TW375551B - Polishing apparatus for semiconductor wafer - Google Patents

Polishing apparatus for semiconductor wafer

Info

Publication number
TW375551B
TW375551B TW085113656A TW85113656A TW375551B TW 375551 B TW375551 B TW 375551B TW 085113656 A TW085113656 A TW 085113656A TW 85113656 A TW85113656 A TW 85113656A TW 375551 B TW375551 B TW 375551B
Authority
TW
Taiwan
Prior art keywords
wafers
semiconductor wafer
polishing apparatus
support
dismount
Prior art date
Application number
TW085113656A
Other languages
English (en)
Inventor
Junichi Yamashita
Original Assignee
Komatsu Denshi Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Denshi Kinzoku Kk filed Critical Komatsu Denshi Kinzoku Kk
Application granted granted Critical
Publication of TW375551B publication Critical patent/TW375551B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW085113656A 1995-12-27 1996-11-08 Polishing apparatus for semiconductor wafer TW375551B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35479495A JPH09174430A (ja) 1995-12-27 1995-12-27 半導体ウェハの研磨装置

Publications (1)

Publication Number Publication Date
TW375551B true TW375551B (en) 1999-12-01

Family

ID=18439954

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085113656A TW375551B (en) 1995-12-27 1996-11-08 Polishing apparatus for semiconductor wafer

Country Status (3)

Country Link
US (1) US5924916A (zh)
JP (1) JPH09174430A (zh)
TW (1) TW375551B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111656A (ja) * 1997-09-30 1999-04-23 Nec Corp 半導体装置の製造方法
US6171174B1 (en) * 1998-06-26 2001-01-09 Advanced Micro Devices System and method for controlling a multi-arm polishing tool
US6241585B1 (en) * 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing
KR100690098B1 (ko) * 1999-10-27 2007-03-08 신에쯔 한도타이 가부시키가이샤 반도체 웨이퍼의 연마방법 및 반도체 웨이퍼의 연마장치
US6413152B1 (en) * 1999-12-22 2002-07-02 Philips Electronics North American Corporation Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost
US6287173B1 (en) * 2000-01-11 2001-09-11 Lucent Technologies, Inc. Longer lifetime warm-up wafers for polishing systems
US6949466B2 (en) * 2001-09-18 2005-09-27 Oriol Inc. CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6575818B2 (en) 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6586336B2 (en) 2001-08-31 2003-07-01 Oriol, Inc. Chemical-mechanical-polishing station
DE10245548A1 (de) * 2002-09-30 2004-04-15 Infineon Technologies Ag Vorrichtung und Verfahren zum Steuern von Polierprozessen bei der Halbleiterherstellung
EP1594653A4 (en) * 2003-01-27 2007-07-25 Inc Inopla DEVICE AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE SWING LOADING AND UNLOADING SHEETS
US7421683B2 (en) * 2003-01-28 2008-09-02 Newmerix Corp£ Method for the use of information in an auxiliary data system in relation to automated testing of graphical user interface based applications
US20110300776A1 (en) * 2010-06-03 2011-12-08 Applied Materials, Inc. Tuning of polishing process in multi-carrier head per platen polishing station
US20140024299A1 (en) * 2012-07-19 2014-01-23 Wen-Chiang Tu Polishing Pad and Multi-Head Polishing System

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611654A (en) * 1969-09-30 1971-10-12 Alliance Tool & Die Corp Polishing machine or similar abrading apparatus
US4009539A (en) * 1975-06-16 1977-03-01 Spitfire Tool & Machine Co., Inc. Lapping machine with vacuum workholder
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
JP3828176B2 (ja) * 1995-02-28 2006-10-04 コマツ電子金属株式会社 半導体ウェハの製造方法
JPH09227361A (ja) * 1996-02-28 1997-09-02 Kanebo Ltd 皮膚洗浄剤組成物

Also Published As

Publication number Publication date
US5924916A (en) 1999-07-20
JPH09174430A (ja) 1997-07-08

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