CN1106046C - Thermal processing apparatus for sheet-like workpieces - Google Patents
Thermal processing apparatus for sheet-like workpieces Download PDFInfo
- Publication number
- CN1106046C CN1106046C CN98120856A CN98120856A CN1106046C CN 1106046 C CN1106046 C CN 1106046C CN 98120856 A CN98120856 A CN 98120856A CN 98120856 A CN98120856 A CN 98120856A CN 1106046 C CN1106046 C CN 1106046C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- heat transfer
- heat
- electric heater
- transfer plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000000137 annealing Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 4
- 210000005069 ears Anatomy 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000265 homogenisation Methods 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Temperature (AREA)
- Furnace Details (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A plurality of Peltier devices are allocated in the electric heater clamped in the lower portion of heat transferring plate for transferring heat to the sheet-like workpieces, and a cooling part is also allocated.
Description
The present invention relates to be used for the laminal workpiece of substrate that semiconductor wafer or CD are used or liquid crystal, substrate for display and so on implements heat treated annealing device.
The applicant etc. once were willing to propose a kind of annealing device flat 9-140492 number by the spy before this: come the laminal workpiece of heat treated with Peltier (Peltier) device.
Above-mentioned annealing device as shown in Figure 4, in the bottom of heat transfer plate 21 that is used for mounting workpiece W, is disposed with the amber ear card device 22 that a plurality of assistant heating are used; Be built-in with the main heater 23 of electric heater; The Peltier device 24 that Jie uses with heat exchange and the cooling device 25 of set.So, when the workpiece W of mounting heats to keeping little gap in above-mentioned heat transfer plate 21 tops, just will be situated between from the radiant heat of heat-transfer area 21a passes toward heat transfer plate 21 with amber ear card device 22, is used for from the radiant heat of heat-transfer area 21a this workpiece W being heated to the temperature of regulation.In addition, when the temperature that makes above-mentioned workpiece W descended (cooling), the obedient device 24 of amber ear that the heat of heat transfer plate 21 is used via heater 23 and heat exchange from above-mentioned amber ear card device 22 moved to cooling device 25.
Used the annealing device of amber ear card device as mentioned above like that, owing to can promptly carry out moving of heat when heating and during cooling, so have the very outstanding advantage of treatment effeciency.But, under the situation of a plurality of amber ear card of fit on the heat transfer plate 21 device 22, the cause of restriction that is produced because of the shape of this amber ear card device 22 and size etc. and the problem in the practicality etc., do not have fully with gap that this amber ear card device of Mi Pu is difficult, it is inevitable forming the gap each other.Therefore, the Temperature Distribution of above-mentioned heat transfer plate 21 is become to complete and homogeneous is difficult, be easy to produce temperature difference having amber ear card device 22 and do not exist between the part of amber ear card device 22, though this temperature difference is very little.In common heat treatment, such temperature difference less can become problem, still, sometimes has to implement accurate heat treatment because of the kind of workpiece, under these circumstances, it is desirable to eliminate temperature difference, makes it to become the Temperature Distribution of homogeneous as far as possible.
Problem on the major technology of the present invention is: the annealing device Temperature Distribution homogenization, that heating accuracy is good of the heat transfer plate when providing the enough simple mechanisms of energy positively to make the heat treated workpiece.
Another technical problem of the present invention is: in above-mentioned annealing device by the temperature of lifting heat transfer plate promptly, the efficient when improving the workpiece heating and cooling.
In order to solve above-mentioned problem, the invention provides such annealing device, it constitutes to possess to have on upper surface and is used for the bottom of heat transfer plate of the heat-transfer area that conducts heat to workpiece, and being situated between is equipped with a plurality of amber ears card devices and cooling segment with electric heater.Above-mentioned electric heater is set to and can carries out uniform heating to the whole heat transfer face of above-mentioned heat transfer plate.
If adopt annealing device with above-mentioned formation, then because electric heater is present between a plurality of amber ear card devices and the heat transfer plate, when carrying out the heat treated of workpiece, make these amber ear card devices and electric heater use together, heat transfer plate is heated, so can be, the Temperature Distribution of the whole heat transfer face on this heat transfer plate be become substantially be homogenization with above-mentioned electric heater to compensating because of the phenomenon that has amber ear card device and do not exist the obedient device of amber ear on heat transfer plate, to produce temperature difference.And, owing to can be added to the temperature that energising amount that amber ear card device gets on is adjusted heat transfer plate simply with increase and decrease, so setting of the temperature of this heat transfer plate and adjustment are easy.
In addition, when making workpiece carry out cooling processing, owing to adopt the way that when making above-mentioned electric heater OFF, makes reverse direct current flow through above-mentioned amber ear card device, heat transfer plate one side of this amber ear card device is become to cooling off a side, so the heat of heat transfer plate moves to cooling segment by this amber ear card device, makes the temperature of this heat transfer plate promptly descend.
Therefore, when the temperature of workpiece is also higher than the design temperature of heat transfer plate, perhaps under making by the situation of the work-piece cools after the heat transfer plate heating, because as above-mentioned, when employing is cut off the power supply of electric heater, make the energising direction way conversely of leading to a plurality of amber ear card devices, with amber ear card device Cooling Heat Transfer plate, so the temperature of heat transfer plate is promptly reduced.
In addition, owing to heating one side of amber ear card device is dispelled the heat by cooling segment, so the cooling effectiveness of amber ear card device uprises.
According to concrete form of implementation of the present invention, employing heater is embedded in have thermal endurance, the way within the crust of conductivity of heat and electrical insulating property, above-mentioned electric heater can form has the lamellar of the size corresponding with the whole heat transfer face of above-mentioned heat transfer plate.
According to another form of implementation of the present invention, between above-mentioned electric heater and amber ear card device, be provided with the intermediate plate that constitutes by the good material of conductivity of heat to such an extent that electric heater is covered.Should hold concurrently to being used for pushing the device that keeps above-mentioned electric heater and the heat from above-mentioned a plurality of amber ear card devices being spread by middle part plate, with the device that conducts heat to whole heat transfer plate equably, by means of the existence of this intermediate plate, just can more positively realize the homogenization of the Temperature Distribution of heat transfer plate.
In the present invention, can also be on thickness direction a plurality of above-mentioned amber ear card devices be set overlappingly.
According to concrete form of implementation of the present invention, above-mentioned processing unit has: the temperature sensor that detects the temperature and the output signal of above-mentioned heat transfer plate; With the controller of controlling according to the output signal of this temperature sensor to the energising of above-mentioned electric heater and Po Er card device.
Fig. 1 is the profile of an embodiment of expression annealing device of the present invention.
Fig. 2 is the dorsal view of the state after being assembled to electric heater on the heat transfer plate.
Fig. 3 is the plane graph of the state that sets of amber ear card device.
Fig. 4 is the profile of the annealing device of scheme formerly.
Shown in Fig. 1 is the representational embodiment of annealing device of the present invention.This annealing device 1 has: possess to have on upper surface and be used for the heat transfer plate 2 of the heat-transfer area 2a that conducts heat to laminal workpiece W; Be set to the electric heater 3 that can heat whole above-mentioned heat-transfer area 2a equably in the bottom of this heat transfer plate 2; Be located at the intermediate plate 4 of the bottom of this electric heater; Be arranged the bottom that is arranged at this intermediate plate 4, make that Jie can be to a plurality of amber ears card devices 5 of above-mentioned heat transfer plate 2 heating with this intermediate plate 4 and electric heater 3; Be arranged at the cooling segment 6 of the bottom of this amber ear card device 5.
Above-mentioned heat transfer plate 2 is that mounting workpiece W and making it heats and/or the parts of the temperature that is cooled to stipulate, be formed than the workpiece W diameter of institute mounting major diameter (200～320mm) circle for example slightly, on the periphery in its lower section, as shown in Figure 2, formed the edge 2b of ring-type, made electric heater 3 is trapped among the centre.The internal diameter of this edge 2b is bigger slightly than the external diameter of workpiece W.
Above-mentioned electric heater 3 has thermal endurance by heater is embedded in, a way of the outer intracutaneous of conductivity of heat and electrical insulating property, forms thin lamellarly, forms simultaneously and makes and constitute all circle of corresponding size with the heat-transfer area 2a of above-mentioned heat transfer plate 2.Above-mentioned heater adopts the figure that the thin foil severing that is made of the material that generates heat because of resistance is become regulation, perhaps wire member is bent to the way formation of the figure of regulation.Above-mentioned crust can be with formation such as silica gel.
In addition, above-mentioned intermediate plate 4 is held concurrently to being used for pushing the device that keeps above-mentioned electric heater 3 and the heat from above-mentioned a plurality of amber ear card devices 5 being spread, with the device that conducts heat to whole heat transfer plate 2 equably, material with the good thermal conduction of aluminium or copper and so on forms, and is provided with whole above-mentioned electric heater 3 coverings.The thickness of this intermediate plate 4 it is desirable to for example about 5mm.
Above-mentioned amber ear card device 5 as shown in Figure 3, around the center of above-mentioned heat transfer plate 2, is configured to be radial with equally spaced angle.In addition, this amber ear card device 5 it is desirable to as shown in the figure, and 2 are piled up setting, to guarantee the temperature difference between upper and lower surface.
Above-mentioned cooling segment 6 possesses the coolant flow channel 6a of the flow of cooling water of making, and this coolant flow channel is connected on the Cold water supply source.
On above-mentioned annealing device 1, also possess the temperature that detects heat transfer plate 2 and the temperature sensor 8 and the controller 9 of output signal are arranged.This controller 9 is the energising amounts that are sent to electric heater 3 and each amber ear card device 5 with the output signal control of temperature sensor 8, regulates the temperature controlling device of heat transfer plate 2, supplies with alternating current to electric heater 3, supplies with direct current to amber ear card device 5.In addition, can switch its flow direction for direct current toward this amber ear card device 5.
On above-mentioned heat transfer plate 2, be provided with the equilateral triangle shape workpiece W that 3 handles will heat-treat support for and heat-transfer area 2a between only keep the liner 10 on spherical top of the state in very little gap.These liners 10 with the suitable lowering or hoisting gear that does not draw among the figure and, make it to rise to the position more outstanding than more past top, the position shown in the figure.
Employing is provided with the way of such liner 10, because the very little gap of formation between the upper surface of heat transfer plate 2 and workpiece W, though so pass some minimizings are arranged, but can make the heating of workpiece W or the cooling more homogeneous that becomes by means of this gap toward the amount of thermal conduction of workpiece W.
In having the annealing device of above-mentioned formation, in heated parts W, make to flow through to make heat transfer plate 2 one sides become direct current for the direction that heats a side at above-mentioned amber ear card device 5, make at electric heater 3 and flow through alternating current.So, just by above-mentioned electric heater 3 and 5 heating of Po Er card device, the workpiece W that the result just becomes heat-transfer area 2a top is heated heat transfer plate 2 equably.In this case, make the coolant flow channel 6a of suitable cooling water flow supercooling part 6.
The temperature of above-mentioned heat transfer plate 2 adopts the signal by temperature sensor 8 outputs, and controller 9 is regulated the way of the energising amount that is sent to electric heater 3 and Po Er card device 5 and critically controlled.
So, owing to adopt above-mentioned electric heater 3 is set De Bipo ear card device 5 also near heat transfer plate 2 one sides, way at the arranged outside amber ear of this electric heater 3 card device 5, it is all just can directly to heat heat transfer plate 2 with above-mentioned electric heater 3, can prevent in the part that has above-mentioned amber ear card device 5 and do not exist between the part of above-mentioned amber ear card device 5, on this heat transfer plate 2, produce temperature difference, so, can positively make all Temperature Distribution homogenizations of heat-transfer area 2a on this heat transfer plate 2.And, from the heat of above-mentioned a plurality of amber ear card devices 5, because with being transmitted to equably on the whole heat transfer plate 2 after intermediate plate 4 diffusions, so the result is the homogenization that also can further promote the Temperature Distribution of heat transfer plate 2 with this way.
In addition, owing to the temperature that can adjust heat transfer plate 2 with the way that increases and decreases the energising amount that is sent to amber ear card device 5 simply, so the temperature of this heat transfer plate 2 is set and adjustment is easy.
In the heating-up temperature of turning down workpiece W, as long as owing to make reverse current flow through above-mentioned amber ear card device 5, and therefore heat transfer plate 2 one sides of this amber ear card device 5 will become cooling one side, so the temperature of this heat transfer plate 2 is reduced.
In addition, when the workpiece W after the heat treated is carried out cooling processing, owing to adopt when making above-mentioned electric heater 3 become OFF, make reverse direct current flow through the way of above-mentioned amber ear card device 5 as mentioned above like that, heat transfer plate 2 one sides of this amber ear card device 5 will become cooling one side, so the heat of heat transfer plate 2 just moves to cooling segment 6 by this amber ear card device 5, and the temperature of this heat transfer plate 2 is promptly descended.
Therefore, under the situation of workpiece W when the temperature of workpiece W is higher than the design temperature of heat transfer plate 2 and after cooling is by heat transfer plate 2 heating, as mentioned above, as long as cut off the energising of being sent to electric heater 3, the energising direction operation conversely of being sent to a plurality of amber ear card devices 5 is got final product.
In this case, part 6 heat radiations because heating one side of amber ear card device 5 is cooled are so the cooling effectiveness of amber ear card device 5 improves.
Claims (5)
1, a kind of annealing device of sheet-like workpieces is characterized in that having:
On upper surface, possess the heat transfer plate that is used for heating or cooling off the heat-transfer area of laminal workpiece is arranged;
Set in the bottom of above-mentioned heat transfer plate can be impartial and directly heat the electric heater of above-mentioned whole heat transfer face;
Be arranged in the bottom of above-mentioned electric heater set can carry out the heating and cooling of above-mentioned heat transfer plate selectively via this electric heater a plurality of amber ears card devices;
And the bottom that is equipped on above-mentioned amber ear card device, make to absorb the cooling segment of emitting after the heat from this amber ear card device in order to cool off this amber ear card device.
2, the described annealing device of claim 1 is characterized in that:
Have thermal endurance by heater is embedded in, the way within the crust of conductivity of heat and electrical insulating property, above-mentioned electric heater forms lamellar, forms simultaneously to have the size corresponding with the whole heat transfer face of above-mentioned heat transfer plate.
3, the described annealing device of claim 2 is characterized in that:
Between above-mentioned electric heater and amber ear card device, be provided with the intermediate plate that constitutes by the good material of conductivity of heat to such an extent that electric heater is covered; This intermediate plate is held concurrently for being used for pushing the device that keeps above-mentioned electric heater and the heat from above-mentioned a plurality of amber ear card devices being spread, with the device that conducts heat to whole heat transfer plate equably.
4, the described annealing device of claim 1 is characterized in that: a plurality of obedient devices of above-mentioned amber ear that are provided with overlappingly on thickness direction.
5, the described annealing device of claim 1 is characterized in that this annealing device has: the temperature sensor that detects the temperature and the output signal of above-mentioned heat transfer plate; With the controller of controlling according to the output signal of this temperature sensor to the energising of above-mentioned electric heater and Po Er card device.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP282783/1997 | 1997-09-30 | ||
| JP9282783A JP2954908B2 (en) | 1997-09-30 | 1997-09-30 | Substrate temperature controller |
| JP282783/97 | 1997-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1213791A CN1213791A (en) | 1999-04-14 |
| CN1106046C true CN1106046C (en) | 2003-04-16 |
Family
ID=17657032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98120856A Expired - Fee Related CN1106046C (en) | 1997-09-30 | 1998-09-30 | Thermal processing apparatus for sheet-like workpieces |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2954908B2 (en) |
| KR (1) | KR100303167B1 (en) |
| CN (1) | CN1106046C (en) |
| GB (1) | GB2330003B (en) |
| TW (1) | TW429480B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2792084A1 (en) * | 1999-04-12 | 2000-10-13 | Joint Industrial Processors For Electronics | INTEGRATED HEATING AND COOLING DEVICE IN A HEAT TREATMENT REACTOR OF A SUBSTRATE |
| KR100562705B1 (en) * | 2003-12-26 | 2006-03-23 | 삼성전자주식회사 | Temperature controller for a semiconductor fabricating tool |
| CN100452306C (en) | 2004-01-30 | 2009-01-14 | 东京毅力科创株式会社 | Substrate holder having a fluid gap and method of fabricating the substrate holder |
| TW200612512A (en) | 2004-06-28 | 2006-04-16 | Ngk Insulators Ltd | Substrate heating sapparatus |
| US20060066335A1 (en) * | 2004-09-28 | 2006-03-30 | Kang Seung H | Semiconductor test device with heating circuit |
| US8461674B2 (en) * | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
| DE102013223430A1 (en) * | 2013-11-18 | 2015-05-21 | BSH Hausgeräte GmbH | Device with a power electronics module for supplying an electrical load of a household appliance with electrical supply voltage, household appliance and method for producing such a device |
| CN108195722A (en) * | 2017-11-21 | 2018-06-22 | 国家电网公司 | Thermostat based on the detection of insulating oil interfacial tension |
| CN108486649B (en) * | 2018-03-13 | 2019-11-08 | 广州铁路职业技术学院（广州铁路机械学校） | Silicon wafer casting method and device |
| CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS579925A (en) * | 1980-06-19 | 1982-01-19 | Takenaka Komuten Co Ltd | Foundation structure for building |
| CN88102434A (en) * | 1987-04-22 | 1988-11-09 | 夏普公司 | Superconducting device |
| GB2261111A (en) * | 1991-09-26 | 1993-05-05 | Stuart Scient Company Limited | Apparatus and method for heating and/or cooling reaction vessels |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09306978A (en) * | 1996-05-15 | 1997-11-28 | Dainippon Screen Mfg Co Ltd | Temp. control of substrate, substrate heat treating apparatus and substrate supporting apparatus |
| WO1998005060A1 (en) * | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
| JP3952325B2 (en) * | 1997-06-10 | 2007-08-01 | Ｓｍｃ株式会社 | High speed sheet cooling system |
-
1997
- 1997-09-30 JP JP9282783A patent/JP2954908B2/en not_active Expired - Fee Related
-
1998
- 1998-09-07 TW TW087114830A patent/TW429480B/en not_active IP Right Cessation
- 1998-09-22 GB GB9820636A patent/GB2330003B/en not_active Expired - Fee Related
- 1998-09-29 KR KR1019980040596A patent/KR100303167B1/en not_active IP Right Cessation
- 1998-09-30 CN CN98120856A patent/CN1106046C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS579925A (en) * | 1980-06-19 | 1982-01-19 | Takenaka Komuten Co Ltd | Foundation structure for building |
| CN88102434A (en) * | 1987-04-22 | 1988-11-09 | 夏普公司 | Superconducting device |
| GB2261111A (en) * | 1991-09-26 | 1993-05-05 | Stuart Scient Company Limited | Apparatus and method for heating and/or cooling reaction vessels |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11110053A (en) | 1999-04-23 |
| KR19990030250A (en) | 1999-04-26 |
| GB2330003B (en) | 1999-10-27 |
| GB9820636D0 (en) | 1998-11-18 |
| KR100303167B1 (en) | 2001-11-22 |
| JP2954908B2 (en) | 1999-09-27 |
| CN1213791A (en) | 1999-04-14 |
| TW429480B (en) | 2001-04-11 |
| GB2330003A (en) | 1999-04-07 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030416 Termination date: 20100930 |