TW432102B - Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same - Google Patents

Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same Download PDF

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Publication number
TW432102B
TW432102B TW086118246A TW86118246A TW432102B TW 432102 B TW432102 B TW 432102B TW 086118246 A TW086118246 A TW 086118246A TW 86118246 A TW86118246 A TW 86118246A TW 432102 B TW432102 B TW 432102B
Authority
TW
Taiwan
Prior art keywords
coin
value
information
sensing
adhesive
Prior art date
Application number
TW086118246A
Other languages
English (en)
Inventor
Masahiro Ohura
Shigeki Muta
Takao Yoshikawa
Original Assignee
Nitto Denko Corp
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Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of TW432102B publication Critical patent/TW432102B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/838—Bonding techniques
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)

Description

M432102 五、新型說明： 【新型所屬之技術領域】 本創作係為一種投幣裝置之資訊回報系統，特別是一種可 以即時回報投幣裝置之投幣狀態給系統使用者的投幣裝置之 資訊回報系統。 【先前技術】 隨著科技的發展，商品貨物的交易越來越便捷，便利商店 *的興起，使得消費者不需專程跑去專賣店或大賣場來購買民生 必需品及曰常用品。便捷的商品買賣管道大大的節省購買者的 時間，而有些小型的生活用品像是飲料、零食、報紙…等，更 能藉由街道旁的投幣裝置快速地賭買。除此之外，投幣式遊戲 機、投幣式洗衣機、投幣式烘乾機在街上也是隨處可見，由此 可知投幣裝置的應用範圍是非常普遍。而投幣裝置不僅讓消費 者可以快速且便利的取得商品，還可以簡化管理者管理商品買 _賣的複雜度，雖然投幣裝置之商品無法如便利商店般的多元， -但是卻能達到獨立進行商品買賣而不需人力控管的目的，節省 了人力成本。 雖然管理者不需對投幣裝置隨時進行管理的工作，但是長 期運作下來，管理者仍需要在投幣裝置到達其所能容納錢幣之 最大量前將硬幣取出，以避免硬幣通道堵塞而造成卡幣或是無 法繼續販賣的情況發生。但是因為管理者無法得知投幣裝置是 否已達到容納硬幣之最大量，因此管理者必須增加交通往來上 的花費及時間來確保投幣裝置内的硬幣不會因已達最大量而 M432102 導致故障的情形發生，增加管理者在成本上的負擔。 有鑑於此，為了使投幣裝置之管理者可以節省在交通往來 上所花費的成本，因此如何告知管理者前往投幣裝置以收取硬 幣的時機，即為目前急需突破的課題。 【新型内容】 本創作為一種投幣裝置之資訊回報系統，其包括：一感測 裝置、一嵌入式系統以及一通訊模組。本創作係要藉由將嵌入 式系統所輸出之資料封包透過通訊模組立即回報給系統使用 者，使其能即時得知投幣裝置的投幣狀態，並衡量前往投幣裝 置取出硬幣的時機，來達到減少交通往來的成本。 本創作提供一種投幣裝置之資訊回報系統，其係用以回報 投幣裝置之一投幣狀態，資訊回報系統包括：一感測裝置，用 以感測投幣狀態並產生一感測值；一嵌入式系統，電訊連接感 測裝置，嵌入式系統包括：一記憶體，用以儲存至少一警戒值 及一設備識別碼；及一中央處理器，讀取感測值並產生一狀態 資訊，且中央處理器輸出包括有設備識別碼及狀態資訊之一資 料封包；以及一通訊模組，電訊連接嵌入式系統且内建有至少 —組聯絡資訊，通訊模組用以接收資料封包並根據聯絡貧訊傳 送資料封包。 藉由本創作的實施，至少可達到下列進步功效： 一、 可以讓管理者能夠即時得知投幣裝置的投幣狀態。 二、 可以減少管理者在交通往來的成本。 三、 藉由投幣裝置回報的資料，可了解機器所放置地點是否能 吸引人潮β 以每ί 了使任何^相關技藝者了解本創作之技術内容並據 今:、二广根據本况明書所揭露之内容、申請專利範圍及圖 :可热習相一關技藝者可輕易地理解本創作相關之目的及優 g在匕將在只知方式中詳細敘述本創作之詳細特徵以及優 _【實施方式】 第1圖為本創作實施例之—種投帶裝置之資訊回報系統之 ^圖：。第2圖為本創作實施例之一種投幣裝置之資訊回報 糸、先之不,€、圖_。第3圖為本創作實施例之—種資訊回較系統 之電路方塊圖。第4A圖為本創作實施例之—麵測值與警戒 值之比較流程圖-。第4Β圖為本創作實施例之一種感測值與 警戒值之比較流程圖二。第5圖為賴作實施例之—種投帶褒 置之資訊回報系統之流程圖。 、 1如第1圖所示，本實施例為一種投帶裝置之資訊回報系統 10，设置於一投幣裝置20内，用以回報投幣裝置2〇之一投幣 狀態給系統使用者，而投幣裝置2G可以是自動販賣機、^車 繳費益或是車票販賣機…等。其中資訊回報系統包括：一感測 裝置30 ; —嵌入式系統40以及一通訊模組5〇。 感測裝置30，是用以感測投幣裝置2〇之投幣狀態，並據 此產生相應之一感測值。其中，感測裝置3〇可以為一重量咸 測器，並且結合於投幣裝置20之一硬幣容器21之下方側，使 得重量感測器可以感測硬幣容器21之重量而產生—類比訊號 M432102 之感測值，而此時感測值即為硬幣容器21之重量值。 如第2圖所示，感測裝置3 0又可以為一計數器或一電子 式投幣感測器，並且結合於投幣裝置20之一硬幣流道22上。 當感測裝置30為計數器時，投入投幣裝置20之硬幣通過硬幣 流道22後，計數器會感應出硬幣之數量，此時感應值即為一 數量值；而當感測裝置30為電子式投幣感測器時，電子式投 幣感測器則會利用脈衝的方式偵測出硬幣的數量及幣值的大 小，此時感應值即為一總幣值。 如第3圖所示，嵌入式系統40，其藉由資料傳輸線與感測 裝置30電訊連接，以讀取感測裝置30產生之感測值，其中嵌 入式系統40包括：一記憶體41及一中央處理器42。記憶體 41係用以預先儲存至少一警戒值及一設備識別碼，而警戒值是 系統使用者預先設定於嵌入式系統40中的數值，可用以與感 測裝置30產生之感測值作比較，設備識別碼則是每一個投幣 裝置20或是感測裝置30所預設的識別號，以供系統使用者辨 識。 中央處理器42可以透過至少一輸入介面43來讀取感測裝 置30產生的感測值，並產生一狀態資訊，其中狀態資訊可以 於中央處理器42讀取記憶體41之警戒值並進行感測值與警戒 值之比較後產生，或是不與警戒值進行比較，而直接於預設時 間點根據感測值產生狀態資訊。 如第3圖及第4A圖所示，舉例來說，中央處理器42會不 斷讀取感測值，並持續與警戒值進行比較，但當感測值小於警 戒值時，中央處理器42會繼續進行感測值與警戒值的比較（步 M432102 驟S200)，直到當感測值大於或等於警戒值時（步驟S100)，中 央處理器42才根據相應之警戒值產生狀態資訊，並同時讀取 記憶體41内的設備識別碼，以輸出包括狀態資訊及設備識別 碼之資料封包（步驟S300)。中央處理器42又透過至少一輸出 介面44傳送資料封包給通訊模組50。也就是說，只有當感測 值到達或超過預設之警戒值時，中央處理器42才會產生及傳 送資料封包。 如第3圖及第4B圖所示，此外中央處理器42也可以用週 期性之方式來進行感測值與警戒值之比較，例如預先設定複數 個時間點於記憶體41内，當到達每一時間點時，中央處理器 42會讀取感測值與警戒值作比較，當感測值大於或等於警戒值 時（步驟S100)，中央處理器42便讀取相應之警戒值以產生狀 態資訊，並同時讀取記憶體41内的設備識別碼，將狀態資訊 及設備識別碼以資料封包的形式輸出（步驟S300)，且透過輸出 介面44傳送給通訊模組50 ;而當到達每一時間點且感測值小 #於警戒值時，中央處理器42會讀取小於或等於當時感測值之 •最大警戒值以產生狀態資訊，且同時讀取記憶體41内的設備 識別碼以輸出資料封包（步驟S400)，並透過輸出介面44傳送 給通訊模組50。 舉例來說，若是於記憶體41預設有警戒值為20，當中央 處理器42於某一時間點讀取到感測裝置30之感測值為30，因 為此時感測值大於警戒值20，因此中央處理器42會讀取警戒 值20以產生狀態資訊，並結合記憶體41内之設備識別碼，產 生資料封包以輸出至通訊模組50 ;而若是於記憶體41内又預 7 M432102 設有警戒值為20及40,當中央處理器42又於另一時間點讀取 到之感測值為35，因為此時感測值小於警戒值40，所以中央 處理器42會讀取小於或等於感測值為35之最大警戒值，即讀 取警戒值為20以產生狀態資訊，並結合記憶體41内之設備識 別碼產生資料封包，以輸出至通訊模組50。因此透過週期性之 方式產生狀態資訊後，能讓系統使用者在預先設定之時間點立 即從回報之資料封包得知投幣裝置20之投幣狀態，並根據設 備識別碼以判斷須前往哪一個投幣裝置20取幣。 又可將中央處理器42設定成當到達複數個時間點時，直 接將讀取之感測值輸出以產生狀態資訊，以週期性之方式產生 狀態資訊後，再輸出包括有設備識別碼及狀態資訊之資料封包 給系統使用者，讓系統使用者在預先設定之時間點立即從回報 之資料封包得知投幣裝置20之感測值。 如第5圖所示，通訊模組50,其藉由資料傳輸線與嵌入式 系統40電訊連接，並用以接收自嵌入式系統40輸出之資料封 包，且通訊模組50内建有至少一組聯絡資訊，通訊模組50會 根據聯絡資訊以傳送資料封包至一伺服器端60。當通訊模組 50為一有線網路模組或一無線網路模組時，聯絡資訊為一電子 郵件位址或一 IP位址，通訊模組50會在接收到資料封包後將 其輸出至伺服器端60，伺服器端60再根據聯絡資訊傳送資料 封包至網路資料庫61，以提供系統使用者能上網透過瀏覽器 62查詢資料封包的内容，而當通訊模組50為一無線通訊模組 時，聯絡資訊為一手機門號，通訊模組50會在接收資料封包 後將其輸出至伺服器端60，伺服器端60再根據聯絡資訊並藉 M432102 由簡簡訊63傳送資料封包至 64能即時得知投幣裝置20的狀離。 的手機，讓用戶端 透過投幣裝置之資訊回^ 用者方便管理各投”置2〇之投幣狀^^能夠讓系統使 戒值的比較’可以即時並主動告知投“值與警 以提供系統使用者判斷前往各投幣裝置 敝的才:幣狀態， 交通往來的成本及時間，並且藉 ；的:機’進而 ^狀態’可了解放置投幣裝置2_點是否能置及人t的投 惟上遂各實施例係用以說明本創作之特點，直； 習該技術者能瞭解本創作 目的在使熟 之專利範圍，故凡其他未脫離本Z:::之 效修飾或修改’仍應包含在以下所述之Γ請之專=而圍完中成之等 【圖式簡單說明】 2圖為本創作實施例之一種投幣襄置之資訊回報系統之示意 2圖為本創作實施例之一種投帶裝置之資訊回報系統之示意 =圖為本創作實施例之—種資訊回報系統之電路方塊圖。 ^圖為本創作實施例之-種感測值與警戒值之比較流程圖 弟4B圖為本創作實施例之一種感測值與警戒值之比較流程圖 ——° 第5圖為本創作實施例之一種投幣裝置之資訊回報系統之流程 9 M432102 圖。 【主要元件符號說明】 10................投幣裝置之資訊回報系統 20 ................投幣裝置 21 ................硬幣容器 22 ................硬幣流道 30................感測裝置 40 ................嵌入式系統 41 ................記憶體 42 ................中央處理器 43 ................輸入介面 44 ................輸出介面 50................通訊模組 60 ................伺服器端 61 ................網路資料庫 62 ................瀏覽器 63 ................SMS簡訊 64 ................用戶端

Claims (1)

  1. 六 申請專利範圍·· 」又Φ裝置之貝矾回報系統，其係用以回報該投幣裝置 ——投繁狀態’該資訊回㈣統包括： ^㈣置’心感測該投瞥狀態並產生-感測值； 1认式系統，電訊連接該感㈣置，純人式系統包括： —用以儲存至少一警戒值及一設備識別碼；及 央處理器’讀取該感測值並產生-狀態資訊，且該 處理$輸出包括有該設備朗碼及該狀態資訊之 —資料封包；以及 電訊連接該嵌人式系統且内建有至少-組聯 次I , ‘訊換组用以接收該資料封包並根據該聯絡 貝矾傳送該資料封包。 I Π = ί圍第”所述之資訊回報系統，其中該感測 哭夕‘·、、里感測器’其係結合於該投幣裝置之-硬幣容 。。之下方側。 3.3 = :::述之資訊回報系統，其中該感測 幣I罢 °。或—電子式投幣感測H，其係結合於該投 置之一硬幣流道上。 4’ =申請專利範圍第丨項所述之資朗報系統 =!：感測值與該警戒值之比較以產生該 該警戒==?產生及傳送係在該感測值大於或等於 5. 系統，以㈣ 之方式進行該感測值與該警戒值之比 M432102 較。 =申凊專利範圍第1項所述之資朗報线，其中該中央 =器讀取該感測值後，以週期性之方式產生該狀態資訊 並輪出該資料封包。 7.22專利範圍第1項所述之資訊回報系統，其中該通訊 —、、、==線網路模組聯絡資訊為—電子郵件位址或 8. 專利範圍第1項所述之資訊回報系統，其中該通訊 吴、，且為-無線網路模組且該聯絡 。5 或—IP位址。 為電子郵件位址 9·如申請專職圍$丨韻述之f訊回 模組為-無線軌触且夠 〃中該通訊 貝与手機門號。 12
TW086118246A 1996-12-04 1997-12-04 Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same TW432102B (en)

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