GB2330003B - Thermal processing apparatus for sheet-like workpieces - Google Patents
Thermal processing apparatus for sheet-like workpiecesInfo
- Publication number
- GB2330003B GB2330003B GB9820636A GB9820636A GB2330003B GB 2330003 B GB2330003 B GB 2330003B GB 9820636 A GB9820636 A GB 9820636A GB 9820636 A GB9820636 A GB 9820636A GB 2330003 B GB2330003 B GB 2330003B
- Authority
- GB
- United Kingdom
- Prior art keywords
- workpieces
- sheet
- processing apparatus
- thermal processing
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9282783A JP2954908B2 (en) | 1997-09-30 | 1997-09-30 | Substrate temperature controller |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9820636D0 GB9820636D0 (en) | 1998-11-18 |
GB2330003A GB2330003A (en) | 1999-04-07 |
GB2330003B true GB2330003B (en) | 1999-10-27 |
Family
ID=17657032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9820636A Expired - Fee Related GB2330003B (en) | 1997-09-30 | 1998-09-22 | Thermal processing apparatus for sheet-like workpieces |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2954908B2 (en) |
KR (1) | KR100303167B1 (en) |
CN (1) | CN1106046C (en) |
GB (1) | GB2330003B (en) |
TW (1) | TW429480B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2792084A1 (en) * | 1999-04-12 | 2000-10-13 | Joint Industrial Processors For Electronics | INTEGRATED HEATING AND COOLING DEVICE IN A HEAT TREATMENT REACTOR OF A SUBSTRATE |
KR100562705B1 (en) * | 2003-12-26 | 2006-03-23 | 삼성전자주식회사 | Temperature controller for a semiconductor fabricating tool |
US8007591B2 (en) | 2004-01-30 | 2011-08-30 | Tokyo Electron Limited | Substrate holder having a fluid gap and method of fabricating the substrate holder |
TW200612512A (en) | 2004-06-28 | 2006-04-16 | Ngk Insulators Ltd | Substrate heating sapparatus |
US20060066335A1 (en) * | 2004-09-28 | 2006-03-30 | Kang Seung H | Semiconductor test device with heating circuit |
US8461674B2 (en) * | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
DE102013223430A1 (en) * | 2013-11-18 | 2015-05-21 | BSH Hausgeräte GmbH | Device with a power electronics module for supplying an electrical load of a household appliance with electrical supply voltage, household appliance and method for producing such a device |
CN108195722A (en) * | 2017-11-21 | 2018-06-22 | 国家电网公司 | Thermostat based on the detection of insulating oil interfacial tension |
CN108486649B (en) * | 2018-03-13 | 2019-11-08 | 广州铁路职业技术学院(广州铁路机械学校) | Silicon wafer casting method and device |
CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2261111A (en) * | 1991-09-26 | 1993-05-05 | Stuart Scient Company Limited | Apparatus and method for heating and/or cooling reaction vessels |
JPH09306978A (en) * | 1996-05-15 | 1997-11-28 | Dainippon Screen Mfg Co Ltd | Temp. control of substrate, substrate heat treating apparatus and substrate supporting apparatus |
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
GB2326278A (en) * | 1997-06-10 | 1998-12-16 | Smc Corp | Thin plate cooling device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS579925A (en) * | 1980-06-19 | 1982-01-19 | Takenaka Komuten Co Ltd | Foundation structure for building |
DE3854679T2 (en) * | 1987-04-22 | 1996-07-18 | Sharp Kk | Superconducting device. |
-
1997
- 1997-09-30 JP JP9282783A patent/JP2954908B2/en not_active Expired - Fee Related
-
1998
- 1998-09-07 TW TW087114830A patent/TW429480B/en not_active IP Right Cessation
- 1998-09-22 GB GB9820636A patent/GB2330003B/en not_active Expired - Fee Related
- 1998-09-29 KR KR1019980040596A patent/KR100303167B1/en not_active IP Right Cessation
- 1998-09-30 CN CN98120856A patent/CN1106046C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2261111A (en) * | 1991-09-26 | 1993-05-05 | Stuart Scient Company Limited | Apparatus and method for heating and/or cooling reaction vessels |
JPH09306978A (en) * | 1996-05-15 | 1997-11-28 | Dainippon Screen Mfg Co Ltd | Temp. control of substrate, substrate heat treating apparatus and substrate supporting apparatus |
WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
GB2326278A (en) * | 1997-06-10 | 1998-12-16 | Smc Corp | Thin plate cooling device |
Also Published As
Publication number | Publication date |
---|---|
JP2954908B2 (en) | 1999-09-27 |
TW429480B (en) | 2001-04-11 |
GB2330003A (en) | 1999-04-07 |
KR100303167B1 (en) | 2001-11-22 |
CN1213791A (en) | 1999-04-14 |
GB9820636D0 (en) | 1998-11-18 |
CN1106046C (en) | 2003-04-16 |
KR19990030250A (en) | 1999-04-26 |
JPH11110053A (en) | 1999-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20020922 |