TW430908B - Semiconductor device and method for manufacturing the same - Google Patents
Semiconductor device and method for manufacturing the sameInfo
- Publication number
- TW430908B TW430908B TW088112815A TW88112815A TW430908B TW 430908 B TW430908 B TW 430908B TW 088112815 A TW088112815 A TW 088112815A TW 88112815 A TW88112815 A TW 88112815A TW 430908 B TW430908 B TW 430908B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor chip
- assumption
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21269798 | 1998-07-28 | ||
JP21269698 | 1998-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW430908B true TW430908B (en) | 2001-04-21 |
Family
ID=26519371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088112815A TW430908B (en) | 1998-07-28 | 1999-07-28 | Semiconductor device and method for manufacturing the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US6611064B1 (zh) |
EP (1) | EP1111667A4 (zh) |
JP (1) | JP3916398B2 (zh) |
KR (1) | KR100418013B1 (zh) |
AU (1) | AU4802199A (zh) |
TW (1) | TW430908B (zh) |
WO (1) | WO2000007234A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4752107B2 (ja) * | 2000-11-29 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP2004311784A (ja) * | 2003-04-08 | 2004-11-04 | Fuji Xerox Co Ltd | 光検出装置、及びその実装方法 |
US20090273072A1 (en) * | 2005-03-31 | 2009-11-05 | Pioneer Corporation | Semiconductor device and method for manufacturing the same |
KR100764164B1 (ko) * | 2006-04-04 | 2007-10-09 | 엘지전자 주식회사 | 인쇄회로기판과 이를 사용한 패키지 및 이들의 제조방법 |
JP2009164500A (ja) * | 2008-01-10 | 2009-07-23 | Sumitomo Bakelite Co Ltd | 接着剤および半導体パッケージ |
JP5625431B2 (ja) * | 2009-03-31 | 2014-11-19 | 住友ベークライト株式会社 | 半導体装置の製造方法 |
CN103221813B (zh) * | 2010-11-12 | 2017-05-17 | Ev 集团 E·索尔纳有限责任公司 | 用于测量晶片堆叠的层厚度和晶格缺陷的测量装置和方法 |
US11688668B2 (en) * | 2019-12-31 | 2023-06-27 | At&S (China) Co. Ltd. | Component carrier with low shrinkage dielectric material |
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US3715589A (en) * | 1970-10-02 | 1973-02-06 | Matsushita Electric Ind Co Ltd | Electromagnetic radiation image displaying panel |
JPS57111034A (en) * | 1980-12-10 | 1982-07-10 | Hitachi Ltd | Semiconductor device and its manufacture |
JPH0796618B2 (ja) * | 1986-11-20 | 1995-10-18 | 新日鐵化学株式会社 | 低熱膨張性樹脂 |
JPH0721042B2 (ja) * | 1987-09-30 | 1995-03-08 | 三井石油化学工業株式会社 | 熱硬化性樹脂組成物 |
US5300459A (en) * | 1989-12-28 | 1994-04-05 | Sanken Electric Co., Ltd. | Method for reducing thermal stress in an encapsulated integrated circuit package |
US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
US5134462A (en) * | 1990-08-27 | 1992-07-28 | Motorola, Inc. | Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate |
US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
JPH06103707B2 (ja) * | 1991-12-26 | 1994-12-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体チップの交換方法 |
US5313365A (en) * | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
US5703405A (en) * | 1993-03-15 | 1997-12-30 | Motorola, Inc. | Integrated circuit chip formed from processing two opposing surfaces of a wafer |
WO1994024704A1 (en) * | 1993-04-12 | 1994-10-27 | Bolger Justin C | Area bonding conductive adhesive preforms |
US5767580A (en) * | 1993-04-30 | 1998-06-16 | Lsi Logic Corporation | Systems having shaped, self-aligning micro-bump structures |
DE69426347T2 (de) * | 1993-09-29 | 2001-05-17 | Matsushita Electric Ind Co Ltd | Verfahren zum Montieren einer Halbleiteranordnung auf einer Schaltungsplatte und eine Schaltungsplatte mit einer Halbleiteranordnung darauf |
US5734201A (en) * | 1993-11-09 | 1998-03-31 | Motorola, Inc. | Low profile semiconductor device with like-sized chip and mounting substrate |
US5473512A (en) * | 1993-12-16 | 1995-12-05 | At&T Corp. | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board |
US5504374A (en) * | 1994-02-14 | 1996-04-02 | Lsi Logic Corporation | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material |
JPH07247364A (ja) * | 1994-03-10 | 1995-09-26 | Toyota Central Res & Dev Lab Inc | オリゴマー分解性高分子、その製造方法、回収方法及び再生方法 |
JP3200280B2 (ja) | 1994-03-30 | 2001-08-20 | シャープ株式会社 | 半導体装置の製造方法 |
FR2723257B1 (fr) * | 1994-07-26 | 1997-01-24 | Sgs Thomson Microelectronics | Boitier bga de circuit integre |
JP3406073B2 (ja) | 1994-08-12 | 2003-05-12 | 日立化成工業株式会社 | 樹脂封止型半導体装置 |
US5508556A (en) * | 1994-09-02 | 1996-04-16 | Motorola, Inc. | Leaded semiconductor device having accessible power supply pad terminals |
US5741446A (en) * | 1995-05-26 | 1998-04-21 | Mitsubishi Engineering-Plastics Corp. | Method of producing a molded article using a mold assembly with an insert block |
US7012320B2 (en) * | 1995-07-06 | 2006-03-14 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
TW310481B (zh) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
US6242802B1 (en) * | 1995-07-17 | 2001-06-05 | Motorola, Inc. | Moisture enhanced ball grid array package |
TW334469B (en) * | 1995-08-04 | 1998-06-21 | Doconitele Silicon Kk | Curable organosiloxane compositions and semiconductor devices |
JP3377660B2 (ja) | 1995-09-29 | 2003-02-17 | シャープ株式会社 | 加熱炉およびダイボンドペーストの硬化方法 |
US5773895A (en) * | 1996-04-03 | 1998-06-30 | Intel Corporation | Anchor provisions to prevent mold delamination in an overmolded plastic array package |
US5783866A (en) * | 1996-05-17 | 1998-07-21 | National Semiconductor Corporation | Low cost ball grid array device and method of manufacture thereof |
-
1999
- 1999-07-27 US US09/744,577 patent/US6611064B1/en not_active Expired - Fee Related
- 1999-07-27 AU AU48021/99A patent/AU4802199A/en not_active Abandoned
- 1999-07-27 KR KR10-2001-7001186A patent/KR100418013B1/ko not_active IP Right Cessation
- 1999-07-27 EP EP99931560A patent/EP1111667A4/en not_active Withdrawn
- 1999-07-27 JP JP2000562946A patent/JP3916398B2/ja not_active Expired - Lifetime
- 1999-07-27 WO PCT/JP1999/004016 patent/WO2000007234A1/ja not_active Application Discontinuation
- 1999-07-28 TW TW088112815A patent/TW430908B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3916398B2 (ja) | 2007-05-16 |
KR20010071046A (ko) | 2001-07-28 |
WO2000007234A1 (en) | 2000-02-10 |
EP1111667A4 (en) | 2005-06-22 |
KR100418013B1 (ko) | 2004-02-14 |
EP1111667A1 (en) | 2001-06-27 |
AU4802199A (en) | 2000-02-21 |
US6611064B1 (en) | 2003-08-26 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |