端子4 3之上面端子 部4 3 b之焊劑4 5之熔點成爲同一熔點，故將片型可變 電阻器電氣式及機械式地連接於印刷配·線基板時實行依回 流爐之軟焊作業，則往該回流爐內連接電極4 2與端子 4 3之上面端子部4 3 b的焊劑4 5再被熔融，之後在回 流爐外，再固化焊劑4 5而被軟焊。然而一般爲金屬之上 面端子部4 3 b對於焊劑的濕潤性，係與包含玻璃或接合 樹脂之電極4 2相比較較良好。由此，成爲電極4 2與端 子4 3之上面端子部4 3 b之軟焊，係對於最初之軟焊再 被熔融焊劑，成爲較多之焊劑移行至上面端子部4 3 b之 狀態下實行軟焊連接，特別是，在如此小型又接合面積小 之片型可變電阻器中，產生連接不安定之可能性的問題。 本發明之片型可變電阻器係用以解決上述問題點者’ 其目的係在於提供一種藉由焊劑被連接於印刷配線基板之 片型可變電阻器具有安定之電氣式及機械式特性的片型可 變電阻器。 {.锖先閱續背面之注意事項再填窝本買) -i n I t ϋ 言 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -10* 43 68 1 9 A7 ___B7_ 五、發明說明（8 ) (解決課題所用之手段） ί”請先閱讀背面之注意事項再填窝本頁) 本發明之片型可變電阻器，其特徵爲：具備絕緣基板 _及設於該絕緣基板之上面的電阻體，及連接於該電阻體之 兩端部且設於絕緣基板之上面的一對電極，及連接於該電 極之金屬板所構成的端子；該端子係具有抵接於絕緣基板 之下面的底板，及分別沿著位於絕緣基板之角隅部之正交 之互相鄰接的兩個側面，並從底板折彎且向上面方向延伸 的第1腳部，及第2腳部，該第1腳部及該第2腳部之前 端部朝上面側折彎，而前端部被軟焊於上述電極。 又，本發明之片型可變電阻器，係第1腳部，及第2 腳部之至少其中一方的前端部，形成比第1腳部，或第2 腳部之根基部更狹窄者。 又，本發明之片型可變電阻器，係從絕緣基板之角隅 部，隔著所定距離，設置第1腳部及第2腳部，同時，在 角隅部之近旁延設電極，在電極設置軟焊區域，第1腳部 及第2腳部之前端部軟焊於該軟焊區域。 經濟部智慧財產局員工消費合作社印製 又，本發明之片型可變電阻器，係在端子之底板，設 有朝絕緣基板之外方突出的突出部。 又，本發明之片型可變電阻器，係端子之突出部，設 於互相鄰接設置之第1腳部與第2腳部之間者。 又，本發明之片型可變電阻器，係具備陶瓷製之絕緣 基板，及設於該絕緣基板之上面的電阻體，及連接之電阻 體之兩端部且設於絕緣基板之上面的一對第1電極，及安 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -11- 經濟部智慧財產局貝工消費合作社印製 4 3 68 1 9 A7 ____B7____ 五、發明說明（9 ) 裝於絕緣基板，且連接於電極之金屬板所構成的端子，在 位於第1電極之近旁的絕緣基板之側面，設置第2電極； 端子係具有底板，及從底板折彎的腳部，將端子之底板配 •設於絕緣基板之下面的狀態下，沿著絕緣基板之側面配置 腳部，同時折彎腳部之前端部並將端子安裝於絕緣基板， 軟焊第1電極與腳部。 又，本發明之片型可變電阻器，係連接第1電極及第 2電極形成之構成。 又，本發明之片型可變電阻器，係在與設置第2電極 之絕綠基板之側面不相同之絕緣基板之側面，配置上述端 子之腳部a 又，本發明之片型可變電阻器，係在設於第2電極的 上述絕緣基板之側面配置端子之腳部。 又，本發明之片型可變電阻器，係具備絕緣基板，及 設於該絕緣基板上面之電阻體，及連接於該電阻體之兩端 部且設於絕緣基板上面的一對電極。及連接於該電極之金 屬板所構成的端子；端子藉由高溫焊劑連接於電極- 又，本發明之片型可變電阻器，係上述高溫焊劑之熔 點爲2 2 0度至3 3 0度之溫度範圍。 又，本發明之片型可變電阻器之安裝方法，其特徵爲 :具備片型可變電阻器，及具有導電圖案的印刷配線基板 1將印刷配線基板對於導電圖案之片型電阻器之端子的軟 焊，以比端子被軟焊於片型可變電阻器之電極的高溫焊劑 之熔點較低熔點的焊劑來實行。 (，讀先閱讀背面之注意事項再填寫本頁) -In—---t--------- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -12- A7 B7 4368 1 9 五、發明說明（1〇 ) (發明之實施形態） 以下I使用圖式說明本發明之實施形態的片型可變電 |阻器，第1圖係表示本發明之第一實施例之片型可變電阻 器的分解斜視圖，第2圖係表示本發明之第一實施例之片 型可變電阻器的俯視圖，第3圖係表示本發明之第一實施 例之片型可變電阻器的仰視圖，第4圖係表示本發明之第 一實施例之片型可變電阻器的剖面圖，第5圖係表示本發 明之第一實施例之片型可變電阻器的主要部分側視圖，第 6圖係表示本發明之第一實施例之片型可變電阻器的主要 部分仰視圖，第7圖係表示本發明之第一實施例之片型可 變電阻器之絕緣基板的仰視圖，第8圖係表示本發明之第 —實施例之片型可變電阻器之絕緣基板的俯視圖，第9圖 係表示本發明之第一實施例之片型可變電阻器之絕緣基板 的側視圖，第1 0圖係表示第7圖之1 0 — 1 0線的剖面 圖。 如第1圖至第1 0圖所示，絕緣基板1係由陶瓷材料 所構成，大約矩形地燒成加工，其縱X橫X厚度尺寸，係 約3 . 5 m m X約3 m m X約0 · 8 m m之小型大小（體 積爲韵8 . 4mm2，具有上面la，及下面lb，及圍繞 四方的側面1 c 1至1 c 4，及設於從上面1 a貫穿至下 面1 b之中心部的圓形孔1 d。在上面1 a之中央部設有 大約圓形之凹部1 e成爲圔繞孔Id ，在下面lb之大約 中央部，設有矩形之淺溝槽狀溝槽部1 4，該溝槽部1 f 本紙張尺度適用_國國家標準（CNS)A4規格（210 χ 297公釐) -13 - ' 請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製A7 B7 436819 V. Description of the invention (1) (Technical field to which the invention belongs) Please read the notes of the back © before filling in the eighth page. This page I w III III The present invention is about a chip type variable resistor, especially A semi-fixed chip variable resistor, or a chip and variable resistor suitable for use in audio equipment and the like, and a method of mounting the same. (Previous explanation) First, a conventional chip variable resistor β will be described using drawings. FIG. 21 is a perspective view showing a conventional chip variable resistor. FIG. 22 is a diagram illustrating a conventional chip variable resistor. A cross-sectional view of a state where a varistor is mounted on a printed wiring board. As shown in Figs. 21 and 22, the insulating substrate 30 is made of a ceramic material, and is fired to form an approximately rectangular shape. It has an upper surface 3 a and a lower surface 3 b and sides. It also has a large-diameter hole 3 0 d provided at approximately the central portion, and an arc-shaped notch portion 3 0 e provided at one side 3 0 c. An arc-shaped resistor (not shown) capable of surrounding the hole 3 Od is formed on the insulating substrate 30 by 3 a a by printing. The vertical X horizontal X thickness dimension is about 4 mm X about 3.5 mm X about 0.8 mm (the volume is about 11.2 mm 2) »The first electrode printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 1 series is composed of silver and glass frit, for example, a pair of resistors (not shown) are provided on the insulating substrate 30 a above 30 a, and a pair of both ends are electrically connected to the resistors. The second electrode 3 2 is made of, for example, silver and glass frit, and is connected to the upper surface 3 0 a, the side surface 3 0 c, and the lower surface 3 0 b of the insulating substrate 30, and is coated. The cross section is c-shaped. In 0 a, the paper size of the first electrode applies the national standard of China (CNS) A4 (210 X 297 mm). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 68 1 9 A7 • B7 V. Description of the invention (2) 31 Electrically connected. The third electrode 3 3 is made of, for example, silver and glass frit 'and can be applied around the hole 3 0 d of the lower surface 30 b of the green substrate 30. The central shaft 3 4 includes a cylindrical central shaft portion 3 4 a ′, an operation portion 34 b provided at one end (upward direction) of the central shaft portion 3 4 a, and the other end provided at the central shaft portion 34 a. 3 (c) of the locking portion (downward direction). The central axis 3 4 a of the central axis 3 4 is rotatably sewn to the lower surface 3 0 b of the insulating substrate 30 in a state of being inserted into the hole 3 4 d of the insulating substrate 30 to pass the The locking portion 3 4 c formed by the caulking is electrically and mechanically connected to the third electrode 33. The slider 3 5 is composed of an elastic metal plate and has a substantially rectangular holding portion 3 5 a and a contact portion 3 5 b provided in an arc shape from the holding portion. The slider 3 5 is fixed to the central shaft portion 3 4 a by an appropriate means, and at the same time, the contact portion 3 5 b is elastically connected to the resistor (not shown). Accordingly, the slider 35 is rotatably held below the insulating substrate by 30 °, and a state in which a conventional chip-type variable resistor is mounted on a printed wiring board will be described. As shown in FIG. 22, the printed wiring board 20 is formed in a flat plate shape made of, for example, a synthetic resin material with glass, and a desired conductive pattern 2 is formed on at least one of the surfaces of the printed wiring board 20. 1. The above-mentioned conventional chip-type variable resistor is placed on the conductive pattern 21 of the printed wiring board 20. In this state, the second electrode 3 2 and the third electrode 33 and the central axis-谙 read the business matters on the back before filling in this page) -------- Order --------- line — -In 1 This paper size applies the Chinese national standard (CNS > A4 specification (210 X 297 mm). 5-A7 436819 _B7___ V. Description of the invention (3) 3 4 The locking part 3 4 c directly abuts the printing The wiring substrate 2 0 ° At this time, the second conductive electrode 21 and the second electrode 3 2 and the third electrode 3 3 of the chip-type variable resistor are coated with a solder paste (not shown) on the predetermined conductive pattern 21 to be connected to the solder paste. .It is transported to a reflow furnace (not shown for soldering). In this way, the chip-type variable resistor soldered to the printed wiring board is electrically and mechanically connected to the printed wiring board. After the chip type variable resistor is installed, it can be easily removed by dissolving the solder 36 with a soldering iron when it is removed from the printed wiring board 20 by repair or the like, and it can be re-soldered to the printed wiring board at the same time. 2 0 'On the other hand, through long-term storage and use, vulcanization of the first and second electrodes 3 1, 32, or soldering flux for soldering are generated. Use the following Figures 23 and 24 illustrate the state where other conventional chip-type variable resistors are mounted on a printed wiring board. Terminals 43 are made of metal plates such as steel, copper, or their alloys, and punched. It is bent and metal-plated to have a lower terminal portion 4 3 a at one end portion and an upper terminal portion 4 3 b at the other end portion. Furthermore, the terminal 43 is inserted through a hole of the insulating substrate 40 At 40e, the lower terminal portion 4 3a is bent in parallel to the lower 40b side of the insulating substrate 40, and the upper terminal portion 43b is bent into the upper surface 40a and the notch portion 40f. The slider 4 4 has a cylindrical central shaft portion 4 4 a and a slider piece 4 4 b provided on the outer peripheral surface of the central shaft portion 4 4 a. The central shaft portion 4 4 a of the slider 4 4 is connected from The upper 40a side to the lower 40b side are inserted into the hole 40d of the insulating substrate 40, and the central shaft portion 4a is applicable to the national paper standard (CNS > A4 specification (210 X 297)). Public address) -6-Please read the precautions on the back before filling out this page) ------ Order --------- Line 1 J, > Employees ’Intellectual Property Bureau Consumption Printed by Sakusha 4368 1 9 A7 ----- B7 V. Description of the invention (4) One end is installed with a caulking joint on the lower side of 90 °. In this state, the slider piece 44b of the slider 4 4 It is elastically connected to the resistor 41, and the slider 44 is rotatably held on the insulating substrate $ 0. 'Flux 4 5 is a general melting point (for example, about 180 degrees) flux, by changing: ): An aerosol 4 5 solders each electrode 4 2 to the upper terminal portion 4 3 b of the terminal 4 3. As shown in FIG. 24, the printed wiring board 20 is formed in a flat plate shape, for example, made of a synthetic resin material or ceramic material with glass, and a desired one is formed on at least one surface of the printed wiring board 20 Conductive pattern (not shown). On the conductive pattern (not shown) of the printed wiring board 20, the lower terminal portion 4 3a of the terminal 4 3 of the conventional chip variable resistor described above is placed. At this time, a solder paste 4 6 having a general melting point (for example, about 180 °) is applied on a predetermined conductive pattern, and a terminal portion 4 3 a of the lower surface of the terminal 4 3 of the chip-type variable resistor is connected to the solder. Paste 4 6. The melting point of the solder paste 46 is a flux having a melting point approximately the same as the melting point of the upper terminal portion 4 3 b of the terminal 43 and the solder 45 which is soldered to the electrode 4 2. In this state, the printed wiring board 20 on which the chip-type variable resistor is placed is disposed in a reflow furnace (not shown; the temperature in the reflow furnace is about 220 ° C), and soldered with a solder paste 4 6 The conductive pattern of the lower terminal portion 4 3 a of the terminal 43 of the chip-type variable resistor and the printed wiring board 20. At this time, since the upper terminal portion 4 3 b and the electrode 4 2 of the terminal 4 3 of the chip-type variable resistor are soldered with the flux 4 5, the temperature in the reflow furnace is once the paper standard is applicable. CNS) A4 size (210 X 297 mm) (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------- Order -------- -• Line I}.! -------- Ί —1 J ------------ A7 4-3 68 I 9 _B7____ V. Description of the invention (5) After remelting After flowing out, after taking it out of the reflow furnace, the flux system is fixed again, so it is soldered. It also has a large-diameter hole 4 0 d 'provided at about the center portion and three small-diameter holes 4 0 e provided at one end portion thereof, and is located near each hole 4 0 e', and has three sides 40c. Notch portion 40f. In addition, its vertical X horizontal X thickness dimension is about 4mmx about 3.5mmx about 0.8mm (the volume is about 1 1 · 2 m 2). The resistor 41 is made of, for example, a ceramic metallurgy paste formed by mixing a glass component with a metal or the like, or a carbon paste mixed with carbon by bonding a resin; the upper surface of the insulating substrate 40 is printed in a circular arc shape to form a circle. Hole 4 0 d. The electrode 4 2 is made of, for example, silver paste mixed with silver powder in glass or resin, and is provided on both ends of the resistor body 41 on the insulating substrate 40 and 40 a, and is provided between the two ends. Into each hole 4 0 e. The electrode 4 2 provided between both ends (central portion) of the resistor 41 is connected to a ring-shaped conductive portion (not shown) provided inside the resistor 41 to surround the hole 4 0 d. . The temperature in the reflow furnace is preferably set to a lower temperature in consideration of the heat-resistant temperature of the integrated circuit IC, chip resistor, or the like arranged on the printed wiring board. Generally, since the temperature in the reflow furnace is not increased by about 40 to 50 degrees higher than the melting point of the flux, the flux cannot be sufficiently melted. Therefore, the temperature is set to this level. (Problems to be Solved by the Invention) Now, for example, the transmitting and receiving circuit parts assembled in mobile phones, etc., (Please read the precautions on the back before filling this page) -IO 一 -------- Order-- ------- Line — Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs I ----------- III — — — — — — — --- This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 public love) -8-A7 436819 ____B7__ V. Description of invention (6) In order to meet the requirements of miniaturization and weight reduction of mobile phones, it is required to send and receive circuits smaller And light weight, the conventional semi-fixed chip variable resistors and resistors used in the frequency adjustment circuit for transmitting and receiving signals, the chip variable resistors have a large volume, so using this chip variable The transmitting and receiving circuit of the resistor has a large volume, which hinders the miniaturization and weight reduction of the mobile circuit. In addition, the conventional chip type variable resistor is electrically connected to the printed wiring board by soldering. Although the chip type variable resistor is mounted on the printed wiring board, the soldering consumes a chip by soldering. Due to the diffusion of the second electrode and the third electrode of the silver paste of the type variable resistor, the electrical and mechanical connection with the printed wiring board is not necessarily a sufficient problem. In addition, since the second electrode and the third electrode must be formed by different processes on the lower and upper sides of the insulating substrate of the conventional chip variable resistor, a high-priced silver paste must be used on the side surface. Cost becomes a problem of high prices. In the past, the chip variable resistors were stored for a long time. When exposed to a sulfur gas, the first and second electrodes 3 1 and 32 became silver sulfide as an insulator, and it was not easy to attach a solder paste. There was also a resistor. The problem is that the first and second electrodes 3 1 and 3 2 are electrically opened, or the space between the second electrode 32 and the conductive pattern 21 is opened. When the chip-type variable resistor is mounted on the printed wiring board 20, it takes a long time to perform soldering in a reflow furnace, and at the same time, the composition of the solder paste 'or soldering conditions, the second electrode 32 The silver component is eluted 'produces the so-called solder f, please read the precautions on the back before filling this page) C3! | Order ------ line * Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs n ϋ nn 1 1 — N I— 1 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -9- A7 436819 ___B7 ____ 5. Description of the invention (7) Agent cost. There is a problem that the resistor and the conductive pattern 21 are electrically opened. When the chip-type variable resistor is used for a long period of time, the first and second electrodes 3 1 and 32 in the exposed state are silver sulfide that becomes an insulator by a sulfur gas, and the resistor and the conductive pattern 21 become The problem of electrical opening. In addition, the conventional chip-type variable resistor is the lower terminal portion 4 3 a of the terminal 4 3 when the solder paste 46 is connected to the conductive pattern of the printed wiring board. The melting point of the solder 4 5 of the connection electrode 4 2 and the terminal portion 4 3 b of the upper surface of the terminal 4 3 is the same melting point. Therefore, the chip variable resistor is electrically and mechanically connected to the printed wiring board. In the soldering operation of the furnace, the flux 4 5 connecting the electrode 4 2 and the upper terminal portion 4 3 b of the terminal 4 3 to the reflow furnace is melted again, and then the flux 4 5 is re-solidified outside the reflow furnace to be soldered. . However, generally, the wettability of the surface terminal portion 4 3 b to the solder is better than that of the electrode 4 2 containing glass or a bonding resin. Thus, the soldering of the upper terminal portion 4 3 b of the electrode 4 2 and the terminal 4 3 is performed in a state where a large amount of flux migrates to the upper terminal portion 4 3 b after the initial soldering is melted. The solder connection, in particular, has such a problem that the connection may be unstable in such a small chip variable resistor having a small bonding area. The chip variable resistor of the present invention is to solve the above-mentioned problems. Its object is to provide a chip variable resistor which is connected to a printed wiring board by a solder and has stable electrical and mechanical characteristics. Chip type variable resistor. {. 锖 Please read the precautions on the back of the book before filling in the book) -in I t ϋ Statement Printed on the paper by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ) -10 * 43 68 1 9 A7 ___B7_ V. Description of the invention (8) (Methods used to solve the problem) ί "Please read the precautions on the back before filling in this page) The chip variable resistor of the present invention, which It is characterized by having an insulating substrate and a resistor provided on the upper surface of the insulating substrate, a pair of electrodes connected to both ends of the resistor and provided on the upper surface of the insulating substrate, and a metal plate connected to the electrode. The terminal has a bottom plate that abuts the lower surface of the insulating substrate, and two mutually adjacent sides that are orthogonal to each other at the corners of the insulating substrate, and is bent from the bottom plate and extends upward. The first leg portion and the second leg portion, the front end portions of the first leg portion and the second leg portion are bent toward the upper side, and the front end portion is soldered to the electrode. The sheet type of the present invention may be Varistor, at least the first leg and the second leg One of the front end portions is formed to be narrower than the base portion of the first leg portion or the second leg portion. In addition, the chip variable resistor of the present invention is located at a predetermined distance from the corner portion of the insulating substrate. , The first leg portion and the second leg portion are provided, and at the same time, an electrode is extended near the corner portion, and a soldering area is provided on the electrode, and the front ends of the first leg portion and the second leg portion are soldered to the soldering area. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the chip-type variable resistor of the present invention is provided on the bottom plate of the terminal, and is provided with a protruding portion protruding outside the insulating substrate. A varistor is a protruding portion of a terminal provided between a first leg portion and a second leg portion adjacent to each other. The chip variable resistor of the present invention includes an insulating substrate made of ceramic, and A resistor body provided on the upper surface of the insulating substrate, a pair of first electrodes provided on both ends of the connected resistor body and provided on the upper surface of the insulating substrate, and the Aberdeen paper dimensions are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -11- Shellfish Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the agency 4 3 68 1 9 A7 ____B7____ 5. Description of the invention (9) Terminals made of metal plates mounted on insulating substrates and connected to the electrodes are provided on the side of the insulating substrate near the first electrode. 2 electrodes; The terminal has a bottom plate and legs bent from the bottom plate. The bottom plate of the terminal is arranged under the insulating substrate, and the legs are arranged along the side of the insulating substrate, and the front end of the leg is bent at the same time. The terminal is mounted on an insulating substrate, and the first electrode and the leg are soldered. The chip variable resistor of the present invention is formed by connecting the first electrode and the second electrode. The chip type of the present invention The variable resistor is disposed on the side of the insulating substrate different from the side of the green substrate on which the second electrode is provided, and the leg portion a of the terminal is arranged. The chip-type variable resistor of the present invention is The leg portions of the terminals are arranged on the sides of the two-electrode insulating substrate. The chip variable resistor of the present invention includes an insulating substrate, a resistor provided on the upper surface of the insulating substrate, and a pair of electrodes connected to both ends of the resistor and provided on the upper surface of the insulating substrate. And a terminal made of a metal plate connected to the electrode; the terminal is connected to the electrode by a high-temperature flux-and the chip-type variable resistor of the present invention has a melting point of the above-mentioned high-temperature flux of 220 to 330 Temperature range. In addition, the method for mounting a chip-type variable resistor of the present invention includes a chip-type variable resistor and a printed wiring board having a conductive pattern. The printed wiring board is a terminal of a chip resistor with a conductive pattern. The soldering is carried out with a lower melting point than a high temperature solder having a terminal soldered to the electrode of the chip variable resistor. (Please read the notes on the back before you fill in this page) -In —--- t --------- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)- 12- A7 B7 4368 1 9 V. Description of the Invention (10) (Inventive Embodiments) The following I will explain the chip-type variable resistor of the embodiment of the present invention using drawings. The first diagram shows the present invention. An exploded perspective view of the chip-type variable resistor of the first embodiment. FIG. 2 is a plan view showing the chip-type variable resistor of the first embodiment of the present invention, and FIG. 3 shows the first embodiment of the present invention. A bottom view of the chip-type variable resistor. FIG. 4 is a cross-sectional view showing the chip-type variable resistor according to the first embodiment of the present invention, and FIG. 5 is a view showing the chip-type variable resistor according to the first embodiment of the present invention. A side view of a main part of a variable resistor. FIG. 6 is a bottom view of a main part of a chip type variable resistor according to a first embodiment of the present invention, and FIG. 7 is a view showing a chip type of the first embodiment of the present invention. Bottom view of the insulating substrate of the varistor, FIG. 8 is a view showing a chip type varistor of the first embodiment of the present invention Fig. 9 is a plan view of an insulating substrate. Fig. 9 is a side view showing the insulating substrate of the chip-type variable resistor according to the first embodiment of the present invention, and Fig. 10 is a sectional view taken along line 10-10 of Fig. 7. . As shown in Fig. 1 to Fig. 10, the insulating substrate 1 is made of a ceramic material and is fired in a rectangular shape. The vertical X horizontal X thickness dimension is about 3.5 mm X about 3 mm X about 0. · Small size of 8 mm (volume is 8.4mm2, with upper surface la, lower surface lb, and sides 1 c 1 to 1 c 4 surrounding the square, and located at the center from 1 a to 1 b The circular hole 1 d is provided at the center of the upper portion 1 a with a circular recess 1 e as the winding hole Id. At the lower portion of the central portion 1 b, a rectangular shallow groove-shaped groove portion 1 4 is provided. ， The groove part 1 f This paper size is applicable _ National Standard (CNS) A4 (210 χ 297 mm) -13-'Please read the precautions on the back before filling out this page) Staff Consumption of Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a cooperative

:----— I— I----I >^^1 I ------广！ 1!--I I I____I A7 B7 436819 五、發明說明（11 ) 之其中一方端部係側面1c1方向朝外部開放。 在其中一方之對向的側面i c 3 (第2圖之上下方向 )，分別設有寬廣之大約矩形的缺口部1 h，及寬狹窄之 .大約矩形的缺口部1 i ’在另一方之對向的側面1 c 2與 測面（第2圖之左右方向），隔著下述之電極3，與上述 缺口部1 i相對向設有一對矩形的缺口部1 j 。 又’在下面1 b ’在上述缺口部1 i側（參照第2圖 )之各角隅部設有一對矩形凹部1 g，該凹部1 g係從下 面1 b凹陷形成，同時正交地連接互相相鄰之兩個側面 1 c 2與側面1 c 3，或是側面1 c 3與側面1 c 4所形 成，此等之方向係朝外部開放之狀態所形成。又，該凹部 lg與溝槽部1 f之深度尺寸t 2，係例如約0 . 2mm 該凹部1 g係說明該凹部1 g之正交且互相相鄰之側 面lc2 ，lc3方向（及側面lc3 ，lc4方向）被 開放者，但是並不被限定於此，開放三個側面方向，或是 開放對向之兩個側面方向之形狀也可以。 電阻體2係由例如金屬陶瓷糊等所構成。藉由印刷等 大約圓弧狀地形成於絕緣基板1之上面1 a的凹部1 e周 圍。 電極3係例如銀糊等所構成，大約矩形，設於絕緣基 板1之上面la ，分別連接於電阻體2之兩端部’藉由印 刷等形成有一對。該電極3係配置於藉由正交且相鄰之絕 緣基板1之各側面1 c 1，1 c 3 ’及側面1 c 2， 請 先 閱 讀 背 面 之 注 意 事 項 再 填A 寫〇 本-Γ 頁 I 一 I 睡 I I I I 訂 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用t國國家標準（CNS)A4規格（210 X 297公釐） -14- 4 3 68 1 9 A7 B7 五、發明說明（12) 1 c 4所形成的角隅部近旁。 (請先閱讀背面之注意事項再填寫本頁) 端子4係由鋼或銅等之金屬板所構成1經穿孔，折彎 加工，由一對第1端子5及第2端子6所構成。又該端子 4之厚度尺寸（厚度）t 3係例如約0 . 1 5_ m m。 第1端子5係具有：大約矩形（四方形）之底板5 a >及與底板5 a成正交且從相鄰之兩個側緣分別朝上方折 彎的第1腳部5 b ，與第2腳部5 c ，及從底板5 a朝外 方突出於第1腳部5 b與第2腳部5 c之間的突出部5 d 。又，其中一方之第1腳部5 b係具備；寬廣之根基部 5 e，及從根基部5 e朝上方延設，此大約平行於底板 5 a地折彎之根基部5 e更寬狹窄之前端部5 f.，另一方 之第2腳部5 c之寬度尺寸。係從根基部一直到前端部 5 g形成相同之寬度尺寸，以與上述前端部5 f大約相同 之寬度所形成。同時，該前端部5 g係大約平行於底板 5 a地被折彎。 經濟部智慧財產局員工消費合作社印製 第1端子5係安裝於絕緣基板1，更具體而言，第1 端子5之底板5 a係抵接於絕緣基板1之下面1 b之凹部 1 g並加以收納，第1端子5之第1腳部5 b，及第2腳 部5 c ，係設有與絕緣基板1之凹部1 g之角隅部成正交 ，且沿著相鄰接之兩個側面1 c 2，1 c 3，及側面 lc3 ’ lc4被配置，又，第1腳部5b及第2腳部 5 c之前端部5 f ，5g，被折彎向絕緣基板1之上面 1 a側。該狀態時，第1腳部5 b及第2腳部5 c之前端 部5 f.，5 g，係沿著設於絕緣基板1之上面1 a的電極 -15- 本紙張尺度適用t國國家標準（CNS)A4規格（210x297公釐） A7 經濟部智慧財產局員工消費合作社印製 4 3 68 1 9 ____B7_ 五、發明說明（13 ) 3之電阻體3側之外緣而被折彎，因此成爲位在與絕緣基 板1之角隅部之間隔著所定間隔，而在電極3 ’形成有藉 由前端部5 f ，5g未被覆蓋之較大領域。 又，第1端子5係配置於抵接於第1腳部5 b及第2 腳部5 c成正交之側面1 c 3，1 c 4及側面1 c 2， 1 c 3之狀態，由此如下述地裝配時可容易地成爲絕緣基 板1之定位。 此狀態時，抵接於絕緣基板1之凹部1 g之第1端子 5的基板5 a，係凹部1 g之深度尺寸t 2爲例如約 0 . 2mm，由於底板5 a之厚度尺寸（厚度）t 3爲例 如約0 . 1 5mm，故在絕緣基板1之下面1 b與底板 5 a之下面之間形成有約0 . 0 5 m m之間隙t 1 ( t 1 =t 2 - t 3 )。亦即，於絕緣基板1之凹部lg配置成 第1端子5之底板5 a被收容之狀態。 發明人對於該間隙t 1實行各種實驗之結果。確認間 隙t 1係在〇<t ISO . 1mm之範圍就可以。 第2端子6係具有：大約長方形之底板6 a ，及於底 板6 a之其中一方之端部朝上方豎起的豎起部6 b ，及於 底板6 a之另一方端部側朝上方經拉伸加工所設置的圓筒 狀中空軸部6 c。 第2端子6係安裝於絕緣基板1，更具體而言，第2 端子6之底板6a ，係被收容並抵接於絕緣基板1之下面 1 b之溝槽部1 f ，中空軸部6 c係被插穿於絕緣基板1 之孔1 d，而豎起部6 b係以朝上面1 a方向延伸之狀態 '請先閱讀背面之注意事項再填寫本頁): ----— I— I ---- I > ^^ 1 I ------ Wide! 1!-I I I____I A7 B7 436819 V. Description of the invention (11) One of the ends is open to the outside in the direction of the side 1c1. On one of the opposite side surfaces ic 3 (upper and lower directions in FIG. 2), a wide approximately rectangular notch portion 1 h and a wide and narrow one are provided. The approximately rectangular notch portion 1 i ′ is opposite to the other side. A pair of rectangular notched portions 1 j are provided facing the side surface 1 c 2 and the measurement surface (the left-right direction in FIG. 2) with the electrode 3 described below facing the notched portion 1 i. A pair of rectangular recesses 1 g are formed at each corner of the above-mentioned notch portion 1 i side (refer to FIG. 2). The recesses 1 g are formed from the lower surface 1 b and are orthogonally connected. The two side surfaces 1 c 2 and 1 c 3 adjacent to each other, or the side surfaces 1 c 3 and 1 c 4 are formed, and these directions are formed in an open state to the outside. In addition, the depth dimension t 2 of the recessed portion lg and the groove portion 1 f is, for example, about 0.2 mm. The recessed portion 1 g indicates the sides lc2 and lc3 (and the side lc3) which are orthogonal to each other and are adjacent to each other. (, Lc4 direction) is open, but it is not limited to this, the shape of opening three side directions, or opening two opposite side directions may be used. The resistor 2 is made of, for example, a cermet paste. The periphery of the recessed portion 1 e formed on the upper surface 1 a of the insulating substrate 1 in a substantially arc shape by printing or the like. The electrodes 3 are made of, for example, silver paste, and are approximately rectangular. The electrodes 3 are provided on the upper surface 1a of the insulating substrate 1, and are connected to both ends of the resistor 2 'by printing or the like. The electrode 3 is arranged on each side 1 c 1, 1 c 3 ′ and side 1 c 2 of the insulating substrate 1 which are orthogonal and adjacent. Please read the precautions on the back before filling in A. This page-Γ page I I I Sleep IIII Orders Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size is applicable to National Standards (CNS) A4 (210 X 297 mm) -14- 4 3 68 1 9 A7 B7 V. Invention Explanation (12) 1 c 4 near the corner. (Please read the precautions on the back before filling in this page.) Terminal 4 is made of metal plate such as steel or copper. 1 It is perforated and bent, and it consists of a pair of first terminal 5 and second terminal 6. The thickness dimension (thickness) t 3 of the terminal 4 is, for example, about 0.15 mm. The first terminal 5 has a substantially rectangular (quadrilateral) bottom plate 5 a > and a first leg portion 5 b which is orthogonal to the bottom plate 5 a and bent upward from two adjacent side edges, respectively, and The second leg portion 5 c and a protruding portion 5 d that protrudes outward from the bottom plate 5 a between the first leg portion 5 b and the second leg portion 5 c. In addition, one of the first leg portions 5 b is provided with a wide root base portion 5 e, and the root base portion 5 e is extended upward from the base portion 5 e, and the root base portion 5 e bent approximately parallel to the bottom plate 5 a is wider and narrower. The width of the front end portion 5 f. And the other second leg portion 5 c. The same width dimension is formed from the root portion to the front end portion 5g, and is formed with the same width as the front end portion 5f. At the same time, the front end portion 5 g is bent approximately parallel to the bottom plate 5 a. The first terminal 5 printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is mounted on the insulating substrate 1, more specifically, the bottom plate 5a of the first terminal 5 is abutted on the concave portion 1 g of the lower surface 1 b of the insulating substrate 1 and For storage, the first leg portion 5 b of the first terminal 5 and the second leg portion 5 c are provided orthogonal to the corner portion of the recessed portion 1 g of the insulating substrate 1, and are arranged along two adjacent adjacent portions. The side surfaces 1 c 2, 1 c 3, and the side surfaces lc3 ′ lc4 are arranged, and the front end portions 5 f and 5g of the first leg portion 5 b and the second leg portion 5 c are bent toward the upper surface 1 of the insulating substrate 1. a side. In this state, the first leg portion 5 b and the second leg portion 5 c before the front end portion 5 f., 5 g are along the electrode 1 a provided on the upper surface of the insulating substrate 1-15 National Standard (CNS) A4 Specification (210x297 mm) A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 68 1 9 ____B7_ V. Invention Description (13) 3 The outer edge of the resistor body 3 was bent, Therefore, the electrode 3 ′ is formed at a predetermined interval from the corner portion of the insulating substrate 1, and a large area that is not covered by the front end portion 5 f and 5 g is formed on the electrode 3 ′. In addition, the first terminal 5 is disposed in a state of contacting the side surfaces 1 c 3, 1 c 4 and 1 c 2, 1 c 3 which are orthogonal to the first leg portion 5 b and the second leg portion 5 c. This can easily become the positioning of the insulating substrate 1 when assembled as described below. In this state, the substrate 5 a of the first terminal 5 which is in contact with the recessed portion 1 g of the insulating substrate 1 has a depth dimension t 2 of the recessed portion 1 g of, for example, about 0.2 mm. The thickness (thickness) of the bottom plate 5 a t 3 is, for example, about 0.15 mm, so a gap t 1 (t 1 = t 2-t 3) of about 0.5 mm is formed between the lower surface 1 b of the insulating substrate 1 and the lower surface of the bottom plate 5 a. That is, the recess 1g of the insulating substrate 1 is arranged in a state where the bottom plate 5a of the first terminal 5 is housed. The inventors carried out various experiments on the gap t 1. It is sufficient to confirm that the gap t 1 is within the range of 0 < t ISO. 1 mm. The second terminal 6 has a substantially rectangular base plate 6 a, a raised portion 6 b erected upward from one end portion of the base plate 6 a, and a side portion facing upward from the other end portion of the base plate 6 a. The cylindrical hollow shaft portion 6 c provided in the drawing process. The second terminal 6 is mounted on the insulating substrate 1, more specifically, the bottom plate 6a of the second terminal 6 is received and abuts on the groove portion 1f of the lower surface 1b of the insulating substrate 1, and the hollow shaft portion 6c. It is inserted through the hole 1 d of the insulating substrate 1, and the raised portion 6 b is extended in the direction of 1 a on the top. 'Please read the precautions on the back before filling this page.)

本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -16- 436819 A7 B7_ 五、發明說明（14) 下配置於沿著設在絕緣基板1.之側面1 c 1的缺口部1 h 之內壁。 該狀態時，與上述第1端子5同•樣地’在絕緣基板1 之下面1 b與第2端子6之下面之間，形成一約0 . 0 5 m m之間隙。 滑動件7係具有：由不鍵鋼，銅，其合金等之金屬板 所構成，經穿孔，折彎被一體加工，並大約圓盤狀地拉伸 加工所形成的保持部7 a，及配置於保持部7 a上方的操 作部7 b，及從保持部7 a延設的大約U形狀滑動部7 c 。在保持部7 a之中心部形成一圓形孔7 d (參照第4圖 )，而在操作部7 b之中心部形成一十字形孔7 e。 該滑動件.7之保持部7 a |係配置於絕緣基板1之上 面1 a之凹部1 e內，同時，第2端子6之中空軸部6 e 以插穿於絕緣基板1之孔1 d之狀態下，中空軸部6 c之 前端部插穿於孔1 d，並歛縫於保持部7 a之孔7 d，在 該狀態下，滑動件7係可轉動地被保持於絕緣基板1。此 時，滑動件7係接觸於第2端子6 » 此時，滑動件7之滑動部7 c係彈接於設在絕緣基板 1之上面la的電阻體2，對應於滑動件7之轉動，滑動 部7 c成爲能在電阻體2上之狀態。 焊劑9係與一般之熔點（例如約1 8 0度）之焊劑相 比較，具有高熔點的高溫焊劑，該熔點係在2 2 0度至 3 3 0度之溫度範圍。該焊劑9係連接設於絕緣基板1之 上面la的電極3 ，及第1端子5之第1腳部5 a的前端 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公爱） 請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產扃員工消費合作社印製 ,lllOJI ti ϋ I n ^ϋ ϋ } —1 n 1- J> il· n ϋ J . -17- A7 436819 B7__ 五、發明說明（15) 部5f ，及第2腳部5c之前端部5g。此時電極3之前 端部5 f ，及前端部5 g未被覆蓋之較大區域，成爲軟焊 區域’而在該軟焊區域，前端部5 f及前端部5 g係與電 ’極3被軟焊。該焊劑9之熔點的溫度範圍係2 2 0度至 3 3 0度’乃溶點過低溫時在實裝時再熔融而產生不方便 之情形，又若高溫時則在軟焊時需費較多之熱量，因該熱 有對其周圍之構成構件不良影響之虞，因此，不會產生此 等而決定者。 以下說明本發明之第1實施例的片型可變電阻器之製 造方法=第1 3圖係表示本發明的片型可變電阻.器之製造 方法的過程圖。 如第1 3圖所示，首先在最初之（A)的過程，於端 子圏1 0，形成一被拉伸加工之圓筒狀中空軸部6 c ，同 時形成一進給孔1 1。 於端子圈1 0 ，隔著所定間隔形成一框部1 2 ，同時 形成一對第1端子5與第2端子6 ，此時，同時地豎立形 成有第2端子6之豎立部6 b。同時一對之第1,端子5之 第1腳部5 b及第2腳部5 c ，分別從底板5 a之兩個側 緣朝上方折彎。 以下詳述在拉伸，彎曲，切斷過程所形成之端子圏。 第1 1圖係表示本發明之實施形態的絕緣基板之端子 之製程的端子圈的主要部分平面圖；第1 2圖係表示第 1 1圖之1 2 - 1 2線的剖面圖。 如第1 1圖及第1 2圖所示，端子圈1 〇係由鋼或銅 本紙張尺度適用尹國國家標準（CNS)A4規格（210 X 297公釐） -18- (請先g讀背面之注意事項再填寫本頁) -ml — — — --- I I ----I · 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（16 ) 請 先 閱 讀 背 面 之 注 意 事 項 再 填 寫 本 頁 等之帶狀金屬板所構成，藉由拉伸，穿孔，彎曲，切斷過 程所形成。又，端子圏1 0係具有：連續地形成之複數個 大約矩形的框部1 2 ，及相對向於框部1 2之寬度方向， •以所定間隔所設置的進給孔1 1。 在框部1 2設有：從進給孔1 1之近旁朝框部1 2之 內方突出，且連結於框部1 2的一對突出部5 d，及連結 於各突出部5 cl的大約四方形之底板5 a (第1端子5) ，及從相鄰接之兩個進給孔1 1之間朝框部1 2之內方突 出，且連結於框部1 2之第2端子6。在上述底板5 a如 上所述，隔著突出部5 d，形成有朝上方折彎的第1腳部 5b及第2腳部5 c。 經濟部智慧財產局員工消費合作社印製 如第1 3圖所示，在（B)之載置，歛縫過程，將以 其他過程（未予圖示）所製造，且電阻體2及電極3設於 上面的絕緣基板1所構成的半成品，載置於連結於端子圈 1 0之框部1 2所形成的第1端子5之底板5 a與第2端 子6上。此時，將半成品之絕緣基板1之側面1 c 3， lc2 (及側面lc3，lc4)抵接於第1端子5之第 1腳部5 b ，及第2腳部5 c ，成爲對端子環1 〇之絕緣 基板1之定位過程》 此時，於絕緣基板1之孔1 d插穿配置第2端子6之 中空軸部6 c。 在該載置過程後，於絕緣基板1之上面1 a分別折彎 第1腳部5 b及第2腳部5 c之前端部，俾實行將第1端 子5與第2端子6歛縫於半成品之彎曲過程。在該彎曲過 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 -19- 4368 1 9 B7 五、發明說明（17 ) 程，第1腳部5 b及第2腳部5 C之各前端部5 f ，5 g ，係沿著與電極3之電阻體2境界近旁之外線被折彎’而 在電極3設有較大之軟焊區域。 • 然後，在（c )之軟焊過程’第1端子之第1腳部 5b及第2腳部5 c之前端部5 f ，5g，在設於電極3 之軟焊區域以高溫焊劑被軟焊，俾連接第1端子5與電極 3 ° 之後，在滑動件組裝，切斷過程，滑動件7組裝於軟 焊有第1端子5之半成品，被組裝之滑動件7係被歛縫於 第2端子6之中空軸部6 c ，半成品與滑動件7與第2端 子6係被一體化，在（D)之單品切斷過程，切斷第2端 子6之豎立部6 b之近旁，及第1端子5之突出部5 d而 從極體1 1分離成爲單品的片型可變電阻器。 以下說明本發明的第一實施例之片型可變電阻器安裝 於印刷配線基板的片型可變電阻器之安裝方法。 第1 4圖係表示本發明的第一實施例之片型可變電阻 器安裝於印刷配線基板之狀態的剖面圖。 如第1 4圖所示，印刷配線基板2 0係例如備有玻璃 之合成樹脂材料所構成且呈平板狀，在印刷配線基板2 0 之至少其中一方之面，形成一所期望之導電圖案（未圖示 )。於該印刷配線基板2 0之導電圖案（未圖示）上載置 上述之本發明的片型可變電阻器。此時在所定之導電圖案 上塗布焊糊1 3 ，載置片型可變電阻器之第1端子5與第 2端子6成爲連接於該焊糊1 3。 (.請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 ' 1 ·1111111 ^31 *1 ----— ir - >-IIIIIILTI — I- I . -β— «I ϋ 1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -20- A7 B7 五、發明說明（18 ) 該焊糊1 3之熔點係例如使用約1 8 0度者，該約 广請先閱績背面之注意事項再填寫本頁) 1 8 0度之熔點係使用比第1端子5軟焊於電極3之高溫 焊劑（熔點2 2 0度至3 3 0度）低熔點溫度的焊劑。 ' 在該狀態下，將載置有片型可變電阻器之印刷配線基 板2 0配置於回流爐（未圖示：回流爐內之溫度係約 2 2 0度）內，焊劑連接片型可變電阻器與印刷配線基板 2 0之導電圖案2 1 ，惟回流爐之溫度係對焊劑之熔點。 未設成高約4 0度至5 0度之溫度，則不能焊劑1 3爲眾 知。由於以高溫焊劑軟焊該片型可變電阻器之第1端子5 與電極3 ，且以比焊糊l· 3之熔點高約4 0至5 0度之溫 度設定回流爐內之溫度，因此，在該回流爐內之溫度，焊 糊1 3會熔融，同時，高溫焊劑係不會熔融地施以安定之 焊劑連接。 經濟部智慧財產局員工消費合作社印製 此時，於片型可變電阻器之絕緣基板1之下面與第1 端子5之底面5 a之下面之間，及絕緣基板1之下面與第 2端子6之下面之間，分別形成有間隙，又由於絕緣基板 1之凹部1 g與溝槽部1 f之各側面方向被開放，因此在 對印刷配線基板2 0之片型可變電阻器之第1 ，第2端子 5，6的軟焊時，則焊糊內之助熔劑及熔劑經上述間隙而 從側面方向之開放部分確實地被飛散。 依據第1 5圖至第2 0圖說明本發明之片型可變電阻 器的第二實施例；第15圖至第18圖係均表示本發明之 片型可變電阻器的第二實施例；第15圖係表示剖面圖， 第1 6圖係表示電極之構成之主要部分的放大斜視圖，第 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) ToTi 4 3 68 19 A7 B7 斜面 大剖 放的 的態 分狀 部裝 要安 主之 之板 態基 狀線 焊配 軟刷 之印 極對 電示 與表 >子係 19)端圖 { 示.8 明表 1 說係第 明圖； 發 7圖 經濟部智慧財產局員工消費合作社印製 圖。 電阻體1 Ο 2係由例如金屬陶瓷系之糊等所構成’藉 由印刷等大約圓弧狀地形成於絕緣基板1 0 1之上面 101a的凹部l〇le周圍。 第1電極1 0 3係例如銀與玻璃料所構成，大約矩形 ，設於絕緣基板1 0 1之上面1 0 1 a，分別連接於電阻 體1 0 2之兩端部，藉由印刷等形成一對。該第1電極 1 0 3係配置於藉由正交且相鄰之絕緣基板1 〇 1之各側 面101c所形成的角隅部近旁》 第2電極1 0 4係由例如銀與玻璃料所構成，形成於 位在第1電極1 0 3之近旁之側面1 〇 1 c_，同時第2電 極1 〇 4係與第1電極1 0 3連結所形成。 第1端子1 0 5係具有：大約矩形（四方形）之底板 1〇5 a，及舆底板1 〇 5 a成正交且從相鄰之兩個側緣 分別朝上方折彎的第1腳部1 0 5 b與第2腳部1 0 5 c 0 第1端子1 0 5係抵接於絕緣基板1 0 1之下面 101b，第1腳部l〇5b及第2腳部105c係正交 於絕緣基板1 0 1之角隅部，且沿著相鄰接之兩個側面 101c被配置，又，第1腳部105b及第2腳部 1 0 5 c之前端1 0 5 c之前端部，被折彎向絕緣基板 1 0 1之上面1 0 1 a側，第1端子1 0 5安裝於絕緣基 (請先閱讀背面之注意事項再填寫本頁) -- — — — 111—^eJalllllllf — — — — — — — —— — — — — — — — — — — 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -22- A7 436819 ___B7___ 五、發明說明（2〇 ) 板 1 0 1。 此狀態時，第1腳部1 0 5 b係接觸或近接於第2電 極1 0 4之狀態，又第2腳部1 0 5 C係沿著沒有第2電 ‘極1 0 4之絕緣基板1 0 1之側面1 0 1 c延伸，同時第 1腳部1 0 5 b及第2腳部1 0 5 c之前端部，係折彎向 設於絕緣基板1 0 1之上面1 0 1 a的第1電極1 〇 3之 電阻體1 0 3側，因此，成爲位於與絕緣基板1 〇 1之角 隅部之間隔著所定間隔，故在第1電極1 0 3，形成有藉 由前端部未被覆蓋之較大區域。 第2端子1 0 6係具有：大約長方形之底板1 0 6 a ，及於底板1 0 6 a之其中一方之端部朝上方豎起的豎起 部1 0 6 b，及於底板1 0 6 a之另一方之端部側朝上方 以拉伸加上所設置的圓筒狀中空軸部1 0 6 c。 第2端子1 0 6係底板1 0 6抵接於絕緣基板1 0 1 之下面1 0 1 b，中空軸部1 0 6 c係被插穿於絕緣基板 101之孔101d，而豎起部106b係以朝上面 1 0 1 a方向延伸之狀態下配置於沿著設在絕緣基板 101之側面101c的缺口部。 滑動件1 0 7係具有由不銹鋼’銅，其合金等之金 屬板所構成，經穿孔’折彎被一體加工，並大約圓盤狀地 拉伸加工所形成的保持部1 0 7 a ’及配置於保持部 107a上方的操作部107b ’及從保持部1〇7 a延 設的大約U形狀滑動部1 0 7 c。在保持部1 〇 7 a之中 心部形成一圓形孔1 0 7 d (參照第1 5圖）’而在操作 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 (請先閱讀背面之注意事項再填寫本頁> 「-------—訂---------線！ 經濟部智慧財產局員工消費合作社印製 -23- 436819 A7 B7___ 五、發明說明（21 ) 部1 0 7 b之中心部形成--Η字形孔1 〇 7 e ^ 該滑動件1 0 7之保持部1 〇 7 a ，係配置於絕緣基 板101之上面101a之凹部1〇16內，同時，第2 •端子1 0 6之中空軸部1 0 6 e以插穿於絕緣基板1 〇 1 之孔1 0 1 d之狀態下，中空軸部1 〇 6 c之前端部插穿 於孔101d，並歛縫於保持部i〇7a之孔l〇7d， 在該狀態下，滑動件1 0 7係可轉動地被保持於絕緣基板 1 0 1。此時’滑動件1 07係接觸於第2端子1 0 6 ° 此時’滑動件1 0 7之滑動部1 〇 7 c係彈接於設在 絕緣基板1 0 1之上面1 0 1 a的電阻體1 〇 2，對應於 滑動件1 0 7之轉動’滑動部1 〇 7 c成爲能在電阻體 1 0 2上之狀態= 焊劑1 0 9係與一般之熔點（例如約1 8 0度）之焊 劑相比較，具有高熔點的高溫焊劑，該熔點係在2 2 0度 至3 3 Q度之溫度範圍。該焊劑1 〇 9係連接設於絕緣基 板1 0 1之上面1 0 1 a的第1電極1 ◦ 3與第1端子 1 0 5之第1腳部1 0 5 a及第2腳部1 0 5 c之前端部 ，以及第2電極104與第1腳部l〇5b。 此時，第1，第2腳部l〇5b，105c之前端部 未被覆蓋之較大區域係成爲軟焊區域，而在該軟焊區域， 第1 ，第2腳部105 b，l〇5c之前端部係與第1電 極1 0 3被軟焊。 又，因第1與第2電極103 ，104之全面，或大 部分之表面，係擴展熔融之焊劑1 0 7，因此，不必設置 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -H ^1 ϋ 1 I— I n ^ I ϋ I n ϋ —^· n n 1 ϋ 1 1 n II ϋ · -24- A7 436819 ______B7_ 五、發明說明（22) 以焊劑覆蓋過程成爲經焊劑1 〇 9覆蓋之狀態。 又該焊劑1 0 9之熔點的溫度範圍係2 2 0度至 3 3 0度’乃熔點過低溫時在實裝時再熔融而產生不方便 之情形’又若高溫時則在軟焊時需費較多之熱量，因該熱 有對其周圍之構成構件不良影響之虞，因此，不會產生此 等而決定者。 以下，依據第1 8圖說明本發明之片型可變電阻器對 印刷配線基板之安裝方法；印刷配線基板1 2 0係例如具 玻璃之合成樹脂材料等所構成呈平板狀，在印刷配線基板 1 2 0之至少其中一方之面，形成一所期望之導電圖案（ 未圖示）。在該印刷配線基板120之導電圖案（未圖示 )上載置上述之本發明的片型可變電阻器。 此時，於所定導電圖案上塗布焊糊（未圖示），載置 印刷配線基板之第1端子1 〇 5與第2端子1 0 6成爲連 接於該焊糊。 該焊糊之熔點係使用例如約1 8 0度者，該約1 8 0 度之溶點係使用具有比第1端子1 〇 5軟焊於第1，第2 電極103，104之高溫焊劑（熔點爲220度至 3 3 0度）之熔點低溫度之焊劑。 在該狀態下，將載置片型可變電阻器之印刷配線基板 1 2 0搬運至回流爐（未圖示：回流爐內之溫度係約 2 2 0度）內，以焊劑1 1 3連接片型可變電阻器與印刷 配線基板1 2 0之導電圖案。 此時，第1 ，第2電極103 ，104之焊劑109 本紙張尺度適用宁國國家標準（CNS)A4規格（210 X 297公釐） -25 - 請先閱讀背面之注意事項再填寫本頁)This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -16- 436819 A7 B7_ V. Description of the invention (14) is arranged along the gap 1 c 1 along the side of the insulating substrate 1. 1 h inside the wall. In this state, a gap of about 0.05 mm is formed between the lower surface 1 b of the insulating substrate 1 and the lower surface of the second terminal 6 in the same manner as the first terminal 5 described above. The slider 7 is composed of a metal plate made of non-bonded steel, copper, its alloy, etc., and is integrally processed through perforation, bending, and approximately disk-shaped stretching processing. An operating portion 7 b above the holding portion 7 a and an approximately U-shaped sliding portion 7 c extending from the holding portion 7 a. A circular hole 7 d (see FIG. 4) is formed in the center portion of the holding portion 7 a, and a cross-shaped hole 7 e is formed in the center portion of the operation portion 7 b. The holding portion 7 a of the slider .7 is arranged in the recess 1 e of the upper surface 1 a of the insulating substrate 1, and at the same time, the hollow shaft portion 6 e of the second terminal 6 is inserted into the hole 1 d of the insulating substrate 1 In this state, the front end of the hollow shaft portion 6 c is inserted into the hole 1 d and caulked into the hole 7 d of the holding portion 7 a. In this state, the slider 7 is rotatably held on the insulating substrate 1. . At this time, the slider 7 is in contact with the second terminal 6 »At this time, the sliding part 7c of the slider 7 is elastically connected to the resistor 2 provided on the upper surface 1a of the insulating substrate 1, corresponding to the rotation of the slider 7, The sliding portion 7 c is in a state capable of being placed on the resistor 2. Flux 9 is a high-temperature flux with a high melting point compared to a general melting point (for example, about 180 degrees). The melting point is in a temperature range of 220 to 330 degrees. The flux 9 is connected to the electrode 3 provided on the upper surface 1a of the insulating substrate 1 and the front end of the first leg portion 5a of the first terminal 5. The paper size is applicable to the Chinese national standard (CNS > A4 specification (210 X 297 public love) (Please read the notes on the back before filling in this page) Printed by Intellectual Property of the Ministry of Economy 扃 Employee Consumer Cooperative, lllOJI ti ϋ I n ^ ϋ ϋ} —1 n 1- J > il · n ϋ J. -17- A7 436819 B7__ 5. Description of the invention (15) 5f and 5g before the second leg 5c. At this time, the larger area of the front end portion 5 f and the front end portion 5 g of the electrode 3 is not covered and becomes a soldering area. In this soldering area, the front end portion 5 f and the front end portion 5 g are connected to the electric pole 3 Was soldered. The temperature range of the melting point of the flux 9 is 220 to 330 degrees. The melting point is too low when the melting point is re-melted during installation, which causes inconvenience. If it is high temperature, it will cost more in soft soldering. The large amount of heat may cause a bad influence on the constituent members around it, so it is not determined by this amount. The manufacturing method of the chip varistor according to the first embodiment of the present invention will be described below. Fig. 13 is a process diagram showing the method of manufacturing the chip varistor of the present invention. As shown in FIG. 13, first, in the first step (A), a cylindrical hollow shaft portion 6 c is formed at the terminal 圏 10 to be stretched and a feed hole 11 is formed at the same time. A frame portion 12 is formed at a predetermined interval on the terminal ring 10, and a pair of first terminals 5 and second terminals 6 are simultaneously formed. At this time, an upright portion 6b of the second terminal 6 is simultaneously erected. At the same time, the first leg portion 5 b and the second leg portion 5 c of the pair of terminals 5 are respectively bent upward from the two side edges of the bottom plate 5 a. The terminal 圏 formed in the process of stretching, bending and cutting is described in detail below. FIG. 11 is a plan view of a main part of a terminal ring showing the manufacturing process of the terminal of the insulating substrate according to the embodiment of the present invention; and FIG. 12 is a cross-sectional view showing lines 1 2 to 12 of FIG. 11. As shown in Fig. 11 and Fig. 12, the terminal ring 10 is made of steel or copper paper. The national standard (CNS) A4 specification (210 X 297 mm) is applicable. -18- (Please read first Note on the back then fill in this page) -ml — — — --- II ---- I · Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (16) Please read the notes on the back first Fill in the band-shaped metal plate on this page, and it is formed by the process of stretching, perforating, bending, and cutting. In addition, the terminal 圏 10 has a plurality of approximately rectangular frame portions 12 formed continuously, and a feeding direction 11 provided at a predetermined interval with respect to the width direction of the frame portion 12. The frame portion 12 is provided with a pair of protruding portions 5 d protruding from the vicinity of the feed hole 11 toward the inside of the frame portion 12 and connected to the frame portion 12, and a pair of protruding portions 5 cl. Approximately a square bottom plate 5 a (the first terminal 5), and protrudes inward of the frame portion 12 from between two adjacent feed holes 11, and is connected to the second terminal of the frame portion 12. 6. As described above, the bottom plate 5a is formed with a first leg portion 5b and a second leg portion 5c which are bent upward through the protruding portion 5d. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in Figure 13; the process of placing and caulking in (B) will be made by other processes (not shown), and the resistor 2 and electrode 3 The semi-finished product composed of the insulating substrate 1 provided on the upper surface is placed on the bottom plate 5 a and the second terminal 6 of the first terminal 5 formed by the frame portion 12 connected to the terminal ring 10. At this time, the side surfaces 1 c 3, lc2 (and the side surfaces lc3, lc4) of the semi-finished insulating substrate 1 are abutted against the first leg portion 5 b and the second leg portion 5 c of the first terminal 5 to form a pair of terminal rings. Positioning Process of the Insulating Substrate 1 of 10》 At this time, the hollow shaft portion 6 c of the second terminal 6 is disposed through the hole 1 d of the insulating substrate 1. After this placement process, the front ends of the first leg portion 5 b and the second leg portion 5 c are respectively bent on the upper surface 1 a of the insulating substrate 1, and the first terminal 5 and the second terminal 6 are crimped together. Bending process of semi-finished products. At this curved paper size, the Chinese National Standard (CNS) A4 specification (210 X 297 mm> -19- 4368 1 9 B7 is applied. V. Description of the invention (17), the first leg 5 b and the second leg Each of the front end portions 5 f and 5 g of 5 C is bent along the outer line near the boundary of the resistor body 2 of the electrode 3, and a large soldering area is provided on the electrode 3. Then, in (c) In the soldering process, the first leg portion 5b of the first terminal and the front end portion 5f and 5g of the second leg portion 5c are soldered with a high-temperature flux in the soldering area provided on the electrode 3, and are connected to the first terminal. After 3 ° and the electrode 3 °, during the slider assembly and cutting process, the slider 7 is assembled to the semi-finished product soldered with the first terminal 5, and the assembled slider 7 is caulked into the hollow shaft portion of the second terminal 6. 6 c, the semi-finished product, the sliding member 7 and the second terminal 6 are integrated. In the single product cutting process of (D), the vicinity of the standing portion 6 b of the second terminal 6 and the protrusion of the first terminal 5 are cut. The chip varistor separated from the pole body 1 1 into a single product by the portion 5 d. The chip varistor of the first embodiment of the present invention will be described below as a chip mounted on a printed wiring board. Method for mounting a type variable resistor. Fig. 14 is a cross-sectional view showing a state where a chip type variable resistor according to a first embodiment of the present invention is mounted on a printed wiring board. As shown in Fig. 14, printed wiring The substrate 20 is made of, for example, a glass-made synthetic resin material and has a flat plate shape, and a desired conductive pattern (not shown) is formed on at least one of the surfaces of the printed wiring substrate 20. On this printed wiring substrate A conductive pattern (not shown) of 20 is placed on the chip variable resistor of the present invention. At this time, a solder paste 1 3 is coated on the predetermined conductive pattern, and the first terminal of the chip variable resistor is placed. 5 and the second terminal 6 are connected to the solder paste 1 3. (Please read the precautions on the back before filling in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy '1 · 1111111 ^ 31 * 1 --- -— ir-> -IIIIIILTI — I- I. -Β— «I ϋ 1 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -20- A7 B7 V. Description of the invention (18 ) The melting point of the solder paste 1 3 is, for example, about 180 °. Please read the results first. Note again fill the page) 180 degrees than the melting points of the first terminal 5 using solder flux to a high temperature (melting point 220 degrees to 330 degrees) a low melting temperature solder of electrode 3. 'In this state, the printed wiring board 20 on which the chip-type variable resistor is placed is placed in a reflow furnace (not shown: the temperature in the reflow furnace is about 220 ° C), and the solder connection chip type can be The varistor and the conductive pattern 2 1 of the printed wiring board 20, but the temperature of the reflow oven is the melting point of the solder. It is not known that the flux 13 cannot be set to a temperature of about 40 to 50 degrees. Since the first terminal 5 and the electrode 3 of the chip variable resistor are soldered with a high-temperature flux, and the temperature in the reflow furnace is set at a temperature of about 40 to 50 degrees higher than the melting point of the solder paste l · 3, At the temperature in the reflow furnace, the solder paste 13 will melt, and at the same time, the high-temperature flux will not be melted and a stable flux connection will be applied. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs at this time, between the lower surface of the insulating substrate 1 of the chip variable resistor and the lower surface 5 a of the first terminal 5, and between the lower surface of the insulating substrate 1 and the second terminal A gap is formed between the lower surface of 6 and each side direction of the recessed portion 1 g and the groove portion 1 f of the insulating substrate 1 is opened. During the soft soldering of the first and second terminals 5 and 6, the flux and the flux in the solder paste are reliably scattered from the side openings through the gap. A second embodiment of the chip variable resistor of the present invention will be described with reference to FIGS. 15 to 20; FIGS. 15 to 18 each show a second embodiment of the chip variable resistor of the present invention. ; Figure 15 is a cross-sectional view, and Figure 16 is an enlarged oblique view of the main part of the electrode structure. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ToTi 4 3 68 19 A7 B7 A large section of the beveled surface is equipped with a plate-like base line welded with a soft brush and an electrode pair with a soft brush. The display is shown in Table 19). 1 is the first bright picture; 7 is the printed picture of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The resistor body 10 2 is made of, for example, a cermet-based paste, and is formed around the concave portion 10le of the upper surface 101a of the insulating substrate 101 by printing or the like in an approximately arc shape by printing or the like. The first electrode 1 0 3 is made of, for example, silver and glass frit, and is approximately rectangular. The first electrode 1 0 3 is provided on the insulating substrate 1 1 1 1 1 a, and is connected to both ends of the resistor 1 102, and is formed by printing or the like. A pair. The first electrode 103 is arranged near the corners formed by the side surfaces 101c of the orthogonal and adjacent insulating substrates 101. The second electrode 104 is made of, for example, silver and glass frit. Is formed on the side surface 1 〇1 c_ located near the first electrode 103, and the second electrode 104 is connected to the first electrode 103. The first terminal 105 is provided with a bottom plate 105a approximately rectangular (quadrilateral) and a bottom plate 105a orthogonal to each other and bent upward from two adjacent side edges, respectively. The part 1 0 5 b and the second leg part 1 0 5 c 0 The first terminal 105 is in contact with the lower surface 101b of the insulating substrate 101, and the first leg part 105b and the second leg part 105c are orthogonal. It is arranged at the corner part of the insulating substrate 10, and is arranged along two adjacent side surfaces 101c, and the first leg part 105b and the second leg part 1 0 5 c front end 1 0 5 c front end , Bent to the top of the insulating substrate 1 0 1 1 1 a side, the first terminal 1 0 5 is installed on the insulating base (please read the precautions on the back before filling this page)-— — — 111 — ^ eJalllllllf — — — — — — — — — — — — — — — — — — — This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -22- A7 436819 ___B7___ V. Description of the invention (2 〇) Board 1 0 1. In this state, the first leg portion 10 5 b is in a state of being in contact with or close to the second electrode 104, and the second leg portion 1 0 5 C is along the insulating substrate without the second electrical pole 1 0 4 The side of 1 0 1 extends 1 0 1 c, while the front ends of the first leg 1 0 5 b and the second leg 1 0 5 c are bent toward the top of the insulating substrate 1 0 1 1 0 1 a Since the resistor 103 side of the first electrode 103 is located at a predetermined distance from the corner portion of the insulating substrate 101, the first electrode 103 is formed with a front end portion. Larger areas not covered. The second terminal 1 0 6 has a bottom plate 1 0 6 a having a substantially rectangular shape, and a raised portion 1 6 6 b which is erected upward at one end of the bottom plate 1 0 6 a, and a bottom plate 1 0 6 The other side of a has a cylindrical hollow shaft portion 10 6 c which is stretched upwards and is provided upward. The second terminal 1 0 6 is a bottom plate 1 0 6 which abuts on the lower surface 1 0 1 of the insulating substrate 1 0 1 b. The hollow shaft portion 1 0 6 c is inserted through the hole 101 d of the insulating substrate 101 and the rising portion 106 b It is arrange | positioned in the notch part provided along the side surface 101c of the insulating substrate 101 in the state extended to the upper direction 1101a. The slider 1 0 7 has a holding portion 10 7 a ′ formed of a metal plate made of stainless steel “copper, an alloy thereof, etc., which is integrally processed through perforation and bending, and stretched in a disc shape. An operation portion 107b 'disposed above the holding portion 107a and an approximately U-shaped sliding portion 10c extending from the holding portion 107a. A circular hole 1 0 7 d (see FIG. 15) is formed in the center of the holding portion 107a, and the Chinese National Standard (CNS) A4 specification (210 X 297 mm>) is applied in the operation of this paper size. Please read the notes on the back before filling in this page > "------------ Order --------- line! Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -23- 436819 A7 B7___ V. Description of the invention (21) The central part of the part 10 7 b is formed-a Η-shaped hole 1 0 7 e ^ The holding part 1 0 7 a of the slider 10 7 is arranged on the upper surface 101 a of the insulating substrate 101 In the recessed portion 1016, at the same time, the hollow shaft portion 1 0 6 e of the terminal 1 0 6 is inserted into the hole 1 0 1 d of the insulating substrate 1 0, and the hollow shaft portion 1 0 6 c The front end portion is inserted into the hole 101d, and is caulked into the hole 107d of the holding portion 107a. In this state, the slider 107 is rotatably held on the insulating substrate 101. At this time, 'sliding' The piece 1 07 is in contact with the second terminal 1 0 6 °. At this time, the sliding part 1 of the slider 1 0 7 is 〇7 c is elastically connected to the resistor body 1 0 1 a provided on the insulating substrate 1 0 1. 2, corresponding to the rotation of the slider 1 0 7 The sliding part 1 〇7 c is in a state where it can be placed on the resistor body 102. Flux 109 is a high-temperature flux having a high melting point compared with a general melting point (for example, about 180 degrees). The melting point is in a temperature range of 220 ° to 3 3 ° C. The flux 10 is connected to the first electrode 1 ◦ 3 and the first terminal 1 0 5 provided on the insulating substrate 1 1 1 1 1 1 The first leg portion 105a and the second leg portion 105b before the end portion, and the second electrode 104 and the first leg portion 105b. At this time, the first and second leg portions 105b, The larger area where the end portion before 105c is not covered is a soldering area, and in this soldering area, the first and second leg portions 105b and 105c are softened with the first electrode 103. In addition, since the first and second electrodes 103 and 104 are complete, or most of the surfaces are extended molten solder 107, it is not necessary to set this paper size to apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm)-Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -H ^ 1 ϋ 1 I— I n ^ I ϋ I n ϋ — ^ · nn 1 ϋ 1 1 n I I ϋ · -24- A7 436819 ______B7_ V. Description of the invention (22) The process of covering with flux becomes a state covered by flux 1.09. The temperature range of the melting point of the flux 1 0 9 is 220 ° to 3 30 °. 'It is inconvenient when the melting point is remelted during installation when the melting point is too low.' If it is high temperature, it needs to be soldered. It requires a large amount of heat, because the heat may adversely affect the constituent members around it, so it is not determined. Hereinafter, the method for mounting the chip type variable resistor of the present invention on a printed wiring board will be described with reference to FIG. 18; the printed wiring board 1 20 is made of, for example, a synthetic resin material with glass and has a flat shape, and is printed on the printed wiring board. At least one of the faces of 1 2 0 forms a desired conductive pattern (not shown). The above-mentioned chip-type variable resistor of the present invention is placed on a conductive pattern (not shown) of the printed wiring board 120. At this time, a solder paste (not shown) is applied to a predetermined conductive pattern, and the first terminal 105 and the second terminal 106 on the printed wiring board are connected to the solder paste. The melting point of the solder paste is, for example, about 180 ° C, and the melting point of about 180 ° C is a high-temperature solder having a soldering resistance of the first terminal 105 to the first and second electrodes 103 and 104 ( Flux with a melting point of 220 ° to 330 °). In this state, the printed wiring board 1 2 0 on which the chip-type variable resistor is placed is transferred to a reflow furnace (not shown: the temperature in the reflow furnace is about 220 ° C.), and connected with a flux 1 1 3 The conductive pattern of the chip-type variable resistor and the printed wiring board 120. At this time, the flux of the first and second electrodes 103 and 104 is 109. The paper size applies the Ning National Standard (CNS) A4 specification (210 X 297 mm) -25-Please read the precautions on the back before filling this page)

K.J 經濟部智慧財產局員工消費合作社印製 t------------!____________________ 4 3 68 1 9 A7 __B7____ 五、發明說明（23 ) 及第1端子1 0 5焊劑1 1 3連接於導電圖案，同時第2 端子1 0 6焊劑1 1 3連接於導電圖案。 如上所述，因藉由焊劑1 1 3覆蓋第1，第2電極 • 103，104之全表面或大部分之表面，因此’即使長 期保管片型可變電阻器，第1 ，第2電極103，1〇4 不但不會產生依硫化氣體之硫化，又不會產生電氣式開放 ，而且也不會有不容易附著焊糊之情形。 又，因第1 ，第2電極103，104係以高熔點之 高溫焊劑1 0 9所覆蓋，因此，即使藉由焊糊軟焊時之回 流爐的較久時間，高溫焊劑1 〇 9也不容易熔融，因此’ 藉由高溫焊劑109，電極103，104係被焊糊保護 著，又藉由第1端子1 〇 5來覆蓋第2電極1 0 4之下方 部，而遮住焊糊，由此，更不容易產生焊劑耗費|不會產 生電氣式開放。 又，實裝片型可變電阻器之後，藉由修理等欲從印刷 配線基板1 2 0拆下時，有依軟焊烙鐵熔解高溫焊劑之溫 度的熱會短時間地加入，在熔解焊劑1. 1 3時，成爲熔融 焊劑1 0 9之一部分，惟第1端子1 0 5之腳部1 0 5 b 係以第1電極1 0 3及第2電極1 0 4之正交之兩面被軟 焊，可增大接合面，又由於腳部1 〇 5 c也以第1電極 1 0 3被軟焊，因此即使焊劑1 0 9之一部分被熔融’端 子1 0 5從絕緣基板1 0 1脫落之可能性也較少’故端子 1 0 5與電極1 0 3，1 0 4成爲開放之可能性也較少。 萬一，即使第1端子1 0 5脫落，也被高溫焊劑 ，請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs t ------------! ____________________ 4 3 68 1 9 A7 __B7____ V. Description of the invention (23) and the first terminal 1 0 5 Solder 1 1 3 is connected to the conductive pattern, and the second terminal 106 solder 1 1 3 is connected to the conductive pattern. As described above, since the entire surface or most of the surfaces of the first and second electrodes 103, 104 are covered with the flux 1 1 3, 'even if the chip-type variable resistor is stored for a long time, the first and second electrodes 103 104 will not only produce sulfidation by sulfide gas, but also will not produce electrical opening, and it will not be difficult to attach solder paste. In addition, since the first and second electrodes 103 and 104 are covered with a high-melting point high-temperature flux 1 0 9, the high-temperature flux 1 0 9 is not used even for a long time in a reflow furnace during solder reflow. It is easy to melt. Therefore, the electrodes 103 and 104 are protected by the solder paste by the high-temperature solder 109, and the lower portion of the second electrode 104 is covered by the first terminal 105, and the solder paste is covered by Therefore, it is more difficult to generate flux consumption | no electrical opening. In addition, after the chip-type variable resistor is mounted, if it is to be detached from the printed wiring board 120 by repairs or the like, the heat of melting the high-temperature solder according to the soldering iron will be added for a short time. At 13:00, it becomes a part of the molten solder 109, but the legs 1 0 5 b of the first terminal 105 are softened by the two orthogonal surfaces of the first electrode 103 and the second electrode 104. Soldering can increase the joint surface, and because the foot portion 105c is also soft soldered with the first electrode 103, so even if a part of the flux 109 is melted, the terminal 1 0 5 is detached from the insulating substrate 1 0 1 There is also less possibility. Therefore, there is less possibility that the terminal 105 and the electrodes 103, 104 are open. In case, even if the 1st terminal 105 is detached, it will be exposed to high-temperature soldering. Please read the precautions on the back before filling out this page.) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

-I (一^^ · ^1 ϋ n · ϋ 1 ϋ f n ^ ^ I n ϋ n n n It I ^ ϋ ϋ n n n I I 1 .^1 ϋ I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -26- A7 436819 五、發明說明（24 ) (請先閱續背面之注意事項再填寫本頁) 1 0 9或腳部1 0 5 b所覆蓋’幾乎不受依硫化或銀之擴 散現象之損傷的第2電極1 0 4 ’係只需短時間之軟焊’ 雖有對焊劑之銀擴散，但不致於斷線，而利用第2電極 _ 1 0 4即可連接於印刷配線基板。雖實裝而長期間使用， 由於表面係以焊劑所覆蓋’因此不會有斷線之情形。 亦即，以不同之兩種類之方法相連接’即使在其中發 生不方便也因在另一方可彌補，故可提高連接之可靠性。 第19圖係表示本發明之片型可變電阻器的第三實施 例，由於該實施例係第1電極1 0 3與第2電極1 〇 4在 絕緣基板1 0 1之邊緣部分被分離者，因此在該情形，設 置焊劑109時，焊劑109係第1，第2電極部103 ，104與第1 ;第2腳部105b，105c之前端部 ，以及從第1腳部10 5 b傳來設於第2電極部104， 同時成爲藉焊劑10 9覆蓋第1，第2電極部103， 1 0 4之全表面或大部分表面之狀態。 由於其他構成係與上述第二實施例同樣，因此在相同 零件附於相同號碼，而在此省略其說明。 經濟部智慧財產局員工消費合作社印製 又第2 0圖係表示本發明之片型可變電阻器的第四實 施例，該實施例係沒有第1腳部1 〇 5 b，而作爲具備第 2腳部1 〇 5 c的第1端子1 〇 5之構成，該第2腳部 1 0 5 c作爲沿著未存在第2電極部1 0 4之側面 1 0 1 c延伸之構成者，在該情形，設置焊劑1 〇 9時， 焊劑1 0 9係設於第1，第2電極部1 〇 3 ，1 0 4與第 2腳部l〇5c之前端部，同時第1 ，第2電極部1〇3 -27- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 436819 經濟部智慧財產局員工消費合作社印製 A7 B7___ 五、發明說明（25 ) '1 0 4之全表面或大部分之表面成爲藉焊劑1 0 9加以 覆蓋之狀態。 由於其他構成係與上述第二實施例同樣，因此在相同 •零件附於相同號碼，而在此省略其說明。 又，在該實施例中，也以軟焊覆蓋藉印刷所形成之第 2電極1 0 4之大部分，此以外.也藉由端子1 0 5軟焊於 印刷配線基板1 2 0。 又，在第四實施例中，將焊劑1 0 9作爲低熔點之焊 劑也可以，此時，第2電極1 0 9斷線時，藉由端子 1 0 5可得到導通，即使端子1 〇 5脫落，也可藉由第2 電極1 0 4可得到導通，亦即，由於以不同之兩種類方法 連接，成爲即使在其中一方發生不方便也可在另一方彌補 之構造，因此結果可提高可靠性。 又，在第四實施例中，將絕緣基板1 0 1之下面 1 0 1 b作爲平坦面，但是，能收納端子1 〇 5之底板 1 0 5 a地形成凹部也可以。 (發明之效果） 如上所述，本發明之片型可變電阻器，由金屬板所構 成的端子係具有抵接於絕緣基板之下面的底板，及分別沿 著位於絕緣基板之角隅部之正交之互相鄰接的兩個側面， 並從底板折彎且向上面方向延伸的第1腳部，及第2腳部 ，該第1腳部及該第2腳部之前端部朝上面側折彎。 而前端部被軟焊於電極，且在絕綠基板之下面與側面 本紙張尺度適用47國國家標準（CNS)A4規格（210 X 297公釐） ----ο'--------訂---------線 I 'J------ (.請先閱讀背面之注意事項再填寫本頁) -28- A/ B7 4 3 68 1 9 五、發明說明（26) 形成由金屬板所構成之端子（電極），因此，對印刷配線 基板之軟焊時，端子（電極）不會藉由焊劑耗費而受損， 故對印刷配線基板之電氣式及機械式地連接成爲安定。 閲 讀 背 © 之 注 意 事 項 再 填 寫 本 頁 • 又，本發明之片型可變電阻器，係第1腳部1及第2 腳部之至少其中一方的前端部，彤成比第1腳部，或第2 腳部之根基部更狹窄，因此藉由寬廣之根基部，可增大側 面電極（端子）之面積，藉由狹窄之前端部，可確保與電 極之軟焊區域。 又，本發明之片型可變電阻器，係從絕緣基板之角隅 部，隔著所定距離，設置第1腳部及第2腳部，同時，在 角隅部之近旁延設電極，在電極設置軟焊區域，第1腳部 及第2腳部之前端部軟焊於該軟焊區域，故可容易又確實 地實行端子與電極之軟焊。 又，本發明之片型可變電阻器，係在端子之底板，設 有朝絕緣基板之外方突出的突出部，可將該突出部作爲形 成端子用之端子圈之連結部分，可藉由自動裝配機連續地 實行片型可變電阻器之裝配，故可提供低成本的.片型可變 電阻器。 經濟部智慧財展局員工消費合作社印製 又’本發明之片型可變電阻器，係端子之突出部，設 於互相鄰接設置之第1腳部與第2腳部之間，可將第1腳 部與第2腳部配置成正交，故具有可容易實行對於絕緣基 板之端子之定位，安裝的效果。 又’本發明之片型可變電阻器，係在位於第1電極 1 0 3之近旁的絕緣基板1 〇 1之側面1 〇 1 c，設置第 -29- 本紙張尺度適用中國國家標準（CNS〉A4規格（210 X 297公爱） A7 436819 B7__ 五、發明說明（27) 2電極104;端子105係具有底板105a ，及從該 底板105a折彎的腳部l〇5b，l〇5c，將端子 1 0 5之底板1 0 5 a配設於絕緣基板1 0 1之下面的狀 •態下，沿著絕緣基板101之側面配置腳部105b， 105c ，同時折彎腳部l〇5b，105c之前端部並 將端子1 0 5安裝於絕緣基板1 0 1，軟焊第1電極 103與腳部105b ，105c ，因此藉由軟焊109 可覆蓋第1 ，第2電極103，104之全表面，或大部 分，所以，第1 ，第2電極部1 0 3，1 0 4係在長期間 保管時，可提供一種不含有依硫化氣體之硫化，焊糊之附 著良好，電氣式連接確實的片型可變電阻器。 又，片型可變電阻器對印刷配線基板1 2 0之實裝時 ，即使在回流爐費較久時間，因第1 |第2電極部10 3 ，1 0 4係成爲藉軟焊1 0 9覆蓋之狀態，因此在作爲高 溫焊劑109時，第1 ，第2電極部103，104中之 銀成分不容易擴散至焊劑中，故可提供一種沒有焊劑耗費 ，電氣式連接確實的片型可變電阻器。 又，即使實裝片型可變電阻器而被長期間地使用，因 藉由焊劑109覆蓋第1 ，第2電極部103 ，104之 全表面或大部分，因此可提供一種第1 ，第2電極部 1 0 3，1 0 4係不會有依硫化氣體之硫化，電氣式連接 確實的片型可變電阻器。 又，以不同之兩種類方法得到與印刷配線基板1 2 0 之連接，因此，即使在其中一方發生不方便也可在另一方 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製-I (一 ^^ · ^ 1 ϋ n · ϋ 1 ϋ fn ^ ^ I n ϋ nnn It I ^ ϋ ϋ nnn II 1. ^ 1 ϋ I This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -26- A7 436819 V. Description of the invention (24) (Please read the precautions on the back of this page before filling out this page) 1 0 9 or foot 1 0 5 b Covered 'Almost free of sulfide or silver The second electrode 1 0 4 which is damaged by the diffusion phenomenon is only required for a short period of soldering. Although the silver of the solder is diffused, it will not be disconnected, and the second electrode _ 104 can be connected to the printing. Wiring board. Although installed and used for a long period of time, the surface is covered with solder, so there will be no disconnection. That is, they are connected by two different methods. The other side can make up, so the reliability of the connection can be improved. Fig. 19 shows a third embodiment of the chip variable resistor of the present invention. Since this embodiment is the first electrode 103 and the second electrode 1 〇 4 The person who is separated at the edge of the insulating substrate 1 01, so in this case, when the flux 109 is provided, the flux 109 is the first and the second The pole portions 103, 104 and the first; the front ends of the second leg portions 105b, 105c, and the first leg portion 10 5 b are transmitted to the second electrode portion 104, and at the same time, the flux 10 9 covers the first and the second portions. The state of the entire surface or most of the surface of the two electrode portions 103, 104. Since the other components are the same as the second embodiment described above, the same parts are attached with the same numbers, and the description is omitted here. Intellectual property of the Ministry of Economic Affairs Figure 20 printed by the Bureau ’s consumer cooperative shows a fourth embodiment of the chip-type variable resistor of the present invention. This embodiment does not have the first leg portion 105b, but has the second leg portion 1 〇5 c The structure of the first terminal 1 〇5, the second leg portion 1 0 5 c is a component extending along the side 1 0 1 c where the second electrode portion 1 0 4 does not exist, and in this case, it is provided In the case of flux 10, flux 10 is provided at the front end portion of the first and second electrode portions 103, 104 and the second leg portion 105c, and at the same time, the first and second electrode portions 103 -27- This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 436819 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7__ _ V. Description of the invention (25) The entire surface or most of the surface of '104 is covered by the flux 1 0. Since the other components are the same as the second embodiment described above, the same parts are attached to The same numbers are omitted here. In this embodiment, most of the second electrode 104 formed by printing is also covered by soldering, and the other parts are also soldered to the terminal 105. Printed wiring board 1 2 0. Further, in the fourth embodiment, it is also possible to use the flux 10 0 as a low-melting-point flux. At this time, when the second electrode 10 9 is disconnected, conduction can be obtained through the terminal 105, even if the terminal 1 05 It can also be turned on by the second electrode 104, that is, the two electrodes are connected by two different methods, which is a structure that can be compensated by the other party even if inconvenience occurs on one side, so the reliability can be improved. Sex. In the fourth embodiment, the lower surface 1 0 1 b of the insulating substrate 10 1 is used as a flat surface, but a recessed portion may be formed so as to accommodate the bottom plate 1 0 5 a of the terminal 105. (Effects of the Invention) As described above, in the chip-type variable resistor of the present invention, the terminal made of a metal plate has a bottom plate that abuts on the lower surface of the insulating substrate, and the bottom portions of the variable resistors are located along the corners of the insulating substrate. The first leg portion and the second leg portion, which are orthogonal to two side surfaces adjacent to each other, are bent from the bottom plate and extend upward, and the front ends of the first leg portion and the second leg portion are folded toward the upper side. bend. The front end is soft soldered to the electrode, and the paper standard is applicable to 47 national standards (CNS) A4 (210 X 297 mm) on the underside and side of the green substrate. ---- ο '------ --Order --------- line I 'J ------ (.Please read the notes on the back before filling this page) -28- A / B7 4 3 68 1 9 V. Invention Explanation (26) The terminals (electrodes) made of metal plates are formed. Therefore, when soldering the printed wiring board, the terminals (electrodes) are not damaged by the consumption of flux. Therefore, the electrical and printed wiring board The mechanical connection becomes stable. Read the precautions on the back © and fill in this page. • The chip variable resistor of the present invention has a front end portion of at least one of the first leg portion 1 and the second leg portion. Or the root base of the second leg is narrower. Therefore, the area of the side electrode (terminal) can be increased by the wide root base, and the soldering area with the electrode can be ensured by narrowing the front end. In addition, the chip variable resistor of the present invention is provided with a first leg portion and a second leg portion at a predetermined distance from the corner portion of the insulating substrate, and at the same time, an electrode is extended near the corner portion, and The electrode is provided with a soldering area, and the front end portions of the first leg portion and the second leg portion are soldered to the soldering area, so soldering between the terminal and the electrode can be easily and reliably performed. In addition, the chip-type variable resistor of the present invention is provided on the bottom plate of the terminal and has a protruding portion protruding outward from the insulating substrate. The protruding portion can be used as a connecting portion of a terminal ring for forming a terminal. The automatic assembly machine continuously performs the chip variable resistor assembly, so it can provide a low-cost. Chip variable resistor. Printed by the Consumers' Cooperative of the Ministry of Economic Affairs and the Bureau of Finance and Economics, the chip-type variable resistor of the present invention is a protruding portion of a terminal and is provided between a first leg portion and a second leg portion adjacent to each other. Since the first leg portion and the second leg portion are arranged orthogonally, it has the effect of easily positioning and mounting the terminals of the insulating substrate. Also, the chip-type variable resistor of the present invention is located on the side 1 〇1 c of the insulating substrate 1 〇1 near the first electrode 103, and sets the -29- This paper size applies to Chinese national standards (CNS 〉 A4 specification (210 X 297 public love) A7 436819 B7__ 5. Description of the invention (27) 2 electrode 104; terminal 105 has a base plate 105a, and the legs 105b, 105c bent from the base plate 105a, will be The bottom plate 1 0 5 a of the terminal 105 is arranged under the insulating substrate 101, and the legs 105b and 105c are arranged along the side of the insulating substrate 101, and the legs 105b and 105c are bent at the same time. The front end and the terminal 105 are mounted on the insulating substrate 101, and the first electrode 103 and the legs 105b and 105c are soldered. Therefore, the entire surface of the first and second electrodes 103 and 104 can be covered by soldering 109. Or most of them. Therefore, when the first and second electrode parts 103, 104 are stored for a long period of time, they can provide a kind of sulfur-free gas-free sulfurization, good adhesion of solder paste, and reliable electrical connection. Chip varistor. In addition, when the chip varistor is mounted on the printed wiring board 120, even during reflow It takes a long time because the first and second electrode portions 10 3 and 104 are covered by soldering 10 9. Therefore, when used as a high-temperature flux 109, the first and second electrode portions 103 and 104 are covered. Since the silver component is not easily diffused into the flux, it is possible to provide a chip-type variable resistor that is electrically connected without the expense of the solder. In addition, even if the chip-type variable resistor is mounted and used for a long period of time, The entire surface or most of the first and second electrode portions 103 and 104 are covered by the flux 109, so a first and second electrode portions 1 0, 3, 104 can be provided without sulfidation by a sulfur gas. The chip-type variable resistor with reliable connection is obtained by the two methods. In addition, the connection to the printed wiring board 120 is obtained by two different methods. Therefore, even if inconvenience occurs on one side, the other side (please read the Please fill in this page for attention) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs

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I—_____I I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -30- A7 B7 4 3 68 19 五、發明說明（28 ) 彌補，可提供一種高可靠性的片型可變w U且@。 請先閱讀背面之注意事項再填寫本頁) 又’由於連接第1電極1 0 3及上述第2電極1 〇 4 所形成’因此設置軟焊1 0 9時’焊劑1 〇 9對第2電極 •部1 0 4之流動變良好’藉'焊劑1 〇 9覆蓋第2電極部 1 0 4成爲良好’可提供一種第2電極部1 〇 4係不會有 依硫化氣體之硫化，電氣式連接確實的片型可·變電β且^。 又’由於在與設置第2電極1 〇 4之絕緣基板1 〇 1 之側面1 0 1 C不同之絕緣基板1 〇 1之側面]_ Q 1 c ， 配置端子1 0 5之腳部1 0 5 c，因此可增大第2電極部 104之焊劑109 ’ 113軟焊面積，可提供一種軟焊 確實的片型可變電阻器。 經濟部智慧財產局員工消費合作社印製 又，由於在設於第2電極1 0 4的絕緣基板1 〇 1之 側面1 0 1 c配置端子1 0 5之腳部1 〇 5 b，因此實裝 片型可變電阻器後，藉由修理等從印刷配線基板1 2 ◦拆 下而熔解焊劑1 1 3時，即時熔融焊劑1 0 3，因以正交 之兩面施以軟焊，端子1 0 5脫落之可能性較少，且片型 可變電阻器再安裝於印刷配線基板1 2 0時，藉由腳部 1 0 5被保護，而藉由幾乎不受焊劑耗費之影響的第2電 極部1 0 4，可提供一種對印刷配線基板1 2 0之軟焊也 確實，且與電阻體1 0 2之連接也確實的片型可變電阻器 〇 又，本發明之片型可變電阻器係端子藉由高溫焊劑連 接於電極，將對於印刷配線基板之片型可變電阻器在回流 爐施以軟焊（焊糊）時，由於以高溫焊劑實行片型可變電 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -31 - 436819 A7 ___B7 _ 五、發明說明（29 ) 請先閱讀背面之注意事項再填寫本頁) 阻器之端子與電極之軟焊’因此’可提供—種該端子與電 極之高溫軟焊不會在回流爐內熔融而可保持安定之連接的 片型可變電阻器。 ' 又，本發明之片型可變電阻器，係高溫焊劑之熔點爲 2 2 0度至3 3 0度之溫度範圍，在端子與電極之軟焊中 ，依對於形成片型可變電阻器之各構成構件之熱所產生之 影響較少，又若爲2 2 0度之高溫焊劑’在回流爐內之溫 度爲一般所想像之大約2 2 0至2 3 0度，則高溫焊劑係 不會熔解，因此，可提供一種具有安定之電氣式及機械式 特性的片型可變電阻器。 又，本發明之片型可變電阻器之安裝方法，將印刷配 線基板對於導電圖案之片型電阻器之端子的軟焊，以比端 子被軟焊於片型可變電阻器之電極的高溫焊劑之熔點較低 熔點的焊劑來實行，對於印刷配線基板之片型可變電阻器 之軟焊時之熱不含對配置於印刷配線基板上的片型可變電 阻器或積體電路或片型電阻器等有不良影響，可提供一種 可分別維持.安定之特性的安裝之方法。 經濟部智慧財產局員工消費合作社印製 (圖式之簡單說明） 第1圖係表示本發明之第一實施例之片型可變電阻器 的分解斜視圖。 第2圖係表示本發明之第一實施例之片型可變電阻器 的俯視圖。 第3圖係表示本發明之第一實施例之片型可變電阻器 紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) - 32 - 4368 1 9 A7 _ B7 五、發明說明（3〇) 的仰視圖。 第4圖係表示本發明之第一實施例之片型可變電阻器 的剖面圖。 ‘ 第5圖係表示本發明之第一實施例之片型可變電阻器 的主要部分側視圖。 弟6圖係表不本發明之第一實施例之片型可變電阻器 的主要部分仰視圖》 第7圖係表示本發明之第一實施例之片型可變電阻器 之絕緣基板的仰視圖。 第8圖係表示本發明之第一實施例之片型可變電阻器 之絕緣基板的俯視圖。 第9圖係表示本發明之第一實施例之片型可變電阻器 之絕綠基板的側視圖》 第10圖係表示本發明之第7圖之10—1〇線的剖 面圖。 第11圖係表示本發明之第一實施例之片型可變電阻 器之端子之製程之端子圏的主要部分平面圖。 經濟部智慧財產局員工消費合作社印製 (，請先閱讀背面之注意事項再填寫本頁) 第12圖係表示本發明之第11圖之12_12線的 剖面圖。 第13圖係表示本發明之片型可變電阻器之製造方法 的過程圖。 第1 4圖係表示將本發明之片型可變電阻器安裝於ep 刷配線基板之狀態的剖面圖。 第15圖係表示本發明之片型可變電阻器之第二實施 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -33- 經濟部智慧財產局員工消費合作社印製 4 3 681 9 A? ___B7_ 五、發明說明（31 ) 例的剖面圖。 第1 6圖係表示本發明之片型可變電阻器之第二實施 例的電極之構成之主要部分的放大斜視圖。 •第1 7圖係表示本發明之片型可變電阻器之第二實施 例的端子與電極之軟焊狀態主要部分的放大斜視圖。 第18圖係表示本發明之片型可變電阻器之第二實施 例的對於印刷配線基板之安裝狀態的剖面圖。 第1 9圖係表示本發明之片型可變電阻器之第三實施 例的電極之構成之主要部分的放大斜視圖。 第2 0圖係表示本發明之片型可變電阻器之第四實施 例的電極之構成之主要部分的放大斜視圖。 第2 1圖係表示以往之片型可變電阻器的斜視圖。 第2 2圖係表示以往之片型可變電阻器之對於印刷配 線基板之安裝狀態的剖面圖。 第2 3圖係表示以往之其他之片型可變電阻器的俯視 圖。 2 4圖係表示將以往之其他之片型可變電阻器安裝於 印刷配線基板之狀態的剖面圖。 (記號之說明） 1 :絕緣基板 1 a :上面 1 b :下面'I illl — ί ^ · —-- IIIII ^ II I ----- 7 --- Ί II! I —_____ I I This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm)- 30- A7 B7 4 3 68 19 V. Description of the invention (28) Compensation can provide a highly reliable chip type variable U and @. (Please read the precautions on the back before filling in this page.) And 'Because it is formed by connecting the first electrode 103 and the second electrode 1 〇4' above, when soldering 109 is set, the flux 1 〇9 is on the second electrode. • The flow of part 104 becomes better. “By” flux 1 009 covers the second electrode part 104 and becomes good. A second electrode part 104 can be provided. There is no sulfurization by sulfide gas. Electrical connection. The exact chip type can be transformed into β and ^. Also because the side surface of the insulating substrate 1 〇1 different from the side surface 1 0 1 of the insulating substrate 1 〇1 where the second electrode 1 〇4 is provided] _ Q 1 c, the leg portion 1 0 5 of the terminal 1 0 5 is arranged. c. Therefore, the soldering area of the flux 109 '113 of the second electrode portion 104 can be increased, and a chip variable resistor with reliable soldering can be provided. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and mounted on the side 1 0 1 c of the insulating substrate 1 〇1 provided on the second electrode 104, and the foot 1 〇5 b of the terminal 105 is installed. After the chip-type variable resistor is removed from the printed wiring board 1 2 by repair or the like, when the solder 1 1 3 is melted, the solder 1 3 is melted immediately, and the solder is applied to the orthogonal two sides, and the terminal 1 0 5 is less likely to fall off, and when the chip-type variable resistor is mounted on the printed wiring board 120 again, the foot 105 is protected, and the second electrode is hardly affected by the consumption of solder. Part 104 can provide a chip-type variable resistor which is reliable in soldering to the printed wiring board 120 and is also reliably connected to the resistor body 102. Furthermore, the chip-type variable resistor of the present invention Device terminals are connected to electrodes with high-temperature flux, and chip-type variable resistors for printed wiring boards are subjected to reflow oven soldering (soldering paste), because chip-type variable-electricity is implemented with high-temperature flux. China National Standard (CNS) A4 (210 X 297 mm) -31-436819 A7 ___B7 _ 5 、 Explanation (29) Please read the precautions on the back before filling this page) The soldering of the terminal and electrode of the resistor 'hence' can be provided-a kind of high temperature soldering of the terminal and electrode will not melt in the reflow furnace and Chip variable resistors for stable connection. 'Also, the chip variable resistor of the present invention is a temperature range of a high temperature solder having a melting point of 220 to 330 degrees. In the soldering of the terminal and the electrode, the chip variable resistor is formed according to the requirements. The influence of the heat of the constituent components is small, and if the temperature of the high temperature flux of 220 ° C in the reflow furnace is about 220 ° to 230 ° C as generally imagined, the high temperature flux is not Since it melts, a chip-type variable resistor having stable electrical and mechanical characteristics can be provided. In addition, in the method for mounting the chip type variable resistor of the present invention, soldering of the printed wiring board to the terminals of the chip type resistor having a conductive pattern is performed at a higher temperature than that of the terminals being soldered to the electrodes of the chip type variable resistor. The melting point of the solder is lower than that of the melting point. It does not include the heat during soldering of the chip type variable resistors on the printed wiring board. It does not include the chip type variable resistors or integrated circuits or chips arranged on the printed wiring board. Type resistors have an adverse effect, and can provide a method of installation that can maintain stable characteristics. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (Simplified Description of the Drawings) FIG. 1 is an exploded perspective view showing a chip variable resistor according to the first embodiment of the present invention. Fig. 2 is a plan view showing a chip-type variable resistor according to a first embodiment of the present invention. Figure 3 shows the paper size of the chip variable resistor according to the first embodiment of the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)-32-4368 1 9 A7 _ B7 V. Description of the invention (3〇) bottom view. Fig. 4 is a sectional view showing a chip-type variable resistor according to a first embodiment of the present invention. ‘FIG. 5 is a side view of a main portion of a chip-type variable resistor according to a first embodiment of the present invention. Figure 6 is a bottom view of the main part of the chip variable resistor according to the first embodiment of the present invention. Figure 7 is a bottom view of the insulating substrate of the chip variable resistor according to the first embodiment of the present invention. Illustration. Fig. 8 is a plan view showing an insulating substrate of the chip-type variable resistor according to the first embodiment of the present invention. Fig. 9 is a side view showing the green substrate of the chip-type variable resistor according to the first embodiment of the present invention. Fig. 10 is a sectional view taken along line 10-10 of Fig. 7 of the present invention. Fig. 11 is a plan view of a main part of a terminal 圏 showing the process of manufacturing the terminal of the chip-type variable resistor according to the first embodiment of the present invention. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Figure 12 is a cross-sectional view showing line 12_12 of Figure 11 of the present invention. Fig. 13 is a process diagram showing a method of manufacturing the chip-type variable resistor of the present invention. FIG. 14 is a cross-sectional view showing a state where the chip-type variable resistor of the present invention is mounted on an ep brush wiring board. Figure 15 shows the second implementation of the chip varistor of the present invention. This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm). -33- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 681 9 A? ___B7_ V. Sectional view of the example of the invention (31). Fig. 16 is an enlarged perspective view showing a main part of an electrode structure of a second embodiment of the chip-type variable resistor of the present invention. Fig. 17 is an enlarged perspective view showing a main part of the soldering state of the terminals and electrodes of the second embodiment of the chip-type variable resistor of the present invention. Fig. 18 is a sectional view showing a mounted state to a printed wiring board according to a second embodiment of the chip-type variable resistor of the present invention. Fig. 19 is an enlarged perspective view showing a main part of an electrode structure of a third embodiment of the chip-type variable resistor of the present invention. Fig. 20 is an enlarged perspective view showing a main part of an electrode structure of a fourth embodiment of the chip-type variable resistor of the present invention. Fig. 21 is a perspective view showing a conventional chip type variable resistor. Fig. 22 is a cross-sectional view showing a state in which a conventional chip-type variable resistor is mounted on a printed wiring board. Fig. 23 is a plan view showing another conventional chip-type variable resistor. Fig. 24 is a cross-sectional view showing a state where other conventional chip-type variable resistors are mounted on a printed wiring board. (Description of symbols) 1: Insulating substrate 1 a: Upper 1 b: Lower

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-1 ^\.~n a]· H 一· n I n ., > n n I n !-- tt I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -35--1 ^ \. ~ N a] · H a · n I n., ≫ n n I n!-Tt I This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -35-

Claims (1)

A8 B8 C8 D8 4 3 6 8 1 9 六、申請專利範圍 附件;L: 第881 15845號專利申請案 中文申請專利範圍修正本 民國90年1月修正 1 · 一種片型可變電阻器，其特徵爲：具備絕緣基板 及設於該絕緣基板之上面的電阻體，及連接於該電阻體之. 兩端部且設於上述絕緣基板之上面的一對電極，及連接於 該電極之金屬板所構成的端子；該端子係具有抵接於上述 絕緣基板之下面的底板，及分別沿著位於上述絕緣基板之 角隅部之正交之互相鄰接的兩個側面，並從上述底板折彎 且向上述上面方向延伸的第1腳部，及第2腳部，該第1 腳部及該第2腳部之前端部朝上述上面側折彎，而上述前 端部被軟焊於上述電極。 .2 ·.如申請專利範圍第1項所述之片型可變電阻器， 其中，上述第1腳部，及上述第2腳部之至少其中一方的 上述前端部，形成比上述第1腳部，或上述第2腳部之根 基部更狹窄者。 3 .如申請專利範圍，第1項或第2項所述之片型可變 電阻器，其中，從上述絕緣基板之角隅部，隔著所定距離 ，設置上述第1腳部及上述第2腳部，同時，在上述角隅 部之近旁延設電極，在上述電極設置軟焊區域，上述第1 腳部及上述第2腳部之上述前端部軟焊於該軟焊區域。 4 ·如申請專利範圍第1項或第2項所述之片型可變 電阻器，其中，在上述端子之上述底板，設有朝上述絕緣 本紙張尺度適用中國國家楼準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 佟： 經濟部智慧財產局員工消費合作社印製 A8 436819 I 六、申請專利範圍 基板之外方突出的突出部。 (請先閲讀背面之注意事項再填寫本頁) 5 ·如申請專利範圍第3項所述之片型可變電阻器， 其中’在上述端子之上述底板，設有朝上述絕緣基板之外 方突出的突出部。 6 .如申請專利範圍第4項所述之片型可變電阻器， 其中，上述端子之上述突出部，設於互相鄰接設置之上述 第1腳部與上述第2腳部之間者。 經濟部智慧財產局員工消費合作社印製 7 .如申請專利範圍第1項所述之片型可變電阻器， 其中，具備陶瓷製之絕緣基板，及設於該絕緣基板之上面 的電阻體，及連接之上述電阻體之兩端部且設於上述絕緣 基板之上面的一對第1電極，及安裝於上述絕緣基板，且 連接於上述電極之金屬板所構成的端子，在位於上述第1 電極之近旁的上述絕緣基板之側面，設置第2電極；上述 端子係具有底板，及從底板折彎的腳部，將上述端子之上 述底板配設於上述絕緣基板之下面的狀態下，沿著上述絕 緣基板之側面配置上述腳部，同時折彎上述腳部之前端部 並將上述端子安裝於上述絕緣基板，軟焊上述第1電極與 上述腳部。 8 ·如申請專利範圍第7項所述之片型可變電阻器， 其中’連接上述第1電極及上述第2電極形成之構成。 9 .如申請專利範圍第7項或第8項所述之片型可變 電阻器’其中，在與設置上述第2電極之上述絕緣基板之 側面不相同之上述絕緣基板之側面，配置上述端子之上述 腳部。 -2- 本紙張认適用中國國家梯準（CNS ) A4^y§· ( 210X297公釐） A8 B8 368 1 9 六、申請專利範圍 (諳先閱讀背面之注$項再填寫本頁) 1 0 .如申請專利範圍第7項或第8項所述之片型可 變電阻器，其中，在設於上述第2電極的上述絕緣基板之 側面配置上述端子之上述腳部。 1 1 .如申請專利範圍第9項所述之片型可變電阻器 ，其中，在設於上述第2電極的上述絕緣基扳之側面配置 上述端子之上述腳部。 12.如申請專利範圍第1項所述之片型可變電阻器 ，其中，端子藉由高溫焊劑連接於上述電極。 1 3 .如申請專利範圍第1 2項所述之片型可變電阻 器，其中，上述高溫焊劑之熔點爲2 2 0度至3 3 0度之 溫度範圍。 經濟部智慧財產局員工消費合作社印製 1 4 . 一種片型可變電阻器之安裝方法，其特徵爲： 具備絕緣基板及設於該絕緣基板之上面的電阻體，及連接 於該電阻體之兩端部且設於上述絕緣基板之上面的—對電 極，及連接於該電極之金屬板所構成的端子；該端子係具 有抵接於上述絕緣基板之下面的底板’及分別沿著位於上 述絕緣基板之角隅部之正交之互相鄰接的兩個側面，並從 上述底板折彎且向上述上面方向延伸的第1腳部’及第2 腳部，該第1腳部及該第2腳部之前端部朝上述上面側折 彎之片型可變電阻器，及具有導電圖案的印刷配線基板， 將上述印刷配線基板對於上述導電圖案之上述片型可變電 阻器之上述端子的軟焊，以比上述端子被軟焊於上述片型 可變電阻器之上述電極的上述高溫焊劑之熔點較低熔點的 焊劑來實行。 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）_ 3 _A8 B8 C8 D8 4 3 6 8 1 9 6. Attachment of patent application scope; L: Patent application No. 881 15845 Chinese application for patent scope amendment Amendment of the Republic of China in January 19901. A chip variable resistor with characteristics It is provided with an insulating substrate and a resistor provided on the upper surface of the insulating substrate, and a pair of electrodes provided at both ends and provided on the upper surface of the insulating substrate, and a metal plate connected to the electrode. The terminal has a bottom plate that abuts the lower surface of the insulating substrate, and two mutually adjacent sides that are orthogonal to each other at the corners of the insulating substrate, and is bent from the bottom plate to the The first leg portion and the second leg portion extending in the upper direction, the front end portions of the first leg portion and the second leg portion are bent toward the upper surface side, and the front end portion is soldered to the electrode. .2 The chip variable resistor according to item 1 of the scope of patent application, wherein the front end portion of at least one of the first leg portion and the second leg portion is formed more than the first leg portion. Or the base of the second leg is narrower. 3. According to the scope of the patent application, the chip variable resistor according to item 1 or item 2, wherein the first leg portion and the second leg portion are provided at a predetermined distance from the corner of the insulating substrate. At the same time, an electrode is extended near the corner portion, and a soldering region is provided on the electrode, and the front end portions of the first and second leg portions are soldered to the soldering region. 4 · The chip variable resistor according to item 1 or item 2 of the scope of patent application, wherein the bottom plate of the terminal is provided with the insulation toward the above-mentioned paper. The standard of China National Building Standard (CNS) A4 is applied. (210X297 mm) (Please read the precautions on the back before filling out this page) Order: Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, A8 436819 I 6. Projections protruding outside the scope of the patent application. (Please read the precautions on the back before filling in this page) 5 · As for the chip variable resistor described in item 3 of the scope of patent application, where 'the bottom plate of the above-mentioned terminal is provided outside the insulating substrate Protruding protrusions. 6. The chip-type variable resistor according to item 4 of the scope of patent application, wherein the protruding portion of the terminal is provided between the first leg portion and the second leg portion adjacent to each other. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 7. The chip-type variable resistor described in item 1 of the scope of patent application, which includes an insulating substrate made of ceramic and a resistor provided on the insulating substrate, And a pair of first electrodes connected to both ends of the resistor and provided on the upper surface of the insulating substrate, and a terminal made of a metal plate mounted on the insulating substrate and connected to the electrode, located in the first A second electrode is provided on the side of the insulating substrate near the electrode; the terminal has a bottom plate and a leg bent from the bottom plate, and the bottom plate of the terminal is arranged below the insulating substrate, along the state The leg portion is arranged on the side surface of the insulating substrate, while the front end portion of the leg portion is bent and the terminal is mounted on the insulating substrate, and the first electrode and the leg portion are soldered. 8. The chip variable resistor according to item 7 in the scope of the patent application, wherein '' is a structure formed by connecting the first electrode and the second electrode. 9. The chip-type variable resistor according to item 7 or item 8 of the scope of the patent application, wherein the terminal is arranged on a side of the insulating substrate that is different from a side of the insulating substrate on which the second electrode is provided. Of the aforementioned feet. -2- This paper is approved for China National Standards (CNS) A4 ^ y§ · (210X297mm) A8 B8 368 1 9 VI. Patent Application Scope (谙 Please read the note on the back of the page before filling this page) 1 0 The chip-type variable resistor according to claim 7 or claim 8, wherein the leg portion of the terminal is arranged on a side surface of the insulating substrate provided on the second electrode. 1 1. The chip-type variable resistor according to item 9 of the scope of patent application, wherein the leg portion of the terminal is arranged on a side of the insulating base plate provided on the second electrode. 12. The chip-type variable resistor according to item 1 of the scope of patent application, wherein the terminal is connected to the above electrode by a high temperature solder. 13. The chip-type variable resistor according to item 12 of the scope of the patent application, wherein the melting point of the high-temperature flux is in a temperature range of 220 to 330 degrees. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 14. A method for mounting a chip-type variable resistor, comprising: an insulating substrate and a resistor provided on the insulating substrate; and a resistor connected to the resistor The two ends are provided on the above-mentioned insulating substrate-the counter electrode, and a terminal composed of a metal plate connected to the electrode; the terminal has a bottom plate that abuts on the lower surface of the above-mentioned insulating substrate, and is located along the above-mentioned The first leg portion and the second leg portion, which are orthogonal to two mutually adjacent sides of the corner portion of the insulating substrate and are bent from the bottom plate and extend in the upper direction, the first leg portion and the second leg portion A chip-type variable resistor in which the front end portion of the leg is bent toward the upper surface side, and a printed wiring board having a conductive pattern, and the printed wiring board is softened to the terminals of the chip-type variable resistor of the conductive pattern. Soldering is performed with a solder having a lower melting point than that of the high-temperature solder whose terminals are soldered to the electrodes of the chip-type variable resistor. This paper size applies to China National Standard (CNS) Α4 specification (210X297 mm) _ 3 _
TW088115845A 1998-10-12 1999-09-14 Chip type variable resistor and its installing method TW436819B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28973598A JP3768355B2 (en) 1998-10-12 1998-10-12 Chip type variable resistor
JP28973798A JP3967833B2 (en) 1998-10-12 1998-10-12 Manufacturing method of chip type variable resistor
JP11104192A JP2000299208A (en) 1999-04-12 1999-04-12 Chip-type variable resistor

Publications (1)

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TW436819B true TW436819B (en) 2001-05-28

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KR (1) KR100321332B1 (en)
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TW (1) TW436819B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745743B (en) * 2018-11-15 2021-11-11 日商Ｋｏａ股份有限公司 Installation accessories and resistor unit

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CN101917822B (en) * 2010-07-28 2012-08-15 友达光电股份有限公司 Light emitting module, combined type circuit board device used by same and assembly method thereof

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Publication number Priority date Publication date Assignee Title
US5631623A (en) * 1993-04-26 1997-05-20 Rohm Co., Ltd. Chip-type variable resistor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745743B (en) * 2018-11-15 2021-11-11 日商Ｋｏａ股份有限公司 Installation accessories and resistor unit

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CN1250938A (en) 2000-04-19
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