JP2000068422A - Electronic circuit unit and method of mounting the electronic circuit unit - Google Patents
Electronic circuit unit and method of mounting the electronic circuit unitInfo
- Publication number
- JP2000068422A JP2000068422A JP10237263A JP23726398A JP2000068422A JP 2000068422 A JP2000068422 A JP 2000068422A JP 10237263 A JP10237263 A JP 10237263A JP 23726398 A JP23726398 A JP 23726398A JP 2000068422 A JP2000068422 A JP 2000068422A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic circuit
- circuit unit
- solder
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Spark Plugs (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、携帯電話機等に使
用される電子回路ユニット、並びに電子回路ユニットの
取付方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit unit used for a portable telephone or the like, and a method of mounting the electronic circuit unit.
【０００２】[0002]
【従来の技術】従来の携帯電話機等に使用される電子回
路ユニットを図６、図７に基づいて説明すると、回路基
板２１は、その端面２１ａに設けられた複数個の切り欠
き部２１ｂを有し、この回路基板２１の上面には導電パ
ターン２２が形成されると共に、切り欠き部２１ｂに
は、導電パターン２２に接続された端面電極２３が形成
されている。また、抵抗、コンデンサー等の電気部品
（図示せず）が導電パターン２２に接続された状態で、
回路基板２１に取り付けられて、一つの回路基板２１か
らなる電子回路ユニット２４が構成されている。2. Description of the Related Art A conventional electronic circuit unit used in a portable telephone or the like will be described with reference to FIGS. 6 and 7. A circuit board 21 has a plurality of notches 21b provided on an end face 21a. A conductive pattern 22 is formed on the upper surface of the circuit board 21, and an end face electrode 23 connected to the conductive pattern 22 is formed in the cutout 21b. Further, in a state where electric components (not shown) such as a resistor and a capacitor are connected to the conductive pattern 22,
An electronic circuit unit 24 composed of one circuit board 21 is mounted on the circuit board 21.
【０００３】そして、このような電子回路ユニット２４
は、例えば、図７に示すように、携帯電話機等のマザー
基板であるプリント基板２５上に載置され、プリント基
板２５に設けた配線パターン２６に、電子回路ユニット
２４の回路基板２１の端面２１ａに設けた端面電極２３
を半田２７付けして、電子回路ユニット２４をプリント
基板２５の配線パターン２６に接続するようになってい
る。しかしながら、回路基板２１は、温度変化、或いは
経時変化等により反りを生じるため、図５に示すよう
に、回路基板２１の両端面２１ａが持ち上がり、このた
め、端面電極２３と配線パターン２６との半田付２７が
不安定となる。[0003] Such an electronic circuit unit 24
For example, as shown in FIG. 7, an end surface 21 a of the circuit board 21 of the electronic circuit unit 24 is mounted on a printed board 25 which is a mother board of a mobile phone or the like, End electrode 23 provided on
Is soldered 27 to connect the electronic circuit unit 24 to the wiring pattern 26 of the printed circuit board 25. However, since the circuit board 21 is warped due to a change in temperature or a change with time, the both end faces 21a of the circuit board 21 are lifted as shown in FIG. Appendix 27 becomes unstable.
【０００４】また、電子回路ユニット２４のプリント基
板２５への取付方法は、先ず、配線パターン２６上にク
リーム半田（図示せず）を塗布し、次に、プリント基板
２５上に回路基板２１を載置して、クリーム半田上に端
面電極２３を位置させた状態で、加熱炉に通してクリー
ム半田を溶かし、電子回路ユニット２４をプリント基板
２５に取り付けるようになっている。しかし、この取付
方法においても、回路基板２１の反りにより、クリーム
半田の端面電極２３への付きが悪く、端面電極２３と配
線パターン２６との半田付２７が不安定となる。[0004] In order to mount the electronic circuit unit 24 on the printed circuit board 25, first, cream solder (not shown) is applied on the wiring pattern 26, and then the circuit board 21 is mounted on the printed circuit board 25. With the end face electrode 23 positioned on the cream solder, the cream solder is melted by passing it through a heating furnace, and the electronic circuit unit 24 is mounted on the printed circuit board 25. However, even in this mounting method, due to the warpage of the circuit board 21, the cream solder does not easily adhere to the end surface electrode 23, and the soldering 27 between the end surface electrode 23 and the wiring pattern 26 becomes unstable.
【０００５】[0005]
【発明が解決しようとする課題】従来の電子回路ユニッ
ト２４は、回路基板２１の端面２１ａに端面電極２３を
設けたものであるため、回路基板２１の反りにより、端
面２１ａに設けた端面電極２３がプリント基板２５の配
線パターン２６から離れ、このため、端面電極２３と配
線パターン２６との半田２７付が悪く、信頼性に欠ける
という問題がある。また、従来の取付方法においても、
回路基板２１の反りにより、クリーム半田の端面電極２
３への付きが悪く、端面電極２３と配線パターン２６と
の半田２７付が不安定になるという問題がある。Since the conventional electronic circuit unit 24 has the end face electrode 23 provided on the end face 21a of the circuit board 21, the end face electrode 23 provided on the end face 21a due to the warp of the circuit board 21. Is separated from the wiring pattern 26 of the printed circuit board 25, so that the solder 27 between the end face electrode 23 and the wiring pattern 26 is poorly attached, and the reliability is poor. Also, in the conventional mounting method,
Due to the warpage of the circuit board 21, the end electrode 2 of the cream solder
3, the solder 27 between the end face electrode 23 and the wiring pattern 26 becomes unstable.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、導電パターンを有し、抵抗、
コンデンサー等の電気部品を取り付けた回路基板と、該
回路基板の端面に設けられた端面電極とを備え、前記回
路基板の下面に導電体を設け、該導電体上に半田盛り上
がり部を形成した構成とした。また、第２の解決手段と
して、前記端面電極に接続して前記導電体を設け、前記
端面電極の近傍の前記導電体上に前記半田盛り上がり部
を形成した構成とした。また、第３の解決手段として、
前記請求項１、又は２記載の電子回路ユニットと、配線
パターンを有するプリント基板を備え、前記配線パター
ン上に設けたクリーム半田上に、前記回路基板の前記半
田盛り上がり部を載置した状態で加熱して、前記電子回
路ユニットを前記プリント基板に取り付けた取付方法と
した。また、第４の解決手段として、金属製のカバーを
有し、前記配線パターン上に設けた前記クリーム半田上
に前記カバーを載置し、前記カバーの取付を、前記電子
回路ユニットの取付と同時に行うようにした取付方法と
した。Means for Solving the Problems As a first means for solving the above problems, there is provided a conductive pattern having a resistance,
A circuit board provided with an electric component such as a capacitor, and an end face electrode provided on an end face of the circuit board, a conductor is provided on a lower surface of the circuit board, and a solder bulge is formed on the conductor. And As a second solution, the conductor is provided so as to be connected to the end face electrode, and the solder bulge is formed on the conductor near the end face electrode. Also, as a third solution,
3. An electronic circuit unit according to claim 1 or 2, further comprising a printed circuit board having a wiring pattern, wherein the solder raised portion of the circuit board is heated on cream solder provided on the wiring pattern. Then, the electronic circuit unit is mounted on the printed circuit board. Further, as a fourth solution, a metal cover is provided, the cover is placed on the cream solder provided on the wiring pattern, and the mounting of the cover is performed simultaneously with the mounting of the electronic circuit unit. The mounting method was to be performed.
【０００７】[0007]
【発明の実施の形態】本発明の携帯電話機等の使用され
る電子回路ユニット、並びに電子回路ユニットの取付方
法を図１〜図５に基づいて説明すると、図１は本発明の
電子回路ユニットの斜視図、図２は本発明の電子回路ユ
ニットを裏面から見た斜視図、図３は本発明の電子回路
ユニットをプリント基板に取り付けた状態を示す要部の
断面図、図４、図５は本発明の電子回路ユニットの取付
方法を示す説明図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic circuit unit used in a portable telephone or the like according to the present invention and a method of mounting the electronic circuit unit will be described with reference to FIGS. 1 to 5. FIG. FIG. 2 is a perspective view of the electronic circuit unit of the present invention viewed from the back surface. FIG. 3 is a cross-sectional view of a main part showing the electronic circuit unit of the present invention mounted on a printed circuit board. It is an explanatory view showing a mounting method of an electronic circuit unit of the present invention.
【０００８】次に、本発明の携帯電話機等に使用される
電子回路ユニットを図１〜図３に基づいて説明すると、
一枚、或いは複数枚からなる回路基板１は、その端面１
ａに設けられた複数個の切り欠き部１ｂを有し、この回
路基板１の上面には導電パターン２が形成されると共
に、切り欠き部１ｂには、導電パターン２に接続された
端面電極３が形成されている。また、回路基板１の下面
には、端面電極３に接続された導電体４が設けられると
共に、端面電極３の近傍の導電体４上には、半田付され
てなる半田盛り上がり部５が形成されている。また、抵
抗、コンデンサー等の電気部品（図示せず）が導電パタ
ーン２に接続された状態で、回路基板１に取り付けられ
て、一つの回路基板１からなる電子回路ユニット６が構
成されている。Next, an electronic circuit unit used in a mobile phone or the like according to the present invention will be described with reference to FIGS.
The circuit board 1 composed of one or a plurality of sheets has an end face 1
The circuit board 1 has a plurality of cutouts 1b provided thereon, a conductive pattern 2 is formed on the upper surface of the circuit board 1, and an end face electrode 3 connected to the conductive pattern 2 is formed in the cutout 1b. Are formed. A conductor 4 connected to the end face electrode 3 is provided on the lower surface of the circuit board 1, and a solder bump 5 formed by soldering is formed on the conductor 4 near the end face electrode 3. ing. In addition, an electronic circuit unit 6 including one circuit board 1 is configured by being attached to the circuit board 1 in a state where electric components (not shown) such as a resistor and a capacitor are connected to the conductive pattern 2.
【０００９】そして、このような電子回路ユニット６
は、例えば、図３に示すように、携帯電話機等のマザー
基板であるプリント基板７上に載置され、プリント基板
７に設けた配線パターン８に、電子回路ユニット６の回
路基板１の端面１ａに設けた端面電極３を半田付９し
て、電子回路ユニット６をプリント基板７の配線パター
ン８に接続するようになっている。そして、電子回路ユ
ニット６には、半田盛り上がり部５を設けているため、
半田量を多くでき、回路基板１が温度変化、或いは経時
変化等により反りを生じても、端面電極３と配線パター
ン８との半田付９が確実にできる。Then, such an electronic circuit unit 6
For example, as shown in FIG. 3, the end surface 1 a of the circuit board 1 of the electronic circuit unit 6 is mounted on a printed circuit board 7 which is a mother board of a mobile phone or the like. The electronic circuit unit 6 is connected to the wiring pattern 8 of the printed circuit board 7 by soldering 9 the end surface electrodes 3 provided on the printed circuit board 7. Since the electronic circuit unit 6 is provided with the solder bump 5,
The amount of solder can be increased, and even if the circuit board 1 is warped due to a change in temperature or a change with time, soldering 9 between the end face electrode 3 and the wiring pattern 8 can be reliably performed.
【００１０】また、本発明の電子回路ユニット６のプリ
ント基板７への取付方法は、先ず、図４に示すように、
配線パターン８上にクリーム半田１０を塗布し、次に、
図５に示すように、プリント基板７上に回路基板１を載
置して、クリーム半田１０上に半田盛り上がり部５を載
置させると共に、金属製のカバー１１を配線パターン８
上のクリーム半田１０上に載置させた状態で、加熱炉に
通してクリーム半田１０、及び半田盛り上がり部５を溶
かし、電子回路ユニット６、並びにカバー１１をプリン
ト基板７に取り付けるようになっている。そして、この
ような取付方法によって、半田量を多くできて、回路基
板１の反りがあっても、配線パターン８と端面電極３の
半田付を確実にできる。The method of attaching the electronic circuit unit 6 to the printed circuit board 7 according to the present invention is as follows, as shown in FIG.
Apply cream solder 10 on wiring pattern 8, then
As shown in FIG. 5, the circuit board 1 is mounted on the printed circuit board 7, the solder bumps 5 are mounted on the cream solder 10, and the metal cover 11 is connected to the wiring pattern 8.
While placed on the upper cream solder 10, the cream solder 10 and the solder bump 5 are melted by passing through a heating furnace, and the electronic circuit unit 6 and the cover 11 are attached to the printed circuit board 7. . By such an attachment method, the amount of solder can be increased, and even if the circuit board 1 is warped, the soldering of the wiring pattern 8 and the end surface electrode 3 can be ensured.
【００１１】[0011]
【発明の効果】本発明の電子回路ユニットは、端面電極
３を設けた回路基板１の下面に、半田盛り上がり部５を
形成したものであるため、回路基板５に反りがあって
も、半田盛り上がり部５によって半田付時の半田を充分
に補うことができて、回路基板１のプリント基板７への
半田付を確実にできる電子回路ユニットを提供できる。
また、端面電極３に接続された導電体４を設け、端面電
極３の近傍の導体４上に半田盛り上がり部５を設けるこ
とにより、端面電極３とプリント基板７との半田付を確
実にでき、回路基板１のプリント基板７への半田付を確
実にできる電子回路ユニットを提供できる。According to the electronic circuit unit of the present invention, since the solder bulging portion 5 is formed on the lower surface of the circuit board 1 on which the end face electrodes 3 are provided, even if the circuit board 5 is warped, the solder bulge is generated. The electronic circuit unit which can sufficiently supplement the solder at the time of soldering by the part 5 and can reliably solder the circuit board 1 to the printed circuit board 7 can be provided.
Further, by providing the conductor 4 connected to the end face electrode 3 and providing the solder bulging portion 5 on the conductor 4 near the end face electrode 3, soldering between the end face electrode 3 and the printed board 7 can be ensured. An electronic circuit unit capable of reliably soldering the circuit board 1 to the printed board 7 can be provided.
【００１２】また、配線パターン８上にクリーム半田１
０を塗布した後、プリント基板７上に回路基板１を載置
して、クリーム半田１０上に半田盛り上がり部５を載置
させた状態で加熱するようにしたため、クリーム半田１
０に含まれたフラックスが半田盛り上がり部５に作用し
て、半田盛り上がり部５の半田付きが良好となると共
に、半田盛り上がり部５によって半田付時の半田を充分
に補うことができて、回路基板１のプリント基板７への
半田付を確実にできる電子回路ユニットの取付方法を提
供できる。また、金属製のカバー１１を配線パターン８
上のクリーム半田１０上に載置させた状態で加熱して、
電子回路ユニット６と共にカバー１１をプリント基板７
に取り付けるようにしたため、電子回路ユニット６とカ
バー１１が同時に取り付けでき、製作性の良好な電子回
路ユニットの取付方法を提供できる。The cream solder 1 is placed on the wiring pattern 8.
Then, the circuit board 1 is placed on the printed circuit board 7 and heated while the solder bulging portion 5 is placed on the cream solder 10.
0 acts on the solder bulging portion 5 to improve the soldering of the solder bulging portion 5, and the solder bulging portion 5 can sufficiently supplement the solder at the time of soldering. It is possible to provide a method of mounting an electronic circuit unit that can reliably solder to one printed circuit board 7. The metal cover 11 is connected to the wiring pattern 8.
Heat while placed on the cream solder 10 above,
The cover 11 is attached to the printed circuit board 7 together with the electronic circuit unit 6.
Since the electronic circuit unit 6 and the cover 11 can be simultaneously attached, a method of attaching the electronic circuit unit with good manufacturability can be provided.
【図１】本発明の電子回路ユニットの斜視図。FIG. 1 is a perspective view of an electronic circuit unit of the present invention.
【図２】本発明の電子回路ユニットを裏面から見た斜視
図。FIG. 2 is a perspective view of the electronic circuit unit of the present invention as viewed from the back.
【図３】本発明の電子回路ユニットをプリント基板に取
り付けた状態を示す要部の断面図。FIG. 3 is a sectional view of a main part showing a state where the electronic circuit unit of the present invention is mounted on a printed circuit board.
【図４】本発明の電子回路ユニットの取付方法を示す説
明図。FIG. 4 is an explanatory view showing a method of mounting the electronic circuit unit of the present invention.
【図５】本発明の電子回路ユニットの取付方法を示す説
明図。FIG. 5 is an explanatory view showing a method of mounting the electronic circuit unit of the present invention.
【図６】従来の電子回路ユニットの斜視図。FIG. 6 is a perspective view of a conventional electronic circuit unit.
【図７】従来の電子回路ユニットをプリント基板に取り
付けた状態を示す要部の断面図。FIG. 7 is a sectional view of a main part showing a state where a conventional electronic circuit unit is mounted on a printed circuit board.
１ 回路基板 １ａ 端面 １ｂ 切り欠き部 ２ 導電パターン ３ 端面電極 ４ 導電体 ５ 半田盛り上がり部 ６ 電子回路ユニット ７ プリント基板 ８ 配線パターン ９ 半田付 １０ クリーム半田 １１ カバー DESCRIPTION OF SYMBOLS 1 Circuit board 1a End face 1b Cutout part 2 Conductive pattern 3 End face electrode 4 Conductor 5 Solder swelling part 6 Electronic circuit unit 7 Printed circuit board 8 Wiring pattern 9 Soldering 10 Cream solder 11 Cover
Claims (4)
ー等の電気部品を取り付けた回路基板と、該回路基板の
端面に設けられた端面電極とを備え、前記回路基板の下
面に導電体を設け、該導電体上に半田盛り上がり部を形
成したことを特徴とする電子回路ユニット。1. A circuit board having a conductive pattern, on which electric parts such as a resistor and a capacitor are mounted, and an end face electrode provided on an end face of the circuit board, wherein a conductor is provided on a lower surface of the circuit board. An electronic circuit unit, wherein a solder bulge is formed on the conductor.
け、前記端面電極の近傍の前記導電体上に前記半田盛り
上がり部を形成したことを特徴とする請求項１記載の電
子回路ユニット。2. The electronic circuit unit according to claim 1, wherein said conductor is provided so as to be connected to said end face electrode, and said solder bulging portion is formed on said conductor near said end face electrode.
ニットと、配線パターンを有するプリント基板を備え、
前記配線パターン上に設けたクリーム半田上に、前記回
路基板の前記半田盛り上がり部を載置した状態で加熱し
て、前記電子回路ユニットを前記プリント基板に取り付
けたことを特徴とする電子回路ユニットの取付方法。3. An electronic circuit unit according to claim 1, further comprising a printed circuit board having a wiring pattern.
On the cream solder provided on the wiring pattern, heating is performed in a state where the solder bulge of the circuit board is placed, and the electronic circuit unit is attached to the printed board. Mounting method.
ン上に設けた前記クリーム半田上に前記カバーを載置
し、前記カバーの取付を、前記電子回路ユニットの取付
と同時に行うようにしたことを特徴とする請求項３記載
の電子回路ユニットの取付方法。4. It has a metal cover, said cover is placed on said cream solder provided on said wiring pattern, and said cover is mounted simultaneously with said electronic circuit unit. The method for mounting an electronic circuit unit according to claim 3, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23726398A JP3872600B2 (en) | 1998-08-24 | 1998-08-24 | Mounting method of electronic circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23726398A JP3872600B2 (en) | 1998-08-24 | 1998-08-24 | Mounting method of electronic circuit unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000068422A true JP2000068422A (en) | 2000-03-03 |
| JP3872600B2 JP3872600B2 (en) | 2007-01-24 |
Family
ID=17012821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23726398A Expired - Fee Related JP3872600B2 (en) | 1998-08-24 | 1998-08-24 | Mounting method of electronic circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3872600B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002023963A3 (en) * | 2000-09-15 | 2002-05-16 | Ericsson Inc | Method and apparatus for surface mounting electrical devices |
-
1998
- 1998-08-24 JP JP23726398A patent/JP3872600B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002023963A3 (en) * | 2000-09-15 | 2002-05-16 | Ericsson Inc | Method and apparatus for surface mounting electrical devices |
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| Publication number | Publication date |
|---|---|
| JP3872600B2 (en) | 2007-01-24 |
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