A7 432 39 9 ___B7___ 五、發明說明（1 ) 【發明所屬之技術領域】 本發明係關於音響機器等所使用之可變電阻器。 【先行技術】 若將先前之可變電阻器依據第6圖〜第8圖說明時，. 矩形狀之陶瓷基板2 1係具有設於中心部之圓形狀之孔 2 1 a，與設於端部附近之一對安裝孔2 1 b。 又，形成於陶瓷基板2 1上之一對電極圖案2 2係由 連接導體部2 2 a，與如圍住安裝孔2 1 b所形成之附銲 錫導體部2 2 b所構成，此電極圖案2 2，係將由銀與玻 璃料（glass fnt)所成之塗釉系（cermet)電極，燒成於陶 瓷基板2 1上面形成。 並且，藉此燒成，電極圖案2 2係在陶瓷基板2 1堅 固地變成密貼狀態。 又，形成於陶瓷基板2 1上，略呈圓孤狀之電阻圖案 2 3係具有進行電阻可變之電阻部2 3 a，此電阻部 2 3 a端部，係分別覆蓋一對電極圖案2 2之連接導體部 2 2 a之狀態下，連接於電極圖案2 2。 並且，此電阻圖案2 3 *係將氧化釕（ruthenium oxside)與玻璃料作爲主成分之塗釉系電阻體，燒成於陶瓷 基板2 1上面形成。 並且，藉此燒成，電阻圖案2 3係將成爲堅固地密貼 於陶瓷基板2 1之狀態。 .-，由金屬材所形成之端子部-2 4係如第8圖所示’ 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) -4 - II---— 1 — — — — — — ·1111111 11111111 I (請先W讀背面之注意事項再填？頁) 經濟部智慧財產局員工消費合作社印*'!取 A7 » 432 39 9 B7__ 五、發明說明（2 ) 具有:外部連接用之連接部2 4 a ，與從連接部2 4 a切開 被彎曲之安裝部2 4b。 並且，此端子部2 4係將安裝部2 4 b貫通於陶瓷基 板21之安裝孔21b，折彎安裝部24b先端部，由被 折彎部分與連接部2 4 a夾持陶瓷基板2 1，將端子部.. 2 4安裝於陶瓷基板2 1，並且，安裝部2 4 t)之折彎部 分爲抵接於附銲錫導體部2 2 b接觸。 又，爲了使電極圖案2 2與端子部2 4之連接確實， 如第7圖所示，成爲在附銲錫導體部2 2 b進行銲錫2 5 之構成。 並且，在陶瓷基板2 1之孔2 1a，安裝安裝有滑動 件（沒有圖示）之迴轉體，將滑動件滑動於電阻圖案2 3 上，進行電阻値變成可變。 於先行技術之可變電阻器，上述銲錫2 5，係通常使 用由含有鉛之銲錫所構成者，但是，近年，環境問題受到 重視之中，要求使用不含鉛之銲錫日益殷切。 並且，於含有鉛之銲錫2 5，一般，楊氏係數爲 2600kgf/mm2 ，線膨脹係數爲22.0 P pm/°C程度，含有鉛之銲錫2 5係像這樣，楊氏係數 小者，將含有鉛之銲錫2 5，銲接於電極圖案2 2之附銲 錫導體部2 2 b時，由於電極圖案2 2爲銀係主成分雖然 會附著銲錫2 5，但是因電阻圖案2 3係破裂成分多所以 銲錫2 5不會附著，因此，如第7圖所示，銲錫2 5不接 著於電.姐圖案2 3之狀態下，-覆蓋-端子部2 4之安裝部 — — — — — — —----- * ! _ ! _ I 訂！ :線 (請先閲讀背面之注意事項再填^-乂頁> 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） -5- ^4 32 39 9 A7 B7_ 五、發明說明（3) 2 4b之狀態下接著於附銲錫導體部2 2 b。 並且，像這樣地，對於使用含鉛之銲錫2 5之可變電 阻器，進行熱周期試驗（在-40 °C〜80 °C之1000 周期試驗）之結果，含有鉛之銲錫2 5，係線膨脹係數較 大，相反地，因楊氏係數小，所以在周期測試，由於銲錫 2 5之膨脹，收縮，在陶瓷基板2 1不會發生龜裂，沒有 發生電極圖案2 2與電阻圖案2 3之斷線不良。 又，依據環保之要求，替代含鉛之銲錫將不含鉛之銲 錫2 5銲接於電極圖案2 2之附銲錫導體部2 2 b時也同 樣地，如第7圖所示，銲錫2 5不接著於電阻圖案2 3之 狀態，覆蓋端子部2 4之安裝部2 4 b之狀態下接著於附 銲錫導體部2 2 b。 並且，像這樣，對於使用不含鉛之銲錫2 5之可變電 阻器，進行熱周期測試（在一4 0 °C〜8 0 °C之1 0 0 0 周期試驗）之結果，如第7圖所示，於電阻圖案2 3之電 阻部2 3 a端部與銲錫2 5之所有境界部分，在陶瓷基板 2 1上部發生龜裂，在電極圖案2 2與電阻圖'案2 3之間 以5 %程度之比率發生斷線之問題。 亦即，不含鉛之銲錫2 5係楊氏係數爲4 0 0 0 kgf/mm2 ，及線膨脹係數爲變成20.9 P P m / °C程度，此不含鉛之銲錫2 5，係較含有銲錫其 楊氏係數變成極大。 因此，電極圖案2 2與電阻圖案2 3，係由燒成牢固 地密貼淤陶瓷基板2 1狀態之冲，-由在熱周期試驗之不含 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I I ^ I I ^ 1 I I I I ^ I ' H ^ ί. ^ — I—^-"J ^ ^ ^ n n ^ ^ I (讀先Μ讀"面之注*事項再填笋人頁) 經濟部智慧財產局員工消費合作社印製 -6 - A7 r 4 32 3 9 9 ___B7_ 五、發明說明（4 ) <請先閱讀背面之注意事項再填穿λ頁) 鉛之銲錫2 5之膨脹，收縮，由銲錫2 5之楊氏係數大之 力量爲施加於電極圖案2 2與電阻圖案2 3之境界線K 2 ，所以，在陶瓷基板2 1發生龜裂，而發生電極圖案2 2 與電阻圖案23之斷線毛病。 亦即，由於不含鉛之銲錫2 5#錫2 5之膨脹，收縮 之力量|係集中於電阻圖案2 3電阻圖案2 3之電阻部 2 3 a端部之短境界線K2，而在陶瓷基板2 1發生龜裂 【發明所欲解決之問題】 於先行技術之可變電阻器，使用不含鉛之銲錫2 5銲 錫2 5時，由於銲錫2 5之膨脹，收縮，由於銲錫2 5之 大楊氏係數之力量集中施加於電極圖案2 2與電阻圖案 2 3間之短境界線K2，所以，在陶瓷基板2 1發生龜裂 ，具有電極圖案2 2與電阻圖案2 3之斷線毛病之問題。 【解決問題之手段】 經濟部智慧財產局員工消費合作社印製 作爲解決上述問題之第1解決手段，具備；陶瓷基板 |與形成於該陶瓷基板上之塗釉系電阻體所構成之電阻圖 案，與形成於上述陶瓷基板上，連接於上述電阻圖案端部 之塗釉系電極所形成之電極圖案，與滑動於上述電阻圖案 上之滑動件|上述電阻圖案係具有進行電阻變化之電阻部 ，與位於上述滑動件之滑動範圍外，從上述電阻部端部向 上述電祖部之形成方向延長形成之-延長部，又，上述電極 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） 經濟部智慧財產局員工消費合作社印製 酽4 32 39 9 at B7 五、發明說明（5) 圖案係具有連接上述電阻部所用之連接導體，與進行銲錫 之附銲錫導體部，如覆蓋上述連接導體部形成上述電阻部 ，並且，如覆蓋上述附銲錫導體部之一部分形成上述延長 部，構成爲於上述電極圖案上之上述電極圖案與上述電阻 圖案之連接長度變長。 又，作爲第2解決手段，形成於上述附銲錫導體部上 之銲錫，係使用不含鉛之銲錫之構成。 又，作爲第3解決手段，上述銲錫係使用楊氏係數爲 4000kg f/mm2 以上者之構成。 【發明之實施形態】 若將本發明之可變電阻器依據第1圖〜第5圖說明時 ，第1圖係有關本發明之可變電阻器之第1實施形態之平 面圖，第2圖係本發明之可變電阻器之要部剖面圖，第3 圖係有關本發明之可變電阻器之端子部之斜視圖，第4圖 係有關本發明之可變電阻器之第2實施例之要部平面圖， 第5圖係有關本發明之可變電阻器之第3實施例之要部平 面圖。 茲依據第1圖〜第3圖就本發明之可變電阻器之第1 實施例之構成說明如下，具有矩形狀之陶瓷基板1，係設 於中心部之圓形狀之孔la ，與設於端部附近之一對安裝 孔1 b 〇 又，形成於陶瓷基板1上之一對電極圖案2，係連接 導體部a，與如圍住安裝孔所形成之附銲錫導體部 本紙張尺度遡用中囷囷家標準（CNS)A4規格（210 * 297公S )-8- -----------裝 ------ 訂！！線 (請先閱讀背面之注*事項再填^4寊) *4 3 2 3 9 g A7 B7 五、發明說明（6) 2 b所構成，此電極圖案2，係將銀與玻瑪料所形成之塗 釉系電極，燒成於陶瓷基板1上面形成β 並且，藉此燒成*電極圖案2將變成牢固地密貼於陶 瓷基板1之狀態。 又’形成於陶瓷基板1上’略呈圓孤狀之電阻圖案3 ’係具有進行電阻可變之電阻部3 a，與從電阻部3 a端 部向電阻部3 a形成方向’亦即，向圓孤變方向延長所形 成之延長部3 b ’此電阻部3 a端部，係分別覆蓋一對電 極圖案2之連接導體部2 a之狀態，連接於電極圖案2， 並且，延長部3 b，係沿著附銲錫導體部2 b側緣部延伸 ，覆蓋附銲錫導體部2 b —部分之狀態連接於電極圖案2 〇 並且’此電阻圖案3 ’係將氧化釘與玻璃料作爲主成 分之塗釉系電阻體•燒成於陶瓷基板1上面形成，藉此燒 成，電阻圖案3，係變成牢固地密貼於陶瓷基板1之狀態 〇 又，由金屬材之端子部4，係如第3圖所示，具有外 部連接用之連接部4 a ，與從連接部4 a切開被彎曲之安 裝部4 b。 並且，此端子部4係將安裝部4 b貫通於陶瓷基板1 之安裝孔1 b，折彎安裝部4 b先端，由被折彎之部分與 連接部4 a夾持陶瓷基板1 ，將端子部4安^於陶瓷基板 1 ，並且1安裝部4 b之折彎部分爲抵接 極圖案-2之附銲錫導體部2 b .接獨--。 《 本紙張尺度適用中國國家標準<CNS)A4規格（210 x 297公釐） -9 - --------------05* --- (請先JW讀背面之注*'?事項再填Γ頁) Γ 4'·ν 經濟部智慧財產局員工消費合作社印製 f 經濟部智慧財產局員工消費合作社印製 r4 32 39 9 A7 B7 五、發明說明（7) .又，爲了將電極圖案2與端子部4之連接將變成確實 ，如第2圖所示，成爲在附銲錫導體部2 b進行不含鉛之 銲錫之構成。 並且，在陶瓷基板1之孔1 a，安裝安裝有滑動件（ 沒有圖示）之迴轉體，將滑動件在電阻圖案3之電阻部.. 3 a上滑動，進行電阻値變成可變。 亦即，延長部3 b係變成位於滑動件之滑動範圍外之 位置。 於本發明之可變電阻器，上述銲錫5，從環保問題使 用不含鉛之銲錫，但是銲錫5，係使用楊氏係數爲 4000kg f/mm2 ，線膨脹係數爲20. 9 ppm/t，又，陶瓷基板1係楊氏係數爲38000: kg f / m m 2 ，線膨脹係數爲7 · 6 ppm /°C，將不 含鉛之銲錫5，如第5圖所示，銲錫於電極圖案2之附銲 錫導體部2 b者。 此時*銲錫5爲不接著於電阻圖案3之狀態下，覆蓋 端子部4之安裝部4 b之狀態接著於附銲錫導體部2 b。 並且，像這樣地，對於使用不含鉛之銲錫5之可變電 阻器，進行熱周期試驗（在-40 °C〜80 °C之1 000 周期測試）之結果，雖然銲錫5之楊氏係數大，但是由於 銲錫5之膨脹，收縮，沒有發生電極圖案2與電阻圖案3 之斷線毛病。 並且，其要因，係電極圖案2與電阻圖案3藉燒成， 牢周地濟貼於陶瓷基板1之狀.態中-，由銲錫5之大楊氏係 請 先 閱 讀 背. 面 之 注- 意 事 碩 再 填 裝 頁 訂 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公爱） -10- 經濟部智慧財產局員工消費合作社印製 霹 4 3 2 3 9 9 A7 _____B7__ 五、發明說明（8 ) 數之力量爲施加於電極圖案2與電阻圖案3之境界線K1 ’但是此境界線K 1，係因變成跨越於電阻部3 a端部與 延長部3 b之側緣之連接長度長者，所以，在所有境界線 K1不會發生龜裂所致。 又，於不含銲錫5，使用楊氏係數爲4500 k g f / m m 2 ，線膨脹係數爲22 . 2ppm/°C之銲 錫5，即使進行1 0 0 0周期之熱周期試驗時，也沒有發 生斷線，又，即使於此楊氏係數以上判斷也可得到同樣之 結果。 又，於第4圖係表示於本發明之第2實施例，此實施 例，係將於上述第1實施例之延長部3 b，更延長，沿著 電極圖案2之附銲錫導體部3 b之全內周側緣部形成，電 阻圖案3與電極圖案2之境界線K1 ，亦即，將連接長度 變成更長者。 又，第5圖係表示於本發明之第3實施例，此實施例 ，係將電阻部3 a與延長部3 b之電極圖案2之境界線 K 1成爲階段狀，將境界線K 1更加延長，電阻圖案3與 電極圖案2之境界線K 1 ，亦即，將連接長度變成更長者 【發明之效果】 於本發明之可變電阻器|如覆蓋電極圖案2之連接導 體部2 a形成電阻圖案3之電阻部3 a，並且，如覆蓋附 銲錫暮體部2 b之一部分形成電阻-圖案3之延長部3b， 本紙張尺度適用中國固家標準（CNS)A4規格（210x297公芨） -11 - — — — — — ill — — — — — ·11 丨 — II 丨 I 丨 I I I I - J , (請先閲讀背面之注意事項再填象4頁> A7 B7A7 432 39 9 ___B7___ V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a variable resistor used in audio equipment and the like. [Advanced technology] If the previous variable resistor is explained based on Figures 6 to 8, the rectangular ceramic substrate 2 1 has a circular hole 2 1 a provided at the center, and is provided at the end. Near one of the pair of mounting holes 2 1 b. In addition, a pair of electrode patterns 2 2 formed on the ceramic substrate 21 is formed by connecting the conductor portion 2 2 a and a solder-conducting conductor portion 2 2 b formed around the mounting hole 2 1 b. This electrode pattern 2 2. It is formed by firing a cermet electrode made of silver and glass fnt on the ceramic substrate 21. By this firing, the electrode pattern 2 2 is firmly attached to the ceramic substrate 21. Further, the resistance pattern 2 3 having a slightly circular shape formed on the ceramic substrate 21 has a resistance portion 2 3 a for variable resistance. The ends of the resistance portion 2 3 a cover a pair of electrode patterns 2 respectively. 2 is connected to the electrode pattern 2 2 in a state of the connection conductor portion 2 2 a. The resistance pattern 2 3 * is an enamel-based resistor having ruthenium oxside and glass frit as main components, and is formed by firing on the ceramic substrate 21. Furthermore, by this firing, the resistance pattern 23 is brought into a state of being firmly adhered to the ceramic substrate 21. .-, the terminal part formed by metal material-2 is shown in Figure 8 'This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -4-II ----- 1 — — — — — — · 1111111 11111111 I (please read the precautions on the reverse side and fill in the first page) The stamp of the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * '! Take A7 »432 39 9 B7__ V. Description of the invention (2 ) It has a connection part 2 4 a for external connection, and a bent mounting part 2 4 b cut from the connection part 2 4 a. In addition, the terminal portion 24 penetrates the mounting portion 2 4b through the mounting hole 21b of the ceramic substrate 21, bends the tip of the mounting portion 24b, and holds the ceramic substrate 2 1 between the bent portion and the connection portion 2 4a. The terminal part 2 is mounted on the ceramic substrate 21, and the bent part of the mounting part 2 4 t) is in contact with the soldered conductor part 2 2 b. In order to ensure the connection between the electrode pattern 22 and the terminal portion 24, as shown in FIG. 7, a configuration in which a solder 2 5 is applied to the solder-conducting conductor portion 2 2 b is provided. A rotary body (not shown) is attached to the hole 2 1a of the ceramic substrate 21, and the slider is slid on the resistance pattern 2 3 to change the resistance 値. In the prior art variable resistor, the above-mentioned solder 25 is usually composed of lead-containing solder. However, in recent years, environmental issues have been paid attention to, and the use of lead-free solder is increasingly required. In addition, for lead-containing solder 25, generally, the Young's coefficient is 2600kgf / mm2, the linear expansion coefficient is about 22.0 P pm / ° C, and the lead-containing solder 25 is like this. The smaller the Young's coefficient, the more When the lead solder 2 5 is soldered to the electrode conductor 2 2 with the solder conductor portion 2 2 b, the electrode pattern 2 2 is a silver-based main component. Although the solder 25 is attached, the resistance pattern 2 3 system has a large number of cracking components. Since the solder 25 does not adhere, as shown in FIG. 7, the solder 25 does not adhere to the electricity. In the state of the pattern 2 3, the mounting portion covering the terminal portion 2 4 — — — — — — —- ---- *! _! _ I Order! : Line (please read the notes on the back before filling in ^ -leaf page) Printed on the paper by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, this paper applies the Chinese National Standard (CNS) A4 (210 * 297 mm) -5- ^ 4 32 39 9 A7 B7_ V. Description of the invention (3) 2 4b is followed by a solder conductor portion 2 2 b. In this way, for a variable resistor using lead-containing solder 2 5 As a result of the thermal cycle test (1000 cycle test at -40 ° C to 80 ° C), the solder containing lead 25 has a larger linear expansion coefficient. Conversely, because the Young's coefficient is small, the cycle test is due to The expansion and contraction of the solder 25 does not cause cracks in the ceramic substrate 21, and no disconnection of the electrode patterns 2 2 and the resistance patterns 23 occurs. In addition, in accordance with environmental protection requirements, the replacement of lead-containing solder will not include The same applies when the lead solder 2 5 is soldered to the electrode conductor 2 2 with the solder conductor portion 2 2 b. As shown in FIG. 7, the solder 2 5 does not adhere to the resistance pattern 23 and covers the terminal portion 2 4. In the state of the mounting portion 2 4 b, the solder conductor portion 2 2 b is continued. For example, for a variable resistor using lead-free solder 25, the results of a thermal cycle test (1 0 0 0 cycle test at 40 ° C to 80 ° C) are shown in Figure 7. At the end of the resistive portion 2 3 a of the resistive pattern 2 3 and all the boundary portions of the solder 25, cracks occurred in the upper portion of the ceramic substrate 21, and between the electrode pattern 2 2 and the resistive pattern 2 3 at 5%. There is a problem of disconnection in the ratio of degrees. That is, the lead-free solder 25 series has a Young's coefficient of 4 0 0 0 kgf / mm2, and the linear expansion coefficient becomes about 20.9 PP m / ° C, which is lead-free. The solder 25 has a larger Young's coefficient than the solder containing it. Therefore, the electrode pattern 2 2 and the resistance pattern 2 3 are formed by firing and firmly adhere to the ceramic substrate 21 in a state of 1-by the thermal cycle The test does not include the paper size applicable to China National Standard (CNS) A4 (210 X 297 mm) II ^ II ^ 1 IIII ^ I 'H ^ ί. ^ — I — ^-" J ^ ^ ^ nn ^ ^ I (read first, read the first note, and then fill in the bamboo shoot page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -6-A7 r 4 32 3 9 9 ___B7_ V. Invention (4) < Please read the precautions on the back before filling in the λ page.) The expansion and contraction of lead solder 25 is caused by the strong Young's coefficient of solder 25, which is applied to the electrode pattern 22 and the resistance pattern. Since the boundary line K 2 of 2 3 occurs, a crack occurs in the ceramic substrate 21, and a disconnection problem between the electrode pattern 2 2 and the resistance pattern 23 occurs. That is, due to the expansion and shrinkage of the lead-free solder 2 5 # tin 2 5 | the short boundary line K2 concentrated on the end of the resistance portion 2 3 a of the resistance pattern 2 3 resistance pattern 2 3, and in the ceramics The substrate 2 1 is cracked. [Problem to be solved by the invention] In the prior art variable resistor, when the lead-free solder 2 5 solder 2 5 is used, due to the expansion and contraction of the solder 2 5, the solder 2 5 The strength of the large Young's coefficient is concentratedly applied to the short boundary line K2 between the electrode pattern 22 and the resistance pattern 23. Therefore, a crack occurs on the ceramic substrate 21, and there is a disconnection problem between the electrode pattern 22 and the resistance pattern 23. Problem. [Means for solving the problem] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs as the first solution to solve the above problems, it has: a ceramic substrate | and a resistor pattern made of an enamel-based resistor formed on the ceramic substrate. With an electrode pattern formed on the ceramic substrate and connected with an enamel-based electrode connected to the end of the resistance pattern, and a slider sliding on the resistance pattern | the resistance pattern has a resistance portion that changes resistance, and The extension part is formed outside the sliding range of the slider, and is extended from the end of the resistance part to the formation direction of the electrical progenitor part. The paper size of the electrode is applicable to the Chinese National Standard (CNS) A4 specification (210 * 297). (Mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 32 39 9 at B7 V. Description of the invention (5) The pattern is provided with a connecting conductor for connecting the above-mentioned resistance part and a soldering conductor part for soldering, such as covering The connection conductor part forms the resistance part, and the extension is formed by covering a part of the conductor part with solder. And the connection length between the electrode pattern and the resistance pattern on the electrode pattern is increased. In addition, as a second solution, the solder formed on the above-mentioned solder-conducting portion is constituted by using lead-free solder. In addition, as a third solution, the solder is configured to use a Young's coefficient of 4000 kg f / mm2 or more. [Embodiment of the invention] If the variable resistor of the present invention is explained with reference to Figs. 1 to 5, the first diagram is a plan view of the first embodiment of the variable resistor of the present invention, and the second diagram is A sectional view of a main part of the variable resistor of the present invention, FIG. 3 is a perspective view of a terminal portion of the variable resistor of the present invention, and FIG. 4 is a view of a second embodiment of the variable resistor of the present invention. Main plan view, FIG. 5 is a main plan view of a third embodiment of the variable resistor of the present invention. The structure of the first embodiment of the variable resistor according to the present invention will be described based on FIGS. 1 to 3 as follows. A rectangular ceramic substrate 1 is provided with a circular hole la at the center and a hole la provided at the center. One pair of mounting holes 1 b near the end, and one pair of electrode patterns 2 formed on the ceramic substrate 1 are connected to the conductor portion a, and the paper conductor portion with a solder conductor formed around the mounting hole is used for this paper. Zhongluo Home Standard (CNS) A4 Specification (210 * 297 Male S) -8- ----------- Installation ------ Order! !! Wire (please read the note on the back * and fill in ^ 4 寊) * 4 3 2 3 9 g A7 B7 V. Description of the invention (6) 2 b This electrode pattern 2 is made of silver and glass materials The formed glaze-based electrode is fired on the ceramic substrate 1 to form β, and the fired * electrode pattern 2 is thereby firmly adhered to the ceramic substrate 1. Also, the 'resistance pattern 3 having a slightly circular shape' formed on the ceramic substrate 1 has a resistance portion 3 a which is variable in resistance, and a direction from the end portion of the resistance portion 3 a to the resistance portion 3 a ', that is, The extension portion 3 b formed by extending in the direction of circular solitary change is an end portion of the resistance portion 3 a, which covers the connection conductor portion 2 a of the pair of electrode patterns 2 and is connected to the electrode pattern 2, and the extension portion 3 b, extending along the side edge portion of the solder-conducting conductor portion 2 b, covering the solder-conducting conductor portion 2 b-partly connected to the electrode pattern 2 〇 and 'this resistance pattern 3' uses oxide nails and glass frit as main components The enamel-based resistor body is formed by firing on the ceramic substrate 1, thereby firing, and the resistance pattern 3 is in a state of being firmly adhered to the ceramic substrate 1. The terminal portion 4 made of a metal material, such as As shown in FIG. 3, the connection portion 4a for external connection is provided, and the bent mounting portion 4b is cut from the connection portion 4a. In addition, the terminal portion 4 penetrates the mounting portion 4 b through the mounting hole 1 b of the ceramic substrate 1, bends the tip of the mounting portion 4 b, and clamps the ceramic substrate 1 between the bent portion and the connection portion 4 a to clamp the terminal. The portion 4 is attached to the ceramic substrate 1, and the bent portion of the 1 mounting portion 4 b is the solder conductor portion 2 b abutting the pole pattern-2. 《This paper size applies to Chinese National Standards < CNS) A4 specification (210 x 297 mm) -9--------------- 05 * --- (Please read JW first Note * '? Please fill in Γ page again) Γ 4' · ν Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs f4 32 39 9 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (7). In addition, in order to secure the connection between the electrode pattern 2 and the terminal portion 4, as shown in FIG. 2, a structure in which a lead-free solder is performed on the solder-attached conductor portion 2b is provided. In addition, a rotary body with a slider (not shown) is mounted on the hole 1 a of the ceramic substrate 1, and the slider is slid over the resistance portion 3 a of the resistance pattern 3 to change the resistance 値. That is, the extension 3b becomes a position outside the sliding range of the slider. In the variable resistor of the present invention, the above-mentioned solder 5 uses a lead-free solder from environmental issues, but the solder 5 uses a Young's coefficient of 4000 kg f / mm2 and a linear expansion coefficient of 20. 9 ppm / t, and The ceramic substrate 1 has a Young's coefficient of 38000: kg f / mm 2 and a linear expansion coefficient of 7 · 6 ppm / ° C. The lead-free solder 5 is shown in Figure 5 and is soldered to the electrode pattern 2 With solder conductor 2 b. At this time, the state where the solder 5 is not adhering to the resistance pattern 3 and the mounting part 4 b covering the terminal part 4 is adhering to the solder conductor part 2 b. In addition, as a result, the results of a thermal cycle test (1,000 cycle test at -40 ° C to 80 ° C) for a variable resistor using lead 5 containing solder 5 were performed, although the Young's coefficient of solder 5 Large, but due to the expansion and contraction of the solder 5, no disconnection of the electrode pattern 2 and the resistance pattern 3 occurred. In addition, the main reason is that the electrode pattern 2 and the resistance pattern 3 are sintered, and are firmly attached to the ceramic substrate 1. In the state-, please read the back of the Young's system of solder 5 first. Yishishuo's refilled page size is applicable to Chinese National Standard (CNS) A4 (210 * 297 public love) -10- Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 2 3 9 9 A7 _____B7__ 5 2. Description of the invention (8) The power of the number is the boundary line K1 applied to the electrode pattern 2 and the resistance pattern 3, but this boundary line K1 is caused to cross the side edge of the end portion of the resistance portion 3a and the extension portion 3b. The connection length of the elderly, so no cracks will occur at all boundaries K1. In addition, when solder 5 is not included, solder 5 having a Young's coefficient of 4500 kgf / mm 2 and a linear expansion coefficient of 22.2 ppm / ° C is used, and no breakage occurs even during a thermal cycle test of 1,000 cycles. In addition, the same result can be obtained even if judged above the Young's coefficient. FIG. 4 shows a second embodiment of the present invention. This embodiment is further extended from the extension portion 3 b of the above-mentioned first embodiment along the solder conductor portion 3 b along the electrode pattern 2. The entire inner peripheral side edge portion is formed, and the boundary line K1 between the resistance pattern 3 and the electrode pattern 2, that is, the connection length is made longer. Fig. 5 shows a third embodiment of the present invention. In this embodiment, the boundary line K1 of the electrode pattern 2 of the resistance portion 3a and the extension portion 3b is stepped, and the boundary line K1 is further changed. The boundary line K 1 between the resistance pattern 3 and the electrode pattern 2 is extended, that is, the connection length becomes longer. [Effect of the invention] In the variable resistor of the present invention, such as the connection conductor portion 2 a covering the electrode pattern 2 is formed. The resistance part 3 a of the resistance pattern 3 and, if a part of the body 2 b with the solder is covered, forms an extension part 3 b of the resistance-pattern 3, this paper size applies the Chinese solid standard (CNS) A4 specification (210x297 cm) -11-— — — — — — ill — — — — — · 11 丨 — II 丨 I 丨 IIII-J, (Please read the precautions on the back before filling in page 4 > A7 B7
P4 3 2 3 9 Q 五、發明說明（9) 因將電極圖案2上之電極圖案2與電阻圖案3之連接長度 變長，所以|即使使用楊氏係數高之銲錫5銲錫5，也可 提供不會斷線之可變電阻器。 又，形成於附銲錫導體部2 b上之銲錫5，係因使用 不含鉛之銲錫，所以，可提供有益於環保之可變電阻器.。 又，銲錫5，係因使用楊氏係數爲4 0 0 0 k g f /m m 2 以上者，所以，由不含鉛之銲錫，可自由 使用楊氏係數大者，可提供生產力良好之可變電阻器。 六.圖式之簡單說明 第1圖係有關本發明之可變電阻器之第1實施例之平 面圖。 第2圖係本發明之可變電阻器之要部剖面圖。 第3圖係有關本發明之可變電阻器之端子部之斜視圖 第4圖係有關本發明之可變電阻器之第2實施例之平 〇 第5圖係有關本發明之可變電阻器之第3實施例之平 第6圖係先行技術之可變電阻器之平面圖。 第7圖係先行技術之可變電阻器之要部剖面圖。 第8圖係先行技術之可變電阻器之端子部之斜視圖。 請 先 Μ 讀 背- 面 意. 事 項 再 填 · ?裝 i 訂 面圖 經濟部智慧財產局員工消费合作社印製 面圖 -【·符號之說明】 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公爱） -12- 經濟部智慧財產局員工消費合作社印製 3239 9 A7 B7 五、發明說明（10) 1 _陶瓷基板，1 a 孔，1 b 安裝孔，2 電極圖案 ? a 連接導體部> 2b 附銲錫導體部，3 電阻圖 案1 '3 a 電阻部，3 b 延長部，4 端子部 j 4 £ i 連接部，4 b 安裝部，5 銲錫，K 1 境界線 I 1---------- -裝------ - 訂！--I I ·線 (請先閱讀"面之"-意事項再填穸\頁) 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13-P4 3 2 3 9 Q V. Description of the invention (9) Since the connection length between the electrode pattern 2 and the resistance pattern 3 on the electrode pattern 2 becomes longer, even if using solder 5 with high Young's coefficient, solder 5 can also be provided Variable resistor that won't break. In addition, since the solder 5 formed on the solder-attached conductor portion 2b uses lead-free solder, it is possible to provide a variable resistor which is environmentally friendly. In addition, since solder 5 uses a Young's coefficient of 4 000 kgf / mm 2 or more, a lead-free solder can be used freely with a large Young's coefficient, and a variable resistor with good productivity can be provided. . 6. Brief Description of Drawings Figure 1 is a plan view of the first embodiment of the variable resistor of the present invention. Fig. 2 is a sectional view of a main part of a variable resistor of the present invention. Fig. 3 is a perspective view of a terminal portion of the variable resistor of the present invention. Fig. 4 is a plan view of a second embodiment of the variable resistor of the present invention. Fig. 5 is a variable resistor of the present invention. Fig. 6 of the third embodiment is a plan view of a prior art variable resistor. Fig. 7 is a cross-sectional view of a main part of a prior art variable resistor. Fig. 8 is a perspective view of a terminal portion of a prior art variable resistor. Please read it first-face-to-face. Fill in the matter again. · 装 i-face-to-face drawing Printed face-to-face printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-[· Explanation of Symbols] This paper size applies to China National Standard (CNS) A4 specifications (210 * 297 public love) -12- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 3239 9 A7 B7 V. Description of the invention (10) 1 _Ceramic substrate, 1 a hole, 1 b mounting hole, 2 electrode pattern? A Connection conductor section> 2b conductor section with solder, 3 resistance pattern 1 '3 a resistance section, 3 b extension section, 4 terminal section j 4 £ i connection section, 4 b mounting section, 5 solder, K 1 boundary line I 1 ---------- -Install -------Order! --I I · Line (please read "quote first" -please fill in the 穸 page) The paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -13-