TW373279B - A kind of weld line bonding pad design semiconductor chip having interlocking layout - Google Patents
A kind of weld line bonding pad design semiconductor chip having interlocking layoutInfo
- Publication number
- TW373279B TW373279B TW087111185A TW87111185A TW373279B TW 373279 B TW373279 B TW 373279B TW 087111185 A TW087111185 A TW 087111185A TW 87111185 A TW87111185 A TW 87111185A TW 373279 B TW373279 B TW 373279B
- Authority
- TW
- Taiwan
- Prior art keywords
- input
- output port
- weld line
- line bonding
- bonding pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087111185A TW373279B (en) | 1998-07-10 | 1998-07-10 | A kind of weld line bonding pad design semiconductor chip having interlocking layout |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087111185A TW373279B (en) | 1998-07-10 | 1998-07-10 | A kind of weld line bonding pad design semiconductor chip having interlocking layout |
Publications (1)
Publication Number | Publication Date |
---|---|
TW373279B true TW373279B (en) | 1999-11-01 |
Family
ID=57941705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087111185A TW373279B (en) | 1998-07-10 | 1998-07-10 | A kind of weld line bonding pad design semiconductor chip having interlocking layout |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW373279B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11748545B2 (en) | 2021-08-04 | 2023-09-05 | I-Shou University | Method and electronic device for configuring signal pads between three-dimensional stacked chips |
-
1998
- 1998-07-10 TW TW087111185A patent/TW373279B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11748545B2 (en) | 2021-08-04 | 2023-09-05 | I-Shou University | Method and electronic device for configuring signal pads between three-dimensional stacked chips |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |