JP2004079871A

JP2004079871A - Electronic circuit unit

Info

Publication number: JP2004079871A
Application number: JP2002240144A
Authority: JP
Inventors: Tomoo Koseki; 小関　智夫
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2002-08-21
Filing date: 2002-08-21
Publication date: 2004-03-11

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit in which an electric circuit has neither a short circuit nor wire breaking. <P>SOLUTION: In the electronic circuit unit, a reinforcing member 8 has a top surface plate 8a which is formed of a plate type material and covers the top surface of a semiconductor component 5 and a plurality of fitting legs 8b connected to the top surface plate 8a, and holds the semiconductor component 5 while the top surface plate 8a abuts against the top surface of the semiconductor component 5 and the fitting legs 8b are fitted to a circuit board 1, so the surface of solder 7 fitted with the semiconductor component 5 is not covered with a resin of an adhesive, but in an open state. When the component is fitted to a motherboard 11, there is no movement of the solder 7 and the electric circuit. Therefore, neither a short circuit nor wire breaking can be obtained. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は携帯電話機の送受信ユニット等に使用して好適な電子回路ユニットに関する。
【０００２】
【従来の技術】
従来の電子回路ユニットの図面を説明すると、図６は従来の電子回路ユニットの平面図、図７は従来の電子回路ユニットの正面図、図８は従来の電子回路ユニットに係り、マザー基板への取付状態を示す要部拡大断面図である。
【０００３】
次に、従来の電子回路ユニットの構成を図６〜図８に基づいて説明すると、一枚、或いは複数枚が積層されて形成された回路基板５１は、上面に形成された配線パターン５２と、回路基板５１の上面の配線パターン５２に接続導体５３ａ等によって導通した状態で、回路基板５１の下面に設けられた複数個の導電体から成るパターン５３と、回路基板５１の側面に設けられた複数個のサイド電極５４とを有する。
【０００４】
ＩＣ部品からなる複数個の半導体部品５５は、下面に多数の電極５６が設けられており、この半導体部品５５は、回路基板５１上に載置され、電極５６が配線パターン５２に半田５７付けされて、回路基板５１に取り付けられている。
そして、この半導体部品５５の半田５７付は、電極５６に予め半田ボールを形成しておき、この半田ボールを配線パターン５２上に載置した状態で、リフロー半田付装置内に搬送して、半導体部品５５の半田５７付を行うようになっている。
【０００５】
また、ここでは図示しないが、回路基板５１には、半導体部品５５以外の種々の電気部品が搭載されて、所望の電気回路が形成されている。
また、半導体部品５５は、半田５７付だけではその支持が不十分であることから、アンダーフィルと呼ばれる絶縁材からなる接着材５８によって、回路基板５１への取付の補強が行われている。
【０００６】
そして、この接着材５８は、特に図８に示すように、半導体部品５５の底面と回路基板５１との間に充填して設けられて、半導体部品５５の底面が回路基板５１に接着された構成となっている。
【０００７】
このような構成を有する従来の電子回路ユニットは、図８に示すように、マザー基板５９上に載置され、リフロー半田付装置によって、マザー基板５９上に設けられた導電パターン６０とパターン５３、及びサイド電極５４が半田６１付けされる。
この半田付け時、接着材５８は加熱されると共に、半導体部品５５を取り付けた半田５７が溶融した状態となる。
【０００８】
そして、接着材５７に含まれた水分や空気が加熱によって膨張して、図８に示すように、溶けた半田５７に圧力がかかった状態となる。
すると、接着材５８の不十分な充填箇所（孔や隙間部分）に溶けた半田５７が押し出されて、近接した位置にある配線パターン５２にショートしたり、或いは、半田ボールとなって外部に流出して、他の電気回路のショートを招くものであった。
更に、溶けた半田５７が押し出された際、その箇所の半田５７が少なくなって、その回路の断線を生じることもあった。
【０００９】
【発明が解決しようとする課題】
従来の電子回路ユニットは、接着材５８によって、半導体部品５５の回路基板５１への取付補強を行うものであるため、マザー基板５９への半田６１付け時、接着材５７に含まれた水分や空気が加熱によって膨張して、溶けた半田５７が押し出され、その結果、電気回路のショートや電気回路の断線を生じるという問題がある。
また、接着材５８が半導体部品５５と回路基板５１の間の隙間に充填されるため、その作業が面倒で、生産性が悪く、コスト高になるという問題がある。
【００１０】
そこで、本発明は電気回路のショートや断線のない電子回路ユニットを提供することを目的とする。
【００１１】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、配線パターンを有し、所望の電気回路が形成された回路基板と、前記配線パターンに半田付けされた半導体部品と、この半導体部品の取付補強を行うための補強部材とを備え、前記補強部材は、板状材で形成され、前記半導体部品の上面を覆う上面板と、この上面板に繋がれた複数個の取付脚とを有し、前記補強部材は、前記上面板が前記半導体部品の上面に当接した状態で、前記取付脚が前記回路基板に取り付けられて、前記補強部材によって前記半導体部品を保持した構成とした。
【００１２】
また、第２の解決手段として、複数個の前記半導体部品が前記回路基板に半田付けされ、前記複数個の半導体部品が一つの前記補強部材によって保持された構成とした。
また、第３の解決手段として、前記半導体部品の上面には、前記上面板から露出する一つ、或いは複数個の露出部を設け、この露出部の箇所で、前記半導体部品と前記上面板とが接着材によって保持された構成とした。
【００１３】
また、第４の解決手段として、前記接着材は、一つの前記半導体部品に対して複数箇所設けた構成とした。
また、第５の解決手段として、前記補強部材は、前記電気回路を覆った状態で、前記回路基板に取り付けられたカバーで形成され、前記カバーには、前記半導体部品の上面を覆う前記上面板と、前記回路基板に取り付けられる前記取付脚とが設けられた構成とした。
【００１４】
また、第６の解決手段として、前記上面板には、前記半導体部品の上面側に突出する平坦面部が形成され、この平坦面部が前記半導体部品の上面に当接した構成とした。
また、第７の解決手段として、前記平坦面部は、前記半導体部品の上面を露出するための一つ、或いは複数個の孔を有し、この孔の箇所において、前記半導体部品と前記平坦面部とが接着材によって保持された構成とした。
【００１５】
【発明の実施の形態】
本発明の電子回路ユニットの図面を説明すると、図１は本発明の電子回路ユニットの第１実施例に係る平面図、図２は本発明の電子回路ユニットの第１実施例に係る正面図、図３は図１の３−３線における断面図、図４は本発明の電子回路ユニットの第２実施例に係る平面図、図５は本発明の電子回路ユニットの第２実施例に係る要部断面図である。
【００１６】
次に、本発明の電子回路ユニットの第１実施例の構成を図１〜図３に基づいて説明すると、一枚、或いは複数枚が積層されて形成された回路基板１は、上面に形成された配線パターン２と、回路基板１の上面の配線パターン２に接続導体３ａによって導通した状態で、回路基板１の下面に設けられた複数個の導電体からなるパターン３と、回路基板１の側面に設けられた複数個のサイド電極４とを有する。
なお、回路基板１の下面に設けられたパターン３は、接続導体３ａによって上面の配線パターン２に接続されたもので説明したが、回路基板１内に設けられたパターンを介して、パターン３と配線パターン２を導通するようにしても良い。
【００１７】
ＩＣ部品からなる複数個の半導体部品５は、下面に多数の電極６が設けられており、この半導体部品５は、回路基板１上に載置され、電極６が配線パターン２に半田７付けされて、回路基板１に取り付けられている。
そして、この半導体部品５の半田７付は、電極６に予め半田ボールを形成しておき、この半田ボールを配線パターン２上に載置した状態で、リフロー半田付装置内に搬送して、半導体部品５の半田７付を行うようになっている。
【００１８】
また、ここでは図示しないが、回路基板１には、半導体部品５以外の種々の電気部品が搭載されて、所望の電気回路が形成されている。
また、半導体部品５は、半田７付だけではその支持が不十分であることから、本発明においては、補強部材８を使用して、半導体部品５の回路基板１への取付の補強が行われている。
【００１９】
次に、その補強構造について説明すると、補強部材８は、金属板等の板状材で形成され、上面板８ａと、この上面板８ａの対向する側縁から外方に延びた複数個の取付脚８ｂと、上面板８ａに設けられた孔８ｃとを有する。
そして、この補強部材８は、複数個の半導体部品５の上面を上面板８ａで覆った状態で、取付脚８ｂが回路基板１に半田付け等の固定手段９よって取り付けられる。
【００２０】
この時、上面板８ａは半導体部品５の上面に当接すると共に、図１に示すように、複数個の半導体部品５のそれぞれの上面には、孔８ｃから露出した露出部５ａと、上面板８ａの側部からはみ出した露出部５ｂとが設けられ、この露出部５ａ、５ｂの箇所に接着材１０が設けられて、この接着材１０によって、半導体部品５と上面板８ａが複数の箇所で保持された構成となっている。
【００２１】
なお、補強部材８は金属板で説明したが、絶縁材からなるフイルム状のものを使用しても良い。
また、半導体部品は複数個使用するもので説明したが、１個の半導体部品を使用するものでも良い。
【００２２】
このような構成を有する本発明の電子回路ユニットは、図３に示すように、マザー基板１１上に載置され、リフロー半田付装置によって、マザー基板１１上に設けられた導電パターン１２がパターン３、及びサイド電極４と半田１３付けされる。
この半田付け時、半導体部品５を取り付けた半田７が溶融した状態となるが、半田７の表面は、接着材の樹脂で覆われることなく、開放状態となっているため、半田７の移行が無く、従って、電気回路のショートや断線がない。
【００２３】
また、図４，図５は本発明の電子回路ユニットの第２実施例を示し、この第２実施例の構成を説明すると、金属板からなる箱形のカバー１４は、上面板１４ａと、この上面板１４ａの四方から折り曲げられた側面板１４ｂと、上面板１４ａに打ち出し加工を行って設けられ、上面板１４ａの一部を構成する複数個の平坦面部１４ｃと、この平坦面部１４ｃに設けられた複数個の孔１４ｄとを有する。
【００２４】
そして、このカバー１４は、電気回路を覆うように配置され、側面板１４ｂが回路基板１に半田付けされて取り付けられる。
この時、平坦面部１４ｃは半導体部品５の上面に当接すると共に、孔１４ｄによって、半導体部品５の上面が露出した露出部５ａが形成される。
【００２５】
ここでは図示しないが、この露出部５ａの箇所には、接着材が設けられて、この接着材によって、半導体部品５と平坦面部１４ｃが複数の箇所で保持された構成となっている。
【００２６】
即ち、この第２実施例は、カバー１４が半導体部品５の取付補強を行う補強部材Ｋを兼ね、カバー１４の上面板１４ａが補強部材Ｋの上面板に相当し、また、カバー１４の側面板１４ｂが補強部材Ｋの取付脚に相当している。
なお、その他の構成は、前記第１実施例と同様であり、同一部品に同一番号付して、ここでは説明を省略する。
【００２７】
なお、この第１実施例では、カバー１４の上面板１４ａに平坦面部１４ｃを設けたもので説明したが、この平坦面部１４ｃを無くして、半導体部品の上面に上面板１４ａを直接当接したり、また、上面板１４ａに孔を設けて、半導体部品の上面を露出して、この箇所に接着材を設けるようにしても良い。
【００２８】
【発明の効果】
本発明の電子回路ユニットは、配線パターンを有し、所望の電気回路が形成された回路基板と、配線パターンに半田付けされた半導体部品と、この半導体部品の取付補強を行うための補強部材とを備え、補強部材は、板状材で形成され、半導体部品の上面を覆う上面板と、この上面板に繋がれた複数個の取付脚とを有し、補強部材は、上面板が半導体部品の上面に当接した状態で、取付脚が回路基板に取り付けられて、補強部材によって半導体部品を保持した構成とした。
このような構成によって、半導体部品を取り付けた半田の表面は、接着材の樹脂で覆われることなく、開放状態となっているため、マザー基板への取付時において、半田の移行が無く、従って、電気回路のショートや断線のないものが得られる。
また、半導体部品と回路基板の隙間に接着材を充填する従来のものに比して、補強部材の取付作業が簡単で、生産性が良く、安価なものが得られる。
【００２９】
また、複数個の半導体部品が回路基板に半田付けされ、複数個の半導体部品が一つの補強部材によって保持されたため、その補強作業が簡単で、生産性が良く、安価なものが得られる。
【００３０】
また、半導体部品の上面には、上面板から露出する一つ、或いは複数個の露出部を設け、この露出部の箇所で、半導体部品と上面板とが接着材によって保持されたため、半導体部品の保持の確実なものが得られる。
【００３１】
また、接着材は、一つの半導体部品に対して複数箇所設けたため、半導体部品の保持のより確実なものが得られる。
【００３２】
また、補強部材は、電気回路を覆った状態で、回路基板に取り付けられたカバーで形成され、カバーには、半導体部品の上面を覆う上面板と、回路基板に取り付けられる取付脚とが設けられたため、カバーが補強部材を兼ね、部品点数が少なく、安価なものが得られる。
【００３３】
また、上面板には、半導体部品の上面側に突出する平坦面部が形成され、この平坦面部が半導体部品の上面に当接したため、各半導体部品に対応した状態で、半導体部品の補強が行える構成が簡単に提供できる。
【００３４】
また、平坦面部は、半導体部品の上面を露出するための一つ、或いは複数個の孔を有し、この孔の箇所において、半導体部品と平坦面部とが接着材によって保持されたため、半導体部品の保持の確実なものが得られると共に、接着材が上面板から上方にはみ出さないものが得られる。
【図面の簡単な説明】
【図１】本発明の電子回路ユニットの第１実施例に係る平面図。
【図２】本発明の電子回路ユニットの第１実施例に係る正面図。
【図３】図１の３−３線における断面図。
【図４】本発明の電子回路ユニットの第２実施例に係る平面図。
【図５】本発明の電子回路ユニットの第２実施例に係る要部断面図。
【図６】従来の電子回路ユニットの平面図。
【図７】従来の電子回路ユニットの正面図。
【図８】従来の電子回路ユニットに係り、マザー基板への取付状態を示す要部拡大断面図。
【符号の説明】
１　回路基板
２　配線パターン
３　パターン
３ａ　接続導体
４　サイド電極
５　半導体部品
５ａ　露出部
５ｂ　露出部
６　電極
７　半田
８　補強部材
８ａ　上面板
８ｂ　取付脚
９　固定手段
１０　接着材
１１　マザー基板
１２　導電パターン
１３　半田
１４　カバー
１４ａ　上面板
１４ｂ　側面板
１４ｃ　平坦面部
１４ｄ　孔
Ｋ　補強部材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic circuit unit suitable for use in a transmitting / receiving unit of a mobile phone.
[0002]
[Prior art]
FIG. 6 is a plan view of a conventional electronic circuit unit, FIG. 7 is a front view of the conventional electronic circuit unit, and FIG. It is a principal part expanded sectional view which shows an attachment state.
[0003]
Next, a configuration of a conventional electronic circuit unit will be described with reference to FIGS. 6 to 8. A circuit board 51 formed by laminating one or a plurality of circuit boards includes a wiring pattern 52 formed on an upper surface, A plurality of conductors 53 provided on the lower surface of the circuit board 51 and a plurality of conductors 53 provided on the side surface of the circuit board 51 in a state of being electrically connected to the wiring pattern 52 on the upper surface of the circuit board 51 by connection conductors 53a and the like. And the side electrodes 54.
[0004]
A plurality of semiconductor components 55 composed of IC components are provided with a large number of electrodes 56 on the lower surface. The semiconductor components 55 are mounted on the circuit board 51, and the electrodes 56 are soldered 57 to the wiring pattern 52. And is attached to the circuit board 51.
To attach the solder 57 to the semiconductor component 55, a solder ball is formed on the electrode 56 in advance, and the solder ball is placed on the wiring pattern 52 and transferred to a reflow soldering apparatus. The soldering of the component 55 is performed.
[0005]
Although not shown here, various electric components other than the semiconductor component 55 are mounted on the circuit board 51 to form a desired electric circuit.
Further, since the semiconductor component 55 is not sufficiently supported only by the attachment of the solder 57, the attachment to the circuit board 51 is reinforced by an adhesive 58 made of an insulating material called an underfill.
[0006]
Then, as shown in FIG. 8 in particular, the adhesive 58 is provided so as to be filled between the bottom surface of the semiconductor component 55 and the circuit board 51, and the bottom surface of the semiconductor component 55 is adhered to the circuit board 51. It has become.
[0007]
A conventional electronic circuit unit having such a configuration is mounted on a mother board 59 as shown in FIG. 8 and is provided with a conductive pattern 60 and a pattern 53 provided on the mother board 59 by a reflow soldering apparatus. And the side electrode 54 is soldered 61.
During this soldering, the adhesive 58 is heated and the solder 57 to which the semiconductor component 55 is attached is in a molten state.
[0008]
Then, the moisture or air contained in the adhesive 57 expands due to the heating, and as shown in FIG.
Then, the solder 57 that has melted into the insufficiently filled portions (holes and gaps) of the adhesive 58 is extruded and short-circuited to the wiring pattern 52 at a close position, or flowed out as a solder ball. As a result, a short circuit of another electric circuit is caused.
Furthermore, when the melted solder 57 is extruded, the amount of the solder 57 at that location is reduced, and the circuit may be disconnected.
[0009]
[Problems to be solved by the invention]
Since the conventional electronic circuit unit reinforces the attachment of the semiconductor component 55 to the circuit board 51 by the adhesive 58, when the solder 61 is attached to the motherboard 59, moisture or air contained in the adhesive 57 is attached. Is expanded by heating, and the melted solder 57 is pushed out. As a result, there is a problem that an electric circuit is short-circuited or an electric circuit is broken.
Further, since the adhesive 58 is filled in the gap between the semiconductor component 55 and the circuit board 51, there is a problem that the operation is troublesome, productivity is low, and cost is high.
[0010]
Therefore, an object of the present invention is to provide an electronic circuit unit free from short-circuit and disconnection of an electric circuit.
[0011]
[Means for Solving the Problems]
As a first means for solving the above problems, there is provided a circuit board having a wiring pattern on which a desired electric circuit is formed, a semiconductor component soldered to the wiring pattern, and mounting reinforcement of the semiconductor component. A reinforcing member, the reinforcing member is formed of a plate-like material, has an upper surface plate covering the upper surface of the semiconductor component, and has a plurality of mounting legs connected to the upper surface plate, The reinforcing member has a configuration in which the mounting leg is attached to the circuit board in a state where the upper surface plate is in contact with the upper surface of the semiconductor component, and the semiconductor component is held by the reinforcing member.
[0012]
As a second solution, a plurality of semiconductor components are soldered to the circuit board, and the plurality of semiconductor components are held by one reinforcing member.
As a third solution, one or a plurality of exposed portions are provided on the upper surface of the semiconductor component so as to be exposed from the upper surface plate. Was held by an adhesive.
[0013]
As a fourth solution, the adhesive is provided at a plurality of locations on one semiconductor component.
As a fifth solution, the reinforcing member is formed of a cover attached to the circuit board while covering the electric circuit, and the cover has an upper surface plate for covering an upper surface of the semiconductor component. And the attachment legs attached to the circuit board.
[0014]
As a sixth solution, a flat surface protruding toward the upper surface of the semiconductor component is formed on the upper surface plate, and the flat surface is in contact with the upper surface of the semiconductor component.
As a seventh solution, the flat surface portion has one or a plurality of holes for exposing the upper surface of the semiconductor component, and at the location of the hole, the semiconductor component and the flat surface portion are connected to each other. Was held by an adhesive.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a plan view of an electronic circuit unit according to a first embodiment of the present invention. FIG. 2 is a front view of the electronic circuit unit according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 1, FIG. 4 is a plan view of a second embodiment of the electronic circuit unit of the present invention, and FIG. It is a fragmentary sectional view.
[0016]
Next, the configuration of the first embodiment of the electronic circuit unit of the present invention will be described with reference to FIGS. 1 to 3. The circuit board 1 formed by laminating one or a plurality of sheets is formed on the upper surface. A plurality of conductors 3 provided on the lower surface of the circuit board 1 in a state where the wiring pattern 2 is electrically connected to the wiring pattern 2 on the upper surface of the circuit board 1 by the connection conductor 3a; And a plurality of side electrodes 4 provided on the substrate.
Although the pattern 3 provided on the lower surface of the circuit board 1 has been described as being connected to the wiring pattern 2 on the upper surface by the connection conductor 3a, the pattern 3 is connected to the pattern 3 provided on the circuit board 1 via the pattern provided on the circuit board 1. The wiring pattern 2 may be made conductive.
[0017]
A plurality of semiconductor components 5 composed of IC components are provided with a large number of electrodes 6 on the lower surface. The semiconductor components 5 are mounted on the circuit board 1, and the electrodes 6 are soldered 7 to the wiring pattern 2. And is attached to the circuit board 1.
The soldering of the semiconductor component 5 is performed by forming a solder ball on the electrode 6 in advance, and transporting the solder ball on the wiring pattern 2 into a reflow soldering apparatus while the solder ball is mounted on the wiring pattern 2. The soldering of the component 5 is performed.
[0018]
Although not shown here, various electric components other than the semiconductor component 5 are mounted on the circuit board 1 to form a desired electric circuit.
In addition, since the support of the semiconductor component 5 is not sufficient if only the solder 7 is attached, in the present invention, the attachment of the semiconductor component 5 to the circuit board 1 is reinforced by using the reinforcing member 8. ing.
[0019]
Next, the reinforcing structure will be described. The reinforcing member 8 is formed of a plate-like material such as a metal plate, and has a top plate 8a and a plurality of mounting members extending outward from opposing side edges of the top plate 8a. It has a leg 8b and a hole 8c provided in the upper surface plate 8a.
The reinforcing members 8 are attached to the circuit board 1 by fixing means 9 such as soldering in a state where the upper surfaces of the plurality of semiconductor components 5 are covered with the upper surface plate 8a.
[0020]
At this time, the upper surface plate 8a contacts the upper surface of the semiconductor component 5, and as shown in FIG. 1, the upper surface of each of the plurality of semiconductor components 5 has an exposed portion 5a exposed from the hole 8c and an upper surface plate 8a. An exposed portion 5b protruding from the side of the semiconductor device 5 and the upper surface plate 8a are held at a plurality of positions by the adhesive 10 at the exposed portions 5a and 5b. It is the configuration that was done.
[0021]
Although the reinforcing member 8 has been described as a metal plate, a film-like member made of an insulating material may be used.
Also, although a description has been given of the case where a plurality of semiconductor components are used, a single semiconductor component may be used.
[0022]
The electronic circuit unit of the present invention having such a configuration is mounted on a mother board 11 as shown in FIG. 3, and the conductive pattern 12 provided on the mother board 11 is formed by a reflow soldering apparatus. , And the side electrode 4 and the solder 13.
At the time of this soldering, the solder 7 to which the semiconductor component 5 is attached is in a molten state, but the surface of the solder 7 is open without being covered with the adhesive resin. There is no short circuit or disconnection of the electric circuit.
[0023]
FIGS. 4 and 5 show a second embodiment of the electronic circuit unit of the present invention. The configuration of the second embodiment will be described. A box-shaped cover 14 made of a metal plate includes an upper plate 14a and an upper plate 14a. Side plates 14b bent from four sides of the upper surface plate 14a, a plurality of flat surface portions 14c formed by stamping the upper surface plate 14a and forming a part of the upper surface plate 14a, and provided on the flat surface portion 14c. And a plurality of holes 14d.
[0024]
The cover 14 is disposed so as to cover the electric circuit, and the side plate 14b is attached to the circuit board 1 by soldering.
At this time, the flat surface portion 14c contacts the upper surface of the semiconductor component 5, and the hole 14d forms an exposed portion 5a where the upper surface of the semiconductor component 5 is exposed.
[0025]
Although not shown here, an adhesive is provided at the location of the exposed portion 5a, and the semiconductor component 5 and the flat surface portion 14c are held at a plurality of locations by the adhesive.
[0026]
That is, in the second embodiment, the cover 14 also serves as a reinforcing member K for mounting and reinforcing the semiconductor component 5, the upper plate 14a of the cover 14 corresponds to the upper plate of the reinforcing member K, and the side plate of the cover 14 14b corresponds to a mounting leg of the reinforcing member K.
The rest of the configuration is the same as that of the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted here.
[0027]
In the first embodiment, the description has been given of the case where the flat surface portion 14c is provided on the upper surface plate 14a of the cover 14. However, the flat surface portion 14c is eliminated, and the upper surface plate 14a is directly in contact with the upper surface of the semiconductor component. Alternatively, a hole may be provided in the upper surface plate 14a to expose the upper surface of the semiconductor component, and an adhesive may be provided at this location.
[0028]
【The invention's effect】
The electronic circuit unit of the present invention has a wiring board, a circuit board on which a desired electric circuit is formed, a semiconductor component soldered to the wiring pattern, and a reinforcing member for reinforcing the mounting of the semiconductor component. The reinforcing member is formed of a plate-like material, and has an upper surface plate covering the upper surface of the semiconductor component, and a plurality of mounting legs connected to the upper surface plate. The mounting legs were attached to the circuit board in a state of contact with the upper surface of the semiconductor device, and the semiconductor component was held by the reinforcing member.
With such a configuration, the surface of the solder to which the semiconductor component is attached is not covered with the resin of the adhesive and is in an open state. Therefore, at the time of attachment to the motherboard, there is no migration of the solder, and therefore, An electric circuit without short circuit or disconnection can be obtained.
Further, as compared with the conventional one in which the adhesive is filled in the gap between the semiconductor component and the circuit board, the mounting work of the reinforcing member is simple, the productivity is good, and a cheap one can be obtained.
[0029]
Further, since a plurality of semiconductor components are soldered to the circuit board and the plurality of semiconductor components are held by one reinforcing member, the reinforcing operation is simple, and a product with good productivity and low cost can be obtained.
[0030]
Also, on the upper surface of the semiconductor component, one or a plurality of exposed portions exposed from the upper surface plate are provided, and the semiconductor component and the upper surface plate are held by the adhesive at the positions of the exposed portions, so that the semiconductor component The one that is surely held can be obtained.
[0031]
In addition, since the adhesive is provided at a plurality of positions for one semiconductor component, a more secure holding of the semiconductor component can be obtained.
[0032]
Further, the reinforcing member is formed of a cover attached to the circuit board while covering the electric circuit, and the cover is provided with an upper surface plate covering the upper surface of the semiconductor component and mounting legs attached to the circuit board. Therefore, the cover also serves as a reinforcing member, and the number of parts is small, and an inexpensive one can be obtained.
[0033]
Further, a flat surface portion protruding toward the upper surface side of the semiconductor component is formed on the upper surface plate, and the flat surface portion is in contact with the upper surface of the semiconductor component, so that the semiconductor component can be reinforced in a state corresponding to each semiconductor component. Can be easily provided.
[0034]
Further, the flat surface portion has one or a plurality of holes for exposing the upper surface of the semiconductor component, and the semiconductor component and the flat surface portion are held by the adhesive at the positions of the holes. It is possible to obtain a material that can be reliably held and that the adhesive does not protrude upward from the upper plate.
[Brief description of the drawings]
FIG. 1 is a plan view according to a first embodiment of an electronic circuit unit of the present invention.
FIG. 2 is a front view of the electronic circuit unit according to the first embodiment of the present invention.
FIG. 3 is a sectional view taken along line 3-3 in FIG. 1;
FIG. 4 is a plan view according to a second embodiment of the electronic circuit unit of the present invention.
FIG. 5 is a sectional view of a main part according to a second embodiment of the electronic circuit unit of the present invention.
FIG. 6 is a plan view of a conventional electronic circuit unit.
FIG. 7 is a front view of a conventional electronic circuit unit.
FIG. 8 is an enlarged sectional view of a main part of a conventional electronic circuit unit, showing a state of attachment to a mother board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 2 Wiring pattern 3 Pattern 3a Connection conductor 4 Side electrode 5 Semiconductor component 5a Exposed part 5b Exposed part 6 Electrode 7 Solder 8 Reinforcement member 8a Top plate 8b Attachment leg 9 Fixing means 10 Adhesive material 11 Mother substrate 12 Conductive pattern 13 Solder 14 cover 14a top plate 14b side plate 14c flat surface portion 14d hole K reinforcing member

Claims

A circuit board having a wiring pattern, on which a desired electric circuit is formed, a semiconductor component soldered to the wiring pattern, and a reinforcing member for reinforcing the mounting of the semiconductor component, wherein the reinforcing member is An upper surface plate formed of a plate-like material and covering an upper surface of the semiconductor component; and a plurality of mounting legs connected to the upper surface plate. An electronic circuit unit, wherein the mounting leg is mounted on the circuit board in a state in which the semiconductor component is held by the reinforcing member.

2. The electronic circuit unit according to claim 1, wherein a plurality of said semiconductor components are soldered to said circuit board, and said plurality of semiconductor components are held by one of said reinforcing members.

On the upper surface of the semiconductor component, one or a plurality of exposed portions exposed from the upper surface plate are provided, and at this exposed portion, the semiconductor component and the upper surface plate are held by an adhesive. The electronic circuit unit according to claim 1 or 2, wherein:

The electronic circuit unit according to claim 3, wherein the adhesive is provided at a plurality of positions for one semiconductor component.

The reinforcing member is formed of a cover attached to the circuit board while covering the electric circuit, and the cover has an upper surface plate covering an upper surface of the semiconductor component, and the cover attached to the circuit board. The electronic circuit unit according to claim 1, further comprising a mounting leg.

6. The electronic circuit unit according to claim 5, wherein a flat surface protruding toward the upper surface of the semiconductor component is formed on the upper surface plate, and the flat surface contacts the upper surface of the semiconductor component.

The flat surface portion has one or a plurality of holes for exposing the upper surface of the semiconductor component, and at the location of the hole, the semiconductor component and the flat surface portion are held by an adhesive. 7. The electronic circuit unit according to claim 6, wherein: