TW423674U - Buckle of heat dissipation device - Google Patents

Buckle of heat dissipation device

Info

Publication number
TW423674U
TW423674U TW088207780U TW88207780U TW423674U TW 423674 U TW423674 U TW 423674U TW 088207780 U TW088207780 U TW 088207780U TW 88207780 U TW88207780 U TW 88207780U TW 423674 U TW423674 U TW 423674U
Authority
TW
Taiwan
Prior art keywords
buckle
heat dissipation
dissipation device
heat
dissipation
Prior art date
Application number
TW088207780U
Other languages
English (en)
Inventor
Chau-Yang Li
Original Assignee
Foxconn Prec Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Prec Components Co Ltd filed Critical Foxconn Prec Components Co Ltd
Priority to TW088207780U priority Critical patent/TW423674U/zh
Priority to US09/418,635 priority patent/US6097601A/en
Publication of TW423674U publication Critical patent/TW423674U/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW088207780U 1999-05-15 1999-05-15 Buckle of heat dissipation device TW423674U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW088207780U TW423674U (en) 1999-05-15 1999-05-15 Buckle of heat dissipation device
US09/418,635 US6097601A (en) 1999-05-15 1999-10-15 Retention mechanism for heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW088207780U TW423674U (en) 1999-05-15 1999-05-15 Buckle of heat dissipation device

Publications (1)

Publication Number Publication Date
TW423674U true TW423674U (en) 2001-02-21

Family

ID=21648154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088207780U TW423674U (en) 1999-05-15 1999-05-15 Buckle of heat dissipation device

Country Status (2)

Country Link
US (1) US6097601A (zh)
TW (1) TW423674U (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043984A (en) * 1998-07-06 2000-03-28 Intel Corporation Electrical assembly that includes a heat sink which is attached to a substrate by a clip
JP2001110966A (ja) * 1999-10-12 2001-04-20 Showa Alum Corp 電子機器用放熱装置
US6210068B1 (en) * 1999-12-27 2001-04-03 Wen-Chen Wei Computer central processing unit heat dissipation device latching structure
TW460109U (en) * 2000-03-15 2001-10-11 Foxconn Prec Components Co Ltd Cooling device
US6327148B1 (en) * 2000-06-29 2001-12-04 Hewlett-Packard Company Heatsink for actively cooled daughterboard system
US6295202B1 (en) * 2000-06-29 2001-09-25 Hewlett-Packard Company Heatsink for actively cooled daughterboard system
US6437469B1 (en) 2000-09-25 2002-08-20 Aaon, Inc. Heat dissipating collar for motor
US6450251B1 (en) * 2000-12-28 2002-09-17 Foxconn Precision Components Co., Ltd. Heat removal system
DE10129788B4 (de) * 2001-06-20 2005-11-10 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
US20030106708A1 (en) * 2001-12-12 2003-06-12 Hao-Yun Ma Heat sink securing means with back plate
TW582568U (en) * 2001-12-12 2004-04-01 Hon Hai Prec Ind Co Ltd Fixing apparatus of back-plate
US6832410B2 (en) * 2002-04-23 2004-12-21 Hewlett-Packard Development Company, L.P. High performance cooling device with side mount fan
TW547916U (en) * 2002-09-18 2003-08-11 Wistron Corp Heat dissipating device for heat generating devices on a circuit board and notebook computer utilizing the heat dissipating device
TW588926U (en) * 2003-06-13 2004-05-21 Hon Hai Prec Ind Co Ltd Heat sink clip
US7042727B2 (en) * 2003-09-26 2006-05-09 Intel Corporation Heat sink mounting and interface mechanism and method of assembling same
TWM243918U (en) * 2003-10-03 2004-09-11 Tai Sol Electronics Co Ltd Structure of heat conduction plate
TWM248229U (en) * 2003-10-31 2004-10-21 Hon Hai Prec Ind Co Ltd Heat sink assembly
US7518872B2 (en) * 2004-06-30 2009-04-14 Intel Corporation Attaching heat sinks to printed circuit boards using preloaded spring assemblies
US7085134B2 (en) * 2004-06-30 2006-08-01 International Business Machines Corporation Dual fan heat sink
US7405932B2 (en) * 2004-07-19 2008-07-29 Hewlett-Packard Development Company, L.P. System and method for cooling electronic devices
CN2736851Y (zh) * 2004-10-21 2005-10-26 鸿富锦精密工业（深圳）有限公司 散热器扣具
US7277293B2 (en) * 2005-04-11 2007-10-02 Inventec Corporation Heat sink conduction apparatus
TW200706098A (en) * 2005-07-26 2007-02-01 Asustek Comp Inc An electronic device with sliding type heatsink
TWI292089B (en) * 2006-04-24 2008-01-01 Quanta Comp Inc Dissipation module
CN100592855C (zh) * 2006-05-12 2010-02-24 富准精密工业(深圳)有限公司 散热器固定装置
US20080094800A1 (en) * 2006-10-20 2008-04-24 Shu-Chuang Chen Heat-dissipating device and method for producing the same
US20080107479A1 (en) * 2006-11-07 2008-05-08 Inventec Corporation Fan fixing apparatus
WO2008114381A1 (ja) * 2007-03-19 2008-09-25 Fujitsu Limited ヒートシンク及び電子装置及び電子装置の製造方法
US8567483B2 (en) * 2009-11-06 2013-10-29 International Business Machines Corporation Heatsink with flexible base and height-adjusted cooling fins
US8550148B2 (en) * 2010-10-13 2013-10-08 Kunshan Jue-Choung Electronics Co., Ltd. Heat plate with clip
JP5998890B2 (ja) * 2012-12-06 2016-09-28 富士通株式会社 バネ付座金及び固定具
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
US9898058B2 (en) * 2016-06-17 2018-02-20 Dell Products, L.P. Method for CPU/heatsink anti-tip and socket damage prevention

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982859A (ja) * 1995-09-11 1997-03-28 Toshiba Corp ヒートシンク組立体
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
TW335187U (en) * 1997-05-24 1998-06-21 Hon Hai Prec Ind Co Ltd Fastening device for CPU assembly
US5973921A (en) * 1997-11-03 1999-10-26 Lin; Yu-Chen Fixation structure for the fan of the CPU heat dissipating device
US6008990A (en) * 1998-11-23 1999-12-28 Liu; Yen-Wen Cartridge type CPU module cooling structure
US5982622A (en) * 1999-03-09 1999-11-09 Chiou; Ming Chin CPU cooling arrangement

Also Published As

Publication number Publication date
US6097601A (en) 2000-08-01

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees