TW371635B - Carrier head with a layer conformable material for a chemical mechanical polishing system - Google Patents

Carrier head with a layer conformable material for a chemical mechanical polishing system

Info

Publication number
TW371635B
TW371635B TW086114854A TW86114854A TW371635B TW 371635 B TW371635 B TW 371635B TW 086114854 A TW086114854 A TW 086114854A TW 86114854 A TW86114854 A TW 86114854A TW 371635 B TW371635 B TW 371635B
Authority
TW
Taiwan
Prior art keywords
conformable material
carrier head
mechanical polishing
chemical mechanical
layer
Prior art date
Application number
TW086114854A
Other languages
English (en)
Inventor
Robert D Tolles
Tsungan Cheng
John Prince
Shamouil Shamouilian
Norm Shendon
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/729,298 external-priority patent/US5820448A/en
Priority claimed from US08/728,688 external-priority patent/US6036587A/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW371635B publication Critical patent/TW371635B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW086114854A 1996-10-10 1997-10-09 Carrier head with a layer conformable material for a chemical mechanical polishing system TW371635B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/729,298 US5820448A (en) 1993-12-27 1996-10-10 Carrier head with a layer of conformable material for a chemical mechanical polishing system
US08/728,688 US6036587A (en) 1996-10-10 1996-10-10 Carrier head with layer of conformable material for a chemical mechanical polishing system

Publications (1)

Publication Number Publication Date
TW371635B true TW371635B (en) 1999-10-11

Family

ID=27111727

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114854A TW371635B (en) 1996-10-10 1997-10-09 Carrier head with a layer conformable material for a chemical mechanical polishing system

Country Status (4)

Country Link
EP (1) EP0835723A1 (zh)
JP (1) JPH10180626A (zh)
KR (1) KR19980032714A (zh)
TW (1) TW371635B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815179B (zh) * 2020-12-08 2023-09-11 大陸商杭州眾硅電子科技有限公司 拋光裝置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
JP3970561B2 (ja) 2001-07-10 2007-09-05 株式会社荏原製作所 基板保持装置及び基板研磨装置
JP4909506B2 (ja) * 2004-10-29 2012-04-04 株式会社岡本工作機械製作所 ウエハ保持用バッキング材を備える研磨ヘッド構造
JP4374370B2 (ja) 2006-10-27 2009-12-02 信越半導体株式会社 研磨ヘッド及び研磨装置
JP5464820B2 (ja) 2007-10-29 2014-04-09 株式会社荏原製作所 研磨装置
KR102098741B1 (ko) * 2013-05-27 2020-04-09 삼성디스플레이 주식회사 증착용 기판 이동부, 이를 포함하는 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN104985522B (zh) * 2015-07-03 2017-03-08 中国科学院微电子研究所 一种表面形貌仿真的方法及系统
US10211072B2 (en) * 2017-06-23 2019-02-19 Applied Materials, Inc. Method of reconstituted substrate formation for advanced packaging applications
KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
KR102100376B1 (ko) * 2019-12-26 2020-04-14 삼성디스플레이 주식회사 증착용 기판 이동부
CN115060125B (zh) * 2022-07-08 2023-11-03 江西洪都航空工业集团有限责任公司 一种可变直径变支撑间距导弹支撑固定机构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558095B1 (fr) * 1984-03-14 1988-04-08 Ribard Pierre Perfectionnements apportes aux tetes de travail des machines de polissage et analogues
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815179B (zh) * 2020-12-08 2023-09-11 大陸商杭州眾硅電子科技有限公司 拋光裝置

Also Published As

Publication number Publication date
KR19980032714A (ko) 1998-07-25
EP0835723A1 (en) 1998-04-15
JPH10180626A (ja) 1998-07-07

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