TW429480B - The thermal processing apparatus for sheet-like workpieces - Google Patents
The thermal processing apparatus for sheet-like workpiecesInfo
- Publication number
- TW429480B TW429480B TW087114830A TW87114830A TW429480B TW 429480 B TW429480 B TW 429480B TW 087114830 A TW087114830 A TW 087114830A TW 87114830 A TW87114830 A TW 87114830A TW 429480 B TW429480 B TW 429480B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpieces
- sheet
- processing apparatus
- thermal processing
- allocated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Temperature (AREA)
- Furnace Details (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9282783A JP2954908B2 (ja) | 1997-09-30 | 1997-09-30 | 基板の温度調整装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429480B true TW429480B (en) | 2001-04-11 |
Family
ID=17657032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087114830A TW429480B (en) | 1997-09-30 | 1998-09-07 | The thermal processing apparatus for sheet-like workpieces |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2954908B2 (zh) |
KR (1) | KR100303167B1 (zh) |
CN (1) | CN1106046C (zh) |
GB (1) | GB2330003B (zh) |
TW (1) | TW429480B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2792084A1 (fr) * | 1999-04-12 | 2000-10-13 | Joint Industrial Processors For Electronics | Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat |
KR100562705B1 (ko) * | 2003-12-26 | 2006-03-23 | 삼성전자주식회사 | 반도체 제조 설비용 온도 조절 장치 |
CN100452306C (zh) * | 2004-01-30 | 2009-01-14 | 东京毅力科创株式会社 | 具有流体间隙的衬底保持器和制造衬底保持器的方法 |
TW200612512A (en) | 2004-06-28 | 2006-04-16 | Ngk Insulators Ltd | Substrate heating sapparatus |
US20060066335A1 (en) * | 2004-09-28 | 2006-03-30 | Kang Seung H | Semiconductor test device with heating circuit |
US8461674B2 (en) * | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
DE102013223430A1 (de) * | 2013-11-18 | 2015-05-21 | BSH Hausgeräte GmbH | Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung |
CN108195722A (zh) * | 2017-11-21 | 2018-06-22 | 国家电网公司 | 基于绝缘油界面张力检测的自动温控装置 |
CN108486649B (zh) * | 2018-03-13 | 2019-11-08 | 广州铁路职业技术学院(广州铁路机械学校) | 硅片铸造方法及装置 |
CN113412031A (zh) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | 一种升温模组及电子设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS579925A (en) * | 1980-06-19 | 1982-01-19 | Takenaka Komuten Co Ltd | Foundation structure for building |
DE3854679T2 (de) * | 1987-04-22 | 1996-07-18 | Sharp K.K., Osaka | Supraleitfähiges Gerät. |
GB2261111A (en) * | 1991-09-26 | 1993-05-05 | Stuart Scient Company Limited | Apparatus and method for heating and/or cooling reaction vessels |
JPH09306978A (ja) * | 1996-05-15 | 1997-11-28 | Dainippon Screen Mfg Co Ltd | 基板温度制御方法、基板熱処理装置及び基板支持装置 |
US5802856A (en) * | 1996-07-31 | 1998-09-08 | Stanford University | Multizone bake/chill thermal cycling module |
JP3952325B2 (ja) * | 1997-06-10 | 2007-08-01 | Smc株式会社 | 高速薄板冷却装置 |
-
1997
- 1997-09-30 JP JP9282783A patent/JP2954908B2/ja not_active Expired - Fee Related
-
1998
- 1998-09-07 TW TW087114830A patent/TW429480B/zh not_active IP Right Cessation
- 1998-09-22 GB GB9820636A patent/GB2330003B/en not_active Expired - Fee Related
- 1998-09-29 KR KR1019980040596A patent/KR100303167B1/ko not_active IP Right Cessation
- 1998-09-30 CN CN98120856A patent/CN1106046C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100303167B1 (ko) | 2001-11-22 |
JP2954908B2 (ja) | 1999-09-27 |
GB2330003A (en) | 1999-04-07 |
JPH11110053A (ja) | 1999-04-23 |
KR19990030250A (ko) | 1999-04-26 |
CN1106046C (zh) | 2003-04-16 |
GB9820636D0 (en) | 1998-11-18 |
GB2330003B (en) | 1999-10-27 |
CN1213791A (zh) | 1999-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MXPA02010754A (es) | Aparato de transferencia de calor para placa de pozos que contienen muestras. | |
EP0511294A4 (en) | Heating apparatus for semiconductor wafers or substrates | |
TW367539B (en) | Cooling method, cooling device and handling apparatus | |
TW291571B (en) | Parylene deposition apparatus including a heated and cooled support platen and an electrostatic clamping device | |
WO2002084712A3 (en) | Rapid thermal processing system for integrated circuits | |
TW328631B (en) | Susceptor, apparatus of heat-treating semiconductor wafer, and method of heat-treating the same | |
TW429480B (en) | The thermal processing apparatus for sheet-like workpieces | |
EP0451740A3 (en) | Temperature control system for semiconductor wafer or substrate | |
TW348273B (en) | Method of heat treatment of silicon monolithic wafers and thermal treatment device thereof and silicon monolithic wafer and process for producing the same | |
GB2323152A (en) | Temperature controlled chuck for vacuum processing | |
EP0438957A3 (en) | Dry interface thermal chuck temperature control system for semiconductor wafer testing | |
ATE388482T1 (de) | Örtliche erwärmung und kühlung von substraten | |
DE60045384D1 (de) | Mehrzonenwiderstandsheizung | |
TW429394B (en) | Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same | |
EP0029501A3 (en) | Heat sink and cooling system for semiconductor modules | |
TW373233B (en) | Furnace sidewall temperature control system | |
TW338015B (en) | Improved method and apparatus for chemical mechanical polishing | |
CA2016982A1 (en) | Processing apparatus for a chemical reaction pack | |
EP1075015A3 (en) | A method and apparatus for thermal control of a semiconductor substrate | |
DE69428618D1 (de) | Thermischer Reaktor für Operationen zur Bearbeitung von Halbleiter-Wafer | |
EP1038314A4 (en) | SUBSTRATE TRANSFER SYSTEM FOR SEMICONDUCTOR PROCESS EQUIPMENT | |
SG75876A1 (en) | Process and device for polishing semiconductor wafers | |
KR880700862A (ko) | 실리콘 웨이퍼와 같은 얇은 부분을 열 처리하는 장치 | |
GB9710204D0 (en) | Semiconductor wafer thermal processing apparatus | |
EP0926718A3 (en) | Heat treatment method for monocrystalline silicon wafers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |