TW429421B - Manufacturing method for preventing the wafer mark from shielding in the palnarization process - Google Patents

Manufacturing method for preventing the wafer mark from shielding in the palnarization process

Info

Publication number
TW429421B
TW429421B TW88122136A TW88122136A TW429421B TW 429421 B TW429421 B TW 429421B TW 88122136 A TW88122136 A TW 88122136A TW 88122136 A TW88122136 A TW 88122136A TW 429421 B TW429421 B TW 429421B
Authority
TW
Taiwan
Prior art keywords
manufacturing
wafer mark
palnarization
shielding
preventing
Prior art date
Application number
TW88122136A
Other languages
Chinese (zh)
Inventor
Meng-Jin Tsai
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW88122136A priority Critical patent/TW429421B/en
Application granted granted Critical
Publication of TW429421B publication Critical patent/TW429421B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A manufacturing method for preventing the wafer mark from shielding in the palnarization process is applied in the manufacturing process of metal plugs, which comprises the steps of: providing a wafer having a wafer mark area a device area; forming a dielectric layer on the wafer to cover the wafer mark area the device area; defining an opening, located in the device area, in the dielectric layer; forming a metal layer for covering the dielectric layer and filling the opening; and performing a chemical mechanical polishing process until the surface of the dielectric layer is exposed, and forming a plug in the opening.
TW88122136A 1999-12-16 1999-12-16 Manufacturing method for preventing the wafer mark from shielding in the palnarization process TW429421B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88122136A TW429421B (en) 1999-12-16 1999-12-16 Manufacturing method for preventing the wafer mark from shielding in the palnarization process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88122136A TW429421B (en) 1999-12-16 1999-12-16 Manufacturing method for preventing the wafer mark from shielding in the palnarization process

Publications (1)

Publication Number Publication Date
TW429421B true TW429421B (en) 2001-04-11

Family

ID=21643404

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88122136A TW429421B (en) 1999-12-16 1999-12-16 Manufacturing method for preventing the wafer mark from shielding in the palnarization process

Country Status (1)

Country Link
TW (1) TW429421B (en)

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees