TW371785B - Conveying device for film-shaped elements - Google Patents

Conveying device for film-shaped elements

Info

Publication number
TW371785B
TW371785B TW085102135A TW85102135A TW371785B TW 371785 B TW371785 B TW 371785B TW 085102135 A TW085102135 A TW 085102135A TW 85102135 A TW85102135 A TW 85102135A TW 371785 B TW371785 B TW 371785B
Authority
TW
Taiwan
Prior art keywords
conveying device
spiral
frame
shaped elements
screw shaft
Prior art date
Application number
TW085102135A
Other languages
English (en)
Inventor
Kazuo Sugiura
Yoshimitsu Hisajima
Naoki Kanayama
Original Assignee
Shinkawa Kk
Shintech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk, Shintech Corp filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW371785B publication Critical patent/TW371785B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20323—Robotic arm including flaccid drive element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20341—Power elements as controlling elements
    • Y10T74/20348—Planar surface with orthogonal movement and rotation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Die Bonding (AREA)
  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Special Conveying (AREA)
  • Automatic Assembly (AREA)
  • Screw Conveyors (AREA)
TW085102135A 1994-11-25 1996-02-24 Conveying device for film-shaped elements TW371785B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31428094A JP3342210B2 (ja) 1994-11-25 1994-11-25 ペレット移送装置

Publications (1)

Publication Number Publication Date
TW371785B true TW371785B (en) 1999-10-11

Family

ID=18051469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102135A TW371785B (en) 1994-11-25 1996-02-24 Conveying device for film-shaped elements

Country Status (4)

Country Link
US (1) US5599159A (zh)
JP (1) JP3342210B2 (zh)
KR (1) KR100220167B1 (zh)
TW (1) TW371785B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8387851B1 (en) * 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
JP6306927B2 (ja) * 2014-04-15 2018-04-04 株式会社荏原製作所 反転機、基板処理装置、及び、反転機の傾き調整方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122535A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Pellet bonding device
JPH0199780A (ja) * 1987-10-12 1989-04-18 Fuji Photo Film Co Ltd 帯状金属板の接合方法
JPH0340502A (ja) * 1989-07-06 1991-02-21 Harada Ind Co Ltd 自動車電話用広帯域アンテナ

Also Published As

Publication number Publication date
KR960019627A (ko) 1996-06-17
KR100220167B1 (ko) 1999-09-01
JP3342210B2 (ja) 2002-11-05
JPH08148542A (ja) 1996-06-07
US5599159A (en) 1997-02-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees