TW429480B - The thermal processing apparatus for sheet-like workpieces - Google Patents

The thermal processing apparatus for sheet-like workpieces

Info

Publication number
TW429480B
TW429480B TW087114830A TW87114830A TW429480B TW 429480 B TW429480 B TW 429480B TW 087114830 A TW087114830 A TW 087114830A TW 87114830 A TW87114830 A TW 87114830A TW 429480 B TW429480 B TW 429480B
Authority
TW
Taiwan
Prior art keywords
workpieces
sheet
processing apparatus
thermal processing
allocated
Prior art date
Application number
TW087114830A
Other languages
English (en)
Inventor
Takayuki Harada
Original Assignee
Smc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smc Corp filed Critical Smc Corp
Application granted granted Critical
Publication of TW429480B publication Critical patent/TW429480B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Temperature (AREA)
  • Furnace Details (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW087114830A 1997-09-30 1998-09-07 The thermal processing apparatus for sheet-like workpieces TW429480B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9282783A JP2954908B2 (ja) 1997-09-30 1997-09-30 基板の温度調整装置

Publications (1)

Publication Number Publication Date
TW429480B true TW429480B (en) 2001-04-11

Family

ID=17657032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087114830A TW429480B (en) 1997-09-30 1998-09-07 The thermal processing apparatus for sheet-like workpieces

Country Status (5)

Country Link
JP (1) JP2954908B2 (zh)
KR (1) KR100303167B1 (zh)
CN (1) CN1106046C (zh)
GB (1) GB2330003B (zh)
TW (1) TW429480B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2792084A1 (fr) * 1999-04-12 2000-10-13 Joint Industrial Processors For Electronics Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat
KR100562705B1 (ko) * 2003-12-26 2006-03-23 삼성전자주식회사 반도체 제조 설비용 온도 조절 장치
CN100452306C (zh) * 2004-01-30 2009-01-14 东京毅力科创株式会社 具有流体间隙的衬底保持器和制造衬底保持器的方法
TW200612512A (en) 2004-06-28 2006-04-16 Ngk Insulators Ltd Substrate heating sapparatus
US20060066335A1 (en) * 2004-09-28 2006-03-30 Kang Seung H Semiconductor test device with heating circuit
US8461674B2 (en) * 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
DE102013223430A1 (de) * 2013-11-18 2015-05-21 BSH Hausgeräte GmbH Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung
CN108195722A (zh) * 2017-11-21 2018-06-22 国家电网公司 基于绝缘油界面张力检测的自动温控装置
CN108486649B (zh) * 2018-03-13 2019-11-08 广州铁路职业技术学院（广州铁路机械学校） 硅片铸造方法及装置
CN113412031A (zh) * 2021-06-21 2021-09-17 合肥联宝信息技术有限公司 一种升温模组及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579925A (en) * 1980-06-19 1982-01-19 Takenaka Komuten Co Ltd Foundation structure for building
DE3854679T2 (de) * 1987-04-22 1996-07-18 Sharp K.K., Osaka Supraleitfähiges Gerät.
GB2261111A (en) * 1991-09-26 1993-05-05 Stuart Scient Company Limited Apparatus and method for heating and/or cooling reaction vessels
JPH09306978A (ja) * 1996-05-15 1997-11-28 Dainippon Screen Mfg Co Ltd 基板温度制御方法、基板熱処理装置及び基板支持装置
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP3952325B2 (ja) * 1997-06-10 2007-08-01 Ｓｍｃ株式会社 高速薄板冷却装置

Also Published As

Publication number Publication date
KR100303167B1 (ko) 2001-11-22
JP2954908B2 (ja) 1999-09-27
GB2330003A (en) 1999-04-07
JPH11110053A (ja) 1999-04-23
KR19990030250A (ko) 1999-04-26
CN1106046C (zh) 2003-04-16
GB9820636D0 (en) 1998-11-18
GB2330003B (en) 1999-10-27
CN1213791A (zh) 1999-04-14

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees