CN205723634U - A kind of piezoelectric plate structure - Google Patents
A kind of piezoelectric plate structure Download PDFInfo
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- CN205723634U CN205723634U CN201620149265.2U CN201620149265U CN205723634U CN 205723634 U CN205723634 U CN 205723634U CN 201620149265 U CN201620149265 U CN 201620149265U CN 205723634 U CN205723634 U CN 205723634U
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- electrode layer
- ceramic piece
- substrate
- piezoelectric
- piezoelectric ceramic
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- 239000000919 ceramic Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 239000002390 adhesive tape Substances 0.000 claims description 15
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 description 2
- 229910052683 pyrite Inorganic materials 0.000 description 2
- 239000011028 pyrite Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
This utility model relates to piezoelectric patches technical field, particularly relates to a kind of piezoelectric plate structure.By substrate, inner electrode layer, piezoelectric ceramic piece, outer electrode layer, extracting electrode layer and holding wire；It is connected by glue layer between described substrate and inner electrode layer；Described piezoelectric ceramic piece bottom surface is connected with inner electrode layer；Described piezoelectric ceramic piece end face one end connects outer electrode layer, and the other end connects extracting electrode layer；Gap is there is between described extracting electrode layer and piezoelectric ceramic piece；It is connected by electric installation between described extracting electrode layer and substrate；Described extracting electrode layer is all connected holding wire by solder joint with outer electrode layer；Making a kind of piezoelectric plate structure provide can use the materials such as aluminium alloy as substrate.
Description
Technical field
This utility model relates to piezoelectric patches technical field, particularly relates to a kind of piezoelectric plate structure.
Background technology
Along with the extensive application of piezoelectric ceramics piezo, increasing materials application is in piezoelectric ceramics piezo
On, relative to traditional copper base, nickel alloy substrate, the solderability of the materials such as aluminium alloy is the best, mesh
The substrate of pre-ceramic chip architecture generally uses the preferable metal material of the solderability such as pyrite, nickel alloy, due to aluminum
The solderability of the materials such as alloy is the best, is not usually used in the substrate of the piezoelectric ceramics piezo of this structure；
And the solderability such as pyrite, nickel alloy preferable metal material price is costly, add production cost.
Utility model content
The purpose of this utility model is to provide a kind of piezoelectric patches knot that the materials such as aluminium alloy can be used as substrate
Structure.
The technical solution of the utility model is as follows:
A kind of piezoelectric plate structure, including substrate, inner electrode layer, piezoelectric ceramic piece, outer electrode layer, extraction electricity
Pole layer and holding wire；It is connected by glue layer between described substrate and inner electrode layer；At the bottom of described piezoelectric ceramic piece
Face is connected with inner electrode layer；Described piezoelectric ceramic piece end face one end connects outer electrode layer, and the other end connects draws
Electrode layer；Gap is there is between described extracting electrode layer and piezoelectric ceramic piece；Described extracting electrode layer and substrate
Between connected by electric installation, this electric installation is conducting resinl；Described extracting electrode layer is equal with outer electrode layer
Holding wire is connected by solder joint.
Described electric installation is conducting resinl.Use conducting resinl, easy to connect and low cost.
Described electric installation is conductive adhesive tape.By the conductive glue at conductive adhesive tape two ends coating film respectively
It is bonded on extracting electrode layer and substrate；Owing to using conductive adhesive tape to use bonding mode so that connection side
Formula becomes easier.
Described conducting resinl contacts with interior electrode end surface.When conducting resinl is while connecting substrate and extracting electrode layer,
By conductive glue on inner electrode layer, it is achieved the series connection of substrate, inner electrode layer and extracting electrode layer so that
Contact becomes more reliable, increases the service life.
Described outer electrode layer and extracting electrode layer use ag material.Owing to outer electrode layer and extracting electrode layer are all adopted
With the splendid silver of solderability so that be easier to during solder joint, and use silver can strengthen conductive effect.
Described extracting electrode layer is positioned at piezoelectric ceramic piece end.Owing to extracting electrode layer is positioned at piezoelectric ceramics bit end
Portion, when connecting substrate with extracting electrode layer with conducting resinl or conductive adhesive tape, it is possible to reduce conducting resinl or conduction
The consumption of adhesive tape.
Described extracting electrode layer stretches out the end of piezoelectric ceramic piece.Owing to extracting electrode layer stretches out piezoelectric ceramic piece
End, only conducting resinl or conductive adhesive tape need to be coated on the bottom surface of extracting electrode layer, reduce the length used
Degree, economizes on resources, and reduces production cost.
The beneficial effects of the utility model are: novel piezoelectric chip architecture of the present utility model uses piezoelectric ceramics altogether
The two of piezoelectric ceramics electrodes are all guided on the external electrode of piezoelectric ceramics by face electrode structure, and by signal
Line directly with the piezoelectric ceramics external electrode of piezoelectric ceramics piezo two extremely go up, and solves smoothly to apply new material
The piezoelectric ceramics piezo signal of telecommunication lead in/out problem.
Accompanying drawing explanation
By detailed description below in conjunction with the accompanying drawings, this utility model is aforesaid and other purpose, feature and
Advantage will become clear from.
Wherein: Fig. 1 is this utility model plan structure schematic diagram；
Fig. 2 is this utility model side structure schematic diagram；
Fig. 3 be this utility model extracting electrode layer stretch out piezoelectric ceramic piece end time structural representation；
Fig. 4 is this utility model conducting resinl guide-tube structure schematic diagram；
Fig. 5 is this utility model conductive adhesive tape structural representation；
In accompanying drawing, 1 is substrate, and 2 is inner electrode layer, and 3 is piezoelectric ceramic piece, and 4 is outer electrode layer, and 5 for drawing
Electrode layer, 6 is holding wire, and 7 is glue layer, and 8 is gap, and 9 is conducting resinl, and 10 is solder joint, and 11 is conduction
Glue conduit, 12 is glue-feeder, and 14 is frustum, and 15 is conductive adhesive tape.
Detailed description of the invention
Seeing shown in Fig. 1-Fig. 5, a kind of piezoelectric plate structure, including substrate 1, inner electrode layer 2, piezoelectric ceramic piece
3, outer electrode layer 4, extracting electrode layer 5 and holding wire 6；By glue layer 7 between described substrate and inner electrode layer
Connect；Described piezoelectric ceramic piece bottom surface is connected with inner electrode layer；Outside described piezoelectric ceramic piece end face one end connects
Electrode layer, the other end connects extracting electrode layer；Gap 8 is there is between described extracting electrode layer and piezoelectric ceramic piece；
Being connected by electric installation between described extracting electrode layer and substrate, this electric installation is conducting resinl 9；Described draw
Go out electrode layer and be all connected holding wire by solder joint with outer electrode layer.
Owing to extracting electrode layer and outer electrode layer are arranged on the same face of piezoelectric ceramic piece, and extracting electrode layer
Connecting substrate by conducting resinl, extracting electrode layer is all connected holding wire by solder joint 10 with outer electrode layer, so
Design make substrate no longer be limited by solderability is the best, the piezoelectric ceramics piezo signal of telecommunication can be realized
Introducing, extraction；And by there is gap between extracting electrode layer and piezoelectric ceramic piece, drawing
Electrode layer separates with outer electrode layer, it is to avoid be interfered；Preferably, conducting resinl uses elargol, uses elargol
Connect extracting electrode layer and substrate, strengthen conductive effect conductive effect in other words more preferable.
Preferably, described electric installation is conductive adhesive tape 15.By leading at conductive adhesive tape two ends coating film
Electricity glue is bonded on extracting electrode layer and substrate respectively；Owing to using conductive adhesive tape to use bonding mode,
Connected mode is made to become easier.
Preferably, described conducting resinl contacts with interior electrode end surface.When conducting resinl is connecting substrate and extraction electrode
While Ceng, by conductive glue on inner electrode layer, it is achieved substrate, inner electrode layer and extracting electrode layer
Series connection so that contact becomes more reliable, increases the service life.
Preferably, described outer electrode layer and extracting electrode layer use ag material.Due to outer electrode layer and extraction electricity
Pole layer all uses the silver that solderability is splendid so that be easier to during solder joint, and uses silver can strengthen conduction effect
Really.
Preferably, described extracting electrode layer is positioned at piezoelectric ceramic piece end.Owing to extracting electrode layer is positioned at piezoelectricity
Potsherd end, when connecting substrate with extracting electrode layer with conducting resinl or conductive adhesive tape, it is possible to reduce conduction
Glue or the consumption of conductive adhesive tape.
Preferably, described extracting electrode layer stretches out the end of piezoelectric ceramic piece.Owing to extracting electrode layer stretches out pressure
The end of electroceramics sheet, only need to be coated in conducting resinl or conductive adhesive tape on the bottom surface of extracting electrode layer, reduces
The length used, economizes on resources, and reduces production cost.
Preferably, described electric installation includes the conducting resinl conduit 11 arranged between extracting electrode layer and substrate,
Glue-feeder 12 is offered on this conducting resinl conduit；All it is bonded with on described extracting electrode layer side and substrate top surface
The frustum 14 inserted for conducting resinl conduit, this frustum is provided with jack.By arranging conducting resinl conduit, protecting
While card connects substrate and extracting electrode layer with conducting resinl, reduce the waste of conducting resinl；Further, owing to adopting
With the setting of conducting resinl conduit, conducting resinl conduit can use the material of fireproof high-temperature resistant, it would however also be possible to employ resistance to
The material of corrosion, uses the design of conducting resinl conduit to be also less prone to covered with dust, it is possible to increase the service life；Logical
Cross and frustum is set, after conducting resinl conduit inserts in jack, spreading glue will be able to conduct electricity at jack gap
Glue conduit is fixed on frustum, then is poured in conducting resinl conduit by conducting resinl by glue-feeder.
The above, be only preferred embodiment of the present utility model, and this utility model not does any form
On restriction, every any simply repaiied according to above example makees in technical spirit of the present utility model
Change, equivalent variations, within each falling within protection domain of the present utility model.
Claims (7)
1. a piezoelectric plate structure, it is characterised in that include substrate, inner electrode layer, piezoelectric ceramic piece, outer electrode layer, extracting electrode layer and holding wire；It is connected by glue layer between described substrate and inner electrode layer；Described piezoelectric ceramic piece bottom surface is connected with inner electrode layer；Described piezoelectric ceramic piece end face one end connects outer electrode layer, and the other end connects extracting electrode layer；Gap is there is between described extracting electrode layer and piezoelectric ceramic piece；It is connected by electric installation between described extracting electrode layer and substrate；Described extracting electrode layer is all connected holding wire by solder joint with outer electrode layer.
A kind of piezoelectric plate structure the most according to claim 1, it is characterised in that described electric installation is conducting resinl.
A kind of piezoelectric plate structure the most according to claim 1, it is characterised in that described electric installation is conductive adhesive tape.
A kind of piezoelectric plate structure the most according to claim 2, it is characterised in that described conducting resinl contacts with interior electrode end surface.
A kind of piezoelectric plate structure the most according to claim 1, it is characterised in that described outer electrode layer and extracting electrode layer use ag material.
6. according to a kind of piezoelectric plate structure described in claim 1,2,3 any one, it is characterised in that described extracting electrode layer is positioned at piezoelectric ceramic piece end.
7. according to a kind of piezoelectric plate structure described in claim 1,2,3 any one, it is characterised in that described extracting electrode layer stretches out the end of piezoelectric ceramic piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620149265.2U CN205723634U (en) | 2016-02-26 | 2016-02-26 | A kind of piezoelectric plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620149265.2U CN205723634U (en) | 2016-02-26 | 2016-02-26 | A kind of piezoelectric plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723634U true CN205723634U (en) | 2016-11-23 |
Family
ID=57334010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620149265.2U Active CN205723634U (en) | 2016-02-26 | 2016-02-26 | A kind of piezoelectric plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723634U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633269A (en) * | 2016-02-26 | 2016-06-01 | 汉得利（常州）电子股份有限公司 | Piezoelectric patch structure |
-
2016
- 2016-02-26 CN CN201620149265.2U patent/CN205723634U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633269A (en) * | 2016-02-26 | 2016-06-01 | 汉得利（常州）电子股份有限公司 | Piezoelectric patch structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |