TW375554B - Wafer holder for chemical and mechanical planarization machines - Google Patents

Wafer holder for chemical and mechanical planarization machines

Info

Publication number
TW375554B
TW375554B TW087109223A TW87109223A TW375554B TW 375554 B TW375554 B TW 375554B TW 087109223 A TW087109223 A TW 087109223A TW 87109223 A TW87109223 A TW 87109223A TW 375554 B TW375554 B TW 375554B
Authority
TW
Taiwan
Prior art keywords
wafer
chemical
wafer holder
mechanical planarization
retainer
Prior art date
Application number
TW087109223A
Other languages
English (en)
Inventor
Joon-Yong Joo
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW375554B publication Critical patent/TW375554B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW087109223A 1998-05-06 1998-06-10 Wafer holder for chemical and mechanical planarization machines TW375554B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980016207A KR100306824B1 (ko) 1998-05-06 1998-05-06 화학적기계적평탄화기계를위한웨이퍼홀더

Publications (1)

Publication Number Publication Date
TW375554B true TW375554B (en) 1999-12-01

Family

ID=19537076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087109223A TW375554B (en) 1998-05-06 1998-06-10 Wafer holder for chemical and mechanical planarization machines

Country Status (4)

Country Link
US (1) US6146256A (zh)
JP (1) JP3834444B2 (zh)
KR (1) KR100306824B1 (zh)
TW (1) TW375554B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
KR100513419B1 (ko) * 1998-11-07 2005-11-25 삼성전자주식회사 웨이퍼 폴리싱장치
US6726537B1 (en) * 2000-04-21 2004-04-27 Agere Systems Inc. Polishing carrier head
US6454637B1 (en) * 2000-09-26 2002-09-24 Lam Research Corporation Edge instability suppressing device and system
US6949158B2 (en) * 2001-05-14 2005-09-27 Micron Technology, Inc. Using backgrind wafer tape to enable wafer mounting of bumped wafers
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
KR100587057B1 (ko) * 2002-12-03 2006-06-07 주식회사 하이닉스반도체 화학적기계연마 장치
KR100649007B1 (ko) * 2004-12-30 2006-11-27 동부일렉트로닉스 주식회사 화학 기계적 연마 장치 및 이를 만드는 방법
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
US7696770B2 (en) * 2007-01-26 2010-04-13 International Business Machines Corportion Self-centering nest for electronics testing
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
US20130316627A1 (en) * 2012-05-14 2013-11-28 Edmond Arzuman Abrahamians Wafer carrier for batch wafer polishing in wafer polishing machines
KR102150409B1 (ko) * 2013-11-26 2020-09-01 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
KR102257450B1 (ko) * 2014-11-03 2021-05-31 주식회사 케이씨텍 화학 기계적 연마 장치용 캐리어 헤드
JP6403015B2 (ja) * 2015-07-21 2018-10-10 東芝メモリ株式会社 研磨装置および半導体製造方法
KR102644392B1 (ko) * 2018-05-15 2024-03-08 주식회사 케이씨텍 기판 캐리어 및 이를 포함하는 기판 연마 장치
CN110802507A (zh) * 2019-11-11 2020-02-18 上海华力微电子有限公司 研磨头和化学机械研磨设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168021A (ja) * 1987-12-23 1989-07-03 Furukawa Electric Co Ltd:The アウターワークホルダー
US5095661A (en) * 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US5549502A (en) * 1992-12-04 1996-08-27 Fujikoshi Machinery Corp. Polishing apparatus
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
JP3129172B2 (ja) * 1995-11-14 2001-01-29 日本電気株式会社 研磨装置及び研磨方法
US5702292A (en) * 1996-10-31 1997-12-30 Micron Technology, Inc. Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine

Also Published As

Publication number Publication date
KR100306824B1 (ko) 2001-11-30
JPH11333714A (ja) 1999-12-07
KR19990084451A (ko) 1999-12-06
JP3834444B2 (ja) 2006-10-18
US6146256A (en) 2000-11-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees