TW432090B - A process for molding sheets of a high density polyethylene in a mold - Google Patents
A process for molding sheets of a high density polyethylene in a mold Download PDFInfo
- Publication number
- TW432090B TW432090B TW085107184A TW85107184A TW432090B TW 432090 B TW432090 B TW 432090B TW 085107184 A TW085107184 A TW 085107184A TW 85107184 A TW85107184 A TW 85107184A TW 432090 B TW432090 B TW 432090B
- Authority
- TW
- Taiwan
- Prior art keywords
- noise
- touch panel
- panel
- antenna
- circuit according
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/002—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/247—Heating methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/006—Using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/007—Using fluid under pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/08—Deep drawing or matched-mould forming, i.e. using mechanical means only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/10—Forming by pressure difference, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/06—PE, i.e. polyethylene
- B29K2023/0608—PE, i.e. polyethylene characterised by its density
- B29K2023/065—HDPE, i.e. high density polyethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2810/00—Chemical modification of a polymer
- C08F2810/10—Chemical modification of a polymer including a reactive processing step which leads, inter alia, to morphological and/or rheological modifications, e.g. visbreaking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2810/00—Chemical modification of a polymer
- C08F2810/20—Chemical modification of a polymer leading to a crosslinking, either explicitly or inherently
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/26—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Position Input By Displaying (AREA)
Description
M432090 五、新型說明: 【新型所屬之技術領域】 -ί-Λ 3Β δ又置 本創作係有關於一種觸控面板的雜訊消除 續出=^錢魏域紐於獅 _收_減㈣雜訊和液晶吨的__訊消 【先前技術】 目前多點觸控(multi_touch)大都使用互感式電容觸控面板。請來 厂第1圖,第丨圖係說明觸控面板則(互感式電容觸控面板陶測 觸控點的方式之示意圖。如第i圖所示,觸控面板1⑻可以準確的 憤測到多點觸控的位置,觸控面板觸的驅動方式係為將Y轴方向 (或X軸方向)的進行電壓或電流的掃描,織在χ軸向(或Y轴方 句進行觸触减賴取’射巧妨向是_序掃躺方式進 行,但X軸向則是整面轴向的訊號資料截取。 切參照第2圖,第2圖係為先前技術說明觸控面板1〇〇的讀出 電路102的不意圖。如第2圖所示,觸控面板1〇〇根據物件1〇4在 觸控面板1〇〇上的位置’產生訊號χ <訊號γ,^過一軟性印刷 電路板(flexible print circuit,FPC)106傳送至一多工器108。然後’訊 號X或訊號Y經由多工器1〇8被送至讀出電路1〇2做訊號處理(放 大及濾波)後,產生訊號X’或訊號γ,。最後,訊號χ,或訊號γ, M432090 被傳送至下-級電路m(類比數位器和微處理器)做 的 運算。 心 明參照第3圖’第3圖係為說明觸控面板卿的操作示音圖。 如第3圖所示,當開關SW1開啟_ 〇n)以及開關撕2卿('二⑽ 時’觸控面板100對Y軸方向的-第-感測線進行電壓或電流的掃 描所產生的訊號源s(訊號γ),對電容Cx充電,使電容cx儲存一 電位V。當開關SW1關閉以及開關SW2開啟時,多工器1〇8在X 軸向將電容Cx所儲存的電位V傳送至讀出電路1〇2做訊號處理。 反之’當開關SW1開啟以及開關SW2關閉時,如果觸控面板1〇〇 上的汛號源係為X軸方向進行電壓或電流的掃描的結果,則當開關 SW1關閉以及開關SW2開啟時,多工s 108係在γ軸向將電容Cy 所儲存的電位V傳送至讀出電路1〇2做訊號處理。然後,經由讀出 電路102所產生的喊V,再送至下—級電路112做相對應的運算。 請參照第4圖和第5圖’第4圖係為說明第i圖的雜訊來源的 示意圖,第5圖係為說明當操作觸控面板1〇〇時,經由讀出電路ι〇2 所產生的虎V’所包含的雜訊的示意圖。如第丨圖和第4圖所示, 第1圖的雜訊包含耦接於觸控面板100的液晶面板114所產生的雜 訊m、觸控面板1〇〇會受外界干擾所產生的雜訊N2,以及多工器 108和讀出電路102所產生的雜訊N3和雜訊N4。因此,如第3圖 和第5圖所不,讀出電路102根據電gCx或電容Cy所儲存的電位 V和雜訊N卜N2、N3及N4與式⑴,產生訊號V,。另外,可根據 5 «J2090
式(2)決定訊雜比SNR ⑴ (2) V,=V+N1+N2+N3+N4 SNR=V/( N1+N2+N3+N4) 如此,讀出電路102根據電位v所產生的訊號v,可能會造成下 一級電路112做錯誤的運算。 【新型内容】 本創作的-實施例提供一種觸控面板的雜訊消除電路。該雜訊 〉除電路包含至少—雜訊天線、—多玉器及-讀出單元。該至少一 天線__合簡麵板的雜訊和_於該觸控面板的一液 雜訊;該多4伽以接收該觸控面板的第—X減測訊 rY軸感測訊號,其中該第—χ軸感測訊號與該第一γ軸 二則减包含觸控面板_訊和該液晶面板驗訊;該讀出單元 …接於'^工S與該至少—雜訊天線,用以_該觸控面板的雜 5孔和該液晶面板的雜1、* ’ 測訊號所包含的=面:.X軸感測訊_^ 於 ° 工面板的雜訊和該液晶面板的雜訊,以產生及 叫亂Bsft議爾 °細咖電路係 二板的雜訊天線或設置於一液晶面板的雜訊天 、肖除β出電路所接收的該觸控面板的雜訊和該液晶面板的 雜訊。如此,摘料僅可提高一下—級魏的訊_,且亦減少 打-級電路(-類比數位轉換器和—微處理器)的錯誤運算。 【實施方式】 “、/> ’、、、第4圖和第6圖’第6圖係為本創作的—實施例說明雜 除Γ路議的示意圖。雜訊消除電路600包含一雜訊天線60卜 。貝出單tl 602及-多工器_。但在本創作的另一實施例中,雜 訊消除電路_包含複數條雜訊天線。雜訊天線60Η系用以搞合觸 =面板卿的雜訊Ν2和耗接於觸控面板⑽的液晶面板ιΐ4(如第4 1 所示)的雜訊N1,其中觸控面板卿係可為-投射式電容觸控面 ^感式^但在本創作的另—實施例中,觸控面板係可為一 黛二電痛控面板(自感式)。多工器_係用以接收觸控面板则 測訊號X1與第—¥減測訊號γι,其中當觸控面 面板100㈣岭向進行電壓或電流的掃描時,多工器608接收觸控 行電壓If 一 γ轴感測訊號Y1;當觸控面板100的¥轴方向進 丁電线電>,描時’多工器_接收觸控面板 感測訊號XI。另外,筮一 竿由 Y1句八鋪松 帛一 x軸感測訊號XI與第-Y軸感測訊號 Γ二觸控面板1〇。的雜謂和液晶面板m的雜訊N1。讀出 1:的雜多工器_與雜訊天線 ’用以利用觸控面板 幻與第一 ,消除第-x轴感測訊號 晶面板m ^⑽二,面板1GG的雜訊叫液 產生及輪出不包含觸控面板1〇〇的雜訊 M432090 N2和液晶面板114的雜訊N1的第二χ轴感測訊號χ2與第二γ軸 感測訊號丫2至下-級電路112。如第6圖所示,讀出單元6()2包含 一差動運算次單元6022,具有一第一輸入端,耦接於多工器6〇8用 以接收第一 X軸感測訊號X1與第一 γ軸感測訊號γι,一第二輸 入端,耦接於雜訊天線601,用以接收觸控面板1〇〇的雜訊N2和液 晶面板114的雜訊N1,及一輪出端,用以輸出不包含觸控面板1〇〇 的雜訊N2和液晶面板1Η的雜訊N1的第二χ軸感測訊號χ2與第 二Υ軸感測訊號Υ2,其中差動運算次單元6〇22係為一差動運算放 大器。另外,差動運算次單元6022可利用一差動對(differemial pair) · 或一儀表放大器(instrumentation amplifier)取代差動運算放大器。另 外’差動對或儀表放大器的操作原理皆和差動運算放大器相同,在 此不再贅述。 請參照第7圖、第8圖、第9圖和第10圖,第7圖係為說明觸 控面板1〇〇的橫切面的示意圖,第8圖係為說明雜訊天線6〇1設置 於觸控面板100的金屬層Μ的示意圖,第9圖係為說明雜訊天線鲁 601設置於觸控面板1〇〇的導電薄膜層ΓΓΟ的示意圖,第1〇圖係為 說明液晶面板114的橫切面的示意圖。如第7圖所示,觸控面板 包含一玻璃基板G (或塑膠基板PET)、一金屬層μ、一絕緣層IS〇1、 一導電薄膜(Indium Tin Oxide)層ITO及一絕緣層IS〇2。如第8圖所 示’金屬層Μ内的金屬線ML1、ML2是用以連接導電薄膜芦mo 所包含的複數個感測單元(複數個X軸感測單元及複數個γ轴感測 單元)。因此’雜訊天線601可設置於觸控面板1〇〇的金屬層Μ,以 8 M432090 耦合觸控面板100的雜訊N2和液晶面板114的雜訊N1。如第9圖 所不,導電薄膜層ITO &含複數個感測單元(複數個X轴感測單元 及複數個Y減測單灿因此,雜訊天線6G1亦可設置於觸控面板 1〇〇的導電薄膜廣ιτο,以躺合觸控面板100的雜訊N2和液晶面板 114的雜訊N1。當雜訊天線6〇1設置於觸控面板1〇〇的金屬層M或 導電薄膜層ΙΤΟ時’雜訊天線601係位於觸控面板i⑻的動作區 (actiVearea)之外,且雜訊天線6〇1係透過耦接於觸控面板1〇〇的軟 性印刷電路板(flexible print circuit, FPC)106耦接於讀出單元6〇2。另 外’如第10圖所示,液晶面板114包含偏光片(poWzer)層1142、 彩色濾光片層1144、彩色濾光片導電玻璃層1146、液晶層1148及 控制電路陣列層115〇。因此,在本創作的另一實施例中,雜訊天線 601亦可設置於液晶面板114的彩色遽光片導電玻璃| 1146或控制 電路陣列層1150,以耦合觸控面板削的雜訊N2和液晶面板114 的雜訊N1。當雜訊天線6〇1設置於液晶面板114的彩色濾光片導電 玻璃層1146或控制電路陣列層1150時,雜訊天線601係位於液晶 面板114的動作區之外,且雜訊天線6〇1係透過耦接於液晶面板ιΐ4 的軟性印刷電路板106耦接於讀出單元6〇2。 請參照第11圖,第11圖係為說明雜訊消除電路6〇〇透過雜訊 天線601消除觸控面板1〇〇的雜訊N2和液晶面板114的雜訊犯的 不意圖。如第11圖所示,當開關SW1開啟以及開關SW2關閉時, 觸控面板100對γ軸方向的一第一感測線進行電壓或電流的掃描所 產生的訊號源S對電容Cx或電容Cy充電,使電容Cx或電容Cy 9 M432090 儲存電位v。但電位v因為受到雜訊N2和雜訊Νι的影響,所以 根據式(3)產生一訊號vi。 Y1=V+N1+N2 ⑶ 田開關SW1關閉以及開關SW2開啟時,多工器6〇8接收訊號 V1 ’且根據式(4)產生一訊號V2傳送至差動運算次單元6〇22的第 一輸入端。 Y2=V+N1+N2+N3 ⑷ 如式(4)所示’N3是為多工器108所產生的雜訊。此時差動運算 次單元6022的第二輸入端亦會透過開關SW3接收來自雜訊天線 6〇1所耦合的觸控面板1〇〇的雜訊N2和液晶面板114(如第4圖所示) 的雜訊N1 ’其中開關SW3的操作時序和開關SW2的操作時序相 同。另外,差動運算次單元6022的輸出端可根據式(5)輸出訊號V3。 V3=Ad[(V+Nl+N2+N3HNl+N2)]+ACm{[(V+Nl+N2+N3)+(Nl+N2) ]/2}+N4 (5) 如式(5)所示,Ad為差動運算次單元6022的差模増益,Acm為 差動運算次單元6022的共模增益。如果差動運算次單元6〇22具有 高共模拒絕比(Common Mode Rejection Ratio, CMRR),則式(5)中的 Acm{[(V+Nl+N2+N3)+(Nl+N2)]/2}項可被消除。因此,式(5)令的訊 10 说V3可被改寫成式⑹中的訊號V4,且可根據式⑺產生訊雜比 SNR,〇 V4 Ad[(V+Nl+N2+N3)-(Nl+N2)]+N4=Ad*(V+N3)+N4 ⑹ SNR’= Ad*V/[(Ad*N3)+N4]=V/[N3+(N4/Ad)] ⑺ 因為目刖雜訊N3及雜訊N4遠小於雜訊m,所以由式⑺與 ⑺可知讯雜比SNR,遠大於訊雜比SNR。 。 設置路’係利用 讀出電路所接收===置於液晶面板的雜訊天線,以消除 作不僅可提高下訊和液晶面板的雜訊。如此,本創 轉換器和微處輪運 =,且'梅下—肅(類比數位 所做細,猶她申請專利範圍 與修倚皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第二係說明觸控面板偵測觸控點之示意圖。 第4圖係為說明第1圖的雜訊來源的示意圖。 ,蝴输組的訊號所 本創作的一實施例說明雜訊消除電路的示意圖。 圖係為_觸控面板的橫切面的示意圖。 =圖係為說·訊天賴置_控面板的 =Γ天教置_控面板轉電_層=意圖。 第10圖係為_液晶面板的橫切面的示意圖。 第11圖係為說明雜訊消除電路透過雜訊錢消除觸控面板的 和液晶面板的雜訊的示意圖。 Ί 【主要元件符號說明】 100 102 ' 602 104 106 108 > 608 112 114 600 601 1142 1144 1146 觸控面板 讀出電路 物件 軟性印刷電路板 多工器 下一級電路 液晶面板 雜訊消除電路 雜訊天線 偏光片層 彩色渡光片層 彩色濾光片導電破螭層 M432090 1148 液晶層 1150 控制電路陣列層 6022 差動運算次單元 Cx、Cy 電容 G 玻璃基板 ISOl、IS02 絕緣層 ITO 導電薄膜層 M 金屬層 ML1、ML2 金屬線 N1、N2、N3、N4 雜訊 S、X、Y、X’、Y’、V’、V卜 V2、V3 訊號 SW1 ' SW2 ' SW3 開關 V 電位 XI 第一 X軸感測訊號 Y1 第一 Y軸感測訊號 X2 第二X軸感測訊號 Y2 第二Y軸感測訊號 13
Claims (1)
- 六 、申請專利範圍: -種_板的雜訊消除電路,包含. 至少一雜訊天線,用叫合該觸控 面板的-液晶面板的雜訊; 的雜騎_於該觸控 —多工器,用以接收該觸控面板的第—x =3號,其中該第一 x軸感測訊號與該第二= 二嘯該觸控面板的雜訊和該液晶面板的雜訊;及 —多4與該至少—雜訊天線,用以利用 h控面板的雜讯和該液晶面板的雜訊,消除該第一X轴 感測訊號與該第-Y輪感測訊號所包含的該觸控面板的雜 訊和該液晶面板的雜訊,以產生及輸出不包含該觸控面板 的雜訊和該液“板的雜訊的第二\軸感測訊號與第二? 軸感測訊號。 2·如請求項1所述之雜m消除電路,其中該讀出單元包含: 一差動運算次單元,具有一第一輸入端,耦接於該多工器,用 以接收該第一X軸感測訊號與該第一 y軸感測訊號,一第 二輸入端,耦接於該至少一雜訊天線,用以接收該觸控面 板的雜訊和該液晶面板的雜訊,及一輸出端,用以輸出該 第二X軸感測訊號與該第二γ軸感測訊號。 3.如請求項2所述之雜訊消除電路,其中該差動運算次單元係為 一差動對。 4. 如請求項2所述之雜訊消除電路,其中該差動運算次單元係為 一差動運算放大器。 5. 如請求項2所述之雜訊消除電路,其中該差動運算次單元係為 一儀表放大器。 6. 如請求項1所述之雜訊消除電路,其中該至少一雜訊天線係設 置於該觸控面板的導電薄膜(Indium Tin Oxide,ΙΤΟ;)。 7. 如請求項1所述之雜訊消除電路,其中該至少一雜訊天線係設 置於該觸控面板的金屬層。 8. 如請求項6或7所述之雜訊消除電路,其中該至少一雜訊天線 係位於該觸控面板的動作區(active area)之外。 9. 如明求項1所述之雜訊消除電路,其中該至少一雜訊天線係透 過耦接於該觸控面板的一軟性印刷電路板(flexible prim drcuit, FPC)輕接於該讀出單元。 求項1所述之雜訊消除電路,其中該至少_雜訊天線係設 置於該液晶面板的彩色滤光片導電玻璃層。 求項1所述之雜訊消除電路,其中該至少—雜訊天線係設 15 M432090 置於該液晶面板的控制電路陣列層。 12·如請求項10或11所述之雜訊消除電路,其中該至少一雜訊夭 線係位於該液晶面板的動作區之外。 13. 如請求項1所述之雜訊消除電路,針該至少—雜訊天線係透 過搞接於該液晶面板的-軟性印刷電路板搞接於該讀出單元。 14. 如請求項1所述之雜訊消除電路,其中該觸控面板係為一投射 式電容觸控面板。 15. 16. 如吻求項14所述之雜訊肖除電路,其巾該投射式電容 係為一互感式電容觸控面板。 項14所述之雜訊消除電路,其中該投射式電容 係為一自献電容觸控面板。 觸控面板 觸控面板 七、圖式: 16
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/435,916 US5736618A (en) | 1995-05-05 | 1995-05-05 | High density polyethylene with improved thermoforming characteristics |
Publications (1)
Publication Number | Publication Date |
---|---|
TW432090B true TW432090B (en) | 2001-05-01 |
Family
ID=23730355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085107184A TW432090B (en) | 1995-05-05 | 1996-06-14 | A process for molding sheets of a high density polyethylene in a mold |
Country Status (8)
Country | Link |
---|---|
US (1) | US5736618A (zh) |
EP (1) | EP0823874A4 (zh) |
JP (1) | JPH11504284A (zh) |
KR (1) | KR19990008334A (zh) |
AU (1) | AU710362B2 (zh) |
CA (1) | CA2220143A1 (zh) |
TW (1) | TW432090B (zh) |
WO (1) | WO1996034734A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT885255E (pt) * | 1996-03-05 | 2002-03-28 | Dow Chemical Co | Poliolefinas de reologia modificada |
WO1998024836A1 (en) * | 1996-12-05 | 1998-06-11 | Mobil Oil Corporation | Foamed high density polyethylene |
US6221925B1 (en) | 1996-12-05 | 2001-04-24 | Mobil Oil Corporation | Foamable high density polyethylene |
CA2301526A1 (en) | 1997-08-27 | 1999-03-04 | Michael E. Rowland | Elastomers with improved processability |
WO2003072644A2 (en) * | 2002-02-22 | 2003-09-04 | Dow Global Technologies Inc. | Thermoplastic foam containing particulate additive |
US7285617B2 (en) * | 2004-10-08 | 2007-10-23 | Exxonmobil Chemical Patents Inc. | Oxygen tailoring of polyethylene blow molding resins |
US20070014978A1 (en) * | 2005-07-18 | 2007-01-18 | Anthony Poloso | Method of flame blocking and articles made therefrom |
WO2015138449A1 (en) | 2014-03-10 | 2015-09-17 | Hickory Springs Manufacturing Company | High temperature non-crosslinked polyethylene-based foam and methods of making the same |
JP6846354B2 (ja) * | 2015-04-30 | 2021-03-24 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | 高密度ポリエチレン |
WO2017124173A1 (en) * | 2016-01-22 | 2017-07-27 | Eski Inc. | Wearable electronic devices and related systems and methods |
WO2021168344A1 (en) * | 2020-02-21 | 2021-08-26 | Skate One Corp. | Apparatus and method for pressing a workpiece |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2919474A (en) * | 1956-01-27 | 1960-01-05 | Gen Electric | Moldable polyethylene |
BE581218A (zh) * | 1958-07-30 | |||
US3764628A (en) * | 1960-01-07 | 1973-10-09 | Grace W R & Co | Tertiary-tertiary bisperoxides |
US3242159A (en) * | 1961-11-27 | 1966-03-22 | Pullman Inc | Treatment of linear polyethylene |
GB1051320A (en) * | 1964-01-13 | 1966-12-14 | W.R. Grace & Co. | Micro-porous polyethylene and a process for the manufacture thereof |
DE1282922B (de) * | 1966-02-14 | 1968-11-14 | Dynamit Nobel Ag | Verfahren zur Herstellung von schaumflockenartigen Formmassen aus vernetzten AEthylenpolymerisaten |
CH475083A (de) * | 1967-06-17 | 1969-07-15 | Haeberli Hans | Verfahren zur Herstellung von Thermoplast-Halbfabrikaten und Produkten mit guten Wärmeverformungseigenschaften |
US3631161A (en) * | 1970-02-05 | 1971-12-28 | Union Carbide Corp | Method for crosslinking ethylene containing polymers |
CA957473A (en) * | 1970-10-28 | 1974-11-12 | E. I. Du Pont De Nemours And Company | Process for continuously extruding crosslinkable polyethylene compositions |
DE2442230C2 (de) * | 1974-09-04 | 1983-04-07 | Basf Ag, 6700 Ludwigshafen | Verfahren zur Herstellung von Polyäthylenfolienmaterial |
US4015058A (en) * | 1974-11-27 | 1977-03-29 | Union Carbide Corporation | Composition with dicumyl peroxide and process for avoiding scorching of ethylene polymer composition |
US4006283A (en) * | 1974-12-23 | 1977-02-01 | General Electric Company | Preparation of di-tertiary butyl peroxide crosslink polyolefin materials |
AU523866B2 (en) * | 1978-04-18 | 1982-08-19 | Du Pont Canada Inc. | Manufacture of film |
US4202790A (en) * | 1978-06-26 | 1980-05-13 | Hercules Incorporated | Peroxide blends |
US4489034A (en) * | 1982-08-25 | 1984-12-18 | Shell Oil Company | Thermoforming process using modified polymer blend |
US4578431A (en) * | 1983-08-31 | 1986-03-25 | Mobil Oil Corporation | Process for improving melt strength of ethylene polymers by treatment with organic peroxide |
IL75719A (en) * | 1984-07-18 | 1988-11-30 | Du Pont Canada | Polyolefin blends containing reactive agents |
US5530072A (en) * | 1995-04-19 | 1996-06-25 | Mobil Oil Corporation | Introduction of long chain branching into linear polyethylenes |
-
1995
- 1995-05-05 US US08/435,916 patent/US5736618A/en not_active Expired - Fee Related
-
1996
- 1996-04-16 CA CA002220143A patent/CA2220143A1/en not_active Abandoned
- 1996-04-16 KR KR1019970707860A patent/KR19990008334A/ko active IP Right Grant
- 1996-04-16 EP EP96912766A patent/EP0823874A4/en not_active Withdrawn
- 1996-04-16 JP JP8533322A patent/JPH11504284A/ja active Pending
- 1996-04-16 AU AU55466/96A patent/AU710362B2/en not_active Ceased
- 1996-04-16 WO PCT/US1996/005183 patent/WO1996034734A1/en not_active Application Discontinuation
- 1996-06-14 TW TW085107184A patent/TW432090B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2220143A1 (en) | 1996-11-07 |
EP0823874A4 (en) | 1999-01-20 |
KR19990008334A (ko) | 1999-01-25 |
WO1996034734A1 (en) | 1996-11-07 |
AU5546696A (en) | 1996-11-21 |
EP0823874A1 (en) | 1998-02-18 |
JPH11504284A (ja) | 1999-04-20 |
US5736618A (en) | 1998-04-07 |
AU710362B2 (en) | 1999-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW432090B (en) | A process for molding sheets of a high density polyethylene in a mold | |
US5670755A (en) | Information input apparatus having functions of both touch panel and digitizer, and driving method thereof | |
US9465492B2 (en) | Touch panel system and electronic device | |
JP2010061405A (ja) | 静電容量センサ、その検出回路、入力装置および容量センサの制御方法 | |
US20070291963A1 (en) | Input device | |
US8144128B2 (en) | Touch panel and coordinates detecting method using touch panel | |
JP6615683B2 (ja) | 容量測定回路、それを用いた入力装置、電子機器 | |
CN111381718B (zh) | 触摸感测装置、触摸感测系统和触摸面板的驱动方法 | |
Park et al. | A 0.26-nJ/node, 400-kHz Tx Driving, Filtered Fully Differential Readout IC With Parasitic RC Time Delay Reduction Technique for 65-in $169\times 97$ Capacitive-Type Touch Screen Panel | |
TW201229837A (en) | Touch sensing apparatus | |
JP3277896B2 (ja) | 押圧検出兼用静電容量式座標検出装置 | |
WO2019069696A1 (ja) | ペンが送信したペン信号を検出するためのセンサパネル | |
CN105808029A (zh) | 一种显示基板、触摸屏及显示装置 | |
TWM432090U (en) | Noise cancellation circuit | |
JP2011165190A (ja) | タッチ検出方法、タッチ検出装置及びタッチ表示装置 | |
CN102103427B (zh) | 触控装置及驱动方法 | |
US10180751B2 (en) | Sensing device for force and tactile-proximity sensing | |
CN107045412B (zh) | 电容式触控结构、触控显示面板、显示装置及扫描方法 | |
JPH117354A (ja) | 静電結合型タブレット装置 | |
CN202394215U (zh) | 噪声消除电路 | |
TW201229836A (en) | Touch sensing apparatus | |
JP2006285518A (ja) | 接触位置座標検出方法および装置 | |
TW201234225A (en) | Touch sensing apparatus | |
TW202234218A (zh) | 觸控顯示裝置及其方法 | |
CN115079859A (zh) | 具有降低噪声的触控电路 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |