TW407088B - Apparatus for polishing silicon wafers - Google Patents

Apparatus for polishing silicon wafers Download PDF

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Publication number
TW407088B
TW407088B TW088109375A TW88109375A TW407088B TW 407088 B TW407088 B TW 407088B TW 088109375 A TW088109375 A TW 088109375A TW 88109375 A TW88109375 A TW 88109375A TW 407088 B TW407088 B TW 407088B
Authority
TW
Taiwan
Prior art keywords
polishing
wafer
patent application
scope
polishing pad
Prior art date
Application number
TW088109375A
Other languages
English (en)
Chinese (zh)
Inventor
Akihirom Inaba
Tomomi Komura
Hiroshige Ishino
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW407088B publication Critical patent/TW407088B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/10—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW088109375A 1998-06-05 1999-07-21 Apparatus for polishing silicon wafers TW407088B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15796498A JPH11347921A (ja) 1998-06-05 1998-06-05 シリコンウェーハの研磨方法

Publications (1)

Publication Number Publication Date
TW407088B true TW407088B (en) 2000-10-01

Family

ID=15661303

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088109375A TW407088B (en) 1998-06-05 1999-07-21 Apparatus for polishing silicon wafers

Country Status (3)

Country Link
JP (1) JPH11347921A (ja)
TW (1) TW407088B (ja)
WO (1) WO1999062671A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394637B (zh) * 2005-08-30 2013-05-01 Tokyo Seimitsu Co Ltd 墊調節器、墊調節方法及拋光裝置
CN108356684A (zh) * 2017-12-13 2018-08-03 中国电子科技集团公司第十三研究所 一种半导体晶片抛光装置用真空吸附模板及抛光装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245266A (ja) * 2006-03-14 2007-09-27 Daikin Ind Ltd Ｃｍｐ装置
CN107498452B (zh) * 2016-06-14 2019-03-01 顺心企业股份有限公司 3d研磨方法及其装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933488B2 (ja) * 1994-08-10 1999-08-16 日本電気株式会社 研磨方法および研磨装置
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5846122A (en) * 1995-04-25 1998-12-08 Lucent Technologies Inc. Method and apparatus for polishing metal-soluble materials such as diamond
US5743788A (en) * 1996-12-02 1998-04-28 Motorola, Inc. Platen coating structure for chemical mechanical polishing and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394637B (zh) * 2005-08-30 2013-05-01 Tokyo Seimitsu Co Ltd 墊調節器、墊調節方法及拋光裝置
CN108356684A (zh) * 2017-12-13 2018-08-03 中国电子科技集团公司第十三研究所 一种半导体晶片抛光装置用真空吸附模板及抛光装置
CN108356684B (zh) * 2017-12-13 2024-02-06 中国电子科技集团公司第十三研究所 一种半导体晶片抛光装置用真空吸附模板及抛光装置

Also Published As

Publication number Publication date
WO1999062671A9 (en) 2001-12-13
WO1999062671A1 (en) 1999-12-09
JPH11347921A (ja) 1999-12-21

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