JPH04322493A - Method of soldering electronic component to printed-circuit board - Google Patents
Method of soldering electronic component to printed-circuit boardInfo
- Publication number
- JPH04322493A JPH04322493A JP9061991A JP9061991A JPH04322493A JP H04322493 A JPH04322493 A JP H04322493A JP 9061991 A JP9061991 A JP 9061991A JP 9061991 A JP9061991 A JP 9061991A JP H04322493 A JPH04322493 A JP H04322493A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- component
- heat
- lead wires
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000005476 soldering Methods 0.000 title claims description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000006071 cream Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は電子部品のプリント基
板へのはんだ付け方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method of soldering electronic components to a printed circuit board.
【０００２】0002
【従来の技術】図３は電子部品のプリント基板へのはん
だ付け方法を示す図であり、図において、１は電子部品
本体、２は部品リード線、３はパッド部、４はプリント
基板、５はクリームはんだである。2. Description of the Related Art FIG. 3 is a diagram showing a method of soldering electronic components to a printed circuit board. is cream solder.
【０００３】従来の電子部品のプリント基板へのはんだ
付け方法は電子部品１より出ている複数の部品リード線
２に対応するパッド部３の上にクリームはんだ５をスク
リーン印刷させ、その後に部品リード線２とパッド部３
の位置を合わせて置いた状態で全体を加熱しはんだ付け
する。次いで電子部品１より出ている複数の部品リード
線２の先端の平坦度が悪い場合等は、部品リード線２と
パッド部３との一部が浮き、はんだ付け付けされていな
い部分が発生するために、はんだゴテで手はんだ修正し
ていた。A conventional method for soldering electronic components to a printed circuit board is to screen print cream solder 5 on pad portions 3 corresponding to a plurality of component lead wires 2 coming out of an electronic component 1, and then to solder the component leads. Line 2 and pad part 3
Heat and solder the whole thing with the parts aligned. Next, if the flatness of the tips of the plurality of component lead wires 2 coming out from the electronic component 1 is poor, a portion of the component lead wires 2 and the pad portion 3 will be lifted, resulting in unsoldered parts. Therefore, I had to manually solder the parts with a soldering iron.
【０００４】0004
【発明が解決しようとする課題】従来の電子部品のプリ
ント基板へのはんだ付け方法は以上のようになっている
ため、電子部品の部品リード線の先端部分の平坦度が悪
い場合、部品リード線とパッド部の一部が浮き、はんだ
付けされない部分が発生するために、後ではんだゴテに
より、手はんだ修正しなければならないという問題点が
あった。[Problems to be Solved by the Invention] Since the conventional method of soldering electronic components to a printed circuit board is as described above, if the flatness of the tip of the component lead wire of an electronic component is poor, There is a problem in that a part of the pad part lifts and some parts are not soldered, which requires manual soldering later with a soldering iron.
【０００５】この発明は上記のような問題点を解消する
ためになされたもので、電子部品の部品リード線の先端
部分の平坦度が悪い場合にも、全ての部品リード線とパ
ッド部をはんだ付けできる電子部品のプリント基板への
はんだ付け方法を提供する。[0005] This invention was made to solve the above-mentioned problems, and even when the flatness of the tip of the component lead wire of an electronic component is poor, it is possible to solder all component lead wires and pads. To provide a method for soldering electronic components onto a printed circuit board.
【０００６】[0006]
【課題を解決するための手段】この発明に係る電子部品
のプリント基板へのはんだ付け方法は、電子部品本体と
プリント基板との間に耐熱性の瞬間接着剤とを塗布し固
着してから全体を加熱するか、又は電子部品本体とプリ
ント基板との間に耐熱性の瞬間接着剤と耐熱性接着剤を
塗布し固着してから全体を加熱するものである。[Means for Solving the Problems] A method of soldering an electronic component to a printed circuit board according to the present invention is to apply a heat-resistant instant adhesive between the electronic component body and the printed circuit board, and then to solder the electronic component to the printed circuit board. Alternatively, a heat-resistant instant adhesive and a heat-resistant adhesive are applied and fixed between the electronic component body and the printed circuit board, and then the whole is heated.
【０００７】[0007]
【作用】この発明は電子部品本体とプリント基板との間
に耐熱性の瞬間接着剤を塗布又は、耐熱性の瞬間接着剤
と耐熱性接着剤を塗布し固着する時に、それぞれの部品
リード線先端部分の平坦度が良くない場合でも全ての部
品リード線がパッド部と接するように部品本体の上から
圧力を加えた状態で固着させるため、後に全体加熱をす
れば全ての部品リード線とパッド部のはんだ付けが可能
となる。[Operation] This invention applies a heat-resistant instant adhesive between an electronic component body and a printed circuit board, or when a heat-resistant instant adhesive and a heat-resistant adhesive are applied and fixed, the tip of each component lead wire is fixed. Even if the flatness of the part is not good, all the component lead wires and the pad part can be fixed by applying pressure from above the component body so that all the component lead wires and the pad part can be fixed by applying pressure from above the component body. soldering becomes possible.
【０００８】[0008]
実施例１．以下、この発明の一実施例を図について説明
する。図１、図２において、１は電子部品本体、２は部
品リード線、３はパッド部、４はパッド部３を有するプ
リント基板、５はクリームはんだ、６は耐熱性瞬間接着
剤（例えば九州松下電器製ペーストＤＢＮ５１０ＳＡ）
、７は耐熱性接着剤（例えばロックタイト社製ロックタ
イト４１０）である。Example 1. An embodiment of the present invention will be described below with reference to the drawings. 1 and 2, 1 is an electronic component body, 2 is a component lead wire, 3 is a pad part, 4 is a printed circuit board having the pad part 3, 5 is cream solder, and 6 is a heat-resistant instant adhesive (for example, Kyushu Matsushita Electrical paste DBN510SA)
, 7 is a heat-resistant adhesive (for example, Loctite 410 manufactured by Loctite).
【０００９】この発明における電子部品のプリント基板
へのはんだ付け方法は電子部品１の部品リード線２に対
応するパッド部３の上にクリームはんだ５をスクリーン
印刷させ、次いで電子部品１の本体が位置するプリント
基板上に耐熱性瞬間接着剤６を塗布、又は耐熱性瞬間接
着剤６と、耐熱性瞬間接着剤７を塗布する。次に自動部
品装着機により電子部品１を部品リード線２とパッド部
３が対応する位置に、部品リード線の弾性変形範囲内で
部品リード線２先端部の平坦度が悪い場合でも、パッド
部３に部品リード線２先端部が触れるように押えつけた
状態で耐熱性瞬間接着剤６を硬化させる。The method of soldering electronic components to a printed circuit board according to the present invention involves screen printing cream solder 5 on pad portions 3 corresponding to component lead wires 2 of electronic component 1, and then placing the main body of electronic component 1 in position. A heat-resistant instant adhesive 6 is applied onto the printed circuit board, or a heat-resistant instant adhesive 6 and a heat-resistant instant adhesive 7 are applied. Next, the automatic component mounting machine places the electronic component 1 in the position where the component lead wire 2 and the pad part 3 correspond, and even if the flatness of the tip of the component lead wire 2 is poor within the elastic deformation range of the component lead wire, the pad part The heat-resistant instant adhesive 6 is cured while being pressed so that the tip of the component lead wire 2 touches the part lead wire 3.
【００１０】部品リード線２の弾性による復元力が小さ
い場合は、耐熱性瞬間接着剤６だけを塗布することで、
次に全体加熱をし、クリームはんだ５を溶かし全ての部
品リード線２とパッド部３とのはんだ付けが可能である
が、部品リード線２の弾性に寄る復元力が大きい場合に
は、耐熱性瞬間接着剤６の塗布だけでは、全体加熱をし
た時に耐熱性瞬間接着剤６の接着力が低下し、部品リー
ド線２の弾性による復元力により部品リード線２がパッ
ド部３より浮いてしまうので、耐熱性瞬間接着剤６の他
に耐熱性接着剤７を塗布することによりパッド部３より
部品リード線２の浮きを防止し、全ての部品リード線２
とパッド部３のはんだ付けが可能になる。If the restoring force due to the elasticity of the component lead wire 2 is small, by applying only the heat-resistant instant adhesive 6,
Next, the whole body is heated to melt the cream solder 5 and it is possible to solder all the component lead wires 2 and pad parts 3. However, if the restoring force due to the elasticity of the component lead wires 2 is large, the heat resistance If only the instant adhesive 6 is applied, the adhesive force of the heat-resistant instant adhesive 6 will decrease when the entire body is heated, and the component lead wire 2 will float above the pad portion 3 due to the restoring force due to the elasticity of the component lead wire 2. By applying heat-resistant adhesive 7 in addition to heat-resistant instant adhesive 6, component lead wires 2 are prevented from floating from pad portion 3, and all component lead wires 2 are
This makes it possible to solder the pad portion 3.
【００１１】[0011]
【発明の効果】以上のように、この発明によれば、電子
部品本体とプリント基板とを耐熱性瞬間接着剤、又は耐
熱性瞬間接着剤と耐熱性接着剤により、部品リード線と
パッド部が接するように圧力を加えた状態で固着してか
ら全体加熱し、はんだ付けするので、はんだ付け後の手
直しがなくなるという効果がある。As described above, according to the present invention, the electronic component main body and the printed circuit board can be bonded together using a heat-resistant instant adhesive, or a heat-resistant instant adhesive and a heat-resistant adhesive. Since the parts are fixed by applying pressure so that they are in contact with each other, then the whole part is heated and soldered, there is no need to make any adjustments after soldering.
【図１】この発明の実施例１によるはんだ付け方法を示
す図である。FIG. 1 is a diagram showing a soldering method according to a first embodiment of the present invention.
【図２】図１のはんだ付け部を示す図である。FIG. 2 is a diagram showing the soldering portion of FIG. 1;
【図３】従来のはんだ付け方法を示す図である。FIG. 3 is a diagram showing a conventional soldering method.
１ 部品本体 ２ 部品リード線 ３ パッド部 ４ プリント基板 ５ クリームはんだ ６ 瞬間接着剤 ７ 耐熱性接着剤 1 Part body 2 Parts lead wire 3 Pad part 4 Printed circuit board 5 Cream solder 6 Instant adhesive 7 Heat-resistant adhesive
Claims (2)
本体と、この電子部品の部品リード線に対応したパッド
部を有するプリント基板とを、瞬間接着剤により固着し
た後、上記部品リード線と上記パッド部をはんだ付けす
ることを特徴とする電子部品のプリント基板へのはんだ
付け方法。1. After fixing an electronic component main body having a plurality of component lead wires and a printed circuit board having a pad portion corresponding to the component lead wires of the electronic component with an instant adhesive, the component lead wires and the A method for soldering electronic components to a printed circuit board, characterized by soldering pad portions.
本体と、この電子部品の部品リード線に対応したパッド
部を有するプリント基板とを瞬間接着剤と耐熱性接着剤
とにより固着した後、上記部品リード線と上記パッド部
をはんだ付けすることを特徴とする電子部品のプリント
基板へのはんだ付け方法。2. After fixing an electronic component main body having a plurality of component lead wires and a printed circuit board having a pad portion corresponding to the component lead wires of the electronic component using an instant adhesive and a heat-resistant adhesive, A method for soldering electronic components to a printed circuit board, characterized by soldering component lead wires and the pad portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9061991A JPH04322493A (en) | 1991-04-22 | 1991-04-22 | Method of soldering electronic component to printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9061991A JPH04322493A (en) | 1991-04-22 | 1991-04-22 | Method of soldering electronic component to printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04322493A true JPH04322493A (en) | 1992-11-12 |
Family
ID=14003507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9061991A Pending JPH04322493A (en) | 1991-04-22 | 1991-04-22 | Method of soldering electronic component to printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04322493A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
-
1991
- 1991-04-22 JP JP9061991A patent/JPH04322493A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
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