TW373309B - Method for forming metal lines of semiconductor device - Google Patents
Method for forming metal lines of semiconductor deviceInfo
- Publication number
- TW373309B TW373309B TW086117926A TW86117926A TW373309B TW 373309 B TW373309 B TW 373309B TW 086117926 A TW086117926 A TW 086117926A TW 86117926 A TW86117926 A TW 86117926A TW 373309 B TW373309 B TW 373309B
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- insulating layer
- metal lines
- semiconductor device
- contact hole
- Prior art date
Links
Abstract
The present invention relates to a method of forming metal lines of a semiconductor device, which is designed to lessen the distance between the adjacent metal lines and includes the steps of: forming a first insulating layer on a semiconductor substrate; forming first and second contact holes in the first insulating layer so as to bury the first and second contact holes; pattern the first metal layer, forming a first metal line on the first contact hole and its neighboring first insulating layer; and a contact plug in the second contact hole; forming a second insulating layer on the first insulating layer including the first metal line; forming a third contact hole, exposing the contact plug, on the second insulating layer by a known method; and forming a second metal line on the third contact hole and its neighboring second insulating layer.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960067437A KR100245091B1 (en) | 1996-12-18 | 1996-12-18 | Process for forming interconnector of semiconductor device |
KR1019960067436A KR19980048790A (en) | 1996-12-18 | 1996-12-18 | Metal contact and line formation method of semiconductor device |
KR1019960067438A KR100224777B1 (en) | 1996-12-18 | 1996-12-18 | Method of forming contact and line of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW373309B true TW373309B (en) | 1999-11-01 |
Family
ID=27349445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086117926A TW373309B (en) | 1996-12-18 | 1997-11-28 | Method for forming metal lines of semiconductor device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3225289B2 (en) |
TW (1) | TW373309B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6132110A (en) * | 1997-04-01 | 2000-10-17 | Olympus Optical Co., Ltd. | Pivotally mounted lens cover for a moveable lens barrel capable of being separated from the lens barrel upon the occurrence of an external force to protect the coupling mechanism from breakage |
-
1997
- 1997-11-28 TW TW086117926A patent/TW373309B/en not_active IP Right Cessation
- 1997-12-17 JP JP36412397A patent/JP3225289B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH10326832A (en) | 1998-12-08 |
JP3225289B2 (en) | 2001-11-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |